RS7530-1YE3L

RS75xx-1 150mA, Low Power Consumption, High Voltage CMOS LDO Regulator FEATURES  Low Quiescent Current IQ: 2µA Typical at Light Loads  150mA Nominal Output Current  Low Dropout Voltage  Low Temperature Coefficient  High Input Voltage (up to 36V)  Output Voltage Accuracy: ±2%  Fixed 2.5V、3.0V、3.3V、3.6V、 DESCRIPTION The RS75xx-1 series is a set of low power high voltage regulators implemented in CMOS technology. Which can provide 150mA output current. The device allows input voltage as high as 36V.It is very suitable for multi-cell battery systems, bus voltage power supply systems and other high DC voltage systems. Wide input voltage can make it well withstand the impact of surge voltage and ensure the stability of output voltage. The RS75xx-1 series only 2uA (typical) current is consumed by itself, which is especially important in multi-battery power supply systems and can reduce the standby power consumption of the whole system . and 5.0V Output Voltage  Over temperature Protection  Short Circuit Protection  Micro SIZE PACKAGES: SOT23-3 and SOT89-3L The RS75xx-1 is available in Green SOT23-3 and SOT89-3L packages. The over temperature is 150°C. Device Information (1) APPLICATIONS  Audio/Video Equipment  Communication Equipment  Battery-Powered Equipment  Automotive Head Unit  Laptop, Palmtops, Notebook Computers PART NUMBER RS75xx-1 (1) PACKAGE BODY SIZE (NOM) SOT23-3(3) 1.60mm×2.92mm SOT89-3L(3) 2.45mm×4.50mm For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Schematic VIN VIN CIN 1μF VOUT RS75xx-1 VOUT COUT 1μF GND REV A.9 1 www.run-ic.com RS75xx-1 Pin Configuration and Functions (Top View) PIN DESCRIPTION PIN NAME SOT23-3 SOT89-3L (L-Type) SOT89-3L GND 1 1 2 VOUT 2 3 1 VIN 3 2 3 REV A.9 2 FUNCTION Ground. Regulator Output. Recommended output capacitor range:1μF to 10μF. Regulator Input. Up to 36V input voltage. At least 1μF supply bypass capacitor is recommended. www.run-ic.com RS75xx-1 PACKAGE/ORDERING INFORMATION PRODUCT RS7525-1 RS7530-1 RS7533-1 RS7536-1 RS7550-1 ORDERING NUMBER VOUT(V) PACKAGE LEAD PACKAGE MARKING PACKAGE OPTION RS7525-1YF3 2.5 SOT23-3 7525-1 Tape and Reel,3000 RS7525-1YE3L 2.5 SOT89-3L(L-Type) 7525-1 Tape and Reel,1000 RS7530-1YF3 3.0 SOT23-3 7530-1 Tape and Reel,3000 RS7530-1YE3L 3.0 SOT89-3L(L-Type) 7530-1 Tape and Reel,1000 RS7533-1YF3 3.3 SOT23-3 7533-1 Tape and Reel,3000 RS7533-1YE3 3.3 SOT89-3L 7533-E Tape and Reel,1000 RS7533-1YE3L 3.3 SOT89-3L(L-Type) 7533-1 Tape and Reel,1000 RS7536-1YF3 3.6 SOT23-3 7536-1 Tape and Reel,3000 RS7536-1YE3L 3.6 SOT89-3L(L-Type) 7536-1 Tape and Reel,1000 RS7550-1YF3 5.0 SOT23-3 7550-1 Tape and Reel,3000 RS7550-1YE3 5.0 SOT89-3L 7550-E Tape and Reel,1000 RS7550-1YE3L 5.0 SOT89-3L(L-Type) 7550-1 Tape and Reel,1000 NOTE: 1.Date Code and Vendor Code also marking in package. 3 www.run-ic.com RS75xx-1 Specifications Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1)(2) MIN MAX UNIT VIN Input voltage -0.3 40 V TJ Junction temperature -40 150 °C PD Continuous power dissipation (3) Tstg Storage temperature (1) W Internally Limited -65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the GND pin. Internal thermal shutdown circuitry protects the device from permanent damage. (2) (3) ESD Ratings V(ESD) Electrostatic discharge VALUE UNIT Human-body model (HBM) ±4000 V Machine model (MM) ±100 V MAX UNIT Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN VIN Input supply voltage IOUT Output current COUT Capacitor of Vout pin TA Operating temperature 2.5 36 V 0 150 mA 1 -40 22 （ ） +85 2 μF °C (1) All voltages are with respect to the GND pin (2) The chip’s operating temperature is determined by the junction temperature(TJ) , the relationship between TA and TJ , Please refer to the application note as below. Thermal Information RS75xx-1 THERMAL METRIC (1) SOT89-3L (L-Type) SOT89-3L SOT23-3 UNIT 3 PINS 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 165 75 185.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 88.5 88.1 104.3 °C/W RθJB Junction-to-board thermal resistance 39.6 9.6 54.5 °C/W ψJT Junction-to-top characterization parameter 26.5 6.2 31.0 °C/W ψJB Junction-to-board characterization parameter 49.7 9.7 54.5 °C/W RJC(bot) Junction-to-case (bottom) thermal resistance 77.7 7.7 N/A °C/W 4 www.run-ic.com RS75xx-1 ELECTRICAL CHARACTERISTICS (VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) PARAMETER TEMP MIN TYP VOUT = 3.3V +25°C - - 36 V Output Voltage Accuracy IOUT = 10mA +25°C -2 0 2 % Ground Pin Current No load +25°C - 2 3 μA +25°C 70 100 - mA +25°C - 526 800 mV +25°C 0.05 0.2 %/V +25°C 25 60 mV Input Voltage(1) SYMBOL VIN CONDITIONS Maximum Output Current (2) Dropout Voltage (3) Line Regulation Load Regulation Power Supply Rejection Ratio Output Voltage Temperature Coefficient (4) VDROP IOUT =100mA, △Vo=2% ΔVOUT VIN = VOUT + 2V to 36V, IOUT = 1mA ΔVIN × VOUT ΔVOUT PSRR VIN =VOUT+2V, IOUT = 1mA to 50mA VOUT = 3.3V, IOUT = 10mA f = 217Hz f = 1KHz ΔVOUT IOUT = 1mA ΔTA × VOUT +25°C FULL 58 40 MAX UNITS dB 100 ppm/°C 150 °C THERMAL PROTECTION Thermal Shutdown Temperature TSHDN NOTES: 1. VIN >= VOUT (NOMINAL) , whichever is greater. 2 Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient temperature and the other environment factors of system. Attention should be paid to the dropout voltage when VIN < VOUT + VDROP. 3. The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V. 4. Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range. 5 www.run-ic.com RS75xx-1 ELECTRICAL CHARACTERISTICS (VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 5.0V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) PARAMETER TEMP MIN TYP VOUT = 5.0V +25°C - - 36 V Output Voltage Accuracy IOUT = 10mA +25°C -2 0 2 % Ground Pin Current No load +25°C - 2 3 μA +25°C 100 150 - mA +25°C - 440 700 mV +25°C 0.05 0.2 %/V +25°C 25 60 mV Input Voltage(1) SYMBOL VIN CONDITIONS VIN = VOUT + 2V Maximum Output Current (2) Dropout Voltage (3) Line Regulation Load Regulation Power Supply Rejection Ratio Output Voltage Temperature Coefficient (4) VDROP IOUT = 100mA △Vo=2% ΔVOUT VIN = VOUT + 2V to 36V, IOUT = 1mA ΔVIN × VOUT ΔVOUT PSRR VIN =VOUT+2V, IOUT = 1mA to150mA VOUT = 5.0V, IOUT = 10mA f = 217Hz f = 1KHz ΔVOUT IOUT = 1mA ΔTA × VOUT +25°C FULL MAX UNITS 58 dB 40 100 ppm/°C 150 °C THERMAL PROTECTION Thermal Shutdown Temperature TSHDN NOTES: 1. VIN >= VOUT (NOMINAL) , whichever is greater. 2. Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient temperature and the other environment factors of system. Attention should be paid to the dropout voltage when VIN < VOUT + VDROP. 3. The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V. 4.Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range. 6 www.run-ic.com RS75xx-1 TYPICAL CHARACTERISTICS VIN = 5.3V, VOUT = 3.0V, CIN = COUT = 1μF, TA = 25°C unless otherwise noted. Load-Transient Response Line-Transient Response IOUT=10mA to 100mA VIN=5.3V to 6.3V,IOUT=50mA VOUT 50mV/div VOUT Time(1ms/div) 100mV/div 1V/div IOUT 100mA/div VIN Time(2ms/div) Output Short Waveform Power-Up/Power-Down Output Waveform VIN=0 to 3.4V,IOUT=50mA VOUT 2V/div 2V/div VIN 100mA/div 2V/div VOUT IOUT VIN=0 to 5.3V,IOUT=50mA Time(2ms/div) Time(1ms/div) IOUT=50mA 7 www.run-ic.com RS75xx-1 TYPICAL CHARACTERISTICS VIN = 5.3V, VOUT = 3.0V, CIN = COUT = 1μF, TA = 25°C unless otherwise noted. 8 www.run-ic.com RS75xx-1 DETAILED DESCRIPTION Overview The RS75xx-1 low-dropout regulators (LDO) consumes only 2µA of quiescent current at light load and delivers excellent line and load transient performance. These characteristics, combined with low noise and good PSRR with low dropout voltage, make this device ideal for portable consumer applications. Functional Block Diagram Thermal Considerations When the junction temperature is too high, the thermal protection circuitry sends a signal to the control logic that will shut down the IC. The IC will restart when the temperature has sufficiently cooled down. The maximum power dissipation is dependent on the thermal resistance of the case and the circuit board, the temperature difference between the die junction and the ambient air, and the rate of air flow. The GND pin must be connected to the ground plane for proper dissipation. Applications Note: 1）The phase compensation circuit and ESR of the output capacitor are used inside the circuit to compensate, so a capacitor larger than 1.0uF must be connected to the ground. 2）It is recommended to use 1uF polar capacitors for input and output, and to keep the capacitors as close to the VIN and VOUT pins of LDO as possible. 3）Pay attention to the use conditions of input and output voltages and load currents to avoid the power consumption (PD) inside the IC exceeding the maximum power consumption allowed by the package. PD=(VIN－VOUT)×IOUT TPN = PD×RθJA+T TPN is junction temperature T is ambient temperature。 4）When the input voltage VIN is greater than 2.5V, if VIN is also higher than the output set value plus the device dropout voltage, VOUT is equal to the set value. Otherwise, VOUT is equal to VIN minus the dropout voltage. If VIN lower than 2.5V, the VOUT is: VOUT = VIN - VDropout 9 www.run-ic.com RS75xx-1 PACKAGE OUTLINE DIMENSIONS SOT23-3 D 1.90 b 2.59 E1 E 0.99 0.95 0.69 e e1 RECOMMENDED LAND PATTERN (Unit: mm) 0.2 A A2 L A1 Symbol c θ Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950(BSC) 0.037(BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° 10 www.run-ic.com RS75xx-1 SOT89-3L D 2.0 A D1 3.0 E E1 0.7 45° b1 L e 1.5 b c 1.5 e1 1.0 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.400 1.600 0.055 0.063 b 0.320 0.520 0.013 0.020 b1 0.400 0.580 0.016 0.023 c 0.350 0.440 0.014 0.017 D 4.400 4.600 0.173 0.181 D1 1.550 REF 0.061 REF E 2.300 2.600 0.091 0.102 E1 3.940 4.250 0.155 0.167 e 1.500 BSC 0.060 BSC e1 3.000 BSC 0.118 BSC L 0.900 1.200 11 0.035 0.047 www.run-ic.com