STPS340U

STPS340U SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features K • Very small conduction losses • Negligible switching losses A NC • Low forward voltage drop DPAK STPS340B • Low thermal resistance • Extremely fast switching A A • Surface mounted device • Avalanche capability specified K K SMB STPS340U • ECOPACK®2 compliant component, STPS340UF SMC STPS340S Table 1. Device summary A K SMBflat STPS340UF www.tokmas.com IF(AV) 3A VRRM 40 V Tj (max) 150 °C VF (max) 0.57 V STPS340U 1 Characteristics Table 2. Absolute Ratings (limiting values) Symbol VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Value Unit 40 V 6 A 3 A DPAK Average forward current Tc = 135 °C δ = 0.5 DPAK TL = 105 °C δ = 0.5 SMB/SMC TL = 115 °C δ = 0.5 SMBflat IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1300 W -65 to + 150 °C 150 °C Tstg Storage temperature range Operating junction temperature Tj 1. Parameter dPtot --------------dTj < 1 -------------------------Rth ( j – a ) (1) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Rth(j-l) Rth(j-c) Parameter Junction to lead Junction to case Value SMB 25 SMBflat 15 SMC 20 DPAK 5.5 Unit °C/W °C/W Table 4. Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM Typ. 2 Max. Unit 20 µA 10 mA 0.63 IF = 3 A 0.52 0.57 V 0.84 IF = 6 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.050 IF2(RMS) www.tokmas.com Min. 0.63 0.72 STPS340U Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) (DPAK / SMB / SMC) IF(AV)(A) PF(AV)(W) 3.5 2.5 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) DPAK 3.0 2.0 δ=1 2.5 SMB / SMC 1.5 Rth(j-a)=65°C/W 2.0 1.5 1.0 1.0 T T 0.5 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 δ=tp/T tp 0.0 3.5 4.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5, per diode) (SMBflat) 0 Tamb(°C) tp 25 50 75 100 125 150 Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) (DPAK) IM(A) IF(AV)(A) 60 3.5 Rth(j-a)=Rth(j-l) DPAK 3.0 50 2.5 40 2.0 SMB flat 30 Tc=25°C 1.5 Tc=75°C Rth(j-a)=40°C/W . SCU=2.5 cm2 1.0 20 T δ=tp/T 0.0 0 t Tamb(°C) tp Tc=125°C IM 10 0.5 t(s) δ=0.5 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) 1.E-03 1.E-02 1.E-01 1.E+00 Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) (SMC) IM(A) IM(A) 10 12 SMB SMC 11 9 10 8 9 7 Ta=25°C 6 8 Ta=25°C 7 5 6 Ta=75°C 4 Ta=75°C 5 4 3 3 2 1 Ta=125°C IM 2 t 1 t(s) δ=0.5 0 1.E-03 Ta=125°C IM t t(s) δ=0.5 0 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 13 www.tokmas.com STPS340U Figure 7. Non repetitive surge peak forward current versus overload duration (maximum values) SMBflat Figure 8. Normalized avalanche power derating versus pulse duration IM(A) PARM(tp) PARM(1µs) 25 SMB flat 1 20 TL=25°C 15 0.1 TL=75°C 10 0.01 TL=125°C 5 IM t t(s) δ=0.5 1.E-03 1.E-02 tp(µs) 0.001 0 1.E-01 0.01 1.E+00 Figure 9. Normalized avalanche power derating versus junction temperature 0.1 1 10 100 1000 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) Zth(j-a)/Rth(j-a) PARM(Tj) PARM(25°C) 1.0 0.9 1.2 DPAK 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 Single pulse T 0.2 0.2 Tj(°C) 0.1 tp(s) 0 25 50 75 100 125 150 1.E-03 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) δ=tp/T 0.0 1.E-02 tp 1.E-01 1.E+00 Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.9 SMB 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 SMC 0.3 T 0.2 Single pulse 0.1 tp(s) δ=tp/T 0.0 1.E-02 T 0.2 Single pulse 0.1 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 tp(s) δ=tp/T 0.0 1.E-02 www.tokmas.com 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 STPS340U Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMBflat Figure 14. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-l)/Rth(j-l) 1.E+01 1.0 Tj=150°C SMB flat 0.9 Tj=125°C 1.E+00 0.8 Tj=100°C 0.7 1.E-01 0.6 Tj=75°C 0.5 1.E-02 0.4 0.3 Tj=25°C 1.E-03 0.2 Single pulse 0.1 tp(s) 0.0 VR(V) 1.E-04 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0 5 10 15 20 25 30 35 40 Figure 15. Junction capacitance versus reverse Figure 16. Forward voltage drop versus forward voltage applied (typical values) current C(pF) 10.00 1000 IFM(A) F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (Maximum values) 1.00 100 Tj=125°C (Typical values) 0.10 Tj=25°C (Maximum values) VR(V) VFM(V) 10 1 10 100 0.01 0.0 0.1 www.tokmas.com 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 STPS340U Figure 18. Thermal resistance junction to Figure 17. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead (SMB / SMC) (DPAK) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 110 100 Printed circuit board FR4 copper thickness = 35 µm 90 Printed circuit board FR4 copper thickness = 35 µm 100 DPAK 90 80 SMB / SMC 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 SCU(cm²) 0 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (SMBflat) Rth(j-a)(°C/W) 110 Printed circuit board FR4 copper thickness = 35 µm 100 90 80 70 60 SMBflat 50 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 www.tokmas.com 3.5 4.0 4.5 5.0 STPS340U 2 Package Information Table 5. DPAK dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.1 0.035 0.043 A2 0.03 0.23 0.001 0.01 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.195 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.024 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 e1 4.4 4.7 0.173 0.185 H 9.35 10.34 0.368 0.407 L 1.0 1.78 0.039 0.070 L2 1.27 0.05 L4 0.6 1.02 0.024 0.040 V2 0° 8° 0° 8° Figure 20. DPAK footprint dimensions (in mm) 10.7 6.1 2.8 4.572 6.3 B A 1.5 This footprint ensures insultation up to 630 V rms (according to IEC 664-1) The device must be positioned within 0.05 A B www.tokmas.com STPS340U Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 21. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 www.tokmas.com STPS340U Table 7. SMBflat dimensions Dimensions Ref. c L L2 E E1 L L1 b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 (1) b 1.95 2.20 0.077 0.087 c(1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 A D Millimeters L1 0.40 0.016 L2 0.60 0.024 1. Applies to plated leads Figure 22. SMBflat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 Typ. 1.20 www.tokmas.com Max. STPS340U Table 8. SMC package dimensions Dimensions Ref Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.40 0.030 0.063 D E A1 C A2 E2 L b Figure 23. Footprint dimensions (in millimeters) 1.54 5.03 1.54 3.15 8.11 13 www.tokmas.com STPS340U 3 Ordering information Table 9. Ordering information Order code Marking STPS340U STPS340 SS34 SS34 STPS340S Package Weight Base qty SMB SMB 0.107g g 0.107 3000 3000 S34 SMC 0.243 g 3000 S340 DPAK 0.30 g Delivery mode Tape and reel STPS340B STPS340B-TR 75 Tube 2500 Tape and reel 3000 Tape and reel ® STPS340UF FU34 ECOPACK 2 SMBflat www.tokmas.com 0.50 g