SS12

SS12 THRU SS1200 Reverse Voltage - 20 to 200 Volts Forward Current - 1.0 Ampere SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features DO-214AC/SMA  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0     For surface mounted applications Metal silicon junction,majority carrier conduction Low power loss,high efficiency Built-in strain relief,ideal for automated placement 0.110(2.80) 0.090(2.30) 0.067 (1.70) 0.051 (1.30)  High forward surge current capability  High temperature soldering guaranteed: 0.177(4.50) 0.150(3.80) 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.097(2.45) 0.073(1.85) Mechanical Data 0.061(1.55) 0.029(0.75) Ca s e : JEDEC DO-214AC/SMA molded plastic body Termina ls : Solderable per MIL-STD-750,Method 2026 Po larity : Color band denotes cathode end Moun ting Po s ition : Any Weigh t : 0.002 ounce, 0.07 grams 0.008(0.20) 0.002(0.05) 0.209(5.30) 0.184(4.70) Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS MDD SS12 MDD SS13 MDD SS14 MDD SS15 MDD SS16 MDD SS18 MDD SS110 MDD SS1150 MDD SS1200 UNITS Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 80 100 150 200 V Maximum RMS voltage Maximum DC blocking voltage VRMS VDC 14 20 21 30 28 40 35 50 42 60 56 80 70 100 105 150 140 200 V V Marking Code I(AV) 1.0 A 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 25 A Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA=25℃ at rated DCblocking voltage TA=100℃ VF Maximum average forward rectified current Peak forward surge current Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range 0.55 0.3 10.0 IR CJ 110 0.70 0.85 0.2 5.0 0.9 V 0.1 2.0 pF 80 RθJA 90.0 TJ -55 to +150 ℃ TSTG -55 to +150 ℃ ℃/W Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0”x2.0”(5.0x5.0cm) copper pad areas http://www.microdiode.com mA Rev:2025A5 Page :1 SS12 THRU SS1200 Reverse Voltage - 20 to 200 Volts Forward Current - 1.0 Ampere Typical Characterisitics Fig.1 Forward Current Derating Curve Fig.2 Typical Reverse Characteristics Instaneous Reverse Current ( μA) Average Forward Current(A) 1.5 1.0 0.5 Single phase half-wave 60 Hz resistive or inductive load 0.0 25 50 75 100 125 150 10 4 10 3 10 2 TJ=100°C TJ=75°C SS12~SS16 SS18~SS1200 101 10 TJ=25°C 0 0 Case Temperature(℃) 40 20 60 100 80 Percent of Rated Peak Reverse Voltage（%） Fig.3 Typical Forward Characteristic Fig.4 Typical Junction Capacitance 500 20 TJ=25°C 200 1.0 Junction Capacitance (pF) Instaneous Forward Current (A) 10 SS12~SS14 SS15~SS16 SS18~SS110 SS1150~SS1200 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 100 50 SS12~SS14 20 SS15~SS1200 10 1.8 0.1 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current 100 25 20 15 10 05 8.3 ms Single Half Sine Wave (JEDEC Method) 1 10 Number of Cycles at 60Hz 100 Transient Thermal Impedance（°C/W） Peak Forward Surage Current (A) 100 Fig.6- Typical Transient Thermal Impedance 30 00 10 1 Reverse Voltage (V) Instaneous Forward Voltage (V) 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） The curve above is for reference only. http://www.microdiode.com Rev:2025A5 Page :2 SS12 THRU SS1200 Reverse Voltage - 20 to 200 Volts Forward Current - 1.0 Ampere Packing information unit:mm P0 P1 Item D1 Symbol Tolerance SMA A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.33 2.36 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.28 12.00 18.00 d E W1 F B A W P D2 T C D Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE SMA REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) 13" 5,000 4. 0 10,000 340*350*40 330 370*370*370 CARTON (pcs) 80,000 Suggested Pad Layout Symbol A Unit (mm) 1.68 Unit (inch) 0.066 B 1.52 0.060 C 3.93 0.154 D 2.41 0.095 E 5.45 0.215 Important Notice and Disclaimer Microdiode Electronics (Shenzhen) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Shenzhen) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Shenzhen) assume any liability for application assistance or customer product design. Microdiode Electronics (Shenzhen) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Shenzhen). Microdiode Electronics (Shenzhen) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Shenzhen). http://www.microdiode.com Rev:2025A2 Page :3