8329TCM-200ML

8329TCM Heatsink Adhesive 8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark grey, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS. Cured Properties Features & Benefits • High thermal conductivity • 1:1 mix ratio • Provides strong electrical insulation • Bonds well to a wide variety of substances • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons Available Packaging Cat. No. Packaging Net Vol. Net Wt. 8329TCM-6ML 2 Syringe Kit 6 mL 14.8 g 8329TCM-50ML 2 Jar Kit 50 mL 121 g Contact Information MG Chemicals, 1210 Corporate Drive Burlington, Ontario, Canada L7L 5R6 Email: support@mgchemicals.com Phone: North America: +(1)800-340-0772 International: +(1) 905-331-1396 Europe: +(44)1663 362888 Resistivity 9 x 1012 Ω·cm Hardness 77 D Tensile Strength 10 N/mm2 Compressive Strength 34 N/mm2 Lap Shear (stainless steel) 6.4 N/mm2 (aluminum) 6.1 N/mm2 Glass Transition Temperature (Tg) 46 ˚C CTE Prior Tg 71 ppm/˚C CTE After Tg 131 ppm/˚C Thermal Conductivity @ 25 ˚C 1.4 W/(m·K) Service Temperature Range -40–150 ˚C Usage Parameters Working Time Mix Ratio by Volume Mix Ratio by Weight 45 min 1:1 0.93:1 Uncured Properties Mixed Density Viscosity @ 25 ˚C ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 (A) (B) 05 July 2023 / Ver. 4.2 2.41 g/mL 780 Pa·s 810 Pa·s 1 8329TCM Application Instructions Cure Instructions Read the product SDS and Application Guide for more detailed instructions before using this product (downloadable at www.mgchemicals.com). Allow to cure at room temperature for 24 hours, or cure the adhesive in an oven at one of these time/temperature options: Recommended Preparation Temperature Time Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues. Syringe 1. Twist and remove the cap from the syringe. Do not discard cap. 2. Measure 1 part by volume of A. 3. Measure 1 part by volume of B. 4. Dispense material on a mixing surface or container, and thoroughly mix parts A and B together. 5. To stop the flow, pull back on the plunger. 6. Clean nozzle to prevent contamination and material buildup. 7. Replace the cap on the syringe. 65 °C 1 hour 80 °C 45 minutes 100 °C 20 minutes Storage and Handling Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use. Can or Jar 1. Stir each part individually to re-incorporate material that may have separated during storage. 2. Measure 0.93 part by weight of A. 3. Measure 1 part by weight of B. 4. Thoroughly mix parts A and B together. 5. Apply adhesive to the application area. Disclaimer This information is believed to be accurate. It is intended for professional end-users who have the skills required to evaluate and use the data properly. M.G. Chemicals Ltd. does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it. ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 05 July 2023 / Ver. 4.2 2