BEAD0603SSJX601A20T

EMI、EMC對策用元件 THIS SPECIFICATION IS APPLIED TO MULTILAYER FERRITE CHIP BEADS BEAD0603SSJX601A20T Product standard of spec sheet 寶仁弘電子有限公司 Prosperity Electronic Co., Limited EML：brh@baorenhong.com Web:www.baorenhong.com TEL：0755-29687188 FAX：0755-29688152 深圳市寶安區福永鎮立新二路天佑創客產業園 TEL：0512-36878535 FAX：0512-36878435 江蘇省昆山市花橋鎮綠地大道 1325號 BEAD0603SSJX601A20T SAFETY REMINDERS Note:This standard is the general industry standard, for customers' reference. ◆ Do not expose the products to magnets or magnetic fields. ◆ Use a wrist band to discharge static electricity in your body through the grounding wire. ◆ Carefully lay out the coil for the circuit board design of the non-magnetic shield type.A malfunction may occur due to magnetic interference. ◆ Soldering corrections after mounting should be within the range of the conditions determined in the specifications.If overheated, a short circuit, performance deterioration, or lifespan shortening may occur. ◆ When embedding a printed circuit board where a chip is mounted to a set, be sure that residual stress is not given to the chip due to the overall distortion of the printed circuit board and partial distortion such as at screw tightening portions. ◆ Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be sufficient for the set thermal design. ◆ Before soldering, be sure to preheat components.The preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150°C. ◆ Do not use or store in locations where there are conditions such as gas corrosion (salt, acid, alkali, etc.). ◆ The storage period is less than 12 months. Be sure to follow the storage conditions (Temperature: 5 to 40°C, Humidity: 10 to 75% RH or less). ◆ When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing protection circuit/device or providing backup circuits in your equipment. ◆ Do not use for a purpose outside of the contents regulated in the delivery specifications. ◆ The products listed on this catalog are intended for use in general electronic equipment (AV equipment, telecommunications equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) under a normal operation and use condition. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. Web Site:http://www.baorenhong.com BEAD0603SSJX601A20T PRODUCT OVERVIEW ◎ Part Number Construction 產品描述: BEAD 0603 S SJX601 A 20 T BEAD--------Series name 系列名稱 0603---------Dimension 產品尺寸 S-------------Material code 材料代碼 SJX601------Impedance 阻抗值 600Ω A-------------High current 耐大電流 20------------Current value 電流值2A T-------------Taping 編帶盤裝 版本：A3.2 首次承認 發行編號：BE20241217A3587-AB01 繪圖：潘陽陽 小姐 審核：羅國良 先生 核準：魏庭 先生 Web Site:http://www.baorenhong.com BEAD0603SSJX601A20T PRODUCT OVERVIEW ◎ Shape&Dimensions 形狀與尺寸: UNIT:mm PART NUMBER A B C D CHIPS REEL 0402 1.00±0.10 0.50±0.10 0.50±0.10 0.25±0.10 10K 0603 1.60±0.20 0.80±0.20 0.80±0.20 0.30±0.20 4K 0805 2.00±0.20 1.20±0.20 0.90±0.20 0.50±0.30 4K 1206 3.20±0.20 1.60±0.20 1.10±0.20 0.50±0.30 3K 1210 3.20±0.20 2.50±0.20 1.30±0.20 0.50±0.30 2K 1806 4.50±0.20 1.60±0.20 1.60±0.20 0.50±0.30 2K 1812 4.50±0.20 3.20±0.20 1.50±0.20 0.50±0.30 1K ◎ Recommended Land Pattern 推薦焊盤布局: UNIT:mm PART NUMBER A B C 0402 0.4 2.2 0.7 0603 0.5 2.5 1.1 0805 0.7 3.8 1.5 1206 1.2 4.5 1.8 1210 1.2 4.5 2.7 1806 1.8 5.8 1.8 1812 1.8 5.8 3.4 Web Site:http://www.baorenhong.com BEAD0603SSJX601A20T ELECTRICAL CHARACTERISTICS ◎ Characteristics Specification Table 特性規格表: ORDERING CORE Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω)MAX Rated Current (mA)MAX BEAD0603SSJX601A20T 600±25% 60mV / 100M 0.100 2000 Standard Testing Condition： Temperature：Ordinary Temperature(15 to 35℃)，In case of doubt：20±2℃ Humidity：Ordinary Humidity(25 to 85% RH)，In case of doubt：60 to 70 % RH Web Site:http://www.baorenhong.com BEAD0603SSJX601A20T TEST DATA OF PREPRODUCTION SAMPLES ◎ Test Data Of Preproduction Samples 樣品測試數據: MEAS.Item Z (Ω) RDC (Ω) A mm B mm C mm D mm Ref value 600±25% 0.1 MAX 1.00±0.10 0.50±0.10 0.50±0.10 0.25±0.10 1 580.55 0.070 1.64 0.81 0.82 0.31 2 599.21 0.083 1.66 0.81 0.81 0.28 3 600.01 0.075 1.66 0.82 0.81 0.32 4 581.26 0.082 1.64 0.80 0.80 0.29 5 599.75 0.080 1.65 0.83 0.81 0.29 6 600.03 0.077 1.64 0.81 0.81 0.31 7 580.49 0.083 1.65 0.84 0.83 0.30 8 599.89 0.070 1.66 0.81 0.83 0.31 9 588.79 0.082 1.63 0.81 0.80 0.29 10 580.54 0.075 1.63 0.83 0.81 0.28 X 591.05 0.078 1.65 0.82 0.81 0.30 R 19.54 0.013 0.03 0.04 0.03 0.04 Test instruments: Impedance : HP 4291B RF Impedance/Material analyzer RDC : HIOKI 3540 at 100MHz 60mV The test data above is only for reference,actual results may differ due to different production batches. Web Site:http://www.baorenhong.com BEAD0603SSJX601A20T THE TEST CURVE ◎ The Test Curve 樣品測試曲線: Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS RELIABILITY TEST 100% Pure matte- tin solder terminal Plating. Pb contain of solder terminal less than 1000ppm Rework temperature:350℃ 3-5 seconds ok. Operating Temperature Range:-40℃ to +125℃. Storage Temperature Range:-40℃ to +125℃. (For products in unopened tape package 0℃ to +40℃. ) Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS RELIABILITY TEST Item Performance Test Condition Preheat:150℃,60 seconds 1. The chip shall not be cracks . Soldering heat resistance 2. More than 75% of terminal electrode shall be covered with solder. Solder: Sn/Ag/Cu Solder:temperature:260 ±5℃ Flux: Rosin Dip time:5±0.5 seconds 3. Impedance: within±20% of the initial value. 4. Inductance: within±10% of the initial value. Solder ability More than 90% of the terminal electrode shall be covered with new solder. The terminal eletrode and the ferrite shall not be damaged by the forces applied on the right conditions. Terminal Strength Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS RELIABILITY TEST Item Performance Test Condition The ferrite shall not be damaged by the forces applied on the right conditions. Bending strength Appearance: Ferrite shall not be damaged. Temperature:100℃ Impedance : Within ±20% of the initial Testing time: 1008 hours. value. Inductance : Within ±10% of the initial Measurement: After placing for 24 hours min. value. High temperature Q: Within±30% of the initial value. resistance This test procedure was according to JESD22-A103-A Impedance: Within±20% of the initial value. Temperature:-40℃ Inductance: Within±10% of the initial value. Testing time: 1008 hours. Q: Within±30% of the initial value. Measurement: After placing for 24 hours min. Appearance: cracking, chipping or any other defects harmful to the Low temperature characteristics shall not be allowed. resistance Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS RELIABILITY TEST Item Performance Appearance: Ferrite shall not be damaged. Test Condition Humidity:95%RH Impedance : Within ±20% of the initial Temperature:60℃ value. Inductance : Within ±10% of the initial Testing time: 1008 hours. value. Q: Within±30% of the initial value. Humidity resistance Measurement: After placing for 24 hours min. This test procedure was according to MIL-STD-202F method 103D Appearance: Cracking, chipping or any other defects harmful to the Temperature:100℃ characteristics shall not be allowed. Impedance: Within ±30% of the initial Testing time: 1008 hours. value. Inductance: Within ±10% of the initial Measurement: After placing for 24 hours min. value. Q: Within±30% of the initial value. Thermal shock This test procedure was according to MIL-STD-883D method 1010.7 Web Site:http://www.baorenhong.com BEAD0603SSJX601A20T SOLDERING AND MOUNTING ● Mildly activated rosin fluxes are preferred. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 1.Recommended temperature profiles for re-flow soldering Standard Profile Pre – heating Limit Profile 150~180℃,90S±30S Heating Above 220℃, 30s-60s Above 217℃,60s-150s Peak temperature 245±3℃ 260℃,10s Cycle of reflow 2 times 2 times 2.Flux,Solder  Use rosin-based flux  Don’t use high acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).  Use lead-free solder, use Sn-3.0Ag-0.5Cu solder  Standard thickness of solder paste: 0.12~0.15mm 3.Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre – heating 150℃, 1 minute Tip temperature 350℃ max. Soldering iron output 30w max. End of soldering iron  3mm max. Soldering time 3 seconds max. Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS CLEANING CONDITIONS ● Products should be cleaned on the following conditions. Cleaning temperature shall be limited to 60℃max. (40℃ max for fluoride and alcohol type cleaner.) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Cleaner Cleaning Conditions: Power: 20 w / liter max. Frequency:28 kHz ~ 40 kHz Time:5 minutes max. ◎Alcohol cleanerIsopropyl alcohol ( IPA) ◎Aqueous agentPINE ALPHA ST – 100S Do not clean after soldering. Some cleaning agents may degrade bonding strength,and characteristics of products by detaching. If cleaning,please contact us. There shall be no residual flux and residual cleaner after cleaning, extra flux maybe affect the electrical characteristics. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS ATTENTION REGARDING P.C.B BENDING The following shall be considered when designing and laying out P.C.B. P.C.B shall be designed so that products are not subjected to the mechanical stress due to warping the board. Products direction Products shall be located in the sideways direction to the mechanical stress. Poor example Good example Products location on P.C.B. separation. Products shall be located carefully so that products are not subjected to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in magnitude of A > C > B  D. Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS RESIN COATING The electrical characteristics may be changed due to the large cure-stress of the resin to be used for coating/molding products. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil ,leading to open circuit. So please pay your careful attention in selecting resin to prevent any affection on the product in case of coating/molding the products with the resin. In prior to use,please make the reliability evaluation with the product mounted in your application set. Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS CAUTION FOR USE Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. 1.Aircraft equipment 2.Aerospace equipment 3.Undersea equipment 4.Power plant control equipment 5.Medical equipment Requirements to the applications listed in the above. 6. Transportation equipment (vehicles, trains, ships, etc.) 7. Traffic signal equipment 8. Disaster prevention / crime prevention equipment 9. Data-processing equipment 10. Applications of similar complexity and / or reliability There is possibility that the inductance value change due to magnetism. Don’t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should de molded with resin or pottery.) Sharp material, such as a pair of tweezers, shall not be touched to the winding portion to prevent the breaking of wire. Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS STORAGE AND HANDLING REQUIREMENTS Storage period Products should be used in 6 months from the day of PROSPERITY ELECTRONICS CO.,LTD outgoing inspection. Solerability should be checked if this period is exceeded. Storage conditions Products should be storage in the warehouse on the following conditions. Temperature : 0 ~ 40℃ Humidity : 55 ~ 70% relative humidity No rapid change on temperature and humidity Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidation of electrode, resulting in poor solderability. Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight etc. Products should be stored under the airtight package condition. Handling Condition Care should be taken when transporting of handling product to avoid excessive vibration or mechanical shock. Web Site:http://www.baorenhong.com MULTILAYER FERRITE CHIP BEADS CONSTRUCTION AND COMPOSITION AND LEAD FREE DETAIL OF BEAD SERIESE Construction and composition of BEAD Outer Terminal Paste Inner Circuit Ferrite Ceramic Body Construction Position Outer Terminal Paste Material composition total% Pb Limit Silver + Glass 10wt%