MF-MSMF150-2

SMD1812 Series Surface Mount PPTC Devices Features HF RoHS REACH Applications ▶compact design saves board space ▶USB port protection - USB 2.0, 3.0&OTG ▶RoHS compliant and lead-free ▶HDMI 1.4 Source protection ▶Halogen-free ▶PDAs / digital cameras ▶Fast response to fault current ▶Game console port protection ▶Symmetrical design ▶PC motherboards-plug and play protection Pb Free 1.Electrical Characteristics I-hold I-trip Vmax Imax Pd typ (A) (A) (Vdc) (A) MF-MSMF010-2 0.10 0.30 60.00 MF-MSMF014-2 0.14 0.34 MF-MSMF020-2 0.20 MF-MSMF020/60-2 Max. Time to trip R0 min R1max (Sec.) (Ohm) (Ohm) 0.50 1.50 1.40 15.00 0.80 1.50 0.15 1.20 6.50 100.00 0.80 8.00 0.02 0.80 5.00 60.00 10.00 0.80 8.00 0.02 1.20 6.00 1.00 16.00 100.00 0.80 8.00 0.15 0.15 1.00 0.75 1.50 16.00 100.00 0.80 8.00 0.20 0.11 0.45 MF-MSMF075/24-2 0.75 1.50 24.00 100.00 0.80 8.00 0.20 0.11 0.45 MF-MSMF075/33X-2 0.75 1.50 33.00 40.00 0.80 8.00 0.20 0.11 0.45 MF-MSMF110/16-2 1.10 2.20 16.00 100.00 0.80 8.00 0.30 0.050 0.225 MF-MSMF110/24X-2 1.10 2.20 24.00 40.00 0.80 8.00 0.50 0.045 0.225 MF-MSMF150-2 1.50 3.00 8.00 100.00 0.80 8.00 0.30 0.030 0.120 MF-MSMF150/12-2 1.50 3.00 12.00 100.00 0.80 8.00 0.50 0.030 0.120 MF-MSMF150/24X-2 1.50 3.00 24.00 40.00 0.80 8.00 1.50 0.030 0.150 MF-MSMF160-24 1.60 3.20 24.00 40.00 0.80 8.00 0.50 0.030 0.130 MF-MSMF200-2 2.00 4.00 8.00 100.00 0.80 8.00 2.00 0.020 0.080 MF-MSMF260-2 2.60 5.20 8.00 100.00 0.80 8.00 5.00 0.015 0.075 MF-MSMF260/16X-2 2.60 5.20 16.00 100.00 1.00 8.00 5.00 0.015 0.075 MF-MSMF300X-2 3.00 6.00 6.00 100.00 1.00 8.00 4.00 0.012 0.060 Current Time (W) (A) 10.00 0.80 60.00 10.00 0.40 30.00 0.20 0.40 MF-MSMF050-2 0.50 MF-MSMF075-2 Model I-hold: Holding Current: maximum current at which the device will not trip in 25℃ still air. I-trip: Tripping Current: minimum current at which the device will trip in 25℃ still air. Vmax: Maximum voltage device can withstand without damage at rated current(Imax). I max: Maximum fault current device can withstand without damage at rated voltage(Vmax). Pd typ:Typical power dissipated from device when in the tripped state at 25℃ still air. R0 min:Minimum resistance of device in initial (un-soldered) state. R1 max:Maximum resistance of device at 25℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec. 2.Product Dimensions(mm)&Marking 2024/03/28 Revision：B Page 1 of 6 SMD1812 Series Surface Mount PPTC Devices C A Marking B D Model A E B C D E Quantity Marking Min Max Min Max Min Max Min Max Min MF-MSMF010-2 4.37 4.73 3.07 3.41 0.65 1.15 0.30 1.20 0.20 pcs/R 1500 MF-MSMF014-2 4.37 4.73 3.07 3.41 0.65 1.15 0.30 1.20 0.20 1500 MF-MSMF020-2 4.37 4.73 3.07 3.41 0.65 1.15 0.30 1.20 0.20 1500 MF-MSMF020/60-2 4.37 4.73 3.07 3.41 0.65 1.15 0.30 1.20 0.20 1500 MF-MSMF050-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF075-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF075/24-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF075/33X-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF110/16-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF110/24X-2 4.37 4.73 3.07 3.41 0.65 1.15 0.30 1.20 0.20 1500 MF-MSMF150-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF150/12-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF150/24X-2 4.37 4.73 3.07 3.41 0.85 1.35 0.30 1.20 0.20 1000 MF-MSMF160-24 4.37 4.73 3.07 3.41 0.85 1.35 0.30 1.20 0.20 1000 MF-MSMF200-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF260-2 4.37 4.73 3.07 3.41 0.35 0.85 0.30 1.20 0.20 2000 MF-MSMF260/16X-2 4.37 4.73 3.07 3.41 0.85 1.35 0.30 1.20 0.20 1000 MF-MSMF300X-2 4.37 4.73 3.07 3.41 0.85 1.35 0.30 1.20 0.20 1000 3.Thermal Derating Chart Recommended hold current(A) at ambient Temperature(℃) I-hold Ambient Operating Temperature -40℃ -20℃ 0℃ 25℃ 40℃ 50℃ 60℃ 70℃ 85℃ 0.10A 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.03 0.14A 0.23 0.19 0.17 0.14 0.12 0.10 0.09 0.08 0.06 0.20A 0.29 0.26 0.23 0.20 0.17 0.15 0.14 0.12 0.10 0.30A 0.43 0.39 0.34 0.30 0.26 0.22 0.21 0.17 0.14 0.35A 0.50 0.45 0.40 0.35 0.30 0.26 0.24 0.20 0.16 0.50A 0.77 0.68 0.59 0.50 0.44 0.40 0.37 0.33 0.29 0.75A 1.15 1.01 0.88 0.75 0.65 0.60 0.55 0.49 0.43 1.10A 1.59 1.43 1.26 1.10 0.95 0.87 0.80 0.71 0.60 1.25A 2.00 1.75 1.52 1.25 1.00 0.95 0.90 0.75 0.53 1.50A 2.06 1.93 1.79 1.50 1.28 1.10 1.02 0.80 0.68 1.60A 2.20 2.06 1.91 1.60 1.36 1.17 1.09 0.85 0.72 2.00A 2.60 2.44 2.22 2.00 1.78 1.67 1.50 1.45 1.29 2.50A 3.27 3.04 2.88 2.50 2.21 2.07 1.92 1.78 1.57 2.60A 3.40 3.16 3.00 2.60 2.30 2.15 2.00 1.85 1.63 3.00A 4.13 3.75 3.30 3.00 2.62 2.43 2.25 2.00 1.78 2024/03/28 Revision：B Page 2 of 6 SMD1812 Series Surface Mount PPTC Devices 3.50A 4.84 4.39 4.04 3.50 2.98 2.66 2.35 1.88 1.55 4.00A 5.80 5.20 4.60 4.00 3.35 3.12 2.75 2.45 2.10 4. Typical time to trip at 25℃ 1812 Series TTT Vs Fault current chart A BC DE 100.00 F G HIJ K L M NOPQ I-hold A B: C: D E F G: H: I: J: K: L: M: N: O: P: Q: Time to Trip(S) 10.00 1.00 0.10 0.10A 0.14A 0.20A 0.30A 0.35A 0.50A 0.75A 1.10A 1.25A 1.50A 1.60A 2.00A 2.50A 2.60A 3.00A 3.50A 4.00A 0.01 0.10 1.00 10.00 100.00 Fault Current(A) 5.Soldering parameters tp TP Critlcal Zone TL to TP Temperature Ramp-up TL tL Ts(max) Ts(min) 25 time to peak temperature Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts (max) to TP) 3°C/second max Temperature Min (Ts(min)) 150°C Temperature Max (Ts(max)) 200°C Time (Min to Max) (ts) 60 – 180 secs Time Maintained Temperature (TL) 217°C Above: Temperature (tL) 60 – 150 seconds Pre Heat: Ramp-down ts Preheat Peak / Classification Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Page 3 of 6 Time ◆All temperature refer to topside of thepackage, measured on the package body surface ◆If reflow temperature exceeds the recommended profile,devices may not meet the performance requirements ◆Recommended reflow methods: IR,vapor phase oven,hot air oven,N2 environment for lead ◆Recommended maximum paste thickness is 0.25mm (0.010inch) ◆Devices can be cleaned using standard industry 2024/03/28 Revision：B methods and solvents SMD1812 Series Surface Mount PPTC Devices Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. 6.Recommended Pad Layout(mm) & Physical Specifications 1.50 1.50 Tin-Plated Nickle-Copper (Solder Material: Terminal Material Matte Tin (Sn)) 3.20 Meets EIA Specification RS186-9E, Lead Solderability 2.70 ANSI/J-STD-002 Category 3. 7.Environmental Specifications Operating Temperature -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State 125°C Passive Aging +85 °C, 1000 hours ; ±5 % typical resistance change Humidity Aging +85 °C, 85 % R.H. 1000 hours; ±5 % typical resistance change MIL–STD–202, Method 107; Thermal Shock +85 °C to -40 °C, 20 times;-30 % typical resistance change Solvent Resistance MIL–STD–202, Method 215 ; No change Vibration MIL–STD–883, Method 2007, Condition A; No change Moisture Sensivity Level Level 1, J–STD–020 Storage Conditions +40 °C Max. 70% RH Max. Packed in original packaging. 8.Test Procedures And Requirements No. Test Test Conditions Accept/Reject Criteria 1 R0 min Resistance measurement at 25℃ R0min ≤ R ≤ R1max 2 R1 max Resistance measurement one hour after post trip R0min ≤ R ≤ R1max 3 I-hold Hold rated current 1800 second without trip, @ 25℃ 4 I-trip Device must trip within 900 second under rated current, @25℃ 5 Max. time to trip 6 Trip Cycle Life Vmax, Imax, 100 cycles No arcing or burning 7 Trip Endurance Vmax,Imax 24 hours No arcing or burning 8 Solderability ANSI/J-STD-002 95 % min. coverage At specified current, 25 °C No trip Trip T ≤ max. time to trip (seconds) 9.Tape and Reel Specifications&Packaging quantity per Reel TAPE SPECIFICATIONS: EIA-481-1 (mm) REEL DIMENSIONS: EIA-481-1 (mm) Q'ty 2,000pcs/Reel 1,500pcs/Reel 1,000pcs/Reel W 12.0±0.10 12.0±0.10 12.0±0.10 F 5.50±0.05 5.50±0.05 E1 1.75±0.10 D0 1.55±0.05 C Ø178±1.0 D Ø60.2±0.5 5.50±0.05 W 13.2±1.5 1.75±0.10 1.75±0.10 1.55±0.05 1.55±0.05 H 16.0±0.5 D1 1.50 min 1.50 min 1.50 min P0 4.0±0.10 4.0±0.10 4.0±0.10 P1 8.0±0.10 8.0±0.10 8.0±0.10 P2 2.0±0.05 2.0±0.05 2.0±0.05 A0 3.58±0.10 3.58±0.10 3.50±0.10 B0 4.93±0.10 4.93±0.10 4.90±0.10 T 0.25±0.05 0.25±0.05 0.25±0.05 K0 0.87±0.10 1.30±0.10 1.70±0.10 2024/03/28 Revision：B Page 4 of 6 SMD1812 Series Surface Mount PPTC Devices Leader 390mm 390mm 390mm Trailer 160mm 160mm 160mm 10. Part Ordering Number System APPLICATION NOTICE 1. Operation of these PPTC devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire. PPTC 器件在超过规定的最大值额定值运行可能会导致器件损坏以及导致电弧和/或火灾。 2. These PPTC devices are intended to protect against the effects of temporary over-current or over-temperature conditions and shall not be taken for use as switch,Multiple times tripping shall lower the PPTC hold current. PPTC 的作用是防止临时的过流或过温造成的不良影响，不能当作开关使用,重复多次的保护会降低 PPTC 的维持电流。 3. Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the 2024/03/28 Revision：B Page 5 of 6 SMD1812 Series Surface Mount PPTC Devices performance of PPTC devices. PPTC 接触润滑剂、硅基油、溶剂、凝胶、电解质、酸和其他相关或类似材料可能会对 PPTC 器件的性能有不利影响。 4. Circuits with inductance may generate a voltage above the rated voltage of the PPTC device and should be thoroughly evaluated within the user’s application during the PPTC selection and qualification process. 带有电感的电路可能产生高于 PPTC 额定电压的电压，因此客户在选型和认定过程中应进行彻底的评估。 5. Please do not smash, clamp, pull, dent or twist by tool during assembling process，as they may result in the PPTC damage. 在装配过程中，避免有砸、挤、拉、扭等方式外力作用于 PPTC 本体上，因为它们可能导致 PPTC 损坏。 6. The above parameters are concluded from one time of reflow soldering processing the PPTC. If there is any further heat generated process like injection or dispensing at the customer's premise, the aforementioned parameters will decrease at certain degree. Therefore the verification test to be conducted is necessary . 规格书所规定的电阻以及电气特性，均是基于在指经过一次回流焊之后的测试。如果客户有二次回流焊或者注塑点胶等其他热工序，会对上述 参数有一定程度的衰减。所以需要验证其适用性。 7. When mounting or using PPTC, all injection molding materials, curing adhesives, UV glue , silica gel and cleaning agents or solvents must be tested in terms of application parameters e.g. temperature, time, and etc to ensure the consistency between the product and the processing before use. PPTC 贴装或应用过程中,所使用到的各类注塑料、单组份、双组份固化胶粘剂、硅胶、清洁剂、溶剂等，需要对注塑料胶料等材料的 应用参数（如温度、时间等）进行验证，以确保产品及工艺的匹配性，确认不会影响 PPTC 性能之后方可使用。 8. The PPTC is thermal sensitive device. It is recommended not to design any heat source devices around it to reduce the outside heat source impact. PPTC 为热敏元件，对环境温度比较敏感，建议在 PPTC 周围不要设计热源元件，尽量减少外部热源的影响。 9. SMD PPTC is designed for SMT processing which applies reflow soldering. Please refer to the JMT recommended curve for reference. If the reflow soldering temperature exceeds the recommended value, the PPTC might be damaged. Hand welding PPTC is prohibited， if there is soldering iron welding process, it is suggested that the welding position sh ould be more than 1.5mm away from PPTC, the welding tool temperature should be lower than 350℃, and the contact ti me between soldering iron and solder joint should not exceed 3sec.. PPTC 贴片产品是为 SMT 工艺设计的封装形式，焊接工艺为回流焊。焊接工艺可参考晶美特推荐的回流焊曲线。如果回流焊温度超过推荐的值， PPTC 将有可能受到损伤。禁止使用手工焊接 PPTC，如有烙铁焊接工艺，建议焊接位置距离 PTC 1.5mm 以上，焊接工具温度低于 350℃，焊接铁 头与焊点的接触时间不超过 3sec。 10. In charging terminal application, PP type material is recommended to use as inner membrane and TPE and PVC type material is inhibited PPTC 在充电线端应用中，建议使用 PP 类材料做内膜，禁止使用 TPE 类与 PVC 类等材料做内膜。 2024/03/28 Revision：B Page 6 of 6