XP162A11C0PR
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P-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 30
RDS(on) (Ω)
ID (A)d
0.050 at VGS = - 10 V
- 7.6
0.056 at VGS = - 4.5 V
- 6.0
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg Tested
Qg (Typ.)
13 nC
APPLICATIONS
• Load Switch
• Battery Switch
D
S
G
G
D
S
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum Power Dissipation
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
ID
IS
- 2.1a, b
6.5
3.5
PD
2.5a, b
1.6a, b
- 55 to 150
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
V
- 7.6
- 5.8
.0a, b
- 6.0
- 5.2a, b
- 35
- 3.5
IDM
Pulsed Drain Current
Continuous Source-Drain Diode Current
Limit
- 30
± 20
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta, c
Maximum Junction-to-Foot
t ≤ 10 s
Steady State
Symbol
RthJA
RthJF
Typical
40
24
Maximum
50
30
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under Steady State conditions is 95 °C/W.
d. Package limited.
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SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
- 30
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
ID = - 250 µA
Gate-Source Threshold Voltage
V
- 31
mV/°C
4.5
VGS(th)
VDS = VGS, ID = - 250 µA
- 2.5
V
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = - 30 V, VGS = 0 V
-1
VDS = - 30 V, VGS = 0 V, TJ = 55 °C
-5
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
RDS(on)
Forward Transconductancea
gfs
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
VDS ≤ - 5 V, VGS = - 10 V
VGS = - 10 V, ID = - 7.0 A
tr
- 20
VDS = - 15 V, ID = - 7.0 A
0.056
18
VDS = - 15 V, VGS = 0 V, f = 1 MHz
1355
180
Ω
S
pF
145
VDS = - 15 V, VGS = - 10 V, ID = - 7.0 A
VDS = - 15 V, VGS = - 4.5 V, ID = - 7.0 A
25
38
13
20
3.5
VDD = - 15 V, RL = 2.7 Ω
ID ≅ - 5.6 A, VGEN = - 10 V, Rg = 1 Ω
0.4
2.0
4.0
10
20
13
20
35
tf
9
18
td(on)
38
57
89
134
tr
nC
5.5
f = 1 MHz
23
td(off)
µA
A
0.050
VGS = - 4.5 V, ID = - 5.6 A
td(on)
td(off)
- 1.0
VDD = - 15 V, RL = 2.7 Ω
ID ≅ - 5.6 A, VGEN = - 4.5 V, Rg = 1 Ω
tf
22
33
11
17
Ω
ns
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
- 6.5
- 30
TC = 25 °C
IS = - 5.6 A, VGS = 0 V
IF = - 5.6 A, dI/dt = 100 A/µs, TJ = 25 °C
A
- 0.71
- 1.2
V
22
33
ns
17
26
nC
13
9
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
4.0
VGS = 10 V thru 4 V
TC = - 55 °C
3.2
ID - Drain Current (A)
ID - Drain Current (A)
25
20
15
10
2.4
TC = 25 °C
1.6
VGS = 3 V
TC = 125 °C
0.8
5
VGS = 2 V
0
0
1
2
3
4
0.0
0.0
5
0.5
VDS - Drain-to-Source Voltage (V)
1.0
1.5
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
1800
0.070
Ciss
1500
VGS = 4.5 V
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
0.060
0.050
VGS = 10 V
0.040
0.030
1200
900
600
Coss
300
0.020
Crss
0.010
0
0
5
10
15
20
25
0
30
6
12
24
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
10
30
1.6
VGS = - 10 V, ID = - 5.6 A
ID = 7 A
8
1.4
R DS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
18
VDS = 15 V
6
VDS = 24 V
4
2
1.2
VGS = - 4.5 V, ID = - 7 A
1.0
0.8
0
0
4
8
12
16
Qg - Total Gate Charge (nC)
Gate Charge
20
24
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.05
100
10
TJ = 150 °C
TJ = 25 °C
1
0.04
R DS(on) - On-Resistance (Ω)
IS - Source Current (A)
ID = 7 A
TJ = 125 °C
0.03
0.02
TJ = 25 °C
0.01
0.00
0
8
12
16
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
2.1
50
1.9
40
1.7
ID = 250 µA
1.5
20
30
20
1.3
1.1
- 50
4
Source-Drain Diode Forward Voltage
Power (W)
VGS(th) (V)
0.1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
10
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
100
Limited by RDS(on)*
ID - Drain Current (A)
10
1 ms
1
10 ms
100 ms
0.1
TA = 25 °C
Single Pulse
0.01
0.1
BVDSS
Limited
1
10
1s
10 s
DC
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
ID - Drain Current (A)
8
6
4
2
0
0
25
50
75
100
125
150
T C - Case Temperature (°C)
Current Derating*
5
3.0
2.5
4
Power (W)
Power (W)
2.0
3
2
1.5
1.0
1
0.5
0
0.0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power, Junction-to-Foot
Power Derating, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 75 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
4. Surface Mounted
10 -3
10 -2
10 -1
1
100
10
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
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Package outline - SOT89
D
A
C
D1
E
H
E1
L
B
e
B1
DIM
e1
Millimeters
Inches
Min
Max
Min
Max
A
1.40
1.60
0.550
0.630
B
0.44
0.56
0.017
B1
0.36
0.48
C
0.35
D
D1
DIM
Millimeters
Inches
Min
Max
Min
Max
E
2.29
2.60
0.090
0.102
0.022
E1
2.13
2.29
0.084
0.090
0.014
0.019
e
1.50 BSC
0.059 BSC
0.44
0.014
0.017
e1
3.00 BSC
0.118 BSC
4.40
4.60
0.173
0.181
H
3.94
4.25
0.155
0.167
1.62
1.83
0.064
0.072
L
0.89
1.20
0.035
0.047
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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