SS2200A

SS22 THRU SS2200 Forward Current - 2.0 Ampere Reverse Voltage - 20 to 200 Volts SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features DO-214AC/SMA  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  For surface mounted applications  Metal silicon junction,majority carrier conduction  Low power loss,high efficiency 0.110(2.80) 0.090(2.30) 0.067 (1.70) 0.051 (1.30)  Built-in strain relief,ideal for automated placement  High forward surge current capability  High temperature soldering guaranteed: 0.177(4.50) 0.150(3.80) 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.097(2.45) 0.073(1.85) 0.061(1.55) 0.029(0.75) 0.008(0.20) 0.002(0.05) Mechanical Data 0.209(5.30) 0.184(4.70) Case: JEDEC DO-214AC/SMA molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight : 0.0021ounce, 0.06grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage VRMM Maximum RMS voltage Maximum DC blocking voltage VRMS VDC MDD SS22 MDD SS23 MDD SS24 MDD SS25 MDD SS26 MDD SS28 MDD SS210 MDD SS2150 MDD SS2200 UNITS 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 150 105 150 200 140 200 V V V Maximum average forward rectified current I(AV) 2.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 50 A Maximum instantaneous forward voltage at 2.0A VF Maximum DC reverse current at rated DCblocking voltage TA=25℃ TA=100℃ Typical junction capacitance (NOTE 1) 0.55 IR CJ RJA 220 Typical thermal resistance (NOTE 2) Operating junction temperature range TJ -55 to +125 Storage temperature range TSTG 0.70 0.85 0.5 5 0.95 0.3 3 mA pF 80 80.0 ℃/W -55 to +150 ℃ -55 to +150 ℃ Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0"x2.0”(5.0x5.0cm) copper pad areas http://www.microdiode.com V Rev:2025A5 Page :1 SS22 THRU SS2200 Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere Typical Characterisitics Fig.2 Typical Reverse Characteristics 3.0 SS22~SS24 SS25~SS2200 2.5 Average Forward Current (A) Instaneous Reverse C urrent ( μ A) Fig.1 Forward Current Derating Curve 2.0 1.5 1.0 0.5 0.0 Single phase half-wave 60 Hz resistive or inductive load 25 50 75 100 125 150 10 4 10 3 10 2 TJ=100°C TJ=75°C SS22~SS26 SS28~SS2200 101 TJ=25°C 10 0 0 Case Temperature (°C) 20 40 60 80 100 Percent of Rated Peak Reverse Voltage（%） Fig.3 Typical Forward Characteristic Fig.4 Typical Junction Capacitance 500 20 TJ=25°C 200 1.0 Junction Capacitance (pF) Instaneous Forward Current (A) 10 SS22-SS24 SS25~SS26 SS28~SS210 SS2150~SS2200 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 100 50 SS22~SS24 20 SS25~SS2200 10 0.1 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current 100 100 50 40 30 20 10 8.3 ms Single Half Sine Wave (JEDEC Method) 1 10 Number of Cycles at 60Hz 100 Transient Thermal Impedance（°C/W） Peak Forward Surage Current (A) 10 Fig.6- Typical Transient Thermal Impedance 60 00 1 Reverse Voltage (V) Instaneous Forward Voltage (V) 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） The curve above is for reference only. http://www.microdiode.com Rev:2025A5 Page :2 SS22 THRU SS2200 Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere Packing information unit:mm P0 Item P1 Symbol Tolerance SMA A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.33 2.36 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.28 12.00 18.00 d E F B A W P D2 T D1 C W1 D Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE S MA REEL SIZE REEL (pcs) COMPONENT SPACING (m/ m) BOX (p cs) IN NER BOX (m/m) REEL DIA, (m/m) CARTON SIZ E (m/m) 13" 5,000 4. 0 1 0,000 340* 350*40 330 370*370* 370 CARTON (p cs) 80, 000 Suggested Pad Layout Symbol A Unit (mm) 1.68 Unit (inch) 0.066 B 1.52 0.060 C 3.93 0.154 D 2.41 0.095 E 5.45 0.215 Important Notice and Disclaimer Microdiode Electronics (Shenzhen) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Shenzhen) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Shenzhen) assume any liability for application assistance or customer product design. Microdiode Electronics (Shenzhen) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Shenzhen). Microdiode Electronics (Shenzhen) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Shenzhen). http://www.microdiode.com Rev:2025A5 Page :3