119A-92A00-R02

SPECIFICATION AND PERFORMANCE Series 119A-XXA00-R02 File 119A-XXA00-R02_spec_4 Date 2020/04/16 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of below table P/N 119A-40A00-R02 119A-56A00-R02 119A-80A00-R02 119A-92A00-R02 Description Mini PCI Express Mini PCI Express Mini PCI Express Mini PCI Express Socket, Socket, Socket, Socket, GF, GF, GF, GF, Reel, Reel, Reel, Reel, H=4.0mm, H=5.6mm, H=8.0mm, H=9.2mm, (w/Logo) (w/Logo) (w/Logo) (w/Logo) Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIALS NO. PART NAME 1 HOUSING 2 CONTACT 3 HOLD DOWN DESCRIPTION LCP MG350, UL94V-0, Black Phosphor Bronze, C5191 Contact Area: Gold Flash, solder area: 100u” matte Tin, all under plated 50u” Nickel Brass, C2680, Solder area: 100u” matte Tin plated, under plated 50u” Nickel RATING Rated Voltage Rated Current Operating Temperature Storage Temperature Durability Item Contact Resistance 50V AC 0.5A -40°C to +85°C -40°C to +85°C 50 cycles ELECTRICAL Requirement Initial: 30mΩ Max. After test 20mΩ change max. Test Condition Solder connectors on PCB and mate them together, measure by applying closed circuit current of 100mA The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - Insulation Resistance Initial: 500Ω Min. After: 100MΩ Min. Dielectric Withstanding Voltage No breakdown maximum at open circuit voltage of 20mV (max). (JIS C5402 5.4) Apply 500V DC between adjacent contacts, or contact and ground. (MIL-STD-202 METHOD 302) Mate connectors; apply 250V AC at 60Hz (rms.) between two adjacent for 1 minute. (Trip current:0.5mA) (MIL-STD-202 METHOD 301) Item MECHANICAL Requirement Test Condition Contact Normal Force 50gf per pin Min. The normal force of the individual contact shall be 50 gf minimum Contact Retention Force 180gf per pin Min. Place a connector on the push-pull machine, then apply a force on a contact head and push the contact to the opposite direction of the contact insertion at the speed of 25±3mm/min. Durability (EIA364-29) Finish After 50 mating and un-mating cycles 1.Contact Resistance: with 1.0mm thick board at the rate of 50mΩ Max. 2.No Damage 25±3mm/min. The connector shall be of no damage to the housing or contacts. The connector shall also meet the requirements of contact resistance in the paragraph 5.1 Shock (EIA364-09) Finish Solder connectors on PCB and mate 1. No electrical discontinuity them together, subject to following more than 0.1μs. shock conditions, 3 shocks shall be 2 .No Damage period along 3 mutually perpendicular 3. Contact Resistance: 50mΩ axis, passing DC 1mA current during Max. the test. 50G,11ms Half-sine The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - (MIL-STD-202 METHOD 213) ENVIRONMENTAL Item Requirement Humidity Test Test Condition Finish Humidity storage at 40±3°C with 1. Contact Resistance: 90±5% RH for 96 hours. 50mΩ Max. Salt Mist Test 2. Insulation Resistance: 100MΩ Min. (EIA364-31) Finish 5±1% salt solutions, at 35±2°C 1. Contact Resistance: duration 24 hours. 50mΩ Max. Connectors detached 2 .No Damage Thermal Shock Stage 1. Contact Resistance: t3 t2 (MIL-STD-1344) Finish 50mΩ Max. t4 2. Insulation Resistance: 100MΩ Min. t1 Temp t1 -55±5°C t2 -55±5°C~+85±5°C t3 +85±5°C t4 +85±5°C~-55°C±5°C Time 30 min 5 min 30 min 5 min Test time: 5 cycles (MIL-STD-202 METHOD 107) Heat Resistance Finish Solder connectors on PCB and mate 1. Contact Resistance: them together, expose to 85±2°C for 50mΩ Max. 48hrs. Upon completion of the exposure 2. Insulation Resistance: period, the test specimens shall be 100MΩ Min. conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (MIL-STD-202 METHOD 108) The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - Solderability SOLDER ABILITY 95% of immersed area must show no voids , pin holes Dip solder tails into the molten solder(held at 230±5 °C) up to 0.5mm from the tip of tails for 3±0.5 seconds. (MIL-STD-202 METHOD 208) Resistance to soldering heat No melting, cracks or functional damage allowed All connectors designed for PCB soldering within this specification must be able to withstand the heat from solder oven according to the graph below. The cycle should be repeated twice. (MIL-STD-202 METHOD 210) Preheating temperature: 150 ~ 200°C, 60~120 seconds Liquidus temperature (TL): 217°C, 60~150 seconds Peak temperature: 260°C Time within 5 °C of peak temperature (Tc): 255°C, 30seconds The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - TEST SEQUENCE No. Test Item 1 Contact Resistance 2 Insulation Resistance 3 Dielectric Withstanding Voltage 4 Contact Normal Force 5 Contact Retention Force 6 Durability Life 7 Shock 8 Temperature Shock 9 Heat Resistance 10 Humidity 11 Salt Spray 12 Solder ability 13 Resistance to Soldering Heat Sample Quantity A B C D E F G H 1,3 1,3 1,3 1,3 1,4 1,3 I J 2,5 1 1 2 2 2 2 3 2 1 1 4 4 4 4 4 4 4 4 4 4 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -5 -