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MDBT50Q-P1MV2

MDBT50Q-P1MV2

  • 厂商:

    RAYTAC(瑞泰)

  • 封装:

    SMD-61P

  • 描述:

  • 数据手册
  • 价格&库存
MDBT50Q-P1MV2 数据手册
Version: L Issued Date: 2023/05/24 Approval Sheet (產品承認書) 產品名稱 (Product) Bluetooth Low Energy Module 解決方案 (Solution) Nordic nRF52840 aQFN Package 產品型號 (Model No.) MDBT50Q – 1MV2 (Chip Antenna) MDBT50Q – P1MV2 (PCB Antenna) 產品料號 (Part No.) see 4.3 Order Code Working distance (in Meters) Operating Model 125 Kbps 1 Mbps 2 Mbps MDBT50Q-1MV2 over 550 over 300 over 150 -40 ~ 85℃ MDBT50Q-P1MV2 over 450 up to 250 up to 120 -40 ~ 85℃ Working range is tested in open space Temperature Index 1. Overall Introduction ...................................................................................................... 4 1.1. Application ............................................................................................................ 4 1.2. Features ............................................................................................................... 5 2. Product Dimension ....................................................................................................... 7 2.1. PCB Dimensions & Pin Indication ......................................................................... 7 2.2. Recommended Layout of Solder Pad ................................................................... 9 2.3. RF Layout Suggestion (aka Keep-Out Area) ....................................................... 11 2.4. Footprint & Design Guide ................................................................................... 13 2.5. Pin Assignment ................................................................................................... 14 2.6. GPIO Located Near the Radio ............................................................................ 17 3. Main Chip Solution ...................................................................................................... 17 4. Shipment Packaging Information .............................................................................. 18 4.1. Marking on Metal Shield ..................................................................................... 19 4.2. Packaging Info .................................................................................................... 20 4.3. Order Code ......................................................................................................... 22 5. Specification ................................................................................................................ 23 5.1. Absolute Maximum Ratings ................................................................................ 23 5.2. Operating Conditions .......................................................................................... 23 5.3. Electrical Specifications ...................................................................................... 24 6. Block Diagram ............................................................................................................. 30 7. Antenna ........................................................................................................................ 31 7.1. MDBT50Q........................................................................................................... 31 7.2. MDBT50Q-P ....................................................................................................... 33 8. Reference Circuit......................................................................................................... 35 8.1. Reg0 DC/DC Enabled......................................................................................... 36 8.2. Reg0 LDO Mode ................................................................................................. 38 8.3. Reg0 DC/DC and LDO Mode Disabled............................................................... 40 8.4. USB Powered ..................................................................................................... 42 8.5. USB Disabled ..................................................................................................... 46 9. Certification ................................................................................................................. 47 9.1. Declaration ID ..................................................................................................... 47 9.2. FCC Certificate (USA) ........................................................................................ 49 9.3. TELEC Certificate (Japan) .................................................................................. 50 2 9.4. 9.5. 9.6. 9.7. 9.8. 9.9. 9.10. 9.11. NCC Certificate (Taiwan) .................................................................................... 52 CE (EU) & RCM (Australia & New Zealand) Test Report .................................... 54 IC Certificate (Canada) ....................................................................................... 57 SRRC Certificate (China).................................................................................... 58 KC Certificate (South Korea) .............................................................................. 59 WPC (ETA) Certificate (India) ............................................................................. 60 RoHS & REACH Report ..................................................................................... 62 End-Product Label .............................................................................................. 62 10. Notes and Cautions ..................................................................................................... 64 11. Basic Facts for nRF52 Family .................................................................................... 65 12. Useful Links ................................................................................................................. 66 Full List of Raytac’s BLE Modules .................................................................................... 67 Release Note ....................................................................................................................... 71 3 1. Overall Introduction Raytac’s MDBT50Q & MDBT50Q-P is a BT 5.2 stack (Bluetooth low energy or BLE) module designed based on Nordic nRF52840 SoC solution, which incorporates: GPIO, SPI, UART, I2C, I2S, PMD, PWM, ADC, NFC and USB interfaces for connecting peripherals and sensors. Features: 1. Embedded 2.4GHz transceiver supports Bluetooth 5.2 ( ), IEEE 802.15.4 & Zigbee) & 2.4Ghz RF & ANT+ upon customer’s preference. ( 2. Compact size with (L) 15.5 x (W) 10.5 x (H) 2.05 or 2 mm. 3. Low power requirements, ultra-low peak, average and idle mode power consumption. 4. Be compatible with a large installed base of mobile phones, tablets and computers. 5. Fully coverage of BLE software stack. 6. BLE & RF transmission switching helps products fit all operation system and most hardware. 1.1. Application ‧IoT Networks ‧Smart home (such as door locks, lighting) sensors and controllers ‧Smart city sensor networks ‧Industrial IoT sensors and controllers ‧Connected white goods ‧Personal Area Networks ‧Health / fitness sensor and monitor device ‧Medical device ‧Interactive entertainment devices ‧Advanced remote controls ‧Gaming controller ‧Advanced wearables ‧Connected watches ‧Advanced personal fitness devices ‧Wearables with wireless secure payment ‧Connected Health ‧Virtual/Augmented Reality applications ‧High performance HID Controllers ‧Mesh Network 4 1.2. Features ‧Bluetooth 5, IEEE 802.15.4, 2.4 GHz transceiver ‧-95dBm sensitivity in 1Mbps Bluetooth low energy (BLE) mode ‧-103dBm sensitivity in 125Kbps BLE mode (long range) ‧+8 dBm TX power (down to -20 dBm in 4 dB steps) ‧On-air compatible with nRF52, nRF51, nRF24L and nRF24AP Series ‧Programmable output power from +8dBm to -20dB ‧RSSI (1dB resolution) ‧Supported data rates: ‧Bluetooth 5: 2 Mbps, 1 Mbps, 500 kbps, 125 kbps ‧IEEE 802.15.4-2006: 250 kbps ‧Proprietary 2.4 GHz: 2 Mbps, 1 Mbps ‧ARM Cortex –M4 32-bit processor with FPU, 64 MHz ‧Memory: 1MB flash / 256KB RAM ‧HW accelerated security ‧ARM TrustZone Cryptocell 310 security subsystem ‧128 bit AES / ECB / CCM / AAR co-processor (on-the-fly packet encryption) ‧Advanced on-chip interfaces ‧USB 2.0 full speed (12Mbps) controller ‧QSPI 32MHz interface ‧High speed 32MHz SPI ‧Type 2 near field communication (NFC-A) tag with wake-on field ‧Programmable peripheral interconnect (PPI) ‧48 general purpose I/O pins ‧EasyDMA automated data transfer between memory and peripherals. ‧12 bit, 200ksps ADC – 8 configurable channels with programmable gain ‧4 x 4 channel pulse width modulator (PWM) units with EasyDMA ‧Audio peripherals : I2S, digital microphone interface (PDM) ‧5 X 32-bit timers with counter mode ‧Up to 4 x SPI masters / 3 x SPI slaves with EasyDMA ‧Up to 2 x I2C compatible 2-wire masters / slaves ‧2 x UART(CTS/RTS) with EasyDMA ‧Quadrature decoder (QDEC) ‧3 x 24-bit real-time counters (RTC) 5 ‧Flexible power management ‧Supply voltage range 1.7V to 5.5V ‧On-chip DC/DC and LDO regulators with automated low current modes ‧Regulated supply for external components from 1.8V to 3.3V ‧Automated peripheral power management ‧Fast wake-up using 64MHz internal oscillator ‧0.4uA at 3V in System OFF mode, no RAM retention ‧1.5uA at 3V in System ON mode, no RAM retention, wake on RTC ‧ Nordic SoftDevice ready and with support for concurrent multi-protocol 6 2. Product Dimension 2.1. PCB Dimensions & Pin Indication ‧MDBT50Q-1MV2 7 ‧MDBT50Q-P1MV2 8 2.2. Recommended Layout of Solder Pad Graphs are all in Top View, Unit in mm. 9 10 2.3. RF Layout Suggestion (aka Keep-Out Area) Make sure to keep the “No Ground Pad” as wider as you can regardless of the size of your PCB. No Ground Pad should be included in the corresponding position of the antenna in EACH LAYER. Place the module towards the edge of PCB to have better performance than placing it on the center. Welcome to send us your layout in PDF for review at service@raytac.com or your contact at Raytac with title “Layout reviewing – Raytac Model No. – YOUR company’s name”. 11 12 Examples of “NOT RECOMMENDED” layout 2.4. Footprint & Design Guide Please visit “Support” page of our website to download. The package includes footprint, 2D/3D drawing, reflow graph/solder profile and recommended spec for external 32.768khz. 13 2.5. Pin Assignment Pin No. Name Pin function Description (1) GND Power Ground (2) GND Power Ground (3) P1.10 Digital I/O (4) P1.11 Digital I/O (5) P1.12 Digital I/O (6) P1.13 Digital I/O (7) P1.14 Digital I/O (8) P1.15 Digital I/O P0.03 Digital I/O AIN1 Analog input P0.29 Digital I/O AIN5 Analog input P0.02 Digital I/O AIN0 Analog input P0.31 Digital I/O AIN7 Analog input P0.28 Digital I/O AIN4 Analog input P0.30 Digital I/O AIN6 Analog input (9) (10) (11) (12) (13) (14) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) Analog input General-purpose I/O (standard drive, low frequency I/O only) Analog input General-purpose I/O (standard drive, low frequency I/O only) Analog input General-purpose I/O (standard drive, low frequency I/O only) Analog input General-purpose I/O (standard drive, low frequency I/O only) Analog input General-purpose I/O (standard drive, low frequency I/O only) Analog input 14 Pin No. Name Pin function Description (15) GND Power Ground (16) P0.27 Digital I/O General-purpose I/O P0.00 Digital I/O General-purpose I/O XL1 Analog input Connection for 32.768 kHz crystal P0.01 Digital I/O General-purpose I/O XL2 Analog input Connection for 32.768 kHz crystal P0.26 Digital I/O General-purpose I/O P0.04 Digital I/O General-purpose I/O AIN2 Analog input Analog input P0.05 Digital I/O General-purpose I/O AIN3 Analog input Analog input P0.06 Digital I/O General-purpose I/O P0.07 Digital I/O General-purpose I/O TRACECLK Trace clock Trace buffer clock (24) P0.08 Digital I/O General-purpose I/O (25) P1.08 Digital I/O General-purpose I/O P1.09 Digital I/O General-purpose I/O TRACEDATA3 Trace data Trace buffer TRACEDATA [3]. P0.11 Digital I/O General-purpose I/O TRACEDATA2 Trace data Trace buffer TRACEDATA[2]. VDD Power Power supply P0.12 Digital I/O General-purpose I/O TRACEDATA1 Trace data Trace buffer TRACEDATA [1]. (30) VDDH Power High voltage power supply (31) DCCH Power DC/DC converter output (32) VBUS Power 5V input for USB 3.3V regulator (33) GND Power Ground (34) D˗̶̶̶ Digital I/O USB D- (35) D+ Digital I/O USB D+ (17) (18) (19) (20) (21) (22) (23) (26) (27) (28) (29) 15 Pin No. Name Pin function Description (36) P0.14 Digital I/O General-purpose digital I/O (37) P0.13 Digital I/O General-purpose digital I/O (38) P0.16 Digital I/O General-purpose digital I/O (39) P0.15 Digital I/O General-purpose digital I/O P0.18 Digital I/O (40) nRESET General-purpose digital I/O (recommended usage: QSPI / CSN) Configurable as system RESET (41) P0.17 Digital I/O (42) P0.19 Digital I/O (43) P0.21 Digital I/O (44) P0.20 Digital I/O (45) P0.23 Digital I/O (46) P0.22 Digital I/O P1.00 Digital I/O TRACEDATA0 Trace data Trace buffer TRACEDATA [0]. (48) P0.24 Digital I/O General-purpose digital I/O (49) P0.25 Digital I/O General-purpose digital I/O )) (50) P1.02 Digital I/O (51) SWDIO Debug P0.09 Digital I/O NFC1 NFC input NFC antenna connection SWDCLK Debug Serial wire debug clock input for debug and programming P0.10 Digital I/O NFC2 NFC input (47) (52) (53) (54) General-purpose digital I/O General-purpose digital I/O (recommended usage: (QSPI / SCK) General-purpose digital I/O (recommended usage: QSPI) General-purpose digital I/O General-purpose digital I/O (recommended usage: QSPI) General-purpose digital I/O (recommended usage: QSPI) General-purpose digital I/O (recommended usage: QSPI) General-purpose I/O (standard drive, low frequency I/O only) Serial wire debug I/O for debug and programming General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) NFC antenna connection 16 Pin No. Name Pin function Description (55) GND Power Ground (56) P1.04 Digital I/O (57) P1.06 Digital I/O (58) P1.07 Digital I/O (59) P1.05 Digital I/O (60) P1.03 Digital I/O (61) P1.01 Digital I/O 2.6. General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) General-purpose I/O (standard drive, low frequency I/O only) GPIO Located Near the Radio Please refer to 2.5 Pin Assignment on page 16 to 18 where identifies some GPIO that have recommended usage. To maximize RF performance, these GPIO are only available to use under standard drive, low frequency I/O only, wrong usage may lead to undesirable performance. Low frequency I/O is a signal with a frequency up to 10 kHz. SPI, I2C, UART, PWM are NOT low frequency I/O. 3. Main Chip Solution RF IC Crystal Frequency Nordic NRF52840 32MHZ 32MHz crystal and RF (VDD) DC/DC inductor (Reg1) are already inside the module. 17 4. Shipment Packaging Information Model Antenna MDBT50Q-1MV2 Chip/Ceramic MDBT50Q-P1MV2 PCB/Printed Photo Module with one black dot is using revision 1 IC. The one without black dot is using revision 2 IC and date code starts from 914 and after. - Unit Weight of Module: MDBT50Q-1MV2: 0.68 g (±0.02 g) ; MDBT50Q-P1MV2: 0.64 g (±0.02 g) - Packaging Type: Anti-static tray or Tape & Reel 18 4.1. Marking on Metal Shield Label contexts for date code 839 and after, For date code 833 to 838, There is no marking on metal shield for module(s) with date code before 833. 19 4.2. Packaging Info 4.2.1. Tray Packaging Anti-static tray is specifically designed for mass production. It can be used directly on SMT automatic machine Before July 1st, 2022 After July 1st, 2022 20 4.2.2. Tape & Reel Packaging 21 4.3. Order Code Each model has two options of packaging. Please use following part no. when placing order to us. Model Tray Tape & Reel MDBT50Q-1MV2 MD-240A3-007 MD-240A3-007R MDBT50Q-P1MV2 MD-240A3-008 MD-240A3-008R MPQ of Reel packaging is 1,500 pcs and Tray packaging is 88 pcs. 22 5. Specification Any technical spec shall refer to Nordic’s official documents as final reference. Contents below are from “nRF52840 Product Specification v1.7”, please click to download full spec. 5.1. Absolute Maximum Ratings 5.2. Operating Conditions 23 5.3. Electrical Specifications 5.3.1. General Radio Characteristics 5.3.2. Radio Current Consumption (Transmitter) 24 5.3.3. Radio Current Consumption (Receiver) 5.3.4. Transmitter Specification 5.3.5. RSSI Specifications 25 5.3.6. Receiver Operation 5.3.7. RX Selectivity 26 5.3.8. RX Intermodulation 27 5.3.9. Radio Timing Parameters 28 5.3.10. CPU 5.3.11. Power Management 29 6. Block Diagram 30 7. Antenna 7.1. MDBT50Q 31 32 7.2. MDBT50Q-P 33 34 8. Reference Circuit This chapter shows a different combination of reference circuits. Before getting started, please read below notes carefully because it is applied to all the reference circuits. ⚫ 32MHz crystal and RF (VDD) DC/DC inductor (Reg1) are already inside the module. ⚫ Module is pre-programmed with Raytac testing code. Default is using LDO mode and need to add external 32.768khz to work. You can use DC-DC mode without adding external 32.768khz, they are NOT related events. ⚫ When using internal 32.768khz RC oscillator, please remove X2 / C12 / C13. ⚫ Recommended L4 spec: 10𝛍H, 0603 Chip Inductor, IDC, min = 80mA, ±20%. ⚫ When NOT using NFC, please remove NFC1 / C19 / C21. 35 8.1. Reg0 DC/DC Enabled Recommend using when the highest input voltage is equal or greater than 3.6V. Supply power from VDDH. 36 37 8.2. Reg0 LDO Mode Recommend using when the highest input voltage is equal or greater than 3.6V. Supply power from VDDH. 38 39 8.3. Reg0 DC/DC and LDO Mode Disabled Recommend using when the highest input voltage is less than 3.6V. 40 41 8.4. USB Powered Recommend using when power the device via USB. 8.4.1. Reg0 DC/DC Enabled 42 43 8.4.2. Reg0 LDO Mode 44 45 8.5. USB Disabled This circuit only focuses on USB disabled. You can use it to go with other 3 reference circuits. Please leave D+ & D- as NC when USB is disabled. 46 9. Certification 9.1. Declaration ID BT 5.1 BT 5.2 47 Profile Description Service Description Alert Notification Profile Alert Notification Service Blood Pressure Service Blood Pressure Profile Device Information Service Cycling Speed & Cadence Service Cycling Speed & Cadence Profile Device Information Service Glucose Service Glucose Profile Device Information Service Health Thermometer Service Health Thermometer Profile Device Information Service Heart Rate Service Heart Rate Profile Device Information Service HID Service HID over GATT Profile Battery Service Link Loss Service Proximity Profile Immediate Alert Service TX Power Service Running Speed & Cadence Service Running Speed & Cadence Profile Device Information Service Time Profile Time Profile Service Glucose Profile (Central) Mesh Provisioning Service Mesh Profile Mesh Proxy Service 48 9.2. FCC Certificate (USA) BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved. 49 9.3. TELEC Certificate (Japan) BLE 1 Mbps & 2 Mbps 50 IEEE 802.15.4 51 9.4. NCC Certificate (Taiwan) BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved. MDBT50Q 52 MDBT50Q-P 53 9.5. CE (EU) & RCM (Australia & New Zealand) Test Report BLE 1 Mbps & 2 Mbps 54 IEEE 802.15.4 55 56 9.6. IC Certificate (Canada) BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved. 57 9.7. SRRC Certificate (China) BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved. 58 9.8. KC Certificate (South Korea) BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved. 59 9.9. WPC (ETA) Certificate (India) BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved. MDBT50Q 60 MDBT50Q-P 61 9.10. RoHS & REACH Report Please visit “Support” page of our website to download. 9.11. End-Product Label It is suggested using following content adding to package or user manual or label to obey the regulation. Any rules of end-product label shall refer to each certification for final reference. 9.11.1. FCC (USA) The FCC statement should be included in the user manual when there is no enough space on label. Otherwise, it should be included on the label. “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.” The final end product must be labeled in a visible area with the following: “Contain FCC ID: SH6MDBT50Q”. 9.11.2. TELEC (Japan) When manufacturer is placing the product on the Japanese market, the product must be affixed with the following Specified Radio Equipment marking: 62 9.11.3. NCC (Taiwan) 請依下列標籤式樣自製標籤,標貼或印鑄於器材本體明顯處,始得販賣或公開陳列。 Series 標籤樣式 MDBT50Q Series MDBT50Q-P Series 以 MDBT50Q 為例,平台廠商必須於平台上標示字樣「本產品內含射頻模組:ID 編號 CCAM18LP0820T7」。 「平台」定義如下:若器材組裝本案模組,消費者仍能正常使用該器材主要功能,該器材得視 為平台。若器材不組裝本案模組,消費者不能正常使用該器材主要功能,該器材不能視為平台。 該類不同廠牌型號器材組裝本案審驗模組後,須分別申請型式認證。 9.11.4. IC (Canada) The IC statement should be included in the user manual when there is no enough space on label. Otherwise, it should be included on the label. “This device complies with Industry Canada license-exempt RSS Standard(s). Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.” The final end product must be labeled in a visible area with the following: “Contain IC ID: 8017A-MDBT50Q”. 63 10. Notes and Cautions Module is not designed to last for a lifetime. Like general products, it is expected to be worn out after continuous usage through the years. To assure that product will perform better and last longer, please make sure you: ⚫ Follow the guidelines of this document while designing circuit/end-product. Any discrepancy of core Bluetooth technology and technical specification of IC should refer to definition of Bluetooth Organization and Nordic Semiconductor as final reference. ⚫ Do not supply voltage that is not within range of specification. ⚫ Eliminate static electricity at any cost when working with the module as it may cause damage. It is highly recommended adding anti-ESD components to circuit design to prevent damage from real-life ESD events. Anti-ESD methods can be also applied in mechanical design. ⚫ Do not expose modules under direct sunlight for long duration. Modules should be kept away from humid and salty air conditions, and any corrosive gasses or substances. Store it within -40℃ to +125℃ before and after installation. ⚫ Avoid any physical shock, intense stress to the module or its surface. ⚫ Do not wash the module. No-Clean Paste is used in production. Washing it will oxidize the metal shield and have chemistry reaction with No-Clean Paste. Functions of the module are not guaranteed if it has been washed. The module is not suitable for life support device or system and not allowed to be used in destructive device or systems in any direct or indirect ways. The customer agrees to indemnify Raytac for any losses when applying modules in applications such as the ones described above. 64 11. Basic Facts for nRF52 Family Below chart shows basic spec for Nordic nRF52 family, which is helpful to understand the differences between each SoC. Any discrepancy shall refer to Nordic’s technical document as final reference. See Full List of Raytac’s BLE Modules for complete model no. of each item. 65 12. Useful Links ⚫ Nordic Infocenter: https://infocenter.nordicsemi.com/index.jsp All the necessary technical files and software development kits of Nordic’s chip are on this website. ⚫ Nordic DevZone: https://devzone.nordicsemi.com/questions/ A highly recommended website for firmware developer. Interact, discuss and consult with other fellow developers and Nordic’s employees to get answers to your questions. The site also includes tutorials in detail to help you get started. ⚫ Official Page of nRF52840 : https://www.nordicsemi.com/eng/Products/nRF52840 A brief introduction to nRF52840 and download links for Nordic’s developing software and SoftDevices. 66 Full List of Raytac’s BLE Modules ⚫ MDBT40 Series Series Nordic Solution MDBT40 nRF51822 Raytac No. IC Ver. Antenna 3 Chip Antenna MDBT40-256V3 MDBT40-256RV3 MDBT40-P256V3 MDBT40-P nRF51822 3 MDBT40-P256RV3 PCB Antenna RAM Flash Memory 16 kb 256 K 32 kb 256 K 16 kb 256 K 32 kb 256 K RAM Flash Memory 64 kb 512 K 24 kb 192 K 64 kb 512 K 24 kb 192 K 64 kb 512 K ⚫ MDBT42Q Series (QFN Package IC) Series MDBT42Q MDBT42Q-P MDBT42Q-U Nordic Solution Raytac No. IC Ver. nRF52832 MDBT42Q-512KV2 2 nRF52810 MDBT42Q-192KV2 2 nRF52811 MDBT42Q-192KL 1 nRF52832 MDBT42Q-P512KV2 2 nRF52810 MDBT42Q-P192KV2 2 nRF52811 MDBT42Q-P192KL 1 nRF52832 MDBT42Q-U512KV2 2 Antenna Chip Antenna PCB Antenna u.FL Connector 67 ⚫ MDBT42 Series (WLCSP Package IC) Series Nordic Solution MDBT42 Raytac No. IC Ver. Antenna RAM Flash Memory 2 Chip Antenna PCB Antenna 64 kb 512 K IC Ver. Antenna RAM Flash Memory 2 Chip Antenna PCB Antenna 64 kb 512 K MDBT42-512KV2 nRF52832 MDBT42-P MDBT42-P512KV2 ⚫ MDBT42V Series (WLCSP Package IC) Series Nordic Solution MDBT42V Raytac No. MDBT42V-512KV2 nRF52832 MDBT42V-P MDBT42V-P512KV2 ⚫ MDBT42T Series (WLCSP Package IC) Series Nordic Solution MDBT42T Raytac No. IC Ver. Antenna RAM Flash Memory 1 Chip Antenna PCB Antenna 24 kb 192 K MDBT42T-192K nRF52805 MDBT42T-P MDBT42T-P192K ⚫ MDBT42TV Series (WLCSP Package IC) Series Nordic Solution MDBT42TV Raytac No. Antenna RAM Flash Memory 1 Chip Antenna PCB Antenna 24 kb 192 K MDBT42TV-192K nRF52805 MDBT42TV-P IC Ver. MDBT42TV-P192K 68 ⚫ MDBT50Q Series (aQFN Package IC) Series Nordic Solution Raytac No. IC Ver. nRF52840 MDBT50Q-1MV2 2 nRF52833 MDBT50Q-512K 1 nRF52840 MDBT50Q-P1MV2 2 nRF52833 MDBT50Q-P512K 1 nRF52840 MDBT50Q-U1MV2 2 nRF52833 MDBT50Q-U512K 1 nRF52840 MDBT50Q-RX MDBT50Q MDBT50Q-P MDBT50Q-U Dongle 1, 2 RAM Flash Memory 256 kb 1 MB 128 kb 512 kb 256 kb 1 MB 128 kb 512 kb 256 kb 1 MB 128 kb 512 kb PCB Antenna 256 kb 1 MB Antenna RAM Flash Memory 32 kb 256 kb 128 kb 512 kb 32 kb 256 kb 128 kb 512 kb Antenna Chip Antenna PCB Antenna u.FL Connector ⚫ MDBT50 Series (QFN Package IC) Series Nordic Solution Raytac No. IC Ver. nRF52820 MDBT50-256R 1 nRF52833 MDBT50-512K 1 nRF52820 MDBT50-P256R 1 nRF52833 MDBT50-P512K 1 MDBT50 MDBT50-P Chip Antenna PCB Antenna 69 ⚫ MDBT53 Series (WLCSP Package IC) Series Nordic Solution Raytac No. IC Ver. Antenna RAM Flash Memory MDBT53 nRF5340 MDBT53-1M 1 Chip Antenna 512 kb 1 MB MDBT53-P nRF5340 MDBT53-P1M 1 PCB Antenna 512 kb 1 MB MDBT53-U nRF5340 MDBT53-U1M 1 u.FL Connector 512 kb 1 MB ⚫ MDBT53V Series (WLCSP Package IC) Series Nordic Solution Raytac No. IC Ver. Antenna RAM Flash Memory MDBT53V nRF5340 MDBT53V-1M 1 Chip Antenna 512 kb 1 MB MDBT53V-P nRF5340 MDBT53V-P1M 1 PCB Antenna 512 kb 1 MB 70 Release Note ⚫ 2017/10/30 Pre-release ⚫ 2018/01/19 Model no. officially changed to MDBT50Q-1M & MDBT50Q-P1M. ⚫ 2018/04/10 Version A (1st release) ⚫ 2018/06/12 Version B (1) Added Chapter 4: Shipment Packaging Info and Chapter 7: Antenna. ⚫ 2018/09/14 Version C (1) Added link of design guide in Chapter 2 (2) Updated photo of module in Chapter 4 and added marking and tray info. (3) Updated schematic in Chapter 8 for easier understanding. (4) Updated Declaration ID & regional certification info in Chapter 9. (5) Added “No-Wash” warning in Chapter 10. ⚫ 2018/11/01 Version D (1) Updated drawing in Chapter 2 for a better understanding of PCB measurement. (2) Updated Chapter 4 with new label info. (3) Added WPC (ETA) certificates in Chapter 9: Certification. ⚫ 2019/05/03 Version E (1) Updated model no. to MDBT50Q-1MV2 & MDBT50Q-P1MV2 because of revision 2 SoC. (2) Updated Chapter 4: Shipment Packaging Info with new module photo, model no. and added tape & reel info. (3) Updated Chapter 5: Specification corresponding to Nordic’s new nRF52840 Product Specification V1.1. (4) Added nRF52811 in Chapter 11: Basic Facts for nRF52 Chips and Full List of Raytac’s BLE Modules. 71 ⚫ 2019/11/04 Version F (1) Added wireless range under radio data rate of 125kbps on front page. (2) Added tolerance information of PCB size and refined descriptions of layout suggestion in Chapter 2: Product Dimension. (3) Updated certification information and added section 11 in Chapter 9: Certification. (4) Added nRF52833 to the chart in Chapter 11: Basic Facts of nRF52 Family & Full List of Raytac ‘s BLE Modules. ⚫ 2020/02/11 Version G (1) Corrected description of SWDIO & SWCLK in section 5 and added remarks about low frequency GPIO in section 6 of Chapter 2. (2) Refined description of default setting in Chapter 8. ⚫ 2020/06/19 Version H (1) Updated tolerance of PCB size in Chapter 2: Product Dimension. (2) Corrected note “D-“ and “D+” in Chapter 8: Reference Circuit (3) Added nRF52820 in Chapter 11: Basic Facts of nRF52 Family. (4) Updated Full List of Raytac’s BLE modules. ⚫ 2020/12/30 Version I (1) Updated information of T&R in Chapter 4: Shipment Packaging Information. (2) Added BT 5.2 SIG approval & NCC Certificate in Chapter 9: Certification. (3) Updated table in Chapter 11: Basic Facts for nRF52 Family. (4) Updated Full List of Raytac’s BLE Modules ⚫ 2021/05/28 Version J (1) Updated MPQ information for T&R package in Chapter 4: Shipment Packaging Information. (2) Updated Chapter 5: Specification corresponding to Nordic’s new nRF52840 Product Specification V1.2 72 ⚫ 2022/07/01 Version K (1) Updated Chapter 4: 4.2.1 Tray Packaging with 4.2.2 Tape & Reel Packaging info. (2) Updated Chapter 2: 2.3 RF Layout Suggestion (aka Keep-Out Area). (3) Updated List of Raytac’s Model no. (4) Corrected Schematic and info in Chapter 8: Reference Circuit. (5) Updated Chapter 5: Specification corresponding to Nordic’s new nRF52840 Product Specification V1.7. ⚫ 2023/05/24 Version L (1) Updated drawing in Chapter 2 for a better understanding of PCB measurement & RF Layout Suggestion. 73
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