TJ-S5050UG3W5TLCRGBTW-A5

TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 承 認 書 Specification For Approval Customer: (客戶) Description: (產品描述) ＳＭＤ５０５０燈珠ＲＧＢＷ正白 Part number:(產品型號) ＴＪ－Ｓ５０５０ＵＧ３Ｗ５ＴＬＣＲＧＢＴＷ－Ａ５ Date: (日期) Approved By: (客戶承認) Prepared By:(我司承認) Approval 核准 Check Design 審核 製作 Sales 業務 Customer Service Hotline：400-676-8616 TEL：0769-8662 5999 0769-8200 2226 E-MIAL∶ｄｇ＠ｔｏｇｉａｌｅｄ．ｃｏｍ FAX：0769-8200 2227 WEB：www.togi aled. c om TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Outline Dimension: φ 4.50 5 4 4 5 6 3 3 6 7 2 2 7 8 1 1 8 1.25 1.5 Polarity Mark ■ 4.08 3.0 5.0 0.6 5.5 0.6 ■ R 5 4 G 6 3 B 7 W 8 2 1 PAD Lay Out PCB 6.4 3.2 0.56 ATTENTION 0.6 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.2 unless otherwise noted. 3. Specifications are subject to change without notice. 注意：此款灯珠由于支架灯杯原因在蓝光点亮时白光荧光粉部分会受到影响激发，非特定条件下不影响使用效果。 2/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD ■Absolute Maximum Ratings (Ta = 25℃) Items Symbol Absolute maximum Rating Unit Dissipation PD 308 mW Forward Current(DC) IF 30 mA Peak Forward Current IFP 100 mA Reverse Voltage VR 5 V Operation Temperature Topr ﹣40～﹢85 ℃ Storage Temperature Tstg ﹣40～﹢80 ℃ Lead Soldering Temperature Tsol Power Max.260℃ for 5 sec Max. (3min from the base of the epoxy bulb) Pulse width≤ ≤0.1msec duty≤ ≤1/10 ■Typical Electrical & Optical Characteristics(Ta=25°) Items Forward Voltage Reverse Current Dominant Wavelength Color Temperature Symbol Condition Min Typ Max Unit R G 1.8 2.8 2.0 3.0 2.4 3.4 V V B 2.8 3.0 3.4 V VF( IF =30mA) W 2.8 3.0 3.4 V IR VR =5V --- --- 2 μA R 620 --- 630 nm Λd(IF =20mA) G 520 --- 530 nm IF =30mA B W 460 5500 400 ------- 470 7000 800 nm K mcd VF ( IF =20mA) R Luminous Intensity View Angle Iv ( IF =20mA) G 1200 --- 2200 mcd Iv(I F =30mA) B W 300 8 ----- 700 12 mcd LM 2θ1/2 IF =20mA --- 120 --- Deg 3/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Typical Electrical/Optical Characteristics Curves (R): 4/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Typical Electrical/Optical Characteristics Curves (G): 5/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD ■ Typical Electrical/Optical Characteristics Curves (B): 6/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD ■ Typical Electrical/Optical Characteristics Curves (W): 7/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Classification Life Test Environment Test Test Item Standard Test Method Operating Life Test JIS7021:B4 MIL-STD-202:107D MIL-STD-750:1026 High Temperature Storage JIS7021:B10 MIL-STD-202:210A MIL-STD-750:2031 Low Temperature Storage JIS7021:B12 Temp &Humidity Test Test Conditions Duration Units Tested Number of Damaged TA=25℃± 5℃,IF=30mA 1000h 22 0/22 1000h 22 0/22 1000h 22 0/22 1000h 22 0/22 50 Cycles 22 0/22 50 Cycles 22 0/22 1 time 22 0/22 3time 22 0/22 TA=100℃± 5℃ TA=﹣55℃± 5℃ TA=85℃± JIS7021:B11 MIL-STD-202:103D 5℃ RH=85﹪± 5℃RH Thermal Shock Test JIS7021:B4 MIL-STD-202:107D MIL-STD-750:1026 ﹣10℃±5℃ ← →100℃ ±5℃ 5min - 5min ﹣55℃～ Temperature Cycling Test JIS7021:A3 MIL-STD-202:107D MIL-STD-750:1051 25℃～85 ℃～25℃ 3min -5min30min- 5min Mechanical Test Resistance to Soldering Heat JIS7021:A1 MIL-STD-202:210A MIL-STD-750:2031 Lead Integrity MIL-STD-750D Method 2036.3 8/11 260±5℃, 10±1sec Load 2.5N 0°～90°～0° TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD ● Soldering : 1. Manual Soldering The temperature of the iron tip should not be higher than 350℃and Soldering time to be within 3 seconds per solder-pad. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. Temperature 260℃ MAX. 140~160℃ 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 ℃ 245 ± 5℃ within 5 sec. 120~150℃ Preheat 120~180 sec. Time 9/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD ● Handling : Care must be taken not to damage LED’s epoxy resin while exposing to high temperature or contact LED’s epoxy resin with hard or sharp objects, such as metal hook, tweezer or sand blasting.. ● Notes for designing: Current limiting resistor must be used in the circuit to drive TOGIA LEDs within the rated figures and not to overload TOGIA LEDs with instantaneous voltage at the turning ON and OFF cycles. When using pulse driving, the average current must be within the rated figures. And the circuit should be designed to avoid reverse voltage when turning off the TOGIA LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder TOGIA LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: Package: Products are packed in one bag of 1000 pcs (one taping reel) and a label is attached to each bag. 10/11 TAIWAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD GUANGDONG TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD ● Tapping and packaging specifications(Units: mm) Label Aluminum moisture-proof bag Desiccant Label ● Package Method unit: mm) 1 0 b a g /b o x 1000 pcs/ r e e l 225 B ar C ode L abel 270 280 215 130 A l u m i n u m F o i l B ag 480 6 b o x / c a r to n 290 410 11/11