Selection Guide
Thermal Interface Materials
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal Properties and Testing
Interface Material Selection Guide
4
5
GAP PAD® Thermally Conductive Materials . . . . . . . . . . . . . . . . . . . . 6
GAP PAD® Comparison Data
Frequently Asked Questions
BERGQUIST® GAP PAD® TGP 800VO
BERGQUIST® GAP PAD® TGP 800VOS
BERGQUIST® GAP PAD® TGP 1000VOUS
BERGQUIST® GAP PAD® TGP HC3000
BERGQUIST® GAP PAD® TGP HC5000
BERGQUIST® GAP PAD® TGP 1100SF
BERGQUIST® GAP PAD® TGP HC1000
BERGQUIST® GAP PAD® TGP 1350
BERGQUIST® GAP PAD® TGP 1500
BERGQUIST® GAP PAD® TGP 1500R
BERGQUIST® GAP PAD® TGP 1500S30
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST® GAP PAD® TGP 2000
BERGQUIST® GAP PAD® TGP 2000SF
BERGQUIST® GAP PAD® TGP A2600
BERGQUIST® GAP PAD® TGP 3004SF
BERGQUIST® GAP PAD® TGP 3500ULM
BERGQUIST® GAP PAD® TGP 5000
BERGQUIST® GAP PAD® TGP 6000ULM
BERGQUIST® GAP PAD® TGP 6000ULM
BERGQUIST® GAP PAD® TGP EMI1000
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Gap Filler Liquid Dispensed Materials and Comparison Data. . . . . . 30
Frequently Asked Questions
BERGQUIST® GAP FILLER TGF 1000
BERGQUIST® GAP FILLER TGF 1000SR
BERGQUIST® GAP FILLER TGF 1100SF
BERGQUIST® GAP FILLER TGF 1400SL
BERGQUIST® GAP FILLER TGF 1500
BERGQUIST® GAP FILLER TGF 1500LVO
BERGQUIST® GAP FILLER TGF 1500RW (One-part)
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST® GAP FILLER TGF 3500LVO
BERGQUIST® GAP FILLER TGF 3600
BERGQUIST® GAP FILLER TGF 4000
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Thermal Interface Compounds, Comparison and FAQs. . . . . . . . . . . 43
BERGQUIST® TGR 1500A
BERGQUIST® TGR 4000
BERGQUIST® LIQUI-FORM TLF LF2000
BERGQUIST® LIQUI-FORM TLF L3500
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HI-FLOW Phase Change Interface Materials. . . . . . . . . . . . . . . . . . . . 48
HI-FLOW Comparison Data
Frequently Asked Questions
BERGQUIST® HI-FLOW THF 900
BERGQUIST® HI-FLOW THF 1000F-AC
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52
Thermal Interface Selection Guide | 1
BERGQUIST® HI-FLOW THF 700UT
BERGQUIST® HI-FLOW THF 1600P
BERGQUIST® HI-FLOW THF 3000UT
BERGQUIST® HI-FLOW THF 500
BERGQUIST® HI-FLOW THF 1500P
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Thermally Conductive Insulators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Frequently Asked Questions
Choosing SIL PAD® Thermally Conductive Insulators
SIL PAD® Comparison Data
Mechanical, Electrical and Thermal Properties
SIL PAD® Thermally Conductive Insulator Selection Table
BERGQUIST® SIL PAD® TSP 900
BERGQUIST® SIL PAD® TSP 1600
BERGQUIST® SIL PAD® TSP 1600S
BERGQUIST® SIL PAD® TSP 1680
BERGQUIST® SIL PAD® TSP 1100ST
BERGQUIST® SIL PAD® TSP 1800
BERGQUIST® SIL PAD® TSP A2000
BERGQUIST® SIL PAD® TSP 1800ST
BERGQUIST® SIL PAD® TSP 3500
BERGQUIST® SIL PAD® TSP A3000
BERGQUIST® SIL PAD® TSP K900
BERGQUIST® SIL PAD® TSP K1100
BERGQUIST® SIL PAD® TSP K1300
BERGQUIST® SIL PAD® TSP Q2500
BERGQUIST® SIL PAD® TSP Q2000
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BOND-PLY and LIQUI-BOND Adhesives . . . . . . . . . . . . . . . . . . . . . . . . 81
BOND-PLY and LIQUI-BOND Comparison Data and FAQs
BERGQUIST® BOND-PLY TBP 850
BERGQUIST® BOND-PLY TBP 400
BERGQUIST® BOND-PLY TBP 400P
BERGQUIST® BOND-PLY TBP 800
BERGQUIST® BOND-PLY TBP 1400LMS-HD
BERGQUIST® LIQUI-BOND TLB EA1800 (Two-Part)
BERGQUIST® LIQUI-BOND TLB SA1000 (One-Part)
BERGQUIST® LIQUI-BOND TLB SA1800 (One-Part)
BERGQUIST® LIQUI-BOND TLB SA2000 (One-Part)
BERGQUIST® LIQUI-BOND TLB SA3500 (Two-Part)
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Ordering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
SIL PAD® Configurations
HI-FLOW Configurations
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Solutions for Surface Mount Applications . . . . . . . . . . . . . . . . . . . . . 100
Where Thermal Solutions Come Together . . . . . . . . . . . . . . . . . . . . . 101
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
2 | Thermal Interface Selection Guide — INTRODUCTION
Henkel. Developing solutions
for the electronics industry.
Proven thermal management solutions and
problem-solving partnership.
We make it our business to know your business. We understand your problems. We
also know that there will always be a better way to help you reach your goals and
objectives. To that end, our company continually invests considerable time and money
into research and development.
Henkel is in the business of solving problems. With our history and experience in the
electronics industry, our experts can help find ways to improve your process, control
and manage heat, and back it all with exceptional service.
Let us show you the value Henkel offers.
Thermal Interface Selection Guide — INTRODUCTION | 3
GLOBAL SUPPORT
THERMAL
MANAGEMENT LEADER
with locations in North America,
Asia and Europe, and sales staff in
30 countries
Our solutions to control and
manage heat in electronic
assemblies and printed circuit
boards are used by many of the
world’s largest OEMs in a wide
range of industries
INNOVATION
Henkel’s BERGQUIST® thermal
solutions were often developed for
specific customer requests
WHY Henkel?
Henkel, the leading solution provider
for adhesives, sealants and functional
coatings worldwide, uses high-quality
BERGQUIST® thermal management
products—like BERGQUIST® TCLAD,
BERGQUIST® SIL PAD® and BERGQUIST®
LIQUI-BOND—to offer technological
solutions for electronics. Beyond that,
we work closely with our customers to
understand your problems and deliver
technologically advanced solutions
backed by exceptional service.
GLOBAL SUPPLY CHAIN
R&D
to maintain a reliable supply of
products to our customers
Over 10 R&D Centers around the
world staffed by 3,000 design and
application professionals
BROAD PRODUCT
PORTFOLIO
that includes LOCTITE®,
TECHNOMELT® and
BERGQUIST® products
4 | Thermal Interface Selection Guide — INTRODUCTION
Thermal Properties and Testing
Thermal Conductivity
Thermal Resistance
Thermal conductivity is the time rate of heat flow through a
unit area producing a unit temperature difference across a unit
thickness.
Thermal resistance is the opposition to the flow of heat through
a unit area of material across an undefined thickness.
Thermal resistance varies with thickness.
Thermal conductivity is an inherent or absolute property of
the material.
Test Methods – ASTM D5470
Thermal Impedance
Thermal Impedance is a property of a particular assembly
measured by the ratio of the temperature difference between
two surfaces to the steady-state heat flow through them.
Factors affecting thermal impedance include:
Area: Increasing the area of thermal contact decreases
thermal impedance.
Thickness: Increasing the insulator thickness increases
thermal impedance.
Pressure: Increasing mounting pressure under ideal
conditions decreases thermal impedance.
2 in. diameter stack (ref. 3.14 in.2) at 10 – 500 psi, 1 hour per layer
Time: Thermal impedance decreases over time.
Measurement: Thermal impedance is affected by the
method of temperature measurement.
Thermal Impedance Per BERGQUIST® TO-220
Thermal Performance (25°C Cold Plate Testing)
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Thermal Interface Selection Guide — INTRODUCTION | 5
Interface Material Selection Guide
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CUSTOM EXTERNAL SHAPES
STANDARD CONFIGURATIONS
ROLL FORM, CONTINUOUS
SHEET STOCK
NOT APPLICABLE
AS
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STANDARD PSA OFFERINGS
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TYPICAL CONVERTED OPTIONS
CUSTOM INTERNAL FEATURES
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SCREW/RIVETS, HIGH PRESSURE
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CLIP, LOW PRESSURE
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ELECTRICAL INSULATOR
COMPUTER APPLICATIONS: CPU,
GPU, ASICS, HARD DRIVES (I)
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MOUNTING METHODS
ELECTRONIC MODULES FOR
TELECOM AND POWER SUPPLIES
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ELECTRONIC MODULES FOR
AUTOMOTIVE: MOTOR AND WIPER
CONTROLS, ANTI-LOCK, ETC.
PRODUCTS
BERGQUIST® SIL PAD® TSP Q2500
BERGQUIST® SIL PAD® TSP Q2000
BERGQUIST® HI-FLOW THF 900
Grease Replacement
BERGQUIST® HI-FLOW THF 1600G
Materials
BERGQUIST® HI-FLOW THF 1000F-AC
BERGQUIST® HI-FLOW THF 700FT
BERGQUIST® HI-FLOW THF 3000UT
BERGQUIST® HI-FLOW THF 500
Grease Replacement
BERGQUIST® HI-FLOW THF 1600P
Materials - Insulated
BERGQUIST® HI-FLOW THF 1500P
Bonding - Thin Film
BERGQUIST® BOND-PLY TBP 400P
BERGQUIST® BOND-PLY TBP 850
Bonding - Fiberglass
BERGQUIST® BOND-PLY TBP 800
Bonding - Unreinforced BERGQUIST® BOND-PLY TBP 400
Bonding - Laminates
BERGQUIST® BOND-PLY TBP 1400LMS-HD
BERGQUIST® SIL PAD® TSP 900
BERGQUIST® SIL PAD® TSP 1600
BERGQUIST® SIL PAD® TSP 1600S
BERGQUIST® SIL PAD® TSP 1680
BERGQUIST® SIL PAD® TSP 1100ST
®
SIL PAD - Fiberglass
BERGQUIST® SIL PAD® TSP 1800
BERGQUIST® SIL PAD® TSP A2000
BERGQUIST® SIL PAD® TSP 1800ST
BERGQUIST® SIL PAD® TSP 3500
BERGQUIST® SIL PAD® TSP A3000
BERGQUIST® SIL PAD® TSP K900
®
SIL PAD - Thin Film
BERGQUIST® SIL PAD® TSP K1100
Polyimide
BERGQUIST® SIL PAD® TSP K1300
BERGQUIST® GAP PAD® TGP 800VO
BERGQUIST® GAP PAD® TGP 800VOS
BERGQUIST® GAP PAD® TGP 1000VOUS
BERGQUIST® GAP PAD® TGP HC3000
BERGQUIST® GAP PAD® TGP HC5000
BERGQUIST® GAP PAD® TGP 1100SF
BERGQUIST® GAP PAD® TGP HC1000
BERGQUIST® GAP PAD® TGP 1350
GAP PAD®
BERGQUIST® GAP PAD® TGP 1500
BERGQUIST® GAP PAD® TGP 1500R
BERGQUIST® GAP PAD® TGP 15000S30
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST® GAP PAD® TGP 2000
BERGQUIST® GAP PAD® TGP 2000SF
BERGQUIST® GAP PAD® TGP A2600
BERGQUIST® GAP PAD® TGP 3500ULM
BERGQUIST® GAP PAD® TGP 5000
BERGQUIST® GAP PAD® TGP 6000ULM
BERGQUIST® GAP PAD® TGP 7000ULM
BERGQUIST® GAP FILLER TGF 1000
BERGQUIST® GAP FILLER TGF 1000SR
BERGQUIST® GAP FILLER TGF 1100SF
BERGQUIST® GAP FILLER TGF 1400SL
BERGQUIST® GAP FILLER TGF 1500
Gap Filler
BERGQUIST® GAP FILLER TGF 1500LVO
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST® GAP FILLER TGF 3500LVO
BERGQUIST® GAP FILLER TGF 3600
BERGQUIST® GAP FILLER TGF 4000
BERGQUIST® LIQUI-BOND TLB EA1800
BERGQUIST® LIQUI-BOND TLB SA1000
Liquid Adhesive
BERGQUIST® LIQUI-BOND TLB SA1800
BERGQUIST® LIQUI-BOND TLB SA2000
BERGQUIST® LIQUI-BOND TLB SA3500
ACTIVE POWER COMPONENTS:
CAPACITORS, INDUCTORS,
RESISTORS
MARKET
APPLICATIONS
INTERFACE APPLICATIONS
DISCRETE POWER DEVICES FOR
POWER SUPPLIES, COMPUTERS,
TELECOM (THRU-HOLE)
PRODUCT OVERVIEW
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T = Typical; AS = Application-Specific (contact your Henkel Sales Representative); A = Available; * = Roll stock configurations are limited (contact your Henkel Sales Representative); Note: For BERGQUIST® HI-FLOW THF 700FT, 225F-AC and BERGQUIST® HI-FLOW THF 3000UT,
the adhesive is not a pressure sensitive adhesive (PSA).
6 | Thermal Interface Selection Guide — GAP PAD®
GAP PAD® Thermally Conductive Materials
Solution-Driven Thermal Management Products for Electronic Devices
A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity
The BERGQUIST® brand is a world leader in thermal interface
materials. The GAP PAD® family of products was developed
to meet the electronic industry’s growing need for interface
materials with greater conformability, higher thermal
performance and easier application.
The extensive GAP PAD® family provides an effective thermal
interface between heat sinks and electronic devices where
uneven surface topography, air gaps and rough surface textures
are present. Henkel application specialists work closely with
customers to specify the proper GAP PAD® material for each
unique thermal management requirement.
Features
Benefits
Options
Each of the many products
within the GAP PAD® family
is unique in its construction,
properties and performance.
Following is an overview of the
important features offered by
the GAP PAD® family.
GAP PAD thermal products
are designed to improve
an assembly’s thermal
performance and reliability
while saving time and money.
Some GAP PAD products have
special features for particular
applications, including:
• Eliminate air gaps to reduce
thermal resistance
• Rubber-coated fiberglass
reinforcement
• Low-modulus
polymer material
• High conformability reduces
interfacial resistance
• Thicknesses from 0.010 in.
to 0.250 in.
• Available with fiberglass/
rubber carriers or in a nonreinforced version
• Low-stress vibration
dampening
• Available in custom diecut parts, sheets and rolls
(converted or unconverted)
• Special fillers to achieve
specific thermal
and conformability
characteristics
• Easy material handling
• Highly conformable to
uneven and rough surfaces
®
• Shock absorbing
• Simplified application
• Puncture, shear and
tear resistance
• Electrically isolating
• Improved performance for
high-heat assemblies
• Natural tack on one or both
sides with protective liner
• Compatible with automated
dispensing equipment
• Variety of thicknesses
and hardnesses
• Range of thermal
conductivities
• Available in sheets and
die-cut parts
Applications
®
• Available with or
without adhesive
GAP PAD® products are wellsuited to a wide variety of
electronics, automotive,
medical, aerospace and
defense applications such as:
• Between an IC and a heat
sink or chassis (typical
packages include BGAs, QFP,
SMT power components and
magnetics)
• Between a semiconductor
and heat sink
• Custom thicknesses and
constructions
• CD-ROM/DVD cooling
• Adhesive or natural inherent
tack
• Memory modules
• Silicone-free GAP PAD®
available in thicknesses of
0.010 in. to 0.125 in.
We produce thousands of
specials. Tooling charges vary
depending on tolerance and
complexity of the part.
• Heat pipe assemblies
• DDR SDRAM
• Hard drive cooling
• Power supply
• IGBT modules
• Signal amplifiers
• Between other heatgenerating devices
and chassis
Thermal Interface Selection Guide — GAP PAD® | 7
GAP PAD® Comparison Data
Conductivity, Hardness and General Overview
®
®
GAP PAD
GAP
Thermal
PAD
Interface
Materials
Materials
® Interface
GAP
PADThermal
Thermal
Interface
Materials
®
BERGQUIST® GAPBERGQUIST
PAD®
GAP PAD®
®
®
BERGQUIST
TGP 3500ULM TGP
3500ULMGAP PAD
TGP 3500ULM
Lowest Modulus
Lowest Modulus
®
BERGQUIST® GAPBERGQUIST
PAD®
GAP PAD®
®
®
BERGQUIST
TGP 5000
TGP 5000 GAP PAD
TGP 5000
Lowest Modulus
®
Soft Class
BERGQUIST® GAPBERGQUIST
PAD®
GAP PAD®
®
®
Soft ClassTGP 1300
BERGQUIST
(S-Class)
TGP 1300 GAP PAD
(S-Class)
TGP 1300
®
BERGQUIST® GAPBERGQUIST
PAD®
GAP PAD®
®
®
BERGQUIST
TGP HC5000
TGP HC5000GAP PAD
TGP HC5000
Lowest Modulus
Soft Class
(S-Class)
®
PAD®
GAP PAD®
BERGQUIST® GAPBERGQUIST
®
®
BERGQUIST
TGP HC3000
TGP HC3000GAP PAD
TGP HC3000
Lowest Modulus
®
®
GAPBERGQUIST
PAD®
GAP PAD®
High Compliance
HighBERGQUIST
Compliance
®
®
BERGQUIST
Compliance
HC1000
TGP HC1000 GAP PAD
(HC) High TGP
(HC)
TGP HC1000
(HC)
®
®
BERGQUIST
BERGQUIST® GAPBERGQUIST
PAD®
GAP
PAD® ® GAPBERGQUIST
PAD®
GAP PAD®
®
®
®
®
BERGQUIST
BERGQUIST
TGP 6000ULM TGP
6000ULMGAP
TGPPAD
7000ULM TGP
7000ULMGAP PAD
TGP 6000ULM
TGP 7000ULM
Lowest Modulus
High Performance
High Performance
High Performance
Ultra-Low Modulus
Ultra-Low Modulus
Modulus
(ULM) Ultra-Low
(ULM)
(ULM)
®
BERGQUIST® GAPBERGQUIST
PAD®
GAP PAD®
®
®
BERGQUIST
TGP 2000
TGP 2000 GAP PAD
TGP 2000
Extended Performance
Extended Performance
Extended Performance
VO Series
®
BERGQUIST® GAPBERGQUIST
PAD®
GAP PAD®
VO Series
®
BERGQUIST
GAP PAD®
TGPVO
1000VOUS
1000VOUS
Series TGP
TGP 1000VOUS
®
PAD®
GAP PAD®
BERGQUIST® GAPBERGQUIST
®
®
BERGQUIST
TGP 800VOS
TGP 800VOSGAP PAD
TGP 800VOS
®
PAD®
GAP PAD®
BERGQUIST® GAPBERGQUIST
®
®
BERGQUIST
TGP 800VO
TGP 800VO GAP PAD
TGP 800VO
Value Performance
Value Performance
Value Performance
GAPBERGQUIST
PAD
GAP PAD
®
®
Value GAP PADValue
GAP PADBERGQUIST
®
®
BERGQUIST
TGP 1350 GAP PAD
Value GAP PAD®TGP 1350
®
®
®
®
TGP 1350
®
PAD®
GAP PAD®
BERGQUIST® GAPBERGQUIST
®
®
BERGQUIST
TGP 1500
TGP 1500 GAP PAD
TGP 1500
®
PAD®
GAP PAD®
BERGQUIST® GAPBERGQUIST
®
®
BERGQUIST
TGP 1500R
TGP 1500R GAP PAD
TGP 1500R
1.0
1.0
1.0
2.0
2.0
3.0
2.0
3.0
4.0
3.0
4.0
-
4.0
-
5.0
5.0
5.0
6.0
-
Specialty GAP PAD® Thermal Interface Materials
BERGQUIST® GAP PAD®
TGP 2202SF
Silicone-Free
BERGQUIST® GAP PAD®
TGP 1100SF
BERGQUIST® GAP PAD®
TGP 3004SF
BERGQUIST® GAP PAD®
TGP 2200SF
High Durability
(HD)
Electromagnetic
(EMI)
BERGQUIST® GAP PAD®
TGP EMI1000
1.0
2.0
3.0
4.0
-
6.0
6.0
7.0
7.0
7.0
8 | Thermal Interface Selection Guide — GAP PAD®
Frequently Asked Questions
Q: What thermal conductivity test method was used to
achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined
in ASTM D5470.
Q: Is GAP PAD® offered with an adhesive?
A: Currently, BERGQUIST® GAP PAD® TGP 800VO, BERGQUIST®
GAP PAD® TGP 800VOS, and BERGQUIST® GAP PAD® TGP
1000VOUS are offered with or without an adhesive and
on the carrier-side of BERGQUIST® SIL PAD® TSP 1600 and
BERGQUIST® SIL PAD® TSP 900. The remaining surface has
natural inherent tack. All other GAP PAD® materials have
inherent tack.
Q: Is the adhesive repositionable?
A: Depending on the surface being applied to, if care is taken,
the pad may be repositioned. Special care should be taken
when removing the pad from aluminum or anodized surfaces
to avoid tearing or delamination.
Q: What is meant by “natural tack”?
A: The characteristic of the rubber itself has a natural inherent
tack, with the addition of an adhesive. As with adhesivebacked products, the surfaces with natural tack may help in
the assembly process to temporarily hold the pad in place
while the application is being assembled. Unlike adhesivebacked products, inherent tack does not have a thermal
penalty since the rubber itself has the tack. Tack strength
varies from one GAP PAD® product to the next.
Q: Can GAP PAD® with natural tack be repositioned?
A: Depending on the material that the pad is applied to, in
most cases they are repositionable. Care should be taken
when removing the pad from aluminum or anodized
surfaces to avoid tearing or delaminating the pad. The
side with the natural tack is always easier to reposition
than an adhesive side.
Q: Is GAP PAD® reworkable?
A: Depending on the application and the pad being used,
GAP PAD® has been reworked in the past. Some of our
customers are currently using the same pad for reassembling
their applications after burn-in processes and after fieldwork
repairs. However, this is left up to the design engineer’s
judgment as to whether or not the GAP PAD®
will withstand reuse.
Q: Will heat make the material softer?
A: From -60°C to 200°C, there is no significant variance in
hardness for silicone GAP PAD® materials and Gap Fillers.
Q: What is the shelf life of GAP PAD®?
A: Shelf life for most GAP PAD® materials is one (1) year after
the date of manufacture. For GAP PAD® with adhesive, the
shelf life is six (6) months from the date of manufacture. After
these dates, inherent tack and adhesive properties should be
recharacterized. The GAP PAD® material’s long-term stability is
not the limiter on the shelf life; it is related to the adhesion or
“age up” of the GAP PAD® to the liner. Or in the case of a
GAP PAD® with adhesive, the shelf life is determined by how
the adhesive ages up to the removable liner.
Q: How is extraction testing performed?
A: The test method used is the Soxhlet Extraction Method;
please refer to GAP PAD® S-Class White Paper.
Q: What is the thickness tolerance of your pads?
A: The thickness tolerance is ±10% on materials greater than 10
mils and ±1 mil on materials £10 mils.
Q: What are the upper processing temperature limits for GAP
PAD® and for how long can GAP PAD® be exposed to them?
A: GAP PAD® in general can be exposed to temporary processing
temperatures of 250°C for five minutes and 300°C for
one minute.
Q: Is GAP PAD® electrically isolating?
A: Yes, all GAP PAD® materials are electrically isolating.
However, keep in mind that GAP PAD® is designed to fill
gaps and it is not recommended for applications where
high mounting pressure is exerted on the GAP PAD®.
Q: How much force will the pad place on my device?
A: Refer to the Pressure vs. Deflection charts in BERGQUIST®
Application Note #116 at our website’s Technical Library.
In addition, there are other helpful resources online at
www.henkel-adhesives.com/thermal.
Q: Why are “wet out,” “compliance” or “conformability”
characteristics of GAP PAD® important?
A: The better a GAP PAD® lays smooth, “wets out” or conforms
to a rough or stepped surface, the less interfacial resistance
caused by air voids and air gaps. GAP PAD® materials are
conformable or compliant, as they adhere very well to the
surface. The GAP PAD® materials can act similarly to a suction
cup on the surface. This leads to a lower overall thermal
resistance of the pad between the two interfaces.
Q: Is anything given off by the material (e.g., extractables,
outgassing)?
A: 1) Silicone GAP PAD® and Gap Fillers, like all soft silicone
materials, can extract low molecular weight silicone (refer
to White Paper on GAP PAD® S-Class). Also note that GAP
PAD® and Gap Filler have some of the lowest extraction
values for silicone-based gap filling products on the
market, and if your application requires minimal silicone,
see our line of silicone-free material. The White Paper on
GAP PAD® S-Class and information about our silicone-free
materials are available on our website.
2) Primarily for aerospace applications, outgassing data is
tested per ASTM E595.
Q: Why does the Technical Data Sheet (on the website)
describe the Shore hardness rating as a bulk rubber
hardness?
A: A reinforcement carrier is generally used in BERGQUIST®
GAP PAD® materials for ease of handling. When testing
hardness, the reinforcement carrier can alter the test results
and incorrectly depict thinner materials as being harder. To
eliminate this error, a 250-mil rubber puck is molded with no
reinforcement carrier. The puck is then tested for hardness.
The Shore hardness is recorded after a 30-second delay.
Thermal Interface Selection Guide — GAP PAD® | 9
BERGQUIST® GAP PAD® TGP 800VO
Formerly known as GAP PAD® VO
Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits
• Thermal conductivity: 0.8 W/m-K
• Enhanced puncture, shear and
tear resistance
• Conformable gap filling material
• Electrically isolating
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 800VO
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
PROPERTY
Gold/Pink
Gold/Pink
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
Inherent Surface Tack (1-sided)
1
1
—
Density, Bulk, Rubber (g/cc)
1.6
1.6
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
100
689
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
0.8
0.8
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
2.47
2.37
2.24
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 800VO is
a cost-effective, thermally conductive
interface material. The material is a filled,
thermally conductive polymer supplied
on a rubber-coated fiberglass carrier
allowing for easy material handling. The
conformable nature of BERGQUIST® GAP
PAD® TGP 800VO allows the pad to fill
in air gaps between PC boards and heat
sinks or a metal chassis.
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 800VO
250
200
150
100
50
0
1
3
5
7
9
11
Thermal Resistance (°C-in.2/W)
13
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
• Between heat-generating magnetic components and a heat sink
Configurations Available:
• Sheet form and die-cut parts
10 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 800VOS
Formerly known as GAP PAD® VO Soft
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 800VOS
• Thermal conductivity: 0.8 W/m-K
PROPERTY
• Conformable, low hardness
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Mauve/Pink
Mauve/Pink
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.200
0.508 to 5.080
ASTM D374
Color
• Enhanced puncture, shear and
tear resistance
• Electrically isolating
Inherent Surface Tack (1-sided)
1
1
—
Density, Bulk, Rubber (g/cc)
1.6
1.6
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
25
25
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
40
275
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
0.8
0.8
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
2.48
2.29
2.11
1) Thirty-second delay value Shore 00 hardness scale.
2) Y oung’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 800VOS
is recommended for applications that
require a minimum amount of pressure
on components. BERGQUIST® GAP PAD®
TGP 800VOS is a highly conformable,
low-modulus, filled-silicone polymer on
a rubber-coated fiberglass carrier. The
material can be used as an interface
where one side is in contact with a
leaded device.
200
180
160
140
120
100
80
60
40
20
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 800VOS
1
2
3 4 5 6 7 8 9
Thermal Resistance (°C-in.2/W)
10
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
Configurations Available:
• Sheet form and die-cut parts
Thermal Interface Selection Guide — GAP PAD® | 11
BERGQUIST® GAP PAD® TGP 1000VOUS
Formerly known as GAP PAD® VO Ultra Soft
Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 1000VOUS
• Thermal conductivity: 1.0 W/m-K
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Mauve/Pink
Mauve/Pink
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
• Decreased strain
Thickness (in.) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
• Puncture-, shear- and tear-resistant
Inherent Surface Tack (1-sided)
• Highly conformable, low hardness
Color
• “Gel-like” modulus
• Electrically isolating
1
1
—
Density, Bulk, Rubber (g/cc)
1.6
1.6
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
5
5
ASTM D2240
Hardness, Bulk Rubber (Shore 00)(1)
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
8
55
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
6,000
6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-0
V-0
UL 94
1.0
1.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
BERGQUIST GAP PAD TGP 1000VOUS
is recommended for applications that
require a minimum amount of pressure
on components. The viscoelastic nature
of the material also gives excellent lowstress vibration dampening and shock
absorbing characteristics. BERGQUIST®
GAP PAD® TGP 1000VOUS is an
electrically isolating material, which
allows its use in applications requiring
isolation between heat sinks and highvoltage, bare-leaded devices.
Deflection (% strain)
®
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
1.97
1.87
1.68
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
®
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 1000VOUS
250
200
150
100
50
0
1
2
3 4 5 6 7 8 9
Thermal Resistance (°C-in.2/W)
10
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
Configurations Available:
• Sheet form and die-cut parts
12 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP HC3000
Formerly known as GAP PAD® HC 3.0
High-Compliance, Thermally Conductive, Low-Modulus Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP HC3000
• Thermal conductivity: 3.0 W/m-K
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Blue
Blue
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
• High-compliance, low
compression stress
Color
• Fiberglass-reinforced for shear and tear
resistance
Inherent Surface Tack
2
2
—
Density, Bulk, Rubber (g/cc)
3.1
3.1
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(4)
15
15
ASTM D2240
Young’s Modulus (psi) / (kPa)(1)
Continuous Use Temp. (°F) / (°C)
16
110
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)(3)
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)
6.5
6.5
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
3.0
3.0
ASTM D5470
THERMAL
BERGQUIST® GAP PAD® TGP HC3000 is
offered with natural inherent tack on
both sides of the material, eliminating
the need for thermally impeding adhesive
layers. The top side has minimal tack for
ease of handling. BERGQUIST® GAP PAD®
TGP HC3000 is supplied with protective
liners on both sides.
Thermal Conductivity (W/m-K)(2)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(2)
10
20
30
0.57
0.49
0.44
1) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2 after 5 minutes of compression at 10% strain on a 1 mm
thickness material.
2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
3) Minimum value at 20 mils.
4) Thirty-second delay value on Shore 00 hardness scale.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP HC3000 is
a soft and compliant gap filling material
with a thermal conductivity of 3.0 W/m-K.
The material offers exceptional thermal
performance at low pressures due to a
unique 3.0 W/m-K filler package and lowmodulus resin formulation. The enhanced
material is ideal for applications requiring
low stress on components and boards
during assembly. BERGQUIST® GAP PAD®
TGP HC3000 maintains a conformable
nature that allows for quick recovery and
excellent wet-out characteristics, even
to surfaces with high roughness and/or
topography.
140
120
100
80
60
40
20
0
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP HC3000
.25
.50
.75
1.00 1.25 1.50 1.75 2.00
Thermal Resistance (°C-in.2/W)
Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts
Thermal Interface Selection Guide — GAP PAD® | 13
BERGQUIST® GAP PAD® TGP HC5000
Formerly known as GAP PAD® HC 5.0
Highly Conformable, Thermally Conductive, Low-Modulus Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP HC5000
• Thermal conductivity: 5.0 W/m-K
PROPERTY
• High-compliance, low compression stress
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Violet
Violet
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)*
0.020, 0.040, 0.060
0.080, 0.100, 0.125
0.508, 1.016, 1.524,
2.032, 2.540, 3.175
ASTM D374
Color
• Fiberglass reinforced for shear and
tear resistance
Inherent Surface Tack
2
2
—
Density, Bulk, Rubber (g/cc)
3.2
3.2
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(4)
35
35
ASTM D2240
Young’s Modulus (psi) / (kPa)(1)
Typical Use Temp. (°F) / (°C)
17.5
121
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)(3)
BERGQUIST® GAP PAD® TGP HC5000 is
offered with natural inherent tack on both
sides of the material, eliminating the need
for thermally-impeding adhesive layers.
The top side has minimal tack for ease of
handling. BERGQUIST® GAP PAD® TGP
HC5000 is supplied with protective liners on
both sides.
5000
ASTM D149
8.0
8.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
5.0
5.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)(2)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(2)
10
20
30
0.35
0.30
0.26
* Custom thicknesses available. Please contact your Henkel Sales Representative for more information.
(1) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2 after 5 minutes of compression at 10% strain on a 1 mm
thickness material.
(2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only.
Actual application performance is directly related to the surface roughness, flatness and pressure applied.
(3) Minimum value at 20 mils.
(4) Thirty-second delay value on Shore 00 hardness scale.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP HC5000 is
a soft and compliant gap filling material
with a thermal conductivity of 5.0 W/m-K.
The material offers exceptional thermal
performance at low pressures due to a
unique filler package and low-modulus resin
formulation. The enhanced material is ideal
for applications requiring low stress on
components and boards during assembly.
BERGQUIST® GAP PAD® TGP HC5000
maintains a conformable nature that
allows for excellent interfacing and wet-out
characteristics, even to surfaces with high
roughness and/or topography.
5000
Dielectric Constant (1,000 Hz)
140
120
100
80
60
40
20
0
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP HC5000
0.2
0.4
0.6
0.8
1.0
Thermal Resistance (°C-in2/W)
1.2
Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts
14 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 1100SF
Formerly known as GAP PAD® 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 1100SF
• Thermal conductivity: 0.9 W/m-K
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Green
Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
• Reduced tack on one side to aid in
application assembly
Thickness (in.) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
• Electrically isolating
Density (g/cc)
Heat Capacity ( J/g-K)
1.1
1.1
ASTM E1269
•
Hardness, Bulk Rubber (Shore 00)(1)
40
40
ASTM D2240
• No silicone outgassing
Color
• No silicone extraction
Inherent Surface Tack (1- or 2-sided)
Young’s Modulus (psi) / (kPa)(2)
•
Continuous Use Temp. (°F) / (°C)
2
—
2.0
ASTM D792
34
234
ASTM D575
-76 to 257
-60 to 125
—
ELECTRICAL
•
Dielectric Breakdown Voltage (VAC)
•
•
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-1
V-1
UL 94
0.9
0.9
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2. For more information on GAP PAD® modulus, refer to
BERGQUIST® Application Note #116 at our website’s Technical Library.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 1100SF
is a thermally conductive, electrically
insulating, silicone-free polymer
specially designed for silicone-sensitive
applications. The material is ideal for
applications with high standoff and
flatness tolerances.
BERGQUIST® GAP PAD® TGP 1100SF is
reinforced for easy material handling and
added durability during assembly. The
material is available with a protective
liner on both sides of the material. The
top side has reduced tack for ease of
handling.
2
2.0
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 1100SF
125
100
75
50
25
0
0
1
2
3
4
Thermal Resistance (°C-in.2/W)
5
Typical Applications Include:
• Digital disk drives and CD-ROMs
• Automotive modules
• Fiber optics modules
Configurations Available:
• Sheet form
• Die-cut parts
Thermal Interface Selection Guide — GAP PAD® | 15
BERGQUIST® GAP PAD® TGP HC1000
Formerly known as GAP PAD® HC1000
“Gel-Like” Modulus Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP HC1000
• Thermal conductivity: 1.0 W/m-K
PROPERTY
• Highly conformable, low hardness
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Grey
Grey
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.010 to 0.020
0.254 to 0.508
ASTM D374
Color
• “Gel-like” modulus
• Fiberglass-reinforced for puncture,
shear and tear resistance
Inherent Surface Tack (1-sided)
2
2
—
Density, Bulk, Rubber (g/cc)
1.6
1.6
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
25
25
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
40
275
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.0
1.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.020 in.(3)
10
20
30
1.30
1.00
0.96
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP HC1000
is an extremely conformable, lowmodulus polymer that acts as a thermal
interface and electrical insulator
between electronic components and
heat sinks. The “gel-like” modulus allows
this material to fill air gaps to enhance
the thermal performance of electronic
systems. BERGQUIST® GAP PAD® TGP
HC1000 is offered with removable
protective liners on both sides of the
material.
20
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP HC1000
18
16
14
12
10
0.25
0.30 0.35 0.40 0.45 0.50
Thermal Resistance (°C-in.2/W)
0.55
Typical Applications Include:
• Computers and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• Memory modules and chip scale packages
• CD-ROM and DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FB-DIMM modules
Configurations Available:
• Sheet form, die-cut parts, and roll form (converted or unconverted)
16 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 1350
Formerly known as GAP PAD® 1450
Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.3 W/m-K
(bulk rubber)
• PEN film reinforcement allows easy
rework and provides puncture and tear
resistance
• Highly conformable/low hardness
• Low strain on fragile components
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 1350
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
PROPERTY
Light Pink
Light Pink
Visual
Reinforcement Carrier
PEN film
PEN film
—
Thickness (in.) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1-sided)
1
1
—
Density, Bulk, Rubber (g/cc)
1.8
1.8
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
30
30
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
16
110
ASTM D575
-76 to 302
-60 to 150
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ω-m)
109
109
ASTM D257
Flame Rating
V-0
V-0
UL 94
1.3
1.3
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
BERGQUIST® GAP PAD® TGP 1350 is a
highly compliant GAP PAD® material
that is ideal for fragile component leads.
The material includes a PEN film, which
facilitates rework and improves puncture
resistance and handling characteristics.
The tacky side of BERGQUIST® GAP PAD®
TGP 1350 maintains a conformable, yet
elastic nature that provides excellent
interfacing and wet-out characteristics,
even to surfaces with high roughness or
uneven topography. BERGQUIST® GAP
PAD® TGP 1350 has inherent tack on one
side of the material, eliminating the need
for thermally impeding adhesive layers. It
is highly recommended that the PEN film
be left intact. However, film removal will
not have a significant impact on thermal
performance.
Please contact your local Henkel Sales
Representative for sample inquiries and
additional product information.
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 1350
Thermal Resistance (°C-in.2/W)
Typical Applications:
• Lighting and LED applications
• When low strain is required for fragile component leads
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
Configurations Available:
• Sheet form and die-cut parts
Thermal Interface Selection Guide — GAP PAD® | 17
BERGQUIST® GAP PAD® TGP 1500
Formerly known as GAP PAD® 1500
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 1500
• Thermal conductivity: 1.5 W/m-K
PROPERTY
• Unreinforced construction for
additional compliancy
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Black
Black
Visual
Reinforcement Carrier
—
—
—
Thickness (in.) / (mm)
0.020 to 0.200
0.508 to 5.080
ASTM D374
Color
• Conformable, low hardness
• Electrically isolating
Inherent Surface Tack (1-sided)
2
2
—
Density, Bulk, Rubber (g/cc)
2.1
2.1
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
45
310
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.5
1.5
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
1.62
1.50
1.33
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 1500 has
an ideal filler blend that gives it a lowmodulus characteristic, which maintains
optimal thermal performance yet still
allows for easy handling. The natural
tack on both sides of the material
allows for good compliance to adjacent
surfaces of components, minimizing
interfacial resistance.
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 1500
200
150
100
50
0
0
1
2
3
4
5
Thermal Resistance (°C-in.2/W)
6
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type
of heat spreader
Configurations Available:
• Sheet form and die-cut parts
18 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 1500R
Formerly known as GAP PAD® 1500R
Thermally Conductive, Reinforced Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 1500R
• Thermal conductivity: 1.5 W/m-K
PROPERTY
• Fiberglass-reinforced for puncture,
shear and tear resistance
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Black
Black
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.010 to 0.020
0.254 to 0.508
ASTM D374
Color
• Easy release construction
• Electrically isolating
Inherent Surface Tack (1-sided)
2
2
—
Density, Bulk, Rubber (g/cc)
2.1
2.1
ASTM D792
Heat Capacity ( J/g-K)
1.3
1.3
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
45
310
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.5
1.5
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.020 in.(3)
10
20
30
1.07
0.88
0.82
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 1500R
has the same highly conformable,
low-modulus polymer as the standard
BERGQUIST® GAP PAD® TGP 1500. The
fiberglass reinforcement allows for easy
material handling and enhances puncture,
shear and tear resistance. The natural tack
on both sides of the material allows for
good compliance to mating surfaces of
components, further reducing
thermal resistance.
THERMAL PERFORMANCE VS. STRAIN
20
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 1500R
18
16
14
12
10
0.25
0.30 0.35 0.40 0.45 0.50
Thermal Resistance (°C-in.2/W)
0.55
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type
of heat spreader
Configurations Available:
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Thermal Interface Selection Guide — GAP PAD® | 19
BERGQUIST® GAP PAD® TGP 1300
Formerly known as GAP PAD® 1500S30
Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling
Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 1300
• Thermal conductivity: 1.3 W/m-K
IMPERIAL VALUE
METRIC VALUE
Color
PROPERTY
Light Pink
Light Pink
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
ASTM D374
• Fiberglass-reinforced for puncture,
shear and tear resistance
Thickness (in.) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
2
2
—
• Quick rebound to original shape
Density, Bulk, Rubber (g/cc)
1.8
1.8
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
30
30
ASTM D2240
• Highly conformable/low hardness
• Decreased strain on fragile components
Inherent Surface Tack (1-sided)
16
110
ASTM D575
-76 to 392
-60 to 200
—
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
TEST METHOD
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 6,000
> 6,000
ASTM D149
Dielectric Constant (1,000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.3
1.3
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
BERGQUIST® GAP PAD® TGP 1300
features an inherent tack on both sides
of the material, eliminating the need for
thermally impeding adhesive layers.
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
1.69
1.41
1.26
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 1300 is a
highly compliant GAP PAD® material
that is ideal for fragile component leads.
The material is fiberglass-reinforced
for improved puncture resistance and
handling characteristics. BERGQUIST®
GAP PAD® TGP 1300 maintains a
conformable, yet elastic nature that
provides excellent interfacing and wet-out
characteristics, even to surfaces with high
roughness or uneven topography.
250
200
160
125
100
80
60
40
20
0
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 1300
0.61
1.21
1.82 2.42 3.03 3.79 4.85 6.06
Thermal Resistance (°C-in.2/W)
7.57
Typical Applications:
• Between any heat-generating component and a heat sink
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
• Shielding devices
Configurations Available:
• Sheet form and die-cut parts
20 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP A2000
Formerly known as GAP PAD® A2000
High-Performance, Thermally Conductive Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP A2000
• Thermal conductivity: 2.0 W/m-K
PROPERTY
• Fiberglass-reinforced for puncture,
shear and tear resistance
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Grey
Grey
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.010 to 0.040
0.254 to 1.016
ASTM D374
Color
• Electrically isolating
Inherent Surface Tack (1-sided)
2
2
—
Density, Bulk, Rubber (g/cc)
2.9
2.9
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
80
80
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
55
379
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
4,000
4,000
ASTM D149
Dielectric Constant (1,000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
2.0
2.0
ASTM D5470
THERMAL
Note: Resultant thickness is defined as the final
gap thickness of the application.
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
1.04
1.00
0.95
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP A2000 acts
as a thermal interface and electrical
insulator between electronic components
and heat sinks. In the thickness range of
10 to 40 mils, BERGQUIST® GAP PAD®
TGP A2000 is supplied with natural tack
on both sides, allowing for excellent
compliance to the adjacent surfaces
of components. The 40 mils material
thickness is supplied with lower tack on
one side, allowing for burn-in processes
and easy rework.
40
35
30
25
20
15
10
0
0.20
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP A2000
0.30 0.40 0.50 0.60 0.70
Thermal Resistance (°C-in.2/W)
0.80
Typical Applications Include:
• Computers and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• Memory modules
• CD-ROM and DVD cooling
• Areas where heat needs to be transferred to a frame chassis or other type
of heat spreader
• DDR SDRAM memory modules
Configurations Available:
• Sheet form, die-cut parts and roll form (converted or unconverted)
Thermal Interface Selection Guide — GAP PAD® | 21
BERGQUIST® GAP PAD® TGP 2000
Formerly known as GAP PAD® 2000S40
Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 2000
• Thermal conductivity: 2.0 W/m-K
PROPERTY
• Low “S-Class” thermal resistance at
very low pressures
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Grey
Grey
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Color
• Highly conformable, low hardness
• Designed for low-stress applications
Inherent Surface Tack (1-sided)
2
2
—
• Fiberglass-reinforced for puncture,
shear and tear resistance
Density, Bulk, Rubber (g/cc)
2.9
2.9
ASTM D792
Heat Capacity ( J/g-K)
0.6
0.6
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
45
310
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
2.0
2.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
BERGQUIST® GAP PAD® TGP 2000 is
offered with inherent natural tack on
both sides of the material allowing for
stick-in-place characteristics during
application assembly. The material is
supplied with protective liners on both
sides. The top side has reduced tack for
ease of handling.
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
0.97
0.89
0.80
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 2000 is
recommended for low-stress applications
that require a mid- to high-thermally
conductive interface material. The highly
conformable nature of the material allows
the pad to fill in air voids and air gaps
between PC boards and heat sinks or
metal chassis with stepped topography,
rough surfaces and high stack-up
tolerances.
125
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 2000
100
75
50
25
0
0.20
0.50
1.00
1.50
2.00
Thermal Resistance (°C-in.2/W)
2.50
Typical Applications Include:
• Power electronics DC/DC: 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics cards, processors and ASICs
• Wireline/wireless communications hardware
• Automotive engine and transmission controls
Configurations Available:
• Sheet form and die-cut parts
22 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 2000SF
Formerly known as GAP PAD® 2200SF
Thermally Conductive, Silicone-Free Gap Filling Material
Features and Benefits
• Thermal conductivity: 2.0 W/m-K
• Silicone-free formulation
• Medium compliance with easy handling
• Electrically isolating
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 2000SF
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Green
Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
Color
Inherent Surface Tack (1- or 2-sided)
2
2
—
Density (g/cc)
2.8
2.8
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
70
70
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
33
228
ASTM D575
-76 to 257
-60 to 125
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
108
108
ASTM D257
Flame Rating
V-O
V-O
UL 94
2.0
2.0
ASTM D5470
THERMAL
BERGQUIST® GAP PAD® TGP 2000SF
is a thermally conductive, electrically
isolating, silicone-free polymer
specially designed for silicone-sensitive
applications. The material is ideal for
applications with uneven topologies and
high stack-up tolerances. BERGQUIST®
GAP PAD® TGP 2000SF is reinforced
for easy material handling and added
durability during assembly. The material
is available with a protective liner on
both sides. BERGQUIST® GAP PAD® TGP
2000SF is supplied with reduced tack on
one side, allowing for burn-in processes
and easy rework.
Thermal Conductivity (W/m-K)
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2. For more information on GAP PAD® modulus, refer to
BERGQUIST® Application Note #116 at our website’s Technical Library.
Note: Resultant thickness is defined as the final gap thickness of the application.
BERGQUIST® GAP PAD® TGP 2000SF
140
0
0
0.5
1.0
1.5
2.0
2.5
Thermal Resistance (°C-in.2/W)
Typical Applications:
• Digital disk drives
• Proximity near electrical contacts (e.g., DC brush motors, connectors, relays)
• Fiber optics modules
Configurations Available:
• Sheet form
• Die-cut parts
• Standard sheet size is 8 in. x 16 in.
Thermal Interface Selection Guide — GAP PAD® | 23
BERGQUIST® GAP PAD® TGP A2600
Formerly known as GAP PAD® A3000
Thermally Conductive, Reinforced Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP A2600
• Thermal conductivity: 2.6 W/m-K
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Gold
Gold
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.015 to 0.125
0.381 to 3.175
ASTM D374
• Fiberglass-reinforced for puncture,
shear and tear resistance
Color
• Reduced tack on one side to aid in
application assembly
Inherent Surface Tack (1-sided)
• Electrically isolating
1
1
—
Density, Bulk, Rubber (g/cc)
3.2
3.2
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
80
80
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
50
344
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)
7.0
7.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
2.6
2.6
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
0.78
0.73
0.68
1) Thirty-second delay value Shore 00 hardness scale.
2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP A2600
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP A2600 is
a thermally conductive, filled-polymer
laminate, supplied on a reinforcing
mesh for added electrical isolation,
easy material handling and enhanced
puncture, shear and tear resistance.
BERGQUIST® GAP PAD® TGP A2600 has a
reinforcement layer on the dark gold side
of the material that assists in burn-in and
rework processes while the light gold
and soft side of the material allows for
added compliance.
125
115
95
75
55
35
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70
Thermal Resistance (°C-in.2/W)
Typical Applications Include:
• Computers and peripherals
• Telecommunications
• Heat pipe assemblies
• Memory modules
• CD-ROM and DVD cooling
• Between CPU and heat spreader
• Areas where heat needs to be
transferred to a frame, chassis or other
type of heat spreader
Configurations Available:
• Sheet form, die-cut parts and roll form (converted or unconverted)
24 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 3004SF
Formerly known as GAP PAD® 3004SF
High-Performance, Thermally Conductive Material
Features and Benefits
• Thermal Conductivity: 3.0 W/m-K
• Silicone-free formulation
• 0.25-mil PET provides easy
disassembly, leaving no residue
• Tacky side allows for ease of handling
and placement
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 3004SF
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Light Gray
Light Gray
Visual
Reinforcement Carrier
0.25-mil PET Film
0.25-mil PET Film
—
Thickness (in.) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
Color
Inherent Surface Tack
1
1
—
3.2
3.2
ASTM D792
-40 to 257
-40 to 125
—
Density, Bulk, Rubber (g/cc)
Continuous Use Temp. (°F) / (°C)
ELECTRICAL
Dielectric Constant (1,000 Hz)(3)
8.0
8.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
3.0
3.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
1) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2 after 5 minutes of compression at 10% strain on a 1 mm
thickness material.
2) Thirty-second delay value Shore 000 hardness scale is 70 for 125 mils.
3) Minimum value at 20 mils.
4) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
BERGQUIST® GAP PAD® TGP 3004SF
is a high-performance, 3.0 W/m-K,
thermally conductive gap filling material.
Note: Resultant thickness is defined as the final gap thickness of the application.
BERGQUIST® GAP PAD® TGP 3004SF
Typical Applications Include:
is silicone-free by design and offers
exceptionally low interfacial resistances
to adjacent surfaces. It is designed for
applications that are silicone-sensitive.
BERGQUIST® GAP PAD® TGP 3004SF is
constructed using a 0.25-mils PET film
that provides a no tack surface on one
side and natural tack on the other side.
• Hard disk drives
• HDD case to tray
• HDD/SSD combination drives
• Automotive electronics
• Medical devices
• Solar energy
• Optical components
• LED lighting
• Laser optics
Configurations Available:
• Sheet form and die-cut parts
• Custom thicknesses available upon request
Thermal Interface Selection Guide — GAP PAD® | 25
BERGQUIST® GAP PAD® TGP 3500ULM
Formerly known as GAP PAD® 3500ULM
Highly Conformable, Thermally Conductive, Ultra-Low Modulus Material
Features and Benefits
• Thermal conductivity: 3.5 W/m-K
• Fiberglass-reinforced for shear and tear
resistance
• Non-fiberglass option for applications
that require an additional reduction
in stress
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 3500ULM
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Grey
Grey
Visual
Reinforcement Carrier
Fiberglass or
no fiberglass
Fiberglass or
no fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack
2
2
—
Density, Bulk, Rubber (g/cc)
3.1
3.1
ASTM D792
Heat Capacity ( J/g-K)
Color
1.0
1.0
ASTM E1269
Young’s Modulus (psi) / (kPa)(1)(2)
4
27.5
—
Continuous Use Temp. (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
BERGQUIST® GAP PAD® TGP 3500ULM is
offered with and without fiberglass and
has higher natural inherent tack on one
side of the material, eliminating the need
for thermally impeding adhesive layers.
The top side has minimal tack for ease
of handling. BERGQUIST® GAP PAD® TGP
3500ULM is supplied with protective
liners on both sides.
> 5,000
ASTM D149
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
3.5
3.5
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(4)
10
20
30
0.50
0.44
0.39
1) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2 after 5 minutes of compression at 10% strain on a 1 mm
thickness material.
2) Thirty-second delay value Shore 000 hardness scale is 70 for 125 mils.
3) Minimum value at 20 mils.
4) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 3500ULM
(ultra-low modulus) is an extremely
soft gap filling material with a thermal
conductivity of 3.5 W/m-K. The material
offers exceptional thermal performance at
low pressures due to a unique 3.5 W/m-K
filler package and ultra-low modulus
resin formulation. The enhanced material
is well-suited for high performance
applications requiring extremely low
assembly stress. BERGQUIST® GAP PAD®
TGP 3500ULM maintains a conformable
nature that allows for excellent
interfacing and wet-out characteristics,
even to surfaces with high roughness
and/or topography.
> 5,000
Dielectric Constant (1,000 Hz)(3)
140
120
100
80
60
40
20
0
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 3500ULM
.25
.50
.75
1.00 1.25 1.50 1.75 2.00
Thermal Resistance (°C-in.2/W)
Typical Applications Include:
• Consumer electronics
• Telecommunications
• ASICs and DSPs
• PC applications
Configurations Available:
• Sheet form and die-cut parts
26 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 5000
Formerly known as GAP PAD® 5000S35
High Thermal Conductivity Plus “S-Class” Softness and Conformability
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 5000
• High-thermal conductivity: 5.0 W/m-K
• Highly conformable, “S-Class” softness
PROPERTY
• Naturally-inherent tack reduces
interfacial thermal resistance
Color
• Conforms to demanding contours and
maintains structural integrity with little
or no stress applied to fragile
component leads
• Fiberglass reinforced for puncture,
shear and tear resistance
• Excellent thermal performance at
low pressures
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Light Green
Light Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1-sided)
2
2
—
Density, Bulk, Rubber (g/cc)
3.6
3.6
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
35
35
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
17.5
121
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)
7.5
7.5
ASTM D150
Volume Resistivity (Ω-m)
109
109
ASTM D257
Flame Rating
V-O
V-O
UL 94
5.0
5.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(3)
10
20
30
0.37
0.32
0.29
(1) Thirty-second delay value Shore 00 hardness scale.
(2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
(3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only.
Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Note: Resultant thickness is defined as the final gap thickness of the application.
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP 5000 is a
fiberglass-reinforced filler and polymer
featuring a high thermal conductivity. The
material yields extremely soft characteristics
while maintaining elasticity and
conformability. The fiberglass reinforcement
provides easy handling and converting,
added electrical isolation and tear
resistance. The inherent natural tack
on both sides assists in application and
allows the product to effectively fill air gaps,
enhancing the overall thermal performance.
The top side has reduced tack for ease
of handling. BERGQUIST® GAP PAD®
TGP 5000 is ideal for high-performance
applications at low mounting pressures.
140
120
100
80
60
40
20
0
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP 5000
0.2
0.4
0.6
0.8
1.0
Thermal Resistance (°C-in.2/W)
1.2
Typical Applications Include:
• Voltage Regulator Modules (VRMs) and POLs
• CD-ROMs and DVD-ROMs
• PC Board to chassis
• ASICs and DSPs
• Memory packages and modules
• Thermally-enhanced BGAs
Configurations Available:
• Die-cut parts are available in any shape or size, separated or in sheet form
Thermal Interface Selection Guide — GAP PAD® | 27
BERGQUIST® GAP PAD® TGP 6000ULM
Formerly known as GAP PAD® 6000ULM
Highly Conformable, Thermally Conductive, Ultra-Low Modulus Material
Features and Benefits
• Thermal conductivity: 6 W/m-K
• High compliance, low compression
stress
• Ultra-low modulus
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 6000ULM
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Grey
Grey
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.060 to 0.125
1.524 to 3.175
ASTM D374
Color
Inherent Surface Tack
2
2
—
Density, Bulk, Rubber (g/cc)
3.2
3.2
ASTM D792
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
Young’s Modulus (psi) / (kPa)(1)(2)
6
41.3
—
Continuous Use Temp. (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
BERGQUIST® GAP PAD® TGP 6000ULM is
an extremely soft gap filling material rated
at a thermal conductivity of 6.0 W/m-K. It is
specially formulated for high performance
applications requiring low assembly stress.
The material offers exceptional thermal
performance at low pressures due to the
unique filler package and ultra-low modulus
resin formulation. BERGQUIST® GAP PAD®
TGP 6000ULM is highly conformal, even
to surfaces with high roughness and/
or topography, allowing for excellent
interfacing and wet-out characteristics.
BERGQUIST® GAP PAD® TGP 6000ULM
is offered with a higher natural inherent
tack on both sides of the material,
eliminating the need for thermallyimpeding adhesive layers and allowing
for stick-in-place characteristics during
assembly.
The top side has minimal tack for ease of
handling and rework.
BERGQUIST® GAP PAD® TGP 6000ULM is
supplied with protective liners on both
sides.
> 5,000
> 5,000
ASTM D149
Dielectric Constant (1,000 Hz)(3)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
6.0
6.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in.2/W) 0.040 in.(4)
10
20
30
0.34
0.29
0.26
1) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2 after 5 minutes of compression at 10% strain on a 1 mm
thickness material.
2) Thirty-second delay value Shore 000 hardness scale is 60 for 125 mils.
3) Minimum value at 20 mils.
4) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks assembly
Configurations Available:
• Sheet form: 8” x 16”
• Standard thickness: 0.060”, 0.080”, 0.100”, 0.125”
28 | Thermal Interface Selection Guide — GAP PAD®
BERGQUIST® GAP PAD® TGP 7000ULM
Formerly known as GAP PAD® 7000ULM
High Thermal Conductivity Plus “S-Class” Softness and Conformability
Features and Benefits
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP 7000ULM
• Thermal Conductivity: 7 W/m-K
• High compliance, low compression stress
PROPERTY
• Ultra-low modulus
Color
IMPERIAL VALUE
METRIC VALUE
Gray
Gray
TEST METHOD
Visual
Density, Bulk, Rubber (g/cc)
3.2
3.2
ASTM D792
Heat Capacity ( J/g-K)
1.1
1.1
ASTM E1269
Hardness, Bulk Rubber (Shore 000)(1)
75
75
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
152
152
–
> 5,000
> 5,000
ASTM D149
8.7
8.7
ASTM D150
1.2×1011
1.2×1011
ASTM D257
V-O
V-O
UL 94
7.0
7.0
ASTM D5470
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
Dielectric Constant (1,000 Hz)
Volume Resistivity (Ω-m)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
BERGQUIST® GAP PAD® TGP 7000ULM is an
extremely soft gap filling material rated at a
thermal conductivity of 7.0 W/m-K.
It is specially formulated for highperformance applications requiring low
assembly stress. The material offers
exceptional thermal performance at low
pressures due to the unique filler
package and ultra-low modulus resin
formulation.
BERGQUIST® GAP PAD® TGP 7000ULM
is highly conformal to rough or irregular
surfaces, allowing excellent wet-out at the
interface. Protective liners are supplied on
both sides allowing for ease of use.
(1) Thirty-second delay value Shore 00 hardness scale.
(2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2.
(3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only.
Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Telecommunications (routers, switches and base stations)
• Optical transceivers
• ASICs and DSPs
Configurations Available:
•
Sheet form: 8” x 8”
• Standard thickness: 0.040, 0.060, 0.080, 0.100, 0.125 in.
• (1, 1.5, 2.0, 2.5, 3.18 mm)
Thermal Interface Selection Guide — GAP PAD | 29
BERGQUIST® GAP PAD® TGP EMI1000
Formerly known as GAP PAD® EMI 1.0
Thermally Conductive, Conformable EMI Absorbing Material
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Electromagnetic interference
(EMI) absorbing
• Highly conformable, low hardness
TYPICAL PROPERTIES OF BERGQUIST® GAP PAD® TGP EMI1000
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Black
Black
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (in.) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Color
• Fiberglass reinforced for puncture,
shear and tear resistance
Inherent Surface Tack (1-sided)
1
1
—
Density, Bulk, Rubber (g/cc)
2.4
2.4
ASTM D792
• Electrically isolating
Heat Capacity ( J/g-K)
1.3
1.3
ASTM E1269
Hardness, Bulk Rubber (Shore 00)(1)
5
5
ASTM D2240
Young’s Modulus (psi) / (kPa)(2)
Continuous Use Temp. (°F) / (°C)
10
69
ASTM D575
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (VAC)
> 1,700
> 1,700
ASTM D149
Dielectric Constant (1,000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.0
1.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)(3)
THERMAL PERFORMANCE VS. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in.2/W) 0.040 in.
1.53
1.40
1.25
EMI PERFORMANCE (ASTM D-5568-01 TEST METHOD)
Absorption (4)
dB/in.
dB/cm
at 2.4 GHz
-7
-2.8
at 5 GHz
-14
-5.5
(1) Thirty-second delay value Shore 00 hardness scale.
(2) Young’s Modulus, calculated using 0.01 in./min. step rate of strain with a sample size of 0.79 in.2. Relaxation stress at 40 mils.
(3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only.
Actual application performance is directly related to the surface roughness, flatness and pressure applied.
(4) Based on waveguide testing with 60 mils thickness testing
Thickness vs. Thermal Resistance
BERGQUIST® GAP PAD® TGP EMI1000
140
0
120
-2
Shielding Effectiveness (dB)
Resultant Thickness (mils)
BERGQUIST® GAP PAD® TGP EMI1000 is a
highly conformable, combination gap filling
material offering both thermal conductivity
performance and electromagnetic energy
absorption (cavity resonances and/or crosstalk causing electromagnetic interference)
at frequencies of 1 GHz and higher. The
material offers EMI suppression and 1.0
W/m-K thermal conductivity performance
with low assembly stress. The soft nature
of the material enhances wet-out at the
interface resulting in better thermal
performance than harder materials with a
similar performance rating. BERGQUIST®
GAP PAD® TGP EMI1000 has an inherent,
natural tack on one side of the material,
eliminating the need for thermallyimpeding adhesive layers and allowing
improved handling during placement and
assembly. The other side is tack-free, again
enhancing handling and rework, if required.
BERGQUIST® GAP PAD® TGP EMI1000
is supplied with a protective liner on the
material’s tacky side.
100
80
60
40
20
0
Absorption and Reflection (60 mils)
BERGQUIST® GAP PAD® TGP EMI1000
-4
-6
-8
-10
-12
-14
0
1.00
2.00
3.00
4.00
Thermal Resistance (°C-in2/W)
5.00
6.00
Typical Applications Include:
• Consumer electronics
• Telecommunications
• ASICs and DSPs
• PC applications
Configurations Available:
• Sheet form and die-cut parts
Lorem ipsum
-16
0
1
2
3
4
5
Frequency (GHz)
6
7
8
30 | Thermal Interface Selection Guide — Gap Filler
Gap Filler Liquid Dispensed Materials
Introduction
Effective thermal management is key to ensuring consistent
performance and long-term reliability of many electronic
devices. With the wide variety of applications requiring thermal
management, the need for alternative thermal material solutions
and innovative material placement methods continues to grow.
Henkel’s family of dispensable liquid polymer materials with
unique characteristics is especially designed for ultimate thermal
management design and component assembly flexibility.
Two-Part Gap Filler
BERGQUIST® two-part, cure-in-place materials are dispensed as a
liquid onto the target surface. As the components are assembled,
the material will wet-out to the adjacent surfaces, filling even the
smallest gaps and air voids. Once cured, the material remains
a flexible and soft elastomer, designed to assist in relieving
coefficient of thermal expansion (CTE) mismatch stresses during
thermal cycling. Gap filler is ideally suited for applications where
pads cannot perform adequately, can be used to replace grease
or potting compounds, and is currently used in power supply,
telecom, digital, and automotive applications.
Liquid Gap Filler Key Performance Benefits
Ultra-Low Modulus: Minimal Stress During Assembly
Because gap filler is dispensed and wet-out in its liquid state, the
material will create virtually zero stress on components during
the assembly process. Gap filler can be used to interface even
the most fragile and delicate devices.
Excellent Conformability to Intricate Geometries
Liquid gap filler materials are able to conform to intricate
topographies, including
surfaces. Due to its increased
Thermalmulti-level
Conductivity (W/m-k)
mobility prior to cure, gap filler can fill small air voids, crevices,
and holes, reducing overall thermal resistance to the heat
generating device.
Gap filler solutions provide easy
dispensing and efficient heat transfer
in electronic applications.
Single Solution for Multiple Applications
Unlike pre-cured gap-filling materials, the liquid approach offers
infinite thickness options and eliminates the need for specific
pad thicknesses or die-cut shapes for individual applications.
Efficient Material Usage
Manual or semiautomatic dispensing tools can be used to apply
material directly to the target surface, resulting in effective use
of material with minimal waste. Further maximization of material
usage can be achieved with implementation of automated
dispensing equipment, which allows for precise material
placement and reduces the application time of the material.
Customizable Flow Characteristics
Although gap filler is designed to flow easily under minimal
pressure, it is thixotropic in nature which helps the material
remain in place after dispensing and prior to cure. BERGQUIST®
gap filler offerings include a range of rheological characteristics
and can be tailored to meet customer-specific flow requirements
from self-leveling to highly thixotropic materials that maintain
their form as dispensed.
Liquid Dispensable Gap Filler Thermal Conductivity
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
BERGQUIST®
GAP FILLER
TGF 1000
BERGQUIST®
GAP FILLER
TGF 1000SR
BERGQUIST®
GAP FILLER
TGF 1100SF
BERGQUIST®
GAP FILLER
TGF 1500
BERGQUIST®
GAP FILLER
TGF 1500LV
BERGQUIST®
GAP FILLER
TGF 2000
BERGQUIST®
GAP FILLER
TGF 3600
BERGQUIST®
GAP FILLER
TGF 4000
Thermal Interface Selection Guide — Gap Filler | 31
Frequently Asked Questions
Q: How is viscosity measured?
A: Due to the thixotropic characteristics of most gap filler
materials, special consideration should be given to the test
method(s) used to determine viscosity of these materials.
Because the material viscosity is dependent on shear rate,
different measurement equipment testing under varying
shear rates will produce varied viscosity readings. When
comparing apparent viscosities of multiple materials, it is
important to ensure that the data was generated using the
same test method and test conditions (therefore the same
shear rate). Test methods and conditions for BERGQUIST®
products are noted in the individual Technical Data Sheets.
Q: How are pot life and cure time defined?
A: Two-part gap filler systems begin curing once the two
components are mixed together. Henkel defines the pot
life (working life) of a two-part system as the time for the
viscosity to double after parts A and B are mixed. Henkel
defines the cure time of a two-part material as the time
to reach 90 percent cure after mixing. Two-part gap filler
materials cure at room temperature (25°C), or cure time can
be accelerated with exposure to elevated temperatures.
Q: Can I use my gap filler after the shelf life has expired?
A: Henkel does not advocate using gap filler products beyond
the recommended shelf life and is unable to recertify
material that has expired. In order to ensure timely use
of product, Henkel recommends a first-in-first-out (FIFO)
inventory system.
Q: How should I store my gap filler?
A: Unless otherwise indicated on Technical Data Sheets, twopart gap filler products should be stored in the original
sealed container in a climate-controlled environment
at or below 25°C and 50% relative humidity. If stored at
reduced temperatures, materials should be placed at room
temperature and allowed to stabilize prior to use. Unless
otherwise noted, all cartridges and tubes should be stored in
Henkel-defined packaging with the nozzle end down.
Q: Do temperature excursions above 25°C affect the
shelf life?
A: Short periods of time above the recommended storage
temperature, such as during shipping, have not been shown
to affect the material characteristics.
Q: Does gap filler have adhesive characteristics?
A: Although gap filler is not designed as a structural adhesive,
when cured, it has a low level of natural tack, which will
allow the material to adhere mildly to adjacent components.
This aids in keeping the material in the interface throughout
repeated temperature cycling and eliminates pump-out from
the interface.
Q: Is gap filler reworkable?
A: In many cases, gap filler can be reworked. The ease of rework
is highly dependent on the topography of the application as
well as the coverage area.
Q: What container sizes are available for gap filler?
A: Two-part materials are available in several standard dual
cartridge sizes including 50 cc (25 cc each of parts A and B)
and 400 cc (200 cc each of parts A and B). Gap filler products
are also available in kits of 1200 cc (two stand-alone 600
cc containers, one of each part) and 10-gallon (two 5-gallon
pails, one of each part) sizes for higher volume production.
Other special and custom container sizes are available
upon request.
Q: How do I mix a two-part gap filler?
A: Disposable plastic static mixing nozzles are used to mix parts
A and B together at the desired ratio. Static mixers can be
attached to the ends of cartridges or mounted on automated
dispensing equipment. They are reliable, accurate and
inexpensive to replace after extended down times. Unless
otherwise indicated, mixing nozzles with a minimum of 21
mixing elements are recommended to achieve proper mixing.
Q: What is the tolerance on the mix ratio?
A: Two-part materials should be mixed to the stated mix
ratio by volume within a +/-5% tolerance to ensure
proper material characteristics. If light-colored streaks
or marbling are present in the material, there has been
inadequate mixing. Henkel recommends purging newly
tapped containers through the static mixer until a
uniform color is achieved. In order to ensure consistent
material characteristics and performance, BERGQUIST®
two-part systems are to be used with matching
part A and B lot numbers.
Q: What options are available for dispensing material
onto my application?
A: Henkel can provide manual or pneumatic applicator guns
for products supplied in dual cartridge form. Gap filler
supplied in high volume container kits can be dispensed
via automated dispensing equipment for high-speed in-line
manufacturing. Henkel and our other experienced automated
dispensing equipment partners can further assist our
customers in creating an optimized dispensing process. For
information regarding dispensing equipment, contact your
local Henkel representative. For some materials, screen or
stencil application may be an option and should be evaluated
on a case by case basis.
Q: Should I be concerned about gap filler compatibility
with other materials in my application?
A: Although not common, it is possible to encounter materials
that can affect the cure of a two-part gap filler. A list of
general categories of compounds that may inhibit the rate
of cure or poison the curing catalyst in gap filler products
is available to help assist with material compatibility
evaluation. Please contact your local Henkel representative
for more details.
32 | Thermal Interface Selection Guide — Gap Filler
BERGQUIST® GAP FILLER TGF 1000
Formerly known as GAP FILLER 1000 (Two-Part)
Thermally Conductive, Liquid Gap-Filling Material
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
TYPICAL PROPERTIES OF BERGQUIST® GAP FILLER TGF 1000
• Ultra-conforming; designed for fragile
and low-stress applications
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color – Part A
Grey
Grey
Visual
• Ambient and accelerated
cure schedules
Color – Part B
White
White
Visual
Viscosity as Mixed (cP)(1)
100,000
100,000
ASTM D2196
Density (g/cc)
1.6
1.6
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life at 25°C (months)
6
6
—
Grey
Grey
Visual
30
30
ASTM D2240
• 100% solids – no cure by-products
• Excellent low- and high-temperature
mechanical and chemical stability
PROPERTY
PROPERTY AS CURED
Color
Hardness (Shore 00)(2)
Heat Capacity ( J/g-K)
1.0
1.0
ASTM E1269
-76 to 347
-60 to 175
—
Dielectric Strength (V/mil) / (V/25 µm)
500
500
ASTM D149
Dielectric Constant (1,000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.0
1.0
ASTM D5470
Continuous Use Temp. (°F) / (°C)
ELECTRICAL AS CURED
THERMAL AS CURED
Thermal Conductivity (W/m-K)
BERGQUIST® GAP FILLER TGF 1000
is a thermally conductive, liquid gap
filling material. It is supplied as a
two-component, room or elevated
temperature curing system. The material
is formulated to provide a balance of
cured material properties highlighted by
a low modulus and good compression set
(memory). The result is a soft, thermally
conductive, form-in-place elastomer ideal
for coupling “hot” electronic components
mounted on PC boards with an adjacent
metal case or heat sink. Before cure,
BERGQUIST® GAP FILLER TGF 1000 flows
under pressure like a grease. After cure,
it does not pump from the interface as a
result of thermal cycling. Unlike thermal
grease, the cured product is dry to the
touch. Unlike cured gap-filling materials,
the liquid approach offers infinite
thickness variations with little or no stress
during displacement and eliminates the
need for specific pad thickness and diecut shapes for individual applications.
BERGQUIST® GAP FILLER TGF 1000 is
intended for use in thermal interface
applications when a strong structural
bond is not required.
CURE SCHEDULE
Pot Life at 25°C (min.)(3)
15
15
—
Cure at 25°C (min.)(4)
60 - 120
60 - 120
—
Cure at 100°C (min.)(4)
5
5
—
1) Brookfield RV, Heli-Path, Spindle TF at 20 rpm, 25°C.
2) Thirty-second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Time to read 90% cure.
Typical Applications Include:
• Automotive electronics
• Computers and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
• Thermally conductive vibration dampening
Configurations Available:
• Supplied in cartridge and kit form
Thermal Interface Selection Guide — Gap Filler | 33
GAP FILLER 1000SR (Two-Part)
Formerly known as GAP FILLER 1000SR (Two-Part)
Thermally Conductive, Liquid Gap-Filling Material
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
TYPICAL PROPERTIES OF BERGQUIST® GAP FILLER TGF 1000SR
• Excellent slump resistance (stays
in place)
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color – Part A
PROPERTY
Violet
Violet
Visual
• Ultra-conforming, with excellent wetout for low stress interface applications
Color – Part B
White
White
Visual
Viscosity, High Shear (cP)(1)
20,000
20,000
ASTM D5099
Density (g/cc)
2.0
2.0
ASTM D792
• 100% solids – no cure by-products
Mix Ratio
1:1
1:1
—
• Excellent low- and high-temperature
mechanical and chemical stability
Shelf Life at 25°C (months)
6
6
—
Violet
Violet
Visual
75
75
ASTM D2240
PROPERTY AS CURED
Color
Hardness (Shore 00)(2)
Heat Capacity ( J/g-K)
Continuous Use Temp. (°F) / (°C)
1.0
1.0
ASTM D1269
-76 to 347
-60 to 175
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil) / (V/25 µm)
500
500
ASTM D149
Dielectric Constant (1,000 Hz)
5.1
5.1
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.0
1.0
ASTM D5470
Pot Life at 25°C (min.)(3)
60
60
—
Cure at 25°C (hr.)(4)
20
20
—
Cure at 100°C (min.)(4)
10
10
—
THERMAL AS CURED
Thermal Conductivity (W/m-K)
CURE SCHEDULE
BERGQUIST® GAP FILLER TGF 1000SR is a
two-part, thermally conductive, liquid gap
filling material that features exceptional
slump resistance. The mixed system will
cure at room temperature and can be
accelerated with the addition of heat.
Unlike cured thermal pad materials, a
liquid approach offers infinite thickness
variations with little or no stress to
sensitive components during assembly.
As cured, BERGQUIST® GAP FILLER
TGF 1000SR provides a soft, thermally
conductive, form-in-place elastomer that
is ideal for fragile assemblies or for filling
unique and intricate air voids and gaps.
BERGQUIST® GAP FILLER TGF 1000SR
exhibits low level natural tack
characteristics and is intended for use
in applications where a strong structural
bond is not required.
Capillary Viscosity, Initial, 4,500 s-1. Part A and B measured separately.
1)
2) Thirty-second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Time to read 90% cure.
Typical Applications:
• Automotive electronics
• Computers and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
Configurations Available:
• Supplied in cartridge or kit form
34 | Thermal Interface Selection Guide — Gap Filler
BERGQUIST® GAP FILLER TGF 1100SF
Formerly known as GAP FILLER 1100SF (Two-Part)
Thermally Conductive, Silicone-Free, Liquid Gap-Filling Material
Features and Benefits
• Thermal conductivity: 1.1 W/m-K
• No silicone outgassing or extraction
• Ultra-conforming; designed for fragile
and low-stress applications
TYPICAL PROPERTIES OF BERGQUIST® GAP FILLER TGF 1100SF
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color – Part A
PROPERTY
Yellow
Yellow
Visual
Color – Part B
Red
Red
Visual
450,000
450,000
ASTM D2196
Viscosity as Mixed (cP)(1)
• Ambient and accelerated
cure schedules
Density (g/cc)
2.0
2.0
ASTM D792
Mix Ratio
1:1
1:1
—
• 100% solids – no cure by-products
Shelf Life at 25°C (months)
6
6
—
Orange
Orange
Visual
60
60
ASTM D2240
PROPERTY AS CURED
BERGQUIST® GAP FILLER TGF 1100SF is
the thermal solution for silicone-sensitive
applications. The material is supplied as
a two-part component, curing at room
or elevated temperatures. The material
exhibits low modulus properties, then
cures to a soft, flexible elastomer, helping
reduce thermal cycling stresses during
operation and virtually eliminating stress
during assembly of low-stress applications.
The two components are colored to
assist as a mix indicator (1:1 by volume).
The mixed system will cure at ambient
temperature. Unlike cured thermal pad
materials, the liquid approach offers
infinite thickness variations with little or
no stress during assembly displacement.
BERGQUIST® Gap Filler TGF 1100SF,
although exhibiting some natural tack
characteristics, is not intended for use in
thermal interface applications requiring a
mechanical structural bond.
Application
BERGQUIST® GAP FILLER TGF 1100SF
can be mixed and dispensed using dualtube cartridge packs with static mixers
and manual or pneumatic gun or high
volume mixing and dispensing equipment
(application of heat may be used to reduce
viscosity).
Color
Hardness (Shore 00)(2)
Heat Capacity ( J/g-K)
0.9
0.9
ASTM E1269
-76 to 257
-60 to 125
—
Dielectric Strength (V/mil) / (V/25 µm)
400
400
ASTM D149
Dielectric Constant (1,000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.1
1.1
ASTM D5470
Continuous Use Temp. (°F) / (°C)
ELECTRICAL AS CURED
THERMAL AS CURED
Thermal Conductivity (W/m-K)
CURE SCHEDULE
Pot Life at 25°C(3)
240 min. (4 hr.)
240 min. (4 hr.)
—
Cure at 25°C (hr.)(4)
24
24
—
Cure at 100°C (min.)(4)
10
10
—
1) Brookfield RV, Heli-Path, Spindle TF at 2 rpm, 25°C.
2) Thirty-second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Time to read 90% cure.
TEMPERATURE DEPENDENCE OF VISCOSITY
The viscosity of the BERGQUIST® GAP FILLER TGF
1100SF material is temperature dependent. The
table below provides the multiplication factor to
obtain viscosity at various temperatures. To obtain
the viscosity at a given temperature, look up the
multiplication factor at that temperature and multiply
the corresponding viscosity at 25°C.
Temperature
°C
20
25
35
45
50
Multiplication Factor
Part A
Part B
1.43
1.57
1.00
1.00
0.58
0.50
0.39
0.30
0.32
0.24
Typical Applications Include:
• Silicone-sensitive optic components
• Mechanical switching relays
• Silicone-sensitive electronics
• Hard disk assemblies
• Filling various gaps between heatgenerating devices to heat sinks and
housings
• Dielectrics for bare-leaded devices
Configurations Available:
• Supplied in cartridge or kit form
Thermal Interface Selection Guide — Gap Filler | 35
BERGQUIST® GAP FILLER TGF 1400SL
Formerly known as GAP FILLER 1400SL
Thermally Conductive, Self-Leveling, Liquid Gap-Filling Material
Features and Benefits
• Thermal Conductivity: 1.4 W/m-K
• Self-leveling
• Very soft
• Vibration dampening
TYPICAL PROPERTIES OF BERGQUIST® GAP FILLER TGF 1400SL
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color – Part A
Yellow
Yellow
Visual
Color – Part B
White
White
Visual
Viscosity as Mixed (cP)(1)
5,000
5,000
ASTM D2196
Density (g/cc)
2.5
2.5
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life at 25°C (months)(2)
6
6
—
PROPERTY AS CURED
Color
Yellow
Yellow
Visual
Hardness (Shore 00)(3)
40
40
ASTM D2240
Heat Capacity ( J/g-K)
0.9
0.9
ASTM D1269
Siloxane Content, ∑D4- D10 (ppm)
40
40
—
Continuous Use Temp. (°F) / (°C)
-76 to 392
-60 to 200
—
Dielectric Strength (V/mil) / (V/25 µm)
250
250
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ω-m)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
UL 94
1.4
1.4
ASTM D5470
Pot Life at 25°C (min.) (4)
120
120
—
Cure at 25°C (hr.)(5)
24
24
—
Cure at 100°C (min.)(5)
30
30
—
ELECTRICAL AS CURED
BERGQUIST® GAP FILLER TGF 1400SL is a
two-part, thermally conductive, silicone
based, liquid gap filling material. This
material has an extremely low viscosity
to enable self-leveling and filling of voids
resulting in excellent thermal transfer.
Unlike cured thermal pad materials, a
liquid approach offers infinite thickness
variations with little or no stress to the
sensitive components during assembly.
As cured, BERGQUIST® GAP FILLER
TGF 1400SL provides a soft, thermally
conductive, form-in-place elastomer that
is ideal for fragile assemblies and filling
unique and intricate gaps.
BERGQUIST® GAP FILLER TGF 1400SL
exhibits low level natural tack
characteristics and is intended for use
in applications where a strong structural
bond is not required.
THERMAL AS CURED
Thermal Conductivity (W/m-K)
CURE SCHEDULE
(1) Brookfield Rheometer, Part A and Part B mixed 1:1 ratio.
(2) See application note for storage and handling recommendations.
(3) Thirty-second delay value, Shore 00 scale.
(4) Time for viscosity to double.
(5) Time to read 90% cure.
Typical Applications Include:
• Automotive electronics
• Telecommunications
• Silicone-sensitive applications
• Lighting
• Power Supplies
• Encapsulating semiconductors and
magnetic components with heatsink
Dispensing
Due to its low viscosity nature,
BERGQUIST® GAP FILLER TGF 1400SL will
settle upon storage. Each container must
be thoroughly mixed before combining
Part A and Part B via static mixer and
dispensing into application.
Configurations Available:
• Available for order in 1200 cc kits and 7-gallon pail formats
36 | Thermal Interface Selection Guide — Gap Filler
BERGQUIST® GAP FILLER TGF 1500
Formerly known as GAP FILLER 1500 (Two-Part)
Thermally Conductive, Liquid Gap-Filling Material
Features and Benefits
• Thermal conductivity: 1.8 W/mK
TYPICAL PROPERTIES OF BERGQUIST® GAP FILLER TGF 1500
• Optimized shear thinning
characteristics for ease of dispensing
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color – Part A
PROPERTY
Yellow
Yellow
Visual
• Excellent slump resistance
(stays in place)
Color – Part B
White
White
Visual
Viscosity, High Shear (cP)(1)
25,000
25,000
ASTM D5099
Density (g/cc)
2.7
2.7
ASTM D792
• Ultra-conforming with excellent wetout for low stress interface applications
Mix Ratio
1:1
1:1
—
Shelf Life at 25°C (months)
6
6
—
• 100% solids – no cure by-products
PROPERTY AS CURED
• Excellent low- and high-temperature
mechanical and chemical stability
Color
Yellow
Yellow
Visual
50
50
ASTM D2240
Hardness (Shore 00)(2)
Heat Capacity ( J/g-K)
1.0
1.0
ASTM D1269
-76 to 392
-60 to 200
—
Dielectric Strength (V/mil) / (V/25 µm)
400
400
ASTM D149
Dielectric Constant (1,000 Hz)
6.4
6.4
ASTM D150
Volume Resistivity (Ω-m)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
UL 94
ASTM D5470
Continuous Use Temp. (°F) / (°C)
ELECTRICAL AS CURED
THERMAL AS CURED
Thermal Conductivity (W/m-K)
CURE SCHEDULE
1.8
1.8
SCHEDULE 1
SCHEDULE 2
Pot Life at 25°C(3)
BERGQUIST® GAP FILLER TGF 1500 is a
two-part, high performance, thermally
conductive, liquid gap-filling material,
which features exceptional slump
resistance and high shear thinning
characteristics for optimized consistency
and control during dispensing. The mixed
system will cure at room temperature
and can be accelerated with the
addition of heat. Unlike cured thermal
pad materials, a liquid approach offers
infinite thickness variations with little
or no stress to the sensitive components
during assembly. BERGQUIST® GAP
FILLER TGF 1500 exhibits low level natural
tack characteristics and is intended
for use in applications where a strong
structural bond is not required. As cured,
BERGQUIST® GAP FILLER TGF 1500
provides a soft, thermally conductive,
form-in-place elastomer that is ideal for
fragile assemblies and filling unique and
intricate air voids and gaps.
60 min.
480 min. (8 hr.)
—
Cure at 25°C(4)
5 hr.
3 days
—
Cure at 100°C(4)
10 min.
30 min.
—
1) Capillary viscosity, initial, 3000 sec-1. Part A and B measured separately.
2) Thirty-second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Time to read 90% cure.
Typical Applications Include:
• Automotive electronics
• Computers and peripherals
• Between any heat generating semiconductor and a heat sink
• Telecommunications
Configurations Available:
• Supplied in cartridge or kit form
• With or without glass beads
Thermal Interface Selection Guide — Gap Filler | 37
BERGQUIST® GAP FILLER TGF 1500LVO
Formerly known as GAP FILLER 1500LV (Two-Part)
Thermally Conductive, Liquid Gap-Filling Material
Features and Benefits
• Thermal conductivity: 1.8 W/m-K
TYPICAL PROPERTIES OF BERGQUIST® GAP FILLER TGF 1500LVO
• Low volatility for silicone-sensitive
applications
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color – Part A
PROPERTY
Yellow
Yellow
Visual
• Ultra-conforming, with excellent
wet-out
Color – Part B
White
White
Visual
Viscosity, High Shear (Pa-s)(1)
20
20
ASTM D5099
Density (g/cc)
2.7
2.7
ASTM D792
• 100% solids — no cure by-products
Mix Ratio
1:1
1:1
—
• Excellent low- and high-temperature
chemical and mechanical stability
Shelf Life at 25°C (months)
6
6
—
Yellow
Yellow
Visual
80
80
ASTM D2240
PROPERTY AS CURED
Color
Hardness (Shore 00)(2)
Heat Capacity ( J/g-K)
1.0
1.0
ASTM D1269
Siloxane Content, SD4-D10 (ppm)
< 100
12 in.
Rule Defined
Features (2)
± 0.015 in. (0.38 mm)
± 0.010 in. (0.25 mm)
± 0.020 in. (0.51 mm) ± 0.020 in. (0.51 mm) ± 0.020 in. (0.51 mm)
TYPICAL GAP PAD® TOLERANCES (3)
Material
Thickness
Length and Width Tolerance
Hole Location
and Diameter
10 mils
± 0.015 in. (0.38 mm)
± 0.015 in. (0.38 mm)
15 mils
± 0.015 in. (0.38 mm)
± 0.015 in. (0.38 mm)
20 mils
± 0.020 in. (0.51 mm)
± 0.020 in. (0.51 mm)
30 mils
± 0.030 in. (0.76 mm)
± 0.030 in. (0.76 mm)
40 mils
± 0.035 in. (0.89 mm)
± 0.035 in. (0.89 mm)
50 mils
± 0.040 in. (1.02 mm)
± 0.040 in. (1.02 mm)
60 mils
± 0.050 in. (1.27 mm)
± 0.050 in. (1.27 mm)
70 mils
± 0.050 in. (1.27 mm)
± 0.050 in. (1.27 mm)
80 mils
± 0.050 in. (1.27 mm)
± 0.050 in. (1.27 mm)
100 mils
± 0.060 in. (1.52 mm)
± 0.060 in. (1.52 mm)
125 mils
± 0.075 in. (1.91 mm)
± 0.075 in. (1.91 mm)
140 mils
± 0.100 in. (2.54 mm)
± 0.100 in. (2.54 mm)
160 mils
± 0.100 in. (2.54 mm)
± 0.100 in. (2.54 mm)
200 mils
± 0.125 in. (3.17 mm)
± 0.125 in. (3.17 mm)
225 mils
± 0.160 in. (4.06 mm)
± 0.160 in. (4.06 mm)
250 mils
± 0.160 in. (4.06 mm)
± 0.160 in. (4.06 mm)
1) Material thicknesses: < 6 in. (152.4 mm), 6 – 12 in. (152.4 – 304.8 mm), > 12 in. (304.8 mm).
2) Rule defined by geometry can be notches, internal shapes not created by a punch or cutouts that are created by
a rule and not a punch.
3) BERGQUIST® GAP PAD® TGP 800VO materials have a SIL PAD® side / cutline tolerance of parts on the liner
to within ± 0.020 in. (0.51 mm) typically, GAP PAD® may deform to the standard tolerances when handled or
removed from the liner.
Note: Dependent upon material and application requirements, tighter tolerances may be feasible and available.
Please contact Henkel Sales for these requests and additional information regarding tolerances.
• Typical number of splices per roll: 3
• Typical butt splice: 2-sided colored tape
Note: Tighter tolerances are available per factory review.
Sheets:
Standard sheet size for most materials is 12 in. x 12 in., with or
without adhesive as specified on the individual data sheet.
When ordering sheets, please specify material type, thickness
and include all dimensions. Contact Henkel Sales if other sizes
are required.
Note: BERGQUIST® SIL PAD® TSP A3000 maximum sheet size is
10 in. x 12 in. GAP PAD® standard sheet size is 8 in. x 16 in.
Rolls:
SIL PAD® materials are available in roll form, with or without
adhesive, with the exception of BERGQUIST® SIL PAD® TSP 2200
and BERGQUIST® SIL PAD® TSP 3500. HI-FLOW materials are
available in roll form. Certain GAP PAD® materials are available in
roll form. Please contact Henkel Sales for more information.
Color Matching:
We identify product color as a reference product characteristic
and/or specification for SIL PAD® and GAP PAD® products. Slight
color variation is normal across lot-to-lot splicing due to the
different variations in natural colorants used to achieve the
desired hue and shade in these products. We continue to monitor
and control incoming raw material specifications
and production processes to ensure the highest possible
consistency of quality and product performance. If you have
any questions regarding color matching, please contact
Henkel Product Management.
Thermal Interface Selection Guide — Ordering | 103
Ordering Information
Adhesives:
BERGQUIST® adhesives include:
SILICONE: (AC)
– Unloaded
(ACA) – Unloaded, Low Tack
(TAC) – Loaded (Thermally Enhanced)
ACRYLIC: (AAC) – Unloaded
(TAAC) – Thermally Loaded
(EAAC) – Thermally Enhanced
Acrylic Adhesives: One (1) year from date of manufacture
when stored in original packaging at 70°F (21°C) and 50%
relative humidity.
Peel adhesion data is available upon request. Please contact
Henkel Sales for more information.
PSA Characteristics:
THICKNESS: 0.0005 in. – 0.001 in., (12 – 25 µm)
(adhesive only)
Note: For non-symmetrical parts, please indicate on print which
side the adhesive is on.
Peel Strength: See data below.
POL = Peel-Off Liner (force per unit width of the liner to the
adhesive)
QS = Quick Stick (simulated force per unit width of the adhesive
to the heat sink)
g/in. = Grams per inch
TYPICAL ADHESIVE PROPERTIES
ADHESIVE
POL
QS
50 – 150 g/in.
Silicone AC
50 – 150 g/in.
Silicone ACA
5 – 70 g/in.
5 – 150 g/in.
Silicone TAC
50 – 150 g/in.
50 – 150 g/in.
Acrylic AAC
5 – 70 g/in.
100 – 800 g/in.
Acrylic TAAC
5 – 70 g/in.
100 – 400 g/in.
Acrylic EAAC
5 – 60 g/in.
100 – 200 g/in.
Note: These values are typical after the material has aged for
2 – 3 weeks and are significantly different immediately after
coating. Upon completion of coating, QS is 250 – 500 g/in. and
POL is 3 – 20 g/in. for all silicone adhesives.
Shelf Life:
Silicone Adhesives: Six (6) months from date of manufacture
when stored in original packaging at 70°F (21°C) and 50%
relative humidity.
Standard pressure sensitive adhesive coated on one side of a
SIL PAD® will increase the thermal resistance (per ASTM D5470)
by 0.2°C-in.2/W. Standard pressure sensitive adhesive on two
sides increases the thermal impedance by 0.4°C-in.2/W.
Thermally conductive pressure sensitive adhesive on one side
increases the thermal resistance by 0.05°C-in.2/W and on two
sides by 0.1°C-in.2/W.
The effect of an adhesive layer on the thermal impedance in an
application will vary. In low-pressure applications, the pressure
sensitive adhesive will wet-out the interface easier and eliminate
the interfacial thermal resistance.
UL Recognition:
For information regarding the UL (Underwriters Laboratories,
Inc.) recognition status of Henkel (BERGQUIST®) SIL PAD®,
GAP PAD® and HI-FLOW materials, the UL web site provides the
most current information.
Using the URL: http://www.ul.com, select “Online Certification
Directory.” You may then enter one of the following file numbers
for the applicable BERGQUIST® file:
QMFZ2.E59150: Plastics – Component. This category includes all
SIL PAD®, GAP PAD® and HI-FLOW materials.
QOQW2.E81718: Polymeric Adhesive Systems, Electrical
Equipment – Component. This category includes
BOND-PLY adhesive only.
In each group there is a “Guide Information” section which gives
a detailed description of the categories listed and all recognized
materials will be listed with supporting data.
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to replace
such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and
liability whatsoever in connection there-with. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order
or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
© Copyright 2019, Henkel Corporation. All rights reserved.
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