UMB10S

UMB2S THRU UMB10S Voltage Range - 200 to 1000 V olts Current - 0.5/0.8 Ampere GLASS PASSIVATED ULTRA FAST RECOVERY BRIDGE RECTIFIERS Features MBS  Ideal for printed circuit board .043(1.10) .028(0.70)  Reliable low cost construction utilizing molded plastic technique .193(4.90) .177(4.50) .053(1.53) .037(0.95)  High temperature soldering guaranteed: 260°/10 seconds at 5 .033(0.84) .022(0.56) lbs., (2.3kg) tension + .157(4.00)  Small size, simple installation  High surge current capability .276(7.0) MAX .142(3.60) .083(2.12) .043(1.10) .014(0.35) .006(0.15) .102(2.60) .087(2.20) Mechanical Data （1） （2） - Case : JEDEC MBS Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.0035 ounce, 0.1 grams .106(2.70) .118(3.0) .090(2.30) MAX + .008(0.20) MAX ~ ~ （4） （3） Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25°C ambient temperature unlss otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS MDD UMB2S MDD UMB4S MDD UMB6S MDD UMB8S MDD UMB10S UNITS VRRM VRMS VDC 200 140 200 400 280 400 600 420 600 800 560 800 1000 700 1000 V V V Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current On glass-epoxy P.C.B.(Note1) On aluminum substrate(Note2) Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current TA=25°C at rated DC blocking voltage TA=100°C Maximum reverse recovery time Typical thermal resistance(NOTE 3) Operating temperature range storage temperature range (NOTE 4) IF(AV) 0.5 0.8 A IFSM 30 A VF 1.0 1.4 RθJL RθJA TJ TSTG 50 V uA mA 5 0.5 IR trr 1.7 75 28 85 -55 to +150 -55 to +150 ns °C/W °C °C NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads. 2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad. 3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)copper pads. 4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A. http://www.microdiode.com Rev:2024A1 Page :1 UMB2S THRU UMB10S Voltage Range - 200 to 1000 V olts Current - 0.5/0.8 Ampere Ratings And Characteristic Curves FIG.2 PEAK FORWARD SURGE CURRENT FIG.1 FORWARD DERATING CURVE 35 Peak Forward Surge Current, (A) Average Forward Rectified Current, (A) 0.8 Aluminum Substrate 0.7 0.6 0.5 0.4 Glass Epoxy P.C.B. 0.3 0.2 0.1 0 0 20 40 60 80 100 120 140 ) 160 30 25 20 15 10 5 0 1 Ambient Temperature, (°C ) Number Of Cycles At 60Hz FIG.3 TYPICAL FORWARD CHARACTERISTICS FIG.4 TYPICAL REVERSE CHARACTERISTICS 100 20 10 TJ=25 C PULSE WIDTH=300 µs 2%DUTY CYCLE 1 0.1 UMB2S UMB4S UMB6S-UMB10S 0.2 0.6 1.0 1.4 1.8 2.0 Instantaneous Reverse Leakage Current, ( A) Instantaneous Forward Current, (A) 100 10 TJ=125 10 1 0.1 TJ=25 0.01 0 Instantaneous Forward Voltage, ( V ) 20 40 60 80 100 Percent Of Rated Peak Reverse Voltage, % The curve above is for reference only. http://www.microdiode.com Rev:2024A1 Page :2 UMB2S THRU UMB10S Voltage Range - 200 to 1000 V olts Current - 0.5/0.8 Ampere Suggested Pad Layout P2 P1 Dim Min P1 6.00 P2 2.40 Q1 1.84 Q2 1.20 Q1 Q2 Dimensions in millimeters http://www.microdiode.com Rev:2024A1 Page :3