OLED DISPLAY MODULE
Product Specification
CUSTOMER
Standard
PRODUCT
NUMBER
DD-25664BE-3A
Date
CUSTOMER
APPROVAL
INTERNAL APPROVALS
Product Mgr
Doc. Control
Electr. Eng
Bazile
Peter
Anthony
Perkins
Rekha
Mani
Date: 11/06/08
Date: 11/06/08
Date: 11/06/08
Approval for Specification only
Approval for Specification and Sample
Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
FORM No. DT-029
TABLE OF CONTENTS
1
MAIN FEATURES ..................................................................................................... 4
2
MECHANICAL SPECIFICATION.......................................................................... 5
2.1
2.2
3
ELECTRICAL SPECIFICATION............................................................................ 7
3.1
3.2
3.3
3.4
3.5
4
CONFORMITY .................................................................................................. 20
DELIVERY ASSURANCE ................................................................................ 20
DEALING WITH CUSTOMER COMPLAINTS ............................................... 25
RELIABILITY SPECIFICATION ......................................................................... 26
8.1
8.2
9
LABELLING AND MARKING ......................................................................... 19
QUALITY ASSURANCE SPECIFICATION ........................................................ 20
7.1
7.2
7.3
8
COMMANDS ..................................................................................................... 17
POWER DOWN AND UP SEQUENCE............................................................. 17
RESET CIRCUIT................................................................................................ 17
ACTUAL APPLICATION EXAMPLE .............................................................. 18
PACKAGING ............................................................................................................ 19
6.1
7
OPTICAL CHARACTERISTICS....................................................................... 16
FUNCTIONAL SPECIFICATION ......................................................................... 17
5.1
5.2
5.3
5.4
6
ABSOLUTE MAXIMUM RATINGS .................................................................. 7
ELECTRICAL CHARACTERISTICS ................................................................. 8
INTERFACE PIN ASSIGNMENT ....................................................................... 9
BLOCK DIAGRAM ........................................................................................... 11
TIMING CHARACTERISTICS ......................................................................... 12
OPTICAL SPECIFICATION.................................................................................. 16
4.1
5
MECHANICAL CHARACTERISTICS ............................................................... 5
MECHANICAL DRAWING ................................................................................ 6
RELIABILITY TESTS ....................................................................................... 26
LIFE TIME.......................................................................................................... 26
HANDLING PRECAUTIONS................................................................................. 27
Product No.
DD-25664BE-3A
REV. B
Page
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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
REVISION RECORD
Rev.
Date
Page
Chapt.
A
27/05/08
--
--
B
11/06/08
10
Product No.
DD-25664BE-3A
Comment
ECR no.
Initial Release
Change in pin no 29, VCC
description
REV. B
Page
3 / 27
Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
1
MAIN FEATURES
ITEM
CONTENTS
Display Format
256 x 64 Dots
Colour
Light Blue Monochrome
Overall Dimensions
88.00 (W) × 27.80 (H) × 2.00 (D) mm
Viewing Area
78.78 (W) x 21.18 (H) mm
Screen Size
3.12”
Mode
Passive Matrix
Duty ratio
1/64
Driver IC
SSD1322
Operating temperature
-30°C ~ +85°C
Storage temperature
-40°C ~ +90°C
Product No.
DD-25664BE-3A
REV. B
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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
2 MECHANICAL SPECIFICATION
2.1 MECHANICAL CHARACTERISTICS
ITEM
CHARACTERISTIC
UNIT
256 x 64
Dots
88.00 (W) × 27.80 (H) × 2.00 (D)
mm
78.78 (W) x 21.18 (H) mm
mm
76.78 (W) x 19.18 (H)
mm
Dot Size
0.28 (W) 0.28 (H)
Mm
Dot Pitch
0.30 (W) x 0.30 (H)
Mm
9.95
G
Display Format
Overall Dimensions
Viewing Area
Active Area
Weight
IC Controller/Driver
Product No.
SSD1322
DD-25664BE-3A
REV. B
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2.2 MECHANICAL DRAWING
Product No.
DD-25664BE-3A
REV. B
Page
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3 ELECTRICAL SPECIFICATION
3.1 ABSOLUTE MAXIMUM RATINGS
Item
Symbol
Min
Max
Unit
Note
VCI
-0.3
4
V
1, 2
Supply Voltage for
Operation
Supply Voltage for
Logic
Supply Voltage for I/O
pins
Supply Voltage for
Display
Operating Current for
VCC
VDD
-0.5
2.75
V
1, 2
VDDIO
-0.5
VCI
V
1, 2
VCC
-0.5
16
V
1, 2
ICC
-
55
mA
1,2
Operating Temperature
TOP
-30
+85
°C
Storage Temperature
TSTG
-40
+90
°C
Static Electricity
Be sure that you are grounded when handling displays.
Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings,
permanent breakage of the module may occur. Also, for normal operations, it is
desirable to use this module under the conditions according to Section 3.2
“Electrical Characteristics”. If this module is used beyond these conditions,
malfunctioning of the module can occur and the reliability of the module may
deteriorate.
Product No.
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REV. B
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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
3.2 ELECTRICAL CHARACTERISTICS
Item
Symbol
Supply Voltage for
Operation
Supply Voltage for
Logic
Supply Voltage for I/O
Pins
Supply Voltage for
Display
Min
Typ
Max
Unit
VCI
2.4
2.8
3.5
V
VDD
2.4
2.5
2.6
V
VDDIO
1.65
1.8
VCI
V
11.5
12
12.5
V
VCC
Condition
Note 3
High Level Input
VIH
0.8xVDDIO
--
VDDIO
V
Low Level Input
VIL
0
--
0.2xVDDIO
V
High Level Output
VOH
0.9xVDDIO
--
VDDIO
V
Low Level Output
VOL
0
--
0.1xVDDIO
V
Note 4
-
1.8
2.25
mA
Note 5
-
1.8
2.25
mA
Note 4
-
26.3
32.9
mA
Note 5
-
41.1
51.4
mA
ICI,SLEEP
-
1
5
µA
ICC,SLEEP
-
1
5
µA
Operating Current for
VCI
ICI
Operating Current for
VCC
ICC
Sleep Mode Current for
VCI
Sleep Mode Current for
VCC
IOUT=100µA,
3.3MHz
IOUT=100µA,
3.3MHz
Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of
panel characteristics and the customer’s request.
Note 4: VCI = 2.8V, VCC = 12V, 50% Display Area Turn on.
Note 5: VCI = 2.8V, VCC = 12V, 100% Display Area Turn on.
Product No.
DD-25664BE-3A
REV. B
Page
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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
3.3 INTERFACE PIN ASSIGNMENT
No.
Symbol
I/O
1
N.C. (GND)
--
2
VSS
P
3
VCC
P
Function
Reserved Pin (Supporting Pin).
The supporting pins can reduce the influences from stresses on the
function pins. This pin must be connected to external ground.
Ground of Logic Circuit
This is a ground pin. It also acts as a reference for the logic pins. It
must be connected to external ground
Power Supply for OEL Panel
This is the most positive supply pin of the chip. They must be
connected to external source.
Voltage Output High Level for COM Signal
4
VCOMH
P
5
VLSS
P
This pin is the input pin for the voltage output high level for COM
signals. A tantalum capacitor should be connected between this pin
and VSS.
Ground of Analog Circuit
This is analog ground pin. It should be connected to VSS externally
Host Data Input/Output Bus
6~13
D7~D0
I/O
These pins are 8-bit bi-directional data bus to be connected to the
microprocessors data bus. When serial mode is selected, D1 will be
the serial data input SDIN and D0 will be the serial clock input
SCLK.
Unused pins must be connected to VSS except for D2 in serial
mode.
Read/Write Enable or Read
14
E/RD#
I
This pin is MCU interface input. When interfacing to a 68XX-series
microprocessor, this pin will be used as the Enable (E) signal.
Read/write operation is initiated when this pin is pulled high and
the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives the
Read (RD#) signal. Data read operation is initiated when this pin is
low and CS# is pulled low.
When serial mode is selected, this pin must be connected to VSS.
Read/Write Select or Write
15
R/W#
I
This pin is MCU interface input. When interfacing to a 68XX-series
microprocessor, this pin will be used as Read/Write (R/W#)
selection input. Pull this pin to “High” for read mode and pull it
“Low” for write mode.
When 80XX interface mode is selected, this pin will be the Write
(WR#) input. Data write operation is initiated when this pin is
pulled low and the CS# is pulled low.
When serial mode is selected, this pin must be connected to VSS.
Communicating Protocol Select
16
17
Product No.
BS0
BS1
I
These pins are MCU interface selection input. See the following
table:
BS0
BS1
3-wire SPI
1
0
4-wire SPI
0
0
8-bit 68XX Parallel
1
1
8-bit 80XX Parallel
0
1
DD-25664BE-3A
REV. B
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Data/Command Control
18
D/C#
I
19
CS#
I
20
RES#
I
21
FR
O
This pin is Data/Command control pin. When the pin is pulled high,
the input at D7~D0 is treated as display data. When the pin is
pulled low, the input at D7~D0 will be transferred to the command
register. For detailed relationship to MCU interface signals, please
refer to the Timing Characteristics Diagrams
Chip Select
This pin is the chip select input. When the pin is enabled for MCU
communication only when CS# is pulled low..
Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization of
the chip is executed.
Cascade Application Connection Pin
This pin is No Connection pins. Nothing should be connected to this
pin. It should be left open individually.
Current Reference for Brightness Adjustment
22
IREF
I
This pin is segment current reference pin. A resistor should be
connected between this pin and VSS. Set the current lower than
10µA
23
N.C.
-
The N.C. pin between function pins are reserved for compatible and
flexible design.
Reserved Pin
Power Supply for I/O Pin
24
VDDIO
P
This pin is a power supply pin of I/O buffer. It should be connected
to VDD or external source. All I/O signals should have VIH
reference to VDDIO. When I/O signal pins (BS0~BS1, D0~D7,
control signals…) pull high, they should be connected to VDDIO.
Power Supply for Core Logic Circuit
25
VDD
P
26
VCI
P
This is a voltage supply pin. It can be supplied externally (within the
range of 2.4~2.6V) or regulated internally from VCI. A capacitor
should be connected between this pin & VSS under all
circumstances.
Power Supply for Operation
This is a voltage supply pin. It must be connected to external source
& always be equal or higher than VDD & VDDIO.
Voltage Output Low Level for SEG Signal
This is segment voltage reference pin.
When external VSL is not used, this pin should be left open.
When external VSL is used, this pin should connect with resistor and
diode to ground.
27
VSL
P
28
VLSS
P
This is the analog ground pin. It should be connected to VSS
externally
29
VCC
I
This is the most positive supply pin of the chip. This should be
connected to external source.
30
N.C. (GND)
-
Product No.
Ground of Analog Circuit
Power Supply for OEL Panel
Reserved Pin (Supporting Pin).
The supporting pins can reduce the influences from stresses on the
function pins. This pin must be connected to external ground.
DD-25664BE-3A
REV. B
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Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
3.4 BLOCK DIAGRAM
MCU Interface Selection: BS0 and BS1
Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, CS#, and RES#
C1, C3, C5: 0.1μF
C2, C4: 4.7μF
C6: 10μF
C7: 1μF
C8: 4.7uF / 25V Tantalum Capacitor R1: 680kΩ,
R1 = 680kΩ, R1= (Voltage at IREF – VSS) / IREF
R2: 50Ω, 1/4W
D1: ≤1.4V, 0.5W
Product No.
DD-25664BE-3A
REV. B
Page
11 / 27
Copyright ©2008 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
3.5 TIMING CHARACTERISTICS
3.5.1 68XX-Series MPU Parallel Interface Timing Characteristics:
Symbol
Description
Min
Max
Unit
tcycle
300
10
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
0
-
ns
tDSW
Write Data Setup Time
40
-
ns
tDHW
Write Data Hold Time
7
-
ns
tDHR
Read Data Hold Time
20
-
ns
tOH
Output Disable Time
-
70
ns
tACC
Access Time
-
140
ns
PWCSL
Chip Select Low Pulse Width (Read)
Chip Select Low Pulse Width (Write)
120
60
-
ns
PWCSH
Chip Select High Pulse Width (Read)
Chip Select High Pulse Width (Write)
60
60
-
ns
tR
Rise Time
-
15
ns
tF
Fall Time
-
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
Product No.
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REV. B
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3.5.2 80XX-Series MPU Parallel Interface Timing Characteristics:
Symbol
Description
Min
Max
Unit
300
10
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
0
-
ns
tDSW
Write Data Setup Time
40
-
ns
tDHW
Write Data Hold Time
7
-
ns
tDHR
Read Data Hold Time
20
-
ns
tOH
-
70
140
ns
tACC
Output Disable Time
Access Time
ns
tPWLR
Read Low Time
150
-
ns
tPWLW
Write Low Time
60
-
ns
tPWHR
Read High Time
Write High Time
60
60
-
ns
-
ns
Chip Select Setup Time
0
-
ns
Chip Select Hold Time to Read
Signal
Chip Select Hold Time
0
-
ns
20
-
ns
tcycle
tPWHW
tCS
tCSH
tCSF
tR
Rise Time
-
15
ns
tF
Fall Time
-
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
Product No.
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REV. B
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3.5.3 Serial Interface Timing Characteristics: (4-wire SPI)
Symbol
Description
Min
Max
Unit
100
15
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
15
-
ns
tCSS
20
10
-
ns
tCSH
Chip Select Setup Time
Chip Select Hold Time
-
ns
tDSW
Write Data Setup Time
15
-
ns
tDHW
Write Data Hold Time
15
-
ns
tCLKL
Clock Low Time
20
-
ns
tCLKH
Clock High Time
20
-
ns
tcycle
tR
Rise Time
-
15
ns
tF
Fall Time
-
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
Product No.
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REV. B
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3.5.4 Serial Interface Timing Characteristics: (3-wire SPI)
Symbol
Description
Min
Max
Unit
100
15
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
15
-
ns
tCSS
20
10
-
ns
tCSH
Chip Select Setup Time
Chip Select Hold Time
-
ns
tDSW
Write Data Setup Time
15
-
ns
tDHW
Write Data Hold Time
15
-
ns
tCLKL
Clock Low Time
20
-
ns
tCLKH
Clock High Time
20
-
ns
tcycle
tR
Rise Time
-
15
ns
tF
Fall Time
-
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
Product No.
DD-25664BE-3A
REV. B
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4 OPTICAL SPECIFICATION
4.1 OPTICAL CHARACTERISTICS
Characteristics
Symbol
Conditions
Min
Typ
Brightness
Lbr
With Polarizer
(Note 3)
60
80
-
C.I.E. (Yellow)
(x)
(y)
Without Polarizer
0.12
0.22
0.16
0.26
0.20
0.30
Dark Room Contrast
CR
-
>2000:1
-
>160
-
-
View Angle
Max Unit
cd/m2
degree
Note 3: Optical measurement taken at VCI = 2.8V, VCC = 12V
Product No.
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REV. B
Page
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5
FUNCTIONAL SPECIFICATION
5.1
COMMANDS
Refer to the Technical Manual for the SSD1322
5.2
POWER DOWN AND UP SEQUENCE
To protect the panel and extend the panel life time, the driver IC power up/down routine
should include a delay period between high voltage and low voltage power sources during
turn on/off. Such that panel has enough time to charge and discharge before/after
operation.
5.2.1 Power up Sequence:
1. Power up VCI & VDDIO
2. Send Display off command
3. Initialization
4. Clear Screen
5. Power up VCC
6. Delay 100ms (when VCC is stable)
7. Send Display on command
5.2.2 Power down Sequence:
1. Send Display off command
2. Power down VCC
3. Delay 100ms (when VCC is reach
0 and panel is completely discharges)
4. Power down VCI & VDDIO
5.3
RESET CIRCUIT
When RES# input is low, the chip initialized with the following status:
1. Display is OFF
2. 480x128 Display Mode
3. Normal segment and display data column and row address mapping (SEG0
mapped to column address 00h and COM0 mapped to row address 00h)
4. Display start line is set at display RAM address 0
5. Column address counter is set at 0
6. Normal scan direction of the COM outputs
7. Contrast control registers is set at 7Fh
Product No.
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REV. B
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5.4 ACTUAL APPLICATION EXAMPLE
Command usage and explanation of an actual example
If the noise is accidentally occurred at the displaying window during the operation, please
reset the display in order to recover the display function.
Product No.
DD-25664BE-3A
REV. B
Page
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6 PACKAGING
6.1 LABELLING AND MARKING
DENSITRON
DD-25664BE-3A
TW YYMM
Product No.
DD-25664BE-3A
REV. B
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7 QUALITY ASSURANCE SPECIFICATION
7.1 CONFORMITY
The performance, function and reliability of the shipped products conform to the Product
Specification.
7.2 DELIVERY ASSURANCE
7.2.1 Delivery inspection standards
•
IPC-AA610 rev. C, class 2 electronic assemblies standard
7.2.2 Zone definition
A Viewing area
B Outside viewing area
Product No.
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REV. B
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7.2.3 Visual inspection
•
•
•
•
Inspect under 30W fluorescent lamp leaving 50 cm between the module and the
lamp and 30 cm between the module and the eye (measuring position).
Appearance is inspected at the best contrast voltage (best contrast is adjusted
considering clearness and crosstalk on screen).
Inspect the module at 45° right and left, top and bottom.
Use the optimum viewing angle during the contrast inspection.
eye
45°
Product No.
DD-25664BE-3A
45°
REV. B
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7.2.3.1 Standard of appearance inspection
Units: mm
Class
Item
Criteria
Minor
Critical
Packing &
Label
Major
Dimension
Outside & inside package Presence of product no., lot no., quantity
Product must not be mixed with others and quantity must not be different from
that indicated on the label
Product dimensions must be according to specification and drawing
Major
Electrical
Product electrical characteristics must be according to specification
Critical
LCD
Display
Black spot,
white spot,
dust
Minor
Missing lines or wrong patterns on LCD display are not allowed
Round type: as per following drawing
∅ = (X+Y)/2
Y
X
Size
∅