ESP32-C6 Series
Datasheet
Ultra-low-power SoC with RISC-V single-core microprocessor
2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4)
Optional 4 MB flash in the chip’s package
30 or 22 GPIOs, rich set of peripherals
QFN40 (5×5 mm) or QFN32 (5×5 mm) package
Including:
ESP32-C6
ESP32-C6FH4
Version 1.0
Espressif Systems
Copyright © 2023
www.espressif.com
Product Overview
The ESP32-C6 SoC (System on Chip) supports Wi-Fi 6 in 2.4 GHz band, Bluetooth 5, Zigbee 3.0 and Thread
1.3. It consists of a high-performance (HP) 32-bit RISC-V processor, an low-power (LP) 32-bit RISC-V processor,
wireless baseband and MAC (Wi-Fi, Bluetooth LE, and 802.15.4), RF module, and numerous peripherals. Wi-Fi,
Bluetooth and 802.15.4 coexist with each other and share the same antenna.
The functional block diagram of the SoC is shown below.
Espressif’s ESP32-C6 Wi-Fi + Bluetooth® Low Energy + 802.15.4 SoC
Wireless MAC and
Baseband
CPU System
⚙
HP RISC-V
32-bit
Microprocessor
Cache
LP RISC-V
32-bit
Microprocessor
SRAM
JTAG
LP
Memory
ROM
RF
2.4 GHz Balun + Switch
Wi-Fi
Baseband
Wi-Fi MAC
Bluetooth LE
Baseband
Bluetooth LE
Link Controller
802.15.4
Baseband
802.15.4
MAC
2.4 GHz Transmitter
2.4 GHz Receiver
RF Synthesizer
Peripherals
SPI
TWAI®
GDMA
⚙
⚙
⚙
⚙
LED PWM
PARLIO
SDIO 2.0
Slave
⚙
⚙
⚙
System Timer
⚙
I2C
GPIO
⚙
I2S
UART
⚙
PCNT
RMT
⚙
ETM
MCPWM
Brownout
Detector
Power Management
ADC
⚙
⚙
⚙
Security
Super
Watchdog
⚙
LP UART
USB Serial/ ⚙
JTAG
LP I2C
⚙
Temperature⚙
Sensor
eFuse
Controller
⚙
Power Management Unit
RTC Watchdog
Timer
⚙
General-Purpose
Timers
⚙
LP IO
Main System
Watchdog Timers
⚙
SHA
⚙
AES
RNG
⚙
⚙
⚙
Secure⚙
Boot
⚙
RSA
⚙
Digital ⚙
Signature
⚙
⚙
ECC
⚙
HMAC
⚙
Clock
Glitch Filter
TEE
Controller
Flash
Encryption
APM
⚙
Modules having power in specific power modes:
Active
Active and Modem-sleep
Active, Modem-sleep, Light-sleep;
All modes
⚙
⚙
optional in Light-sleep
optional in Deep-sleep
ESP32-C6 Functional Block Diagram
For more information on power consumption, see Section 3.9 Low Power Management.
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Features
Note that when ESP32-C6 scans in Station
Wi-Fi
mode, the SoftAP channel will change along
• 1T1R in 2.4 GHz band
with the Station channel
• Operating frequency: 2412 ~ 2484 MHz
– Antenna diversity
• IEEE 802.11ax-compliant
– 802.11mc FTM
– 20 MHz-only non-AP mode
Bluetooth®
– MCS0 ~MCS9
• Bluetooth LE: Bluetooth 5.3 certified
– Uplink and downlink OFDMA, especially
suitable for simultaneous connections in
• Bluetooth mesh
high-density environments
• High power mode (20 dBm)
– Downlink MU-MIMO (multi-user, multiple
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
input, multiple output) to increase network
• Advertising extensions
capacity
– Beamformee that improves signal quality
• Multiple advertisement sets
– Channel quality indication (CQI)
• Channel selection algorithm #2
– DCM (dual carrier modulation) to improve
• LE power control
link robustness
• Internal co-existence mechanism between Wi-Fi
and Bluetooth to share the same antenna
– Spatial reuse to maximize parallel
transmissions
IEEE 802.15.4
– Target wake time (TWT) that optimizes
• Compliant with IEEE 802.15.4-2015 protocol
power saving mechanisms
• OQPSK PHY in 2.4 GHz band
• Fully compatible with IEEE 802.11b/g/n protocol
– 20 MHz and 40 MHz bandwidth
• Data rate: 250 Kbps
– Data rate up to 150 Mbps
• Thread 1.3
– Wi-Fi Multimedia (WMM)
• Zigbee 3.0
– TX/RX A-MPDU, TX/RX A-MSDU
CPU and Memory
– Immediate Block ACK
• HP RISC-V processor:
– Fragmentation and defragmentation
– Clock speed: up to 160 MHz
– Transmit opportunity (TXOP)
– Four stage pipeline
– Automatic Beacon monitoring (hardware
– CoreMark® score: 441.32 CoreMark;2.76
TSF)
CoreMark/MHz (160 MHz)
– 4 × virtual Wi-Fi interfaces
• LP RISC-V processor:
– Simultaneous support for Infrastructure BSS
in Station mode, SoftAP mode, Station +
– Clock speed: up to 20 MHz
SoftAP mode, and promiscuous mode
– Two stage pipeline
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ESP32-C6 Series Datasheet v1.0
• L1 cache: 32 KB
• Timers:
• ROM: 320 KB
– 1 × 52-bit system timer
• HP SRAM: 512 KB
– 2 × 54-bit general-purpose timers
• LP SRAM: 16 KB
– 3 × digital watchdog timers
• Supported SPI protocols: SPI, Dual SPI, Quad
– 1 × analog watchdog timer
SPI, QPI interfaces that allow connection to flash
Power Management
and other SPI devices off the chip’s package
• Flash controller with cache is supported
• Fine-resolution power control through a selection
of clock frequency, duty cycle, Wi-Fi operating
• Flash in-Circuit Programming (ICP) is supported
modes, and individual power control of internal
components
Advanced Peripheral Interfaces
• Four power modes designed for typical
• 30 × GPIOs (QFN40), or 22 × GPIOs (QFN32)
scenarios: Active, Modem-sleep, Light-sleep,
• Analog interfaces:
Deep-sleep
– 1 × 12-bit SAR ADC, up to 7 channels
• Power consumption in Deep-sleep mode is 7 µA
– 1 × temperature sensor
• Low-power (LP) memory remains powered on in
Deep-sleep mode
• Digital interfaces:
– 2 × UART
Security
– 1 × Low-power (LP) UART
• Secure boot - permission control on accessing
– 2 × SPI ports for communication with flash
internal and external memory
– 1 × General purpose SPI port
• Flash encryption - memory encryption and
decryption
– 1 × I2C
– 1 × Low-power (LP) I2C
• 4096-bit OTP, up to 1792 bits for users
– 1 × I2S
• Trusted execution environment (TEE) controller
and access permission management (APM)
– 1 × Pulse count controller
• Cryptographic hardware acceleration:
– 1 × USB Serial/JTAG controller
– AES-128/256 (FIPS PUB 197)
– 2 × TWAI® controller, compatible with ISO
– ECC
11898-1 (CAN Specification 2.0)
– 1 × SDIO 2.0 slave controller
– HMAC
– LED PWM controller, up to 6 channels
– RSA
– 1 × Motor Control PWM (MCPWM)
– SHA
– 1 × Remote control peripheral (TX/RX)
– Digital signature
– 1 × Parallel IO interface (PARLIO)
– Hash (FIPS PUB 180-4)
• External Memory Encryption and Decryption
– General DMA controller, with 3 transmit
(XTS_AES)
channels and 3 receive channels
• Random Number Generator (RNG)
– Event task matrix (ETM)
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ESP32-C6 Series Datasheet v1.0
transmission
RF Module
• Up to +19.5 dBm of power for an 802.11ax
• Antenna switches, RF balun, power amplifier,
transmission
low-noise receive amplifier
• Up to -106 dBm of sensitivity for Bluetooth LE
• Up to +21 dBm of power for an 802.11b
receiver (125 Kbps)
Applications
With low power consumption, ESP32-C6 is an ideal choice for IoT devices in the following areas:
• Smart Home
• POS machines
• Industrial Automation
• Service robot
• Health Care
• Audio Devices
• Consumer Electronics
• Generic Low-power IoT Sensor Hubs
• Smart Agriculture
• Generic Low-power IoT Data Loggers
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ESP32-C6 Series Datasheet v1.0
Contents
Contents
Product Overview
2
Features
3
Applications
5
1
ESP32-C6 Series Comparison
12
1.1
Nomenclature
12
1.2
Comparison
12
2
Pins
13
2.1
Pin Layout
13
2.2
Pin Overview
15
2.3
IO Pins
19
2.3.1
IO MUX and GPIO Pin Functions
19
2.3.2
LP IO MUX Functions
22
2.3.3
Analog Functions
22
2.3.4
Restrictions for GPIOs and LP GPIOs
24
2.4
Analog Pins
25
2.5
Power Supply
26
2.5.1
Power Pins
26
2.5.2
Power Scheme
26
2.5.3
Chip Power-up and Reset
27
2.6
Strapping Pins
29
2.6.1
SDIO Sampling and Driving Clock Edge Control
30
2.6.2
Chip Boot Mode Control
30
2.6.3
ROM Messages Printing Control
30
2.6.4
JTAG Signal Source Control
31
2.7
Pin Mapping Between Chip and Flash
32
3
Functional Description
33
3.1
CPU and Memory
33
3.1.1
HP CPU
33
3.1.2
LP CPU
33
3.1.3
Internal Memory
34
3.1.4
Off-package Flash
34
3.1.5
Address Mapping Structure
35
3.1.6
Cache
35
3.1.7
TEE Controller
35
3.1.8
Access Permission Management (APM)
35
3.1.9
Timeout Protection
36
3.2
3.3
System Clocks
36
3.2.1
CPU Clock
36
3.2.2
Low-Power Clocks
36
Analog Peripherals
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Contents
3.4
3.5
3.6
3.7
3.8
3.3.1
Analog-to-Digital Converter (ADC)
37
3.3.2
Temperature Sensor
37
Digital Peripherals
37
3.4.1
Universal Asynchronous Receiver Transmitter (UART)
37
3.4.2
Serial Peripheral Interface (SPI)
37
3.4.3
I2C Interface
38
3.4.4
I2S Interface
38
3.4.5
Pulse Count Controller (PCNT)
38
3.4.6
USB Serial/JTAG Controller
39
®
3.4.7
TWAI Controller
39
3.4.8
SDIO 2.0 Slave Controller
39
3.4.9
LED PWM Controller
40
3.4.10 Motor Control PWM (MCPWM)
40
3.4.11 Remote Control Peripheral
41
3.4.12 Parallel IO (PARLIO) Controller
41
3.4.13 General DMA Controller (GDMA)
41
3.4.14 Event Task Matrix (ETM)
41
Radio
42
3.5.1
2.4 GHz Receiver
42
3.5.2
2.4 GHz Transmitter
42
3.5.3
Clock Generator
42
Wi-Fi
43
3.6.1
Wi-Fi Radio and Baseband
43
3.6.2
Wi-Fi MAC
43
3.6.3
Networking Features
44
Bluetooth LE
44
3.7.1
Bluetooth LE PHY
45
3.7.2
Bluetooth LE Link Controller
45
802.15.4
45
3.8.1
802.15.4 PHY
45
3.8.2
802.15.4 MAC
46
3.9
Low Power Management
46
3.10
Timers
46
3.10.1 System Timer
46
3.10.2 General Purpose Timers
47
3.10.3 Watchdog Timers
47
Cryptography/Security Components
48
3.11.1 AES Accelerator (AES)
48
3.11.2 ECC Accelerator (ECC)
48
3.11.3 HMAC Accelerator (HMAC)
49
3.11.4 RSA Accelerator (RSA)
49
3.11.5 SHA Accelerator (SHA)
49
3.11.6 Digital Signature (DS)
50
3.11.7 External Memory Encryption and Decryption (XTS_AES)
50
3.11.8 Random Number Generator (RNG)
51
Peripheral Pin Configurations
51
3.11
3.12
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ESP32-C6 Series Datasheet v1.0
Contents
4
Electrical Characteristics
54
4.1
Absolute Maximum Ratings
54
4.2
Recommended Power Supply Characteristics
54
4.3
VDD_SPI Output Characteristics
55
4.4
DC Characteristics (3.3 V, 25 °C)
55
4.5
ADC Characteristics
56
4.6
Current Consumption
56
4.6.1
RF Current Consumption in Active Mode
56
4.6.2
Current Consumption in Other Modes
57
4.7
Reliability
58
5
RF Characteristics
59
5.1
Wi-Fi Radio
59
5.1.1
Wi-Fi RF Transmitter (TX) Characteristics
59
5.1.2
Wi-Fi RF Receiver (RX) Characteristics
60
5.2
5.3
Bluetooth LE Radio
62
5.2.1
Bluetooth LE RF Transmitter (TX) Characteristics
62
5.2.2
Bluetooth LE RF Receiver (RX) Characteristics
64
802.15.4 Radio
66
5.3.1
802.15.4 RF Transmitter (TX) Characteristics
66
5.3.2
802.15.4 RF Receiver (RX) Characteristics
66
6
Packaging
67
7
Related Documentation and Resources
68
Appendix A – ESP32-C6 Consolidated Pin Overview
69
Revision History
71
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ESP32-C6 Series Datasheet v1.0
List of Tables
List of Tables
1-1 ESP32-C6 Series Comparison
12
2-1 QFN40 Pin Overview
16
2-2 QFN32 Pin Overview
17
2-3 QFN40 IO MUX Pin Functions
20
2-4 QFN32 IO MUX Pin Functions
20
2-5 LP IO MUX Functions
22
2-6 Analog Functions
23
2-7 Analog Pins
25
2-8 Power Pins
26
2-9 Voltage Regulators
26
2-10 Description of Timing Parameters for Power-up and Reset
28
2-11 Default Configuration of Strapping Pins
29
2-12 Description of Timing Parameters for the Strapping Pins
29
2-13 SDIO Input Sampling Edge/Output Driving Edge Control
30
2-14 Boot Mode Control
30
2-15 ROM Messages Printing Control
31
2-16 JTAG Signal Source Control
31
2-17 Pin Mapping Between QFN40 Chip and Off-package Flash
32
3-1 Peripheral Pin Configurations
51
4-1 Absolute Maximum Ratings
54
4-2 Recommended Power Characteristics
54
4-3 VDD_SPI Internal and Output Characteristics
55
4-4 DC Characteristics (3.3 V, 25 °C)
55
4-5 ADC Characteristics
56
4-6 ADC Calibration Results
56
4-7 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode
57
4-8 Current Consumption for Bluetooth LE in Active Mode
57
4-9 Current Consumption for 802.15.4 in Active Mode
57
4-10 Current Consumption in Modem-sleep Mode
57
4-11 Current Consumption in Low-Power Modes
58
4-12 Reliability Qualifications
58
5-1 Wi-Fi RF Characteristics
59
5-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards
59
5-3 TX EVM Test
59
5-4 RX Sensitivity
60
5-5 Maximum RX Level
61
5-6 RX Adjacent Channel Rejection
62
5-7 Bluetooth LE RF Characteristics
62
5-8 Bluetooth LE - Transmitter Characteristics - 1 Mbps
62
5-9 Bluetooth LE - Transmitter Characteristics - 2 Mbps
63
5-10 Bluetooth LE - Transmitter Characteristics - 125 Kbps
63
5-11 Bluetooth LE - Transmitter Characteristics - 500 Kbps
63
5-12 Bluetooth LE - Receiver Characteristics - 1 Mbps
64
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List of Tables
5-13 Bluetooth LE - Receiver Characteristics - 2 Mbps
64
5-14 Bluetooth LE - Receiver Characteristics - 125 Kbps
65
5-15 Bluetooth LE - Receiver Characteristics - 500 Kbps
65
5-16 802.15.4 RF Characteristics
66
5-17 802.15.4 Transmitter Characteristics - 250 Kbps
66
5-18 802.15.4 Receiver Characteristics - 250 Kbps
66
7-1 QFN40 Pin Overview
69
7-2 QFN32 Pin Overview
70
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ESP32-C6 Series Datasheet v1.0
List of Figures
List of Figures
1-1 ESP32-C6 Series Nomenclature
12
2-1 ESP32-C6 Pin Layout (QFN40, Top View)
13
2-2 ESP32-C6 Pin Layout (QFN32, Top View)
14
2-3 ESP32-C6 Power Scheme
27
2-4 Visualization of Timing Parameters for Power-up and Reset
27
2-5 Visualization of Timing Parameters for the Strapping Pins
30
3-1 Address Mapping Structure
35
6-1 QFN40 (5×5 mm) Package
67
6-2 QFN32 (5×5 mm) Package
67
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ESP32-C6 Series Datasheet v1.0
1 ESP32-C6 Series Comparison
1 ESP32-C6 Series Comparison
1.1 Nomenclature
ESP32-C6
H
F
x
Flash
Flash temperature
H: High temperature
N: Normal temperature
In-package flash
Chip series
Figure 1-1. ESP32-C6 Series Nomenclature
1.2 Comparison
Table 1-1. ESP32-C6 Series Comparison
Ordering Code1 In-Package Flash
ESP32-C6
ESP32-C6FH4
—
Ambient Temp.2 (°C)
3
4 MB (Quad SPI)
4
Package
–40 ∼ 105
QFN40 (5×5 mm)
–40 ∼ 105
QFN32 (5×5 mm)
1
For details on chip marking and packing, see Section 6 Packaging.
2
Ambient temperature specifies the recommended temperature range of the environment immediately outside an Espressif chip.
3
Can connect a flash outside the chip package. For details, see Section 3.1.4 Offpackage Flash.
4
For details about SPI modes, see Section 2.7 Pin Mapping Between Chip and
Flash.
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ESP32-C6 Series Datasheet v1.0
2 Pins
2 Pins
31 SDIO_CMD
32 SDIO_CLK
33 SDIO_DATA0
34 SDIO_DATA1
35 SDIO_DATA2
36 SDIO_DATA3
37 VDDA1
38 XTAL_N
39 XTAL_P
40 VDDA2
2.1 Pin Layout
ANT
1
30 U0RXD
VDDA3P3
2
29 U0TXD
VDDA3P3
3
28 VDDPST2
CHIP_PU
4
27 GPIO15
VDDPST1
5
26 SPID
XTAL_32K_P
6
25 SPICLK
XTAL_32K_N
7
GPIO2
8
23 VDD_SPI
GPIO3
9
22 SPIWP
ESP32-C6
24 SPIHD
41 GND
SPICS0 20
GPIO13 19
GPIO12 18
GPIO11 17
GPIO10 16
GPIO9 15
GPIO8 14
MTDO 13
MTCK 12
21 SPIQ
MTDI 11
MTMS 10
Figure 2-1. ESP32-C6 Pin Layout (QFN40, Top View)
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25 SDIO_DATA0
26 SDIO_DATA1
27 SDIO_DATA2
28 SDIO_DATA3
29 VDDA1
30 XTAL_N
31 XTAL_P
32 VDDA2
2 Pins
ANT
1
24 SDIO_CLK
VDDA3P3
2
23 SDIO_CMD
VDDA3P3
3
22 U0RXD
CHIP_PU
4
21 U0TXD
VDDPST1
5
20 VDDPST2
XTAL_32K_P
6
XTAL_32K_N
7
GPIO2
8
ESP32-C6
19 GPIO15
18 GPIO14
17 GPIO13
GPIO12 16
GPIO9 15
GPIO8 14
MTDO 13
MTCK 12
MTDI 11
MTMS 10
GPIO3
9
33 GND
Figure 2-2. ESP32-C6 Pin Layout (QFN32, Top View)
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2 Pins
2.2 Pin Overview
The ESP32-C6 chip integrates multiple peripherals that require communication with the outside world. To keep
the chip package size reasonably small, the number of available pins has to be limited. So the only way to route
all the incoming and outgoing signals is through pin multiplexing. Pin muxing is controlled via software
programmable registers (see ESP32-C6 Technical Reference Manual > Chapter IO MUX and GPIO Matrix).
All in all, the ESP32-C6 chip has the following types of pins:
• IO pins with the following predefined sets of functions to choose from:
– Each IO pin has predefined IO MUX and GPIO functions – see Table 2-3 QFN40 IO MUX Pin
Functions or Table 2-4 QFN32 IO MUX Pin Functions
– Some IO pins have predefined LP IO MUX functions – see Table 2-5 LP IO MUX Functions
– Some IO pins have predefined analog functions – see Table 2-6 Analog Functions
Predefined functions means that each IO pin has a set of direct connections to certain on-chip components.
During run-time, the user can configure which component from a predefined set to connect to a certain pin
at a certain time via memory mapped registers (see the TRM).
• Analog pins that have exclusively-dedicated analog functions – see Table 2-7 Analog Pins
• Power pins supply power to the chip components and non-power pins – see Table 2-8 Power Pins
Notes for Table 2-1 QFN40 Pin Overview or Table 2-2 QFN32 Pin Overview (see below):
1. For more information, see respective sections below. Alternatively, see Appendix A – ESP32-C6
Consolidated Pin Overview.
2. Bold marks the pin function set in which a pin has its default function in the default boot mode. See
Section 2.6.2 Chip Boot Mode Control.
3. In column Pin Providing Power, regarding pins powered by VDD_SPI:
• Power actually comes from the internal power rail supplying power to VDD_SPI. For details, see
Section 2.5.2 Power Scheme.
4. Except for GPIO12 and GPIO13 whose default drive strength is 40 mA, the default drive strength for all the
other pins is 20 mA.
5. Column Pin Settings shows predefined settings at reset and after reset with the following abbreviations:
• IE – input enabled
• WPU – internal weak pull-up resistor enabled
• WPD – internal weak pull-down resistor enabled
• USB_PU – USB pull-up resistor enabled
– By default, the USB function is enabled for USB pins (i.e., GPIO12 and GPIO13), and the pin
pull-up is decided by the USB pull-up resistor. The USB pull-up resistor is controlled by
USB_SERIAL_JTAG_DP/DM_PULLUP and the pull-up value is controlled by
USB_SERIAL_JTAG_PULLUP_VALUE. For details, see ESP32-C6 Technical Reference Manual >
Chapter USB Serial/JTAG Controller).
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2 Pins
– When the USB function is disabled, USB pins are used as regular GPIOs. At reset, GPIO13’s
internal weak pull-up resistor is disabled by default. After reset, GPIO13’s internal weak pull-up
resistor is enabled by default. A pin’s internal weak pull-up and pull-down resistors are
configurable by IO_MUX_FUN_WPU/WPD.
6. Depends on the value of EFUSE_DIS_PAD_JTAG
• 0 - default value. Input enabled, and internal weak pull-up resistor enabled (IE & WPU)
• 1 - input enabled (IE)
7. Output enabled
Table 2-1. QFN40 Pin Overview
Pin
Pin
Pin
Pin Settings 6,7
Pin Providing
1
Power
3-5
No.
Name
Type
At Reset
1
ANT
Analog
2
VDDA3P3
Power
3
VDDA3P3
Power
4
CHIP_PU
Analog
5
VDDPST1
Power
6
XTAL_32K_P
IO
VDDPST1
7
XTAL_32K_N
IO
VDDPST1
8
GPIO2
IO
VDDPST1
IE
IE
9
GPIO3
IO
VDDPST1
IE
10
MTMS
IO
VDDPST1
11
MTDI
IO
VDDPST1
Pin Function Sets 1,2
After Reset
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
IE
IO MUX
LP IO MUX
Analog
IE
IE
IO MUX
LP IO MUX
Analog
IE
IE
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
LP IO MUX
VDDPST1
12
MTCK
IO
VDDPST1
13
MTDO
IO
VDDPST1
IE
IO MUX
14
GPIO8
IO
VDDPST2
IE
IE
IO MUX
15
GPIO9
IO
VDDPST2
IE, WPU
IE, WPU
IO MUX
16
GPIO10
IO
VDDPST2
IE
IO MUX
17
GPIO11
IO
VDDPST2
IE
IO MUX
18
GPIO12
IO
VDDPST2
IE
IO MUX
Analog
19
GPIO13
IO
VDDPST2
USB_PU
IE, USB_PU
IO MUX
Analog
20
SPICS0
IO
VDD_SPI
WPU
IE, WPU
IO MUX
21
SPIQ
IO
VDD_SPI
WPU
IE, WPU
IO MUX
22
SPIWP
IO
VDD_SPI
WPU
IE, WPU
IO MUX
23
VDD_SPI
24
SPIHD
IO
VDD_SPI
WPU
IE, WPU
IO MUX
25
SPICLK
IO
VDD_SPI
WPU
IE, WPU
IO MUX
26
SPID
IO
VDD_SPI
WPU
IE, WPU
IO MUX
27
GPIO15
IO
VDDPST2
IE
IE
IO MUX
28
VDDPST2
29
U0TXD
IO
VDDPST2
WPU 7
IO MUX
30
U0RXD
IO
VDDPST2
IE, WPU
IO MUX
31
SDIO_CMD
IO
VDDPST2
WPU
IE
IO MUX
32
SDIO_CLK
IO
VDDPST2
WPU
IE
IO MUX
33
SDIO_DATA0
IO
VDDPST2
WPU
IE
IO MUX
Power/IO
IE, WPU
6
—
IO MUX
Analog
Power
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Table 2-1 – cont’d from previous page
Pin
Pin
Pin
Type
Pin Settings 6,7
Pin Providing
1
No.
Name
34
SDIO_DATA1
IO
35
SDIO_DATA2
36
SDIO_DATA3
37
VDDA1
Power
38
XTAL_N
Analog
39
XTAL_P
Analog
40
VDDA2
Power
41
GND
Power
Power
3-5
Pin Function Sets 1,2
At Reset
After Reset
IO MUX
VDDPST2
WPU
IE
IO MUX
IO
VDDPST2
WPU
IE
IO MUX
IO
VDDPST2
WPU
IE
IO MUX
LP IO MUX
Analog
Table 2-2. QFN32 Pin Overview
Pin
Pin
Pin
Pin Settings 6,7
Pin Providing
1
Power
3-5
No.
Name
Type
At Reset
1
ANT
Analog
2
VDDA3P3
Power
3
VDDA3P3
Power
4
CHIP_PU
Analog
5
VDDPST1
Power
6
XTAL_32K_P
IO
VDDPST1
7
XTAL_32K_N
IO
VDDPST1
8
GPIO2
IO
VDDPST1
IE
IE
9
GPIO3
IO
VDDPST1
IE
10
MTMS
IO
VDDPST1
11
MTDI
IO
VDDPST1
Pin Function Sets 1,2
After Reset
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
IE
IO MUX
LP IO MUX
Analog
IE
IE
IO MUX
LP IO MUX
Analog
IE
IE
IO MUX
LP IO MUX
Analog
IO MUX
LP IO MUX
Analog
LP IO MUX
VDDPST1
IE, WPU
6
12
MTCK
IO
VDDPST1
13
MTDO
IO
VDDPST1
IE
IO MUX
14
GPIO8
IO
VDDPST2
IE
IE
IO MUX
15
GPIO9
IO
VDDPST2
IE, WPU
IE, WPU
IO MUX
16
GPIO12
IO
VDDPST2
IE
IO MUX
Analog
17
GPIO13
IO
VDDPST2
IE, USB_PU
IO MUX
Analog
18
GPIO14
IO
VDDPST2
IE
IO MUX
19
GPIO15
IO
VDDPST2
IE
IO MUX
20
VDDPST2
21
U0TXD
IO
VDDPST2
WPU 7
IO MUX
22
U0RXD
IO
VDDPST2
IE, WPU
IO MUX
23
SDIO_CMD
IO
VDDPST2
WPU
IE
IO MUX
24
SDIO_CLK
IO
VDDPST2
WPU
IE
IO MUX
25
SDIO_DATA0
IO
VDDPST2
WPU
IE
IO MUX
26
SDIO_DATA1
IO
VDDPST2
WPU
IE
IO MUX
27
SDIO_DATA2
IO
VDDPST2
WPU
IE
IO MUX
28
SDIO_DATA3
IO
VDDPST2
WPU
IE
IO MUX
29
VDDA1
Power
30
XTAL_N
Analog
31
XTAL_P
Analog
USB_PU
IE
Power
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Table 2-2 – cont’d from previous page
Pin
Pin
Pin
Pin Providing
1
No.
Name
Type
32
VDDA2
Power
33
GND
Power
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Pin Settings 6,7
At Reset
After Reset
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IO MUX
LP IO MUX
Analog
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2.3 IO Pins
For details on configuring IO pins, see 《ESP32-C6 技术参考手册》 > Chapter IO MUX and GPIO pins.
2.3.1 IO MUX and GPIO Pin Functions
The pins of ESP32-C6 can be assigned any function (F0-F2) from their respective sets of IO MUX functions as
listed in Table 2-3 QFN40 IO MUX Pin Functions or Table 2-4 QFN32 IO MUX Pin Functions.
Each set of the IO MUX functions has a general purpose input/output (GPIO0, GPIO1, etc.) function. If a pin is
assigned a GPIO function, this pin’s signal is routed via the GPIO matrix, which incorporates internal signal
routing circuitry for mapping signals programmatically. It gives the pin access to almost any IO MUX function.
However, the flexibility of programmatic mapping comes at a cost as it might affect speed and latency of routed
signals.
Notes for 2-3 QFN40 IO MUX Pin Functions or Table 2-4 QFN32 IO MUX Pin Functions:
1. Bold marks the default pin functions in the default boot mode. See Section 2.6.2 Chip Boot Mode Control.
2. Regarding highlighted cells, see Section 2.3.4 Restrictions for GPIOs and LP GPIOs.
3. Each IO MUX function (Fn, n = 0 ~ 2) is associated with a type. The description of type is as follows:
• I – input. O – output. T – high impedance.
• I1 – input; if the pin is assigned a function other than Fn, the input signal of Fn is always 1.
• I0 – input; if the pin is assigned a function other than Fn, the input signal of Fn is always 0.
4. Function names:
GPIO…
General-purpose input/output with signals routed via the GPIO matrix. For
more details on the GPIO matrix, see ESP32-C6 Technical Reference Manual
U…RXD
U…TXD
SDIO…
> Chapter IO MUX and GPIO Matrix.
}
UART0/1 receive/transmit signals.
SDIO interface signals.
5. Groups of functions (see the markings in the table):
a. JTAG interface for debugging.
b. UART interface for debugging.
c. SPI0/1 interface for connection to in-package or off-package flash via SPI bus. See also Section 2.7 Pin
Mapping Between Chip and Flash.
d. SPI2 main interface for fast SPI connection. Among these pins, FSPICS0 is for input or output signals in
master or slave mode, whereas FSPICS1 ~ FSPICS5 are for output signals in master mode.
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Table 2-3. QFN40 IO MUX Pin Functions
Pin
No.
IO MUX /
GPIO
Name
IO MUX Function
0
Type
1
Type
6
GPIO0
GPIO0
I/O/T
GPIO0
I/O/T
7
GPIO1
GPIO1
I/O/T
GPIO1
I/O/T
8
GPIO2
GPIO2
I/O/T
GPIO2
I/O/T
9
GPIO3
GPIO3
I/O/T
GPIO3
I/O/T
10
GPIO4
MTMS
I1
GPIO4
11
GPIO5
MTDI
I1
12
GPIO6
MTCK
13
GPIO7
14
2
Type
5d
FSPIQ
I1/O/T
I/O/T
FSPIHD
I1/O/T
GPIO5
I/O/T
FSPIWP
I1/O/T
I1
GPIO6
I/O/T
FSPICLK
I1/O/T
MTDO
O/T
GPIO7
I/O/T
FSPID
I1/O/T
GPIO8
GPIO8
I/O/T
GPIO8
I/O/T
15
GPIO9
GPIO9
I/O/T
GPIO9
I/O/T
16
GPIO10
GPIO10
I/O/T
GPIO10
I/O/T
17
GPIO11
GPIO11
I/O/T
GPIO11
I/O/T
18
GPIO12
GPIO12
I/O/T
GPIO12
I/O/T
19
GPIO13
GPIO13
I/O/T
GPIO13
I/O/T
20
GPIO24
SPICS0
O/T
GPIO24
I/O/T
21
GPIO25
SPIQ
I1/O/T
GPIO25
I/O/T
22
GPIO26
SPIWP
I1/O/T
GPIO26
I/O/T
23
GPIO27
GPIO27
I/O/T
GPIO27
I/O/T
24
GPIO28
SPIHD
I1/O/T
GPIO28
I/O/T
25
GPIO29
SPICLK
O/T
GPIO29
I/O/T
26
GPIO30
SPID
I1/O/T
GPIO30
I/O/T
27
GPIO15
GPIO15
I/O/T
GPIO15
I/O/T
29
GPIO16
U0TXD
O
GPIO16
I/O/T
FSPICS0
I1/O/T
30
GPIO17
U0RXD
I1
GPIO17
I/O/T
FSPICS1
O/T
31
GPIO18
SDIO_CMD
I1/O/T
GPIO18
I/O/T
FSPICS2
O/T
32
GPIO19
SDIO_CLK
I1
GPIO19
I/O/T
FSPICS3
O/T
33
GPIO20
SDIO_DATA0
I1/O/T
GPIO20
I/O/T
FSPICS4
O/T
34
GPIO21
SDIO_DATA1
I1/O/T
GPIO21
I/O/T
FSPICS5
O/T
35
GPIO22
SDIO_DATA2
I1/O/T
GPIO22
I/O/T
36
GPIO23
SDIO_DATA3
I1/O/T
GPIO23
I/O/T
5a
5c
5c
5b
5d
Table 2-4. QFN32 IO MUX Pin Functions
Pin
No.
IO MUX /
GPIO
Name
IO MUX Function
0
Type
1
Type
6
GPIO0
GPIO0
I/O/T
GPIO0
I/O/T
7
GPIO1
GPIO1
I/O/T
GPIO1
I/O/T
2
Type
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Table 2-4 – cont’d from previous page
Pin
No.
IO MUX /
GPIO
Name
IO MUX Function
0
Type
1
Type
2
Type
5d
8
GPIO2
GPIO2
9
GPIO3
GPIO3
10
GPIO4
11
I/O/T
GPIO2
I/O/T
FSPIQ
I1/O/T
I/O/T
GPIO3
I/O/T
MTMS
I1
GPIO4
I/O/T
FSPIHD
I1/O/T
GPIO5
MTDI
I1
GPIO5
I/O/T
FSPIWP
I1/O/T
12
GPIO6
MTCK
I1
GPIO6
I/O/T
FSPICLK
I1/O/T
13
GPIO7
MTDO
O/T
GPIO7
I/O/T
FSPID
I1/O/T
14
GPIO8
GPIO8
I/O/T
GPIO8
I/O/T
15
GPIO9
GPIO9
I/O/T
GPIO9
I/O/T
16
GPIO12
GPIO12
I/O/T
GPIO12
I/O/T
17
GPIO13
GPIO13
I/O/T
GPIO13
I/O/T
18
GPIO14
GPIO14
I/O/T
GPIO14
I/O/T
19
GPIO15
GPIO15
I/O/T
GPIO15
I/O/T
21
GPIO16
U0TXD
O
GPIO16
I/O/T
FSPICS0
I1/O/T
22
GPIO17
U0RXD
I1
GPIO17
I/O/T
FSPICS1
O/T
23
GPIO18
SDIO_CMD
I1/O/T
GPIO18
I/O/T
FSPICS2
O/T
24
GPIO19
SDIO_CLK
I1
GPIO19
I/O/T
FSPICS3
O/T
25
GPIO20
SDIO_DATA0
I1/O/T
GPIO20
I/O/T
FSPICS4
O/T
26
GPIO21
SDIO_DATA1
I1/O/T
GPIO21
I/O/T
FSPICS5
O/T
27
GPIO22
SDIO_DATA2
I1/O/T
GPIO22
I/O/T
28
GPIO23
SDIO_DATA3
I1/O/T
GPIO23
I/O/T
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5b
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2.3.2 LP IO MUX Functions
LP IO MUX functions are activated if the HP digital system is turned off to save power. LP IO MUX functions and
data input/output are configured by the LP CPU.
Notes for Table 2-5 LP IO MUX Functions:
1. Bold marks the default pin functions in the default boot mode. See Section 2.6.2 Chip Boot Mode Control.
2. Regarding highlighted cells, see Section 2.3.4 Restrictions for GPIOs and LP GPIOs.
3. Function names:
LP_GPIO…
General-purpose input/output configured by LP CPU.
LP_UART…
LP UART functions.
LP_I2C…
LP I2C functions.
Table 2-5. LP IO MUX Functions
Pin
LP IO
LP IO MUX Function
No.
Name
0
1
6
LP_GPIO0
LP_GPIO0
LP_UART_DTRN
7
LP_GPIO1
LP_GPIO1
LP_UART_DSRN
8
LP_GPIO2
LP_GPIO2
LP_UART_RTSN
9
LP_GPIO3
LP_GPIO3
LP_UART_CTSN
10
LP_GPIO4
LP_GPIO4
LP_UART_RXD
11
LP_GPIO5
LP_GPIO5
LP_UART_TXD
12
LP_GPIO6
LP_GPIO6
LP_I2C_SDA
13
LP_GPIO7
LP_GPIO7
LP_I2C_SCL
2.3.3 Analog Functions
Analog functions can operate in any power mode.
Notes for Table 2-6 Analog Functions:
1. Bold marks the default pin functions in SPI Boot mode.
2. Regarding highlighted cells, see Section 2.3.4 Restrictions for GPIOs and LP GPIOs.
3. Function names:
XTAL_32K_P
XTAL_32K_N
}
32 kHz external clock input/output connected to ESP32-C6’s oscillator.
P/N means differential clock positive/negative.
ADC1_CH…
Analog to digital conversion channel for ADC1.
}
USB Serial/JTAG function. USB signal is a differential signal transmitted
USB_D-
USB_D+
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Table 2-6. Analog Functions
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QFN40
QFN32
Analog
Pin No.
Pin No.
IO Name
0
Analog Function
1
6
6
GPIO0
XTAL_32K_P
ADC1_CH0
7
7
GPIO1
XTAL_32K_N
ADC1_CH1
8
8
GPIO2
ADC1_CH2
9
9
GPIO3
ADC1_CH3
10
10
GPIO4
ADC1_CH4
11
11
GPIO5
ADC1_CH5
12
12
GPIO6
18
16
GPIO12
USB_D-
19
17
GPIO13
USB_D+
23
—
GPIO27
VDD_SPI
ADC1_CH6
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2.3.4 Restrictions for GPIOs and LP GPIOs
All IO pins of the ESP32-C6 have GPIO and some have LP GPIO pin functions. However, the IO pins are
multiplexed and have other important pin functions. This should be taken into account while certain pins are
chosen for general purpose input output.
In tables in Section 2.3 IO Pins, some pin functions are highlighted . The non-highlighted GPIO or LP GPIO pins
are recommended for use first. If more pins are needed, the highlighted GPIOs or LP GPIOs should be chosen
carefully to avoid conflicts with important pin functions.
The highlighted IO pins have the following important pin functions:
• GPIO – allocated for communication with flash and NOT recommended for other uses. For details, see
Section 2.7 Pin Mapping Between Chip and Flash.
• GPIO – have one of the following important functions:
– Strapping pins – need to be at certain logic levels at startup. See Section 2.6 Strapping Pins.
– USB_D+/- – by default, connected to the USB Serial/JTAG Controller. To function as GPIOs, these
pins need to be reconfigured.
– JTAG interface – often used for debugging. See Table 2-3 QFN40 IO MUX Pin Functions or Table 2-4
QFN32 IO MUX Pin Functions, note 5a. To free these pins up, the pin functions USB_D+/- of the USB
Serial/JTAG Controller can be used instead. See also Section 2.6.4 JTAG Signal Source Control.
– UART interface – often used for debugging. See Table 2-3 QFN40 IO MUX Pin Functions or Table 2-4
QFN32 IO MUX Pin Functions, note 5b.
See also Appendix A – ESP32-C6 Consolidated Pin Overview.
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2.4 Analog Pins
Table 2-7. Analog Pins
QFN40
QFN32
Pin
Pin
Pin
Pin No.
Pin No.
Name
Type
Function
1
1
ANT
I/O
RF input and output
4
4
CHIP_PU
—
High: on, enables the chip (Powered up).
Low: off, the chip powers off (powered down).
Note: Do not leave the CHIP_PU pin floating.
38
30
XTAL_N
—
External clock input/output connected to chip’s crystal or
39
31
XTAL_P
—
oscillator. P/N means differential clock positive/negative.
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2.5 Power Supply
2.5.1 Power Pins
The chip is powered via the power pins described in Table 2-8 Power Pins.
Table 2-8. Power Pins
Power Supply 1,2
QFN40
QFN32
Pin
Pin No.
Pin No.
Name
Direction
Power Domain / Other
2
2
VDDA3P3
Input
Analog power domain
3
3
VDDA3P3
Input
Analog power domain
5
5
VDDPST1
Input
LP digital and part of analog pin power domains
Input
In-package flash (backup power line)
Output
In-package flash and off-package flash
23
—
VDD_SPI 3
IO Pins 4
28
20
VDDPST2
Input
HP digital power domain
37
29
VDDA1
Input
Analog power domain
40
32
VDDA2
Input
Analog power domain
41
33
GND
—
External ground connection
LP IO
HP IO
1
See in conjunction with Section 2.5.2 Power Scheme.
2
For recommended and maximum voltage and current, see Section 4.1 Absolute Maximum Ratings and Section
4.2 Recommended Power Supply Characteristics.
3
To configure VDD_SPI as input or output, see ESP32-C6 Technical Reference Manual > Chapter Low-power
Management.
4
LP IO pins are those powered by VDDPST1 and so on, as shown in Figure 2-3 ESP32-C6 Power Scheme. See
also Table 2-3 QFN40 IO MUX Pin Functions or Table 2-4 QFN32 IO MUX Pin Functions > Column Pin Providing
Power.
2.5.2 Power Scheme
The power scheme is shown in Figure 2-3 ESP32-C6 Power Scheme.
The components on the chip are powered via voltage regulators.
Table 2-9. Voltage Regulators
Voltage Regulator
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Output
Power Supply
HP
1.1 V
HP power domain
LP
1.1 V
LP power domain
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VDD_PST1
VDD_PST2
LP
Voltage
Regulator
VDDA1 VDDA2
HP
Voltage
Regulator
RSPI
Analog
VDD_SPI
LP IO
LP System
HP
System
HP IO
Figure 2-3. ESP32-C6 Power Scheme
2.5.3 Chip Power-up and Reset
Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, CHIP_PU – the
pin used for power-up and reset – is pulled high to activate the chip. For information on CHIP_PU as well as
power-up and reset timing, see Figure 2-4 and Table 2-10.
tST BL
VDDA3P3,
VDDPST1,
VDDPST2,
VDDA1,
VDDA2
tRST
2.8 V
VIL_nRST
CHIP_PU
Figure 2-4. Visualization of Timing Parameters for Power-up and Reset
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Table 2-10. Description of Timing Parameters for Power-up and Reset
Parameter
Description
Min (µs)
Time reserved for the power rails of VDDA3P3, VDDPST1, VDtST BL
DPST2, VDDA1 and VDDA2 to stabilize before the CHIP_PU pin
50
is pulled high to activate the chip
tRST
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Time reserved for CHIP_PU to stay below VIL_nRST to reset the
chip (see Table 4-4)
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2.6 Strapping Pins
At each startup or reset, a chip requires some initial configuration parameters, such as in which boot mode to
load the chip, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins
operate as regular IO pins.
The parameters controlled by the given strapping pins at chip reset are as follows:
• SDIO sampling and driving clock edge – MTMS and MTDI
• Chip boot mode – GPIO8 and GPIO9
• ROM code printing to UART – GPIO8
• JTAG signal source – GPIO15
GPIO9 is connected to the chip’s internal weak pull-up resistor at chip reset. This resistor determines the default
bit value of GPIO9. Also, the resistor determines the bit value if GPIO9 is connected to an external
high-impedance circuit.
Table 2-11. Default Configuration of Strapping Pins
Strapping Pin
Default Configuration
Bit Value
MTMS
Floating
–
MTDI
Floating
–
GPIO8
Floating
–
GPIO9
Pull-up
1
GPIO15
Floating
–
To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the
ESP32-C6 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host
MCU.
All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping
pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in
any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed
up to be used as regular IO pins after reset.
Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold time.
For more information, see Table 2-12 and Figure 2-5.
Table 2-12. Description of Timing Parameters for the Strapping Pins
Parameter
tSU
Description
Min (ms)
Setup time is the time reserved for the power rails to stabilize before
the CHIP_PU pin is pulled high to activate the chip.
0
Hold time is the time reserved for the chip to read the strapping pin
tH
values after CHIP_PU is already high and before these pins start
3
operating as regular IO pins.
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tSU
tH
VIL_nRST
CHIP_PU
VIH
Strapping pin
Figure 2-5. Visualization of Timing Parameters for the Strapping Pins
2.6.1 SDIO Sampling and Driving Clock Edge Control
The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive
output lines. See Table 2-13 SDIO Input Sampling Edge/Output Driving Edge Control.
Table 2-13. SDIO Input Sampling Edge/Output Driving Edge Control
MTMS
MTDI
Edge behavior
– (Floating)
– (Floating)
0
0
Falling edge sampling, falling edge output
0
1
Falling edge sampling, rising edge output
1
0
Rising edge sampling, falling edge output
1
1
Rising edge sampling, rising edge output
Default Configuration
2.6.2 Chip Boot Mode Control
GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 2-14 Boot Mode Control Boot
Mode Control.
Table 2-14. Boot Mode Control
Boot Mode
GPIO8
GPIO9
Default Configuration
– (Floating)
1 (Pull-up)
SPI Boot (default)
Any value
1
Download Boot
1
0
Invalid combination1
0
0
1
This combination triggers unexpected behavior
and should be avoided.
2.6.3 ROM Messages Printing Control
During the boot process, the messages by the ROM code can be printed to:
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• (Default) UART0 and USB Serial/JTAG controller
• USB Serial/JTAG controller
• UART0
EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 2-15
ROM Messages Printing Control.
Table 2-15. ROM Messages Printing Control
eFuse1
GPIO8
ROM Code Printing
0
Ignored
Always enabled
1
2
3
1
0
Enabled
1
Disabled
0
Disabled
1
Enabled
Ignored
Always disabled
eFuse: EFUSE_UART_PRINT_CONTROL
EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT controls the printing to USB Serial/JTAG controller. When this
bit is 1, printing to USB Serial/JTAG controller is disabled. When this bit is 0, and USB Serial/JTAG controller is
enabled via EFUSE_DIS_USB_SERIAL_JTAG, ROM messages can be printed to USB Serial/JTAG
controller.
2.6.4 JTAG Signal Source Control
The strapping pin GPIO15 can be used to control the source of JTAG signals during the early boot process. This
pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that
cannot be in a high impedance state.
As Table 2-16 shows, GPIO15 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG,
and EFUSE_JTAG_SEL_ENABLE.
Table 2-16. JTAG Signal Source Control
eFuse 1a eFuse 2b eFuse 3c GPIO15
0
0
0
Ignored
1
JTAG Signal Source
USB Serial/JTAG Controller
0
JTAG pins MTDI, MTCK, MTMS, and MTDO
1
USB Serial/JTAG Controller
0
1
Ignored
Ignored
JTAG pins MTDI, MTCK, MTMS, and MTDO
1
0
Ignored
Ignored
USB Serial/JTAG Controller
1
1
Ignored
Ignored
JTAG is disabled
a
eFuse 1: EFUSE_DIS_PAD_JTAG
b
eFuse 2: EFUSE_DIS_USB_JTAG
c
eFuse 3: EFUSE_JTAG_SEL_ENABLE
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2 Pins
2.7 Pin Mapping Between Chip and Flash
Table 2-17 lists the pin mapping between the chip and off-package flash for all SPI modes.
For chip variants with in-package flash (namely variants in QFN32 package, see Table 1-1 ESP32-C6 Series
Comparison), the pins allocated for communication with in-package flash are not routed out, but you can take
Table 2-17 as a reference.
For more information on SPI controllers, see also Section 3.4.2 Serial Peripheral Interface (SPI).
Notice:
It is not recommended to use the pins connected to flash for any other purposes.
Table 2-17. Pin Mapping Between QFN40 Chip and Off-package Flash
QFN40
Pin Name
Pin No.
Dual SPI
Quad SPI
Flash
Flash
Flash
25
SPICLK
CLK
CLK
CLK
20
SPICS0
CS#
CS#
CS#
26
SPID
MOSI
SIO0
SIO0
21
SPIQ
MISO
SIO1
SIO1
22
SPIWP
WP#
SIO2
24
SPIHD
HOLD#
SIO3
1
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3 Functional Description
This chapter describes the functions of ESP32-C6.
3.1 CPU and Memory
3.1.1 HP CPU
ESP32-C6 has a HP 32-bit RISC-V single-core processor with the following features:
• four-stage pipeline that supports a clock frequency of up to 160 MHz
• RV32IMAC ISA (instruction set architecture)
• 32-bit multiplier and 32-bit divider
• up to 28 vectored interrupts at 15 priority levels
• up to 4 hardware breakpoints/watchpoints
• up to 16 PMP/PMA regions
• JTAG for debugging
• compliant with RISC-V debug specification v0.13
• compliant with RISC-V Trace Specification v1.0
3.1.2 LP CPU
ESP32-C6 integrates a LP 32-bit RISC-V processor. This LP CPU is designed as a simplified, low-power
replacement of HP CPU in sleep modes. It can be also used to supplement the functions of the HP CPU in
normal working mode. The LP CPU and LP memory remain powered on in Deep-sleep mode. Hence, the
developer can store a program for the LP CPU in the LP memory to access LP IO, LP peripherals, and real-time
timers in Deep-sleep mode.
LP CPU has the following features:
• two-stage pipeline that supports a clock frequency of up to 20 MHz
• RV32IMAC ISA (instruction set architecture)
• 32-bit general-purpose registers
• 32-bit multiplier and divider
• support for interrupts
• up to 2 hardware breakpoints/watchpoints
• JTAG for debugging
• compliant with RISC-V debug specification v0.13
• boot by the CPU, its dedicated timer, or LP IO
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3.1.3 Internal Memory
ESP32-C6’s internal memory includes:
• 320 KB of ROM: for booting and core functions
• HP memory: 512 KB of SRAM for data and instructions
• LP memory: 16 KB of SRAM that can be accessed by HP CPU or LP CPU. It can retain data in
Deep-sleep mode
• 4 Kbit of eFuse: 1792 bits are reserved for your data, such as encryption key and device ID
• In-package flash: See details in Chapter 1 ESP32-C6 Series Comparison
3.1.4 Off-package Flash
ESP32-C6 supports SPI, Dual SPI, Quad SPI, and QPI interfaces that allow connection to multiple flash outside
the chip’s package.
CPU’s instruction memory space and read-only data memory space can map into off-package flash of
ESP32-C6, whose size can be 16 MB at most. ESP32-C6 supports hardware encryption/decryption based on
XTS-AES to protect developers’ programs and data in flash.
Through high-speed caches, ESP32-C6 can support at a time up to:
• 16 MB of instruction memory space which can map into flash as individual blocks of 64 KB. 32-bit fetch is
supported
• 16 MB of data memory space which can map into flash as individual blocks of 64 KB. 8-bit, 16-bit and
32-bit reads are supported
Note:
After ESP32-C6 is initialized, software can customize the mapping of off-package flash into the CPU address space.
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3.1.5 Address Mapping Structure
Figure 3-1. Address Mapping Structure
3.1.6 Cache
ESP32-C6 has an four-way set associative cache. This cache is read-only and has the following features:
• size: 32 KB
• pre-load function
• lock function
• critical word first and early restart
3.1.7 TEE Controller
ESP32-C6 integrates a TEE (Trusted Execution Environment) controller to configure and extend security modes
for masters in the system. The TEE controller has the following features:
• up to 32 masters
• four security modes
• accessible by the main master in TEE security mode
3.1.8 Access Permission Management (APM)
ESP32-C6 integrates an APM module to manage access permissions. The module compares information
transmitted over the bus with predefined configurations and decides if to grant access. APM has the following
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features:
• 16 regions with configurable addresses
• support for interrupts
• exception records
• accessible by the main master in TEE security mode
3.1.9 Timeout Protection
ESP32-C6 integrates a timeout protection module against bus being stuck. The module has the following
features:
• up to 65535 configurable timeout periods (3 timeout modules in CPU peripherals, APB peripherals and LP
peripherals)
• support for interrupts
• exception records
3.2 System Clocks
3.2.1 CPU Clock
The CPU clock has three possible sources:
• external main crystal clock
• internal fast RC oscillator clock (typically about 20 MHz, and adjustable)
• PLL clock
The application can select the clock source from the three clocks above. The selected clock source drives the
CPU clock directly, or after division, depending on the application. When the clock source is PLL clock, the clock
frequency should be no more than 160 MHz. Once the CPU is reset, the default clock source would be the
external main crystal clock divided by 1.
Note:
ESP32-C6 is unable to operate without an external main crystal clock.
3.2.2 Low-Power Clocks
The LP slow clock is used for RTC counter, RTC watchdog and the power management unit (PMU). It has four
possible sources:
• internal low-speed RC oscillator (typically about 32 kHz, and adjustable)
• internal slow RC oscillator (typically about 150 kHz, and adjustable)
• external low-speed (32 kHz) crystal clock
• external IO clock (external clock source connected with digital IO)
The LP fast clock is used for low-power peripherals and sensor controllers. It has two possible sources:
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• external main crystal clock divided by 2
• internal fast RC oscillator clock (typically about 20 MHz, and adjustable)
3.3 Analog Peripherals
3.3.1 Analog-to-Digital Converter (ADC)
ESP32-C6 integrates a 12-bit SAR ADC and supports measurements on 7 channels (analog-enabled
pins).
For GPIOs assigned to ADC, please refer to Table 3-1.
3.3.2 Temperature Sensor
The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted via
an ADC into a digital value.
The temperature sensor has a range of –40 °C to 125 °C. It is designed primarily to sense the temperature
changes inside the chip. The temperature value depends on factors like microcontroller clock frequency or I/O
load. Generally, the chip’s internal temperature is higher than the ambient temperature.
3.4 Digital Peripherals
3.4.1 Universal Asynchronous Receiver Transmitter (UART)
ESP32-C6 has three UART interfaces, i.e. UART0, UART1 and LP UART. All the three interfaces provide
hardware flow control (CTS and RTS signals) and software flow control (XON and XOFF).
UART0 and UART 1 support IrDA and asynchronous communication (RS232 and RS485) at a speed of up to 5
Mbps. UART0 and UART1 connect to GDMA via UHCI0 interface (i.e. Universal Host Controller Interface), and
can be accessed by the GDMA controller or directly by the CPU.
LP UART only supports asynchronous communication (RS232) at a speed of up to 1.25 Mbps. LP UART can
only by accessed by the CPU.
For GPIOs assigned to UART, please refer to Table 3-1.
3.4.2 Serial Peripheral Interface (SPI)
ESP32-C6 features three SPI interfaces (SPI0, SPI1, and SPI2). SPI0 and SPI1 can be configured to operate in
SPI memory mode, while SPI2 can be configured to operate in general-purpose SPI mode.
• SPI Memory mode
In SPI memory mode, SPI0 and SPI1 interface with external SPI memory. Data are transferred in unit of
byte. Up to four-line STR reads and writes are supported. The clock frequency is configurable to a
maximum of 120 MHz.
• SPI2 General-purpose SPI (GP-SPI) mode
SPI2 can operate in master and slave modes. SPI2 supports two-line full-duplex communication and
single-/two-/four-line half-duplex communication in both master and slave modes. The host’s clock
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frequency is configurable. Data are transferred in unit of byte. The clock polarity (CPOL) and phase (CPHA)
are also configurable. The SPI2 interface can connect to GDMA.
– In master mode, the clock frequency is 80 MHz at most, and the four modes of SPI transfer format are
supported.
– In slave mode, the clock frequency is 60 MHz at most, and the four modes of SPI transfer format are
also supported.
For the recommended pin mapping between ESP32-C6 and off-package flash, please see Table 2-17 Pin
Mapping Between QFN40 Chip and Off-package Flash.
For GPIOs assigned to SPI, please refer to Table 3-1.
3.4.3 I2C Interface
ESP32-C6 has an I2C and a LP I2C bus interfaces. I2C is used for I2C master mode or slave mode, depending
on your configuration, while LP I2C is always in master mode. Both interfaces support:
• standard mode (100 Kbit/s)
• fast mode (400 Kbit/s)
• up to 800 Kbit/s (constrained by SCL and SDA pull-up strength)
• 7-bit and 10-bit addressing mode
• double addressing mode
• 7-bit broadcast address
You can configure instruction registers to control the I2C interface for more flexibility.
For GPIOs assigned to I2C, please refer to Table 3-1.
3.4.4 I2S Interface
ESP32-C6 includes a standard I2S interface. This interface can operate as a master or a slave in full-duplex
mode or half-duplex mode, and can be configured for 8-bit, 16-bit, 24-bit, or 32-bit serial communication. BCK
clock frequency, from 10 kHz up to 40 MHz, is supported.
The I2S interface supports TDM Philips, TDM MSB alignment, TDM PCM standard, PDM standard, and
PCM-to-PDM TX interface. It connects to the GDMA controller.
For GPIOs assigned to I2S, please refer to Table 3-1.
3.4.5 Pulse Count Controller (PCNT)
The pulse count controller (PCNT) in ESP32-C6 captures pulses and counts pulse edges in seven modes. It has
the following features:
• four independent pulse counters (units) that count from 1 to 65535
• each unit consists of two independent channels sharing one pulse counter
• all channels have input pulse signals (e.g. sig_ch0_un) with their corresponding control signals (e.g.
ctrl_ch0_un)
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• independently filter glitches of input pulse signals (sig_ch0_un and sig_ch1_un) and control signals
(ctrl_ch0_un and ctrl_ch1_un) on each unit
• each channel has the following parameters:
1. selection between counting on positive or negative edges of the input pulse signal
2. configuration to Increment, Decrement, or Disable counter mode for control signal’s high and low
states
• Maximum frequency of pulses: 40 MHz
For GPIOs assigned to PCNT, please refer to Table 3-1.
3.4.6 USB Serial/JTAG Controller
ESP32-C6 integrates a USB Serial/JTAG controller. This controller has the following features:
• CDC-ACM virtual serial port and JTAG adapter functionality
• USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not
support the faster 480 Mbit/s high-speed transfer mode)
• programming in-package/off-package flash
• CPU debugging with compact JTAG instructions
• a full-speed USB PHY integrated in the chip
For GPIOs assigned to USB Serial/JTAG, please refer to Table 3-1.
3.4.7 TWAI® Controller
ESP32-C6 has two TWAI® controllers with the following features:
• compatible with ISO 11898-1 protocol (CAN Specification 2.0)
• standard frame format (11-bit ID) and extended frame format (29-bit ID)
• bit rates from 1 Kbit/s to 1 Mbit/s
• multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required)
• 64-byte receive FIFO
• acceptance filter (single and dual filter modes)
• error detection and handling: error counters, configurable error warning limit, error code capture, arbitration
lost capture, automatic transceiver standby
For GPIOs assigned to TWAI® , please refer to Table 3-1.
3.4.8 SDIO 2.0 Slave Controller
ESP32-C6 integrates an SD device interface that conforms to the industry-standard SDIO Specification Version
2.0, and allows a host controller to access the SoC, using the SDIO bus interface and protocol. The host can
access the registers of the SDIO interface directly and the shared memory via a DMA engine, thus maximizing
performance without engaging the processor cores.
The SDIO 2.0 Slave Controller supports the following features:
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• clock range: 0 to 50 MHz
• SPI, 1-bit SDIO, and 4-bit SDIO transfer modes
• configurable sampling and driving clock edges
• special registers for direct access by host
• interrupting host to initiate data transfer
• automatic loading of SDIO bus data and automatic discarding of padding data
• block size of up to 512 bytes
• interrupt vectors between the host and the slave, allowing both to interrupt each other
• supports DMA for data transfer
For GPIOs assigned to SDIO, please refer to Table 3-1.
3.4.9 LED PWM Controller
The LED PWM controller can generate independent digital waveform on six channels. The LED PWM
controller:
• can generate digital waveform with configurable periods and duty cycle. The resolution of duty cycle can
be up to 20 bits
• has multiple clock sources, including 80 MHz PLL clock, external main crystal clock, and internal fast RC
oscillator
• can operate when the CPU is in low-power mode (Light-sleep mode)
• supports gradual increase or decrease of duty cycle, which is useful for the LED RGB color-gradient
generator
• up to 16 duty cycle ranges for each PWM generator to generate gamma curve signals - each range can be
independently configured in terms of fading direction (increase or decrease), fading amount (the amount by
which the duty cycle increases or decreases each time), the number of fades (how many times the duty
cycle fades in one range), and fading frequency
For GPIOs assigned to LED PWM, please refer to Table 3-1.
3.4.10 Motor Control PWM (MCPWM)
ESP32-C6 integrates a MCPWM that can be used to drive digital motors and smart light. This controller has a
clock divider (prescaler), three PWM timers, three PWM operators, and a dedicated capture submodule.
PWM timers are used to generate timing references. The PWM operators generate desired waveform based on
the timing references. By configuration, a PWM operator can use the timing reference of any PWM timer, and use
the same timing reference with other PwM operators. PWM operators can also use different PWM timers’ values
to produce independent PWM signals. PWM timers can be synchronized.
For GPIOs assigned to MCPWM, please refer to Table 3-1.
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3.4.11 Remote Control Peripheral
The Remote Control Peripheral (RMT) supports two channels of infrared remote transmission and two channels
of infrared remote reception. By controlling pulse waveform through software, it supports various infrared and
other single wire protocols. All four channels share a 192 × 32-bit memory block to store transmit or receive
waveform.
For GPIOs assigned to RMT, please refer to Table 3-1.
3.4.12 Parallel IO (PARLIO) Controller
ESP32-C6 integrates a PARLIO controller for parallel data transfer. It has a transmitter and a receiver, connected
with the GDMA controller. In full-duplex mode the PARLIO controller supports up to 8-bit parallel data transfer,
while in half-duplex mode it supports up to 16-bit parallel data transfer.
The PARLIO controller has the following features:
• multiple clock sources and clock division, with clock frequency up to 40 MHz
• clock edge sampling
• 1/2/4/8/16-bit data transfer
• changeable sample sequence for data to be transmitted and received in 1-bit,2-bit, and 4-bit mode
• support for multiple data sampling mode by the receiver
• support for multiple EOF signal generation modes by the receiver
• support for transmitter clock gating
For GPIOs assigned to PARLIO, please refer to Table 3-1.
3.4.13 General DMA Controller (GDMA)
ESP32-C6 has a general DMA controller (GDMA) with six independent channels, i.e. three transmit channels and
three receive channels. These six channels are shared by peripherals with DMA feature. The GDMA controller
implements a fixed-priority scheme among these channels.
The GDMA controller controls data transfer using linked lists. It allows peripheral-to-memory and
memory-to-memory data transfer at a high speed. All channels can access internal RAM.
Peripherals on ESP32-C6 with DMA feature are SPI2, UHCI0, I2S, AES, SHA, ADC, and PARLIO.
3.4.14 Event Task Matrix (ETM)
ESP32-C6 integrates a SOC ETM with multiple channels. Each input event on channels is mapped to an output
task. Events are generated by peripherals, while tasks are received by peripherals. The SOC ETM has the
following features:
• up to 50 mapping channels, each connected to an event and a task and controlled independently
• an event or a task can be mapped to any tasks or events in the matrix. That is to say, one event can be
mapped to different tasks via multiple channels, or different events can be mapped to the same task via
their individual channels
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• peripherals supporting ETM include GPIO, LED PWM, general-purpose timers, RTC Timer, system timer,
MCPWM, temperature sensor, ADC, I2S, LP CPU, GDMA, and PMU
3.5 Radio
The ESP32-C6 radio consists of the following blocks:
• 2.4 GHz receiver
• 2.4 GHz transmitter
• bias and regulators
• balun and transmit-receive switch
• clock generator
3.5.1 2.4 GHz Receiver
The 2.4 GHz receiver demodulates the 2.4 GHz RF signal to quadrature baseband signals and converts them to
the digital domain with two high-resolution, high-speed ADCs. To adapt to varying signal channel conditions,
ESP32-C6 integrates RF filters, Automatic Gain Control (AGC), DC offset cancelation circuits, and baseband
filters.
3.5.2 2.4 GHz Transmitter
The 2.4 GHz transmitter modulates the quadrature baseband signals to the 2.4 GHz RF signal, and drives the
antenna with a high-powered CMOS power amplifier. The use of digital calibration further improves the linearity of
the power amplifier.
Additional calibrations are integrated to cancel any radio imperfections, such as:
• carrier leakage
• I/Q amplitude/phase matching
• baseband nonlinearities
• RF nonlinearities
• antenna matching
These built-in calibration routines reduce the cost, time, and specialized equipment required for product
testing.
3.5.3 Clock Generator
The clock generator produces quadrature clock signals of 2.4 GHz for both the receiver and the transmitter. All
components of the clock generator are integrated into the chip, including inductors, varactors, filters, regulators
and dividers.
The clock generator has built-in calibration and self-test circuits. Quadrature clock phases and phase noise are
optimized on chip with patented calibration algorithms which ensure the best performance of the receiver and the
transmitter.
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3.6 Wi-Fi
3.6.1 Wi-Fi Radio and Baseband
The ESP32-C6 Wi-Fi radio and baseband support the following features:
• compliant with IEEE 802.11b/g/n/ax
• 1T1R in 2.4 GHz band
• 802.11ax
– 20 MHz-only non-AP mode
– MCS0 ~MCS9
– uplink and downlink OFDMA
– downlink MU-MIMO (multi-user, multiple input, multiple output)
– longer OFDM symbol, with 0.8, 1.6, 3.2 µs guard interval
– DCM (dual carrier modulation), up to 16-QAM
– single-user/multi-user beamformee
– channel quality indication (CQI)
– RX STBC (single spatial stream)
• 802.11b/g/n
– MCS0 ~MCS7 that supports 20 MHz and 40 MHz bandwidth
– MCS32
– data rate up to 150 Mbps
– 0.4 µs guard interval
• adjustable transmitting power
• antenna diversity
ESP32-C6 supports antenna diversity with an external RF switch. This switch is controlled by one or more
GPIOs, and used to select the best antenna to minimize the effects of channel imperfections.
3.6.2 Wi-Fi MAC
ESP32-C6 implements the full IEEE 802.11 b/g/n/ax Wi-Fi MAC protocol. It supports the Basic Service Set (BSS)
STA and SoftAP operations under the Distributed Control Function (DCF). Power management is handled
automatically with minimal host interaction to minimize the active duty period.
The ESP32-C6 Wi-Fi MAC applies the following low-level protocol functions automatically:
• 4 × virtual Wi-Fi interfaces
• infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode
• RTS protection, CTS protection, Immediate Block ACK
• fragmentation and defragmentation
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• TX/RX A-MPDU, TX/RX A-MSDU
• transmit opportunity (TXOP)
• Wi-Fi multimedia (WMM)
• GCMP, CCMP, TKIP, WAPI, WEP, BIP, WPA2-PSK, and WPA3-PSK
• automatic beacon monitoring (hardware TSF)
• 802.11mc FTM
• 802.11ax supports:
– target wake time (TWT) requester
– multiple BSSIDs
– triggered response scheduling
– uplink power headroom
– operating mode
– buffer status report
– Multi-user Request-to-Send (MU-RTS), Multi-user Block ACK Request (MU-BAR), and Multi-STA
Block ACK (M-BA) frame
– intra-PPDU power saving mechanism
– two network allocation vectors (NAV)
– BSS coloring
– spatial reuse
– uplink power headroom
– operating mode control
– buffer status report
– TXOP duration RTS threshold
– UL-OFDMA random access (UORA)
3.6.3 Networking Features
Espressif provides libraries for TCP/IP networking, ESP-WIFI-MESH networking, and other networking protocols
over Wi-Fi. TLS 1.0, 1.1 and 1.2 is also supported.
3.7 Bluetooth LE
ESP32-C6 includes a Bluetooth Low Energy subsystem that integrates a hardware link controller, an RF/modem
block and a feature-rich software protocol stack. It supports the core features of Bluetooth 5 and Bluetooth
mesh.
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3.7.1 Bluetooth LE PHY
Bluetooth Low Energy PHY in ESP32-C6 supports:
• 1 Mbps PHY
• 2 Mbps PHY for higher data rates
• coded PHY for longer range (125 Kbps and 500 Kbps)
• HW listen before talk (LBT)
3.7.2 Bluetooth LE Link Controller
Bluetooth Low Energy Link Controller in ESP32-C6 supports:
• LE advertising extensions, to enhance broadcasting capacity and broadcast more intelligent data
• multiple advertisement sets
• simultaneous advertising and scanning
• multiple connections in simultaneous central and peripheral roles
• adaptive frequency hopping and channel assessment
• LE channel selection algorithm #2
• LE power control
• connection parameter update
• high duty cycle non-connectable advertising
• LE privacy 1.2
• LE data packet length extension
• link layer extended scanner filter policies
• low duty cycle directed advertising
• link layer encryption
• LE Ping
3.8 802.15.4
ESP32-C6 includes an IEEE Standard 802.15.4 subsystem that integrates PHY and MAC layer. It supports
various software stacks including Thread, Zigbee, Matter, HomeKit, MQTT and so on.
3.8.1 802.15.4 PHY
ESP32-C6 ’s 802.15.4 PHY supports:
• O-QPSK PHY in 2.4 GHz
• 250 Kbps data rate
• RSSI and LQI supported
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3.8.2 802.15.4 MAC
ESP32-C6 supports most key features defined in IEEE Standard 802.15.4-2015, including:
• CSMA/CA
• active scan and energy detect
• HW frame filter
• HW auto acknowledge
• HW auto frame pending
• coordinated sampled listening (CSL)
3.9 Low Power Management
With the use of advanced power-management technologies, ESP32-C6 can switch between different power
modes. ESP32-C6 supports:
• Active mode: CPU and chip radio are powered on. The chip can receive, transmit, or listen.
• Modem-sleep mode: The CPU is operational and the clock frequency can be reduced. Wi-Fi base band
and radio are disabled, but Wi-Fi connection can remain active.
• Light-sleep mode: The CPU is paused. Any wake-up events (wireless power management module, SDIO
host, RTC timer, or external interrupts) will wake up the chip. Wi-Fi base band and radio are disabled, but
Wi-Fi connection can remain active. Users can disable the CPU and most peripherals except SRAM and
wireless power management module (as shown in ESP32-C6 Functional Block Diagram) to further reduce
current consumption.
• Deep-sleep mode: CPU, SRAM, and most peripherals are powered down. Only the LP memory is
powered on. LP peripheral states can be configured. Wi-Fi connection data are stored in the LP memory.
The LP CPU is operational.
3.10
Timers
3.10.1 System Timer
ESP32-C6 integrates a 52-bit system timer, which has two 52-bit counters and three comparators. The system
timer has the following features:
• counters with an average clock frequency of 16 MHz
• three types of independent interrupts generated according to alarm value
• two alarm modes: target mode and period mode
• 52-bit alarm values and 26-bit alarm periods
• automatic reload of counter value
• counters can be stalled if the CPU is stalled or in OCD mode
• real-time alarm events
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3.10.2 General Purpose Timers
ESP32-C6 is embedded with two 54-bit general-purpose timers, which are based on 16-bit prescalers and
54-bit auto-reload-capable up/down-timers.
The timers’ features are summarized as follows:
• a 16-bit clock prescaler, from 2 to 65536
• a 54-bit time-base counter programmable to be incrementing or decrementing
• able to read real-time value of the time-base counter
• halting and resuming the time-base counter
• programmable alarm generation
• level interrupt generation
• real-time alarm events
• tasks in response to ETM, including enable and disable timers, enable alarms, read the timer’s real-time
values, reload the timer’s values
3.10.3 Watchdog Timers
Digital Watchdog Timers
The ESP32-C6 contains three digital watchdog timers: one in each of the two timer groups (called Main System
Watchdog Timers, or MWDT) and one in the low-power system (called the RTC Watchdog Timer, or
RWDT).
During the flash boot process, RWDT and the MWDT in timer group 0 (TIMG0) are enabled automatically in order
to detect and recover from booting errors.
Watchdog timers have the following features:
• four stages, each with a programmable timeout value. Each stage can be configured, enabled and
disabled separately
• interrupt, CPU reset, or core reset for MWDT upon expiry of each stage; interrupt, CPU reset, core reset, or
system reset for RWDT upon expiry of each stage
• 32-bit expiry counter
• write protection, to prevent RWDT and MWDT configuration from being altered inadvertently
• flash boot protection
If the boot process from an SPI flash does not complete within a predetermined period of time, the
watchdog will reboot the entire main system.
Analog Watchdog Timer
The ESP32-C6 also has one analog watchdog timer: RTC super watchdog timer (SWD). Super watchdog (SWD)
is an ultra-low-power circuit in analog domain that helps to prevent the system from operating in a sub-optimal
state and resets the system (system reset) if required. SWD contains a watchdog circuit that needs to be fed for
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at least once during its timeout period, which is slightly less than one second. About 100 ms before watchdog
timeout, it will also send out a WD_INTR signal as a request to remind the system to feed the watchdog.
If the system does not respond to SWD feed request and watchdog finally times out, SWD will generate a system
level signal SWD_RSTB to reset whole digital circuits on the chip (system reset).
The source of the clock for SWD is constant and can not be selected.
SWD has the following features:
• ultra-low power
• interrupt to indicate that the SWD is about to time out
• various dedicated methods for software to feed SWD, which enables SWD to monitor the working state of
the whole operating system
3.11
Cryptography/Security Components
3.11.1 AES Accelerator (AES)
ESP32-C6 integrates an Advanced Encryption Standard (AES) accelerator, which is a hardware device that
speeds up computation using AES algorithm significantly, compared to AES algorithms implemented solely in
software. The AES accelerator integrated in ESP32-C6 has two working modes, which are Typical AES and
DMA-AES.
The following functionality is supported:
• typical AES working mode
– AES-128/AES-256 encryption and decryption
• DMA-AES working mode
– AES-128/AES-256 encryption and decryption
– Block cipher mode
* ECB (Electronic Codebook)
* CBC (Cipher Block Chaining)
* OFB (Output Feedback)
* CTR (Counter)
* CFB8 (8-bit Cipher Feedback)
* CFB128 (128-bit Cipher Feedback)
– interrupt on completion of computation
3.11.2 ECC Accelerator (ECC)
Elliptic Curve Cryptography (ECC) is an approach to public-key cryptography based on the algebraic structure of
elliptic curves. ECC allows smaller keys compared to RSA cryptography while providing equivalent
security.
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ESP32-C6’s ECC Accelerator can complete various calculations based on different elliptic curves, thus
accelerating the ECC algorithm and ECC-derived algorithms (such as ECDSA).
ESP32-C6’s ECC Accelerator has the following features:
• two different elliptic curves, namely P-192 and P-256 defined in FIPS 186-3
• six working modes
• interrupt upon completion of calculation
3.11.3 HMAC Accelerator (HMAC)
The Hash-based Message Authentication Code (HMAC) module computes Message Authentication Codes
(MACs) using Hash algorithm SHA-256 and keys as described in RFC 2104. The 256-bit HMAC key is stored in
an eFuse key block and can be set as read-protected, i. e., the key is not accessible from outside the HMAC
accelerator.
Main features are as follows:
• standard HMAC-SHA-256 algorithm
• Hash result only accessible by configurable hardware peripheral (in downstream mode)
• compatibility with challenge-response authentication algorithm
• required keys for the Digital Signature (DS) peripheral (in downstream mode)
• re-enabled soft-disabled JTAG (in downstream mode)
3.11.4 RSA Accelerator (RSA)
The RSA accelerator provides hardware support for high-precision computation used in various RSA asymmetric
cipher algorithms, significantly improving their run time and reducing their software complexity. Compared with
RSA algorithms implemented solely in software, this hardware accelerator can speed up RSA algorithms
significantly. The RSA accelerator also supports operands of different lengths, which provides more flexibility
during the computation.
The following functionality is supported:
• large-number modular exponentiation with two optional acceleration options
• large-number modular multiplication, up to 3072 bits
• large-number multiplication, with operands up to 1536 bits
• operands of different lengths
• interrupt on completion of computation
3.11.5 SHA Accelerator (SHA)
ESP32-C6 integrates an SHA accelerator, which is a hardware device that speeds up the SHA algorithm
significantly, compared to a SHA algorithm implemented solely in software. The SHA accelerator integrated in
ESP32-C6 has two working modes, which are Typical SHA and DMA-SHA.
The following functionality is supported:
• the following hash algorithms introduced in FIPS PUB 180-4 Spec
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– SHA-1
– SHA-224
– SHA-256
• two working modes
– typical SHA
– DMA-SHA
• interleaved function when working in Typical SHA working mode
• interrupt function when working in DMA-SHA working mode
3.11.6 Digital Signature (DS)
A Digital Signature (DS) is used to verify the authenticity and integrity of a message using a cryptographic
algorithm. This can be used to validate a device’s identity to a server, or to check the integrity of a
message.
ESP32-C6 includes a Digital Signature (DS) module providing hardware acceleration of messages’ signatures
based on RSA. HMAC is used as the key derivation function to output the DS_KEY key using eFuse as the input
key. Subsequently, the DS module uses DS_KEY to decrypt the pre-encrypted parameters and calculate the
signature. The whole process happens in hardware so that neither the decryption key for the RSA parameters nor
the input key for the HMAC key derivation function can be seen by users while calculating the signature.
The following functionality is supported:
• RSA digital signatures with key length up to 3072 bits
• encrypted private key data, only decryptable by DS module
• SHA-256 digest to protect private key data against tampering by an attacker
3.11.7 External Memory Encryption and Decryption (XTS_AES)
The ESP32-C6 integrates an External Memory Encryption and Decryption module that complies with the
XTS-AES standard algorithm specified in IEEE Std 1619-2007, providing security for users’ application code and
data stored in the external memory (flash). Users can store proprietary firmware and sensitive data (e.g.,
credentials for gaining access to a private network) to the off-package flash.
The following functionality is supported:
• general XTS-AES algorithm, compliant with IEEE Std 1619-2007
• software-based manual encryption
• high-speed auto decryption without software’s participation
• encryption and decryption functions jointly enabled/disabled by registers configuration, eFuse parameters,
and boot mode
• configurable Anti-DPA
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3.11.8 Random Number Generator (RNG)
The ESP32-C6 contains a true random number generator, which generates 32-bit random numbers that can be
used for cryptographical operations, among other things.
The random number generator in ESP32-C6 generates true random numbers, which means random numbers
generated from a physical process, rather than by means of an algorithm. No number generated within the
specified range is more or less likely to appear than any other number.
3.12
Peripheral Pin Configurations
Table 3-1. Peripheral Pin Configurations
Interface
Signal
Pin
Function
ADC
ADC1_CH0
XTAL_32K_P
12-bit SAR ADC
ADC1_CH1
XTAL_32K_N
ADC1_CH2
GPIO2
ADC1_CH3
GPIO3
ADC1_CH4
MTMS
ADC1_CH5
MTDI
ADC1_CH6
MTCK
MTDI
MTDI
MTCK
MTCK
MTMS
MTMS
MTDO
MTDO
U0RXD_in
Any GPIO pins
JTAG
UART
JTAG for software debugging
Two UART channels with hardware flow control
and GDMA
U0CTS_in
U0DSR_in
U0TXD_out
U0RTS_out
U0DTR_out
U1RXD_in
U1CTS_in
U1DSR_in
U1TXD_out
U1RTS_out
U1DTR_out
LP UART
I2C
LP_UART_DTRN
XTAL_32K_P
One LP UART channel with hardware flow control
LP_UART_DSRN
XTAL_32K_N
and GDMA
LP_UART_RTSN
GPIO2
LP_UART_CTSN
GPIO3
LP_UART_RXD
MTMS
LP_UART_TXD
MTDI
I2CEXT0_SCL_in
Any GPIO pins
One I2C channel in slave or master mode
MTCK
One LP I2C channel in slave or master mode
I2CEXT0_SDA_in
I2CEXT0_SCL_out
I2CEXT0_SDA_out
LP I2C
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Interface
Signal
Pin
Function
LP_I2C_SCL
MTDO
LED PWM
ledc_ls_sig_out0~5
Any GPIO pins
Six independent PWM channels
I2S
I2S0O_BCK_in
Any GPIO pins
Stereo input and output from/to the audiocodec
Any GPIO pins
Two channels for an IR transceiver of various
I2S_MCLK_in
I2SO_WS_in
I2SI_SD_in
I2SI_BCK_in
I2SI_WS_in
I2SO_BCK_out
I2S_MCLK_out
I2SO_WS_out
I2SO_SD_out
I2SI_BCK_out
I2SI_WS_out
I2SO_SD1_out
Remote Control
RMT_SIG_IN0~1
Peripheral
RMT_SIG_OUT0~1
SPI0/1
SPICLK_out_mux
SPICLK
Support Standard SPI, Dual SPI, Quad SPI, and
SPICS0_out
SPICS0
QPI that allow connection to off-package flash
SPICS1_out
Any GPIO pins
SPID_in/_out
SPID
SPIQ_in/_out
SPIQ
SPIWP_in/_out
SPIWP
SPIHD_in/_out
SPIHD
FSPICLK_in/_out_mux
Any GPIO pins
SPI2
waveforms
The following functionality is supported:
• Master mode and slave mode of SPI, Dual SPI,
Quad SPI, and QPI
• Connection to off-package flash, RAM and other
SPI devices
• Four modes of SPI transfer format
• Configurable SPI frequency
• 64-byte FIFO or GDMA buffer
FSPICS0_in/_out
FSPICS1~5_out
FSPID_in/_out
FSPIQ_in/_out
FSPIWP_in/_out
FSPIHD_in/_out
USB Serial/JTAG
®
TWAI
USB_D+
GPIO13
USB-to-serial converter, and USB-to-JTAG
USB_D-
GPIO12
converter
TWAI0_RX
Any GPIO pins
Compatible with ISO 11898-1 protocol
TWAI0_TX
TWAI0_BUS_OFF_ON
TWAI0_CLKOUT
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Interface
Signal
Pin
Function
Any GPIO pins
Captures pulses and counts pulse edges in
TWAI0_STANDBY
TWAI1_RX
TWAI1_TX
TWAI1_BUS_OFF_ON
TWAI1_CLKOUT
TWAI1_STANDBY
Pulse Count Controller
PCNT_SIG_CH0_in0~3
seven modes
PCNT_SIG_CH1_in0~3
PCNT_CTRL_CH0_in0~3
PCNT_CTRL_CH1_in0~3
MCPWM
PWM0_SYNC0~2_in
Any GPIO pins
One MCPWM to generate:
• differential PWM output signals
• fault input signals to be detected
• input signals to be captured
• external synchronization signals for PWM timers
PWM0_out0a
PWM0_out0b
PWM0_out1a
PWM0_F0~2_in
PWM0_out1b
PWM0_out2a
PWM0_out2b
PWM0_CAP0~2_in
PARLIO
PARL_RX_DATA0~15
Any GPIO pins
A module for parallel data transfer, with
• 16 pins to receive parallel data
• 16 pins to transmit parallel data
• 1 receiver clock pin (clock input)
• 2 transmitter clock pins (clock input and output)
PARL_TX_DATA0~15
PARL_RX_CLK_in
PARL_TX_CLK_in/_out
SDIO
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SDIO_CMD
SDIO interface, conforming to the industry
SDIO_CLK
SDIO_CLK
standard SDIO Specification Version 2.0
SDIO_DATA0
SDIO_DATA0
SDIO_DATA1
SDIO_DATA1
SDIO_DATA2
SDIO_DATA2
SDIO_DATA3
SDIO_DATA3
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in Table 4-1 Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and normal operation of the device at these or any other conditions beyond those
indicated in Section 4.2 Recommended Power Supply Characteristics is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 4-1. Absolute Maximum Ratings
Parameter
Input power pins
TST ORE
1
Description
1
Min
Max
Unit
Allowed input voltage
–0.3
3.6
V
Storage temperature
–40
150
°C
For more information on input power pins, see Section 2.5.1 Power
Pins.
2
The product proved to be fully functional after all its IO pins were pulled
high while being connected to ground for 24 consecutive hours at ambient temperature of 25 °C.
4.2 Recommended Power Supply Characteristics
For recommended ambient temperature, see Section 1 ESP32-C6 Series Comparison.
Table 4-2. Recommended Power Characteristics
Parameter 1
Description
VDDA1, VDDA2, VDDA3P3
Recommended input voltage
3.0
3.3
3.6
V
VDDPST1
Recommended input voltage
3.0
3.3
3.6
V
—
3.0
3.3
3.6
V
Recommended input voltage
3.0
3.3
3.6
V
Cumulative input current
0.5
—
—
A
VDD_SPI (as input)
VDDPST2
IV DD
2, 3
Min
Typ
Max
Unit
1
See in conjunction with Section 2.5 Power Supply.
2
If VDDPST2 is used to power VDD_SPI (see Section 2.5.2 Power Scheme), the voltage drop
on RSP I should be accounted for. See also Section 4.3 VDD_SPI Output Characteristics.
3
If writing to eFuses, the voltage on VDDPST2 should not exceed 3.3 V as the circuits responsible for burning eFuses are sensitive to higher voltages.
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4.3 VDD_SPI Output Characteristics
Table 4-3. VDD_SPI Internal and Output Characteristics
Parameter
Description 1
Typ
VDD_SPI powered by VDD3P3_RTC via RSP I
RSP I
Unit
7.5
for 3.3 V flash 2
1
See in conjunction with Section 2.5.2 Power Scheme.
2
VDD3P3_RTC must be more than VDD_flash_min + I_flash_max * RSP I ;
Ω
where
• VDD_flash_min – minimum operating voltage of flash
• I_flash_max – maximum operating current of flash
4.4 DC Characteristics (3.3 V, 25 °C)
Table 4-4. DC Characteristics (3.3 V, 25 °C)
Parameter
Description
CIN
Pin capacitance
VIH
High-level input voltage
Min
Typ
—
0.75 × VDD1
Max
Unit
2
—
pF
—
VDD1+ 0.3
V
1
VIL
Low-level input voltage
–0.3
—
0.25 × VDD
IIH
High-level input current
—
—
50
nA
IIL
Low-level input current
—
—
50
nA
VOH 2
High-level output voltage
—
—
V
VOL
2
0.8 × VDD1
Low-level output voltage
1
V
—
—
0.1 × VDD
V
—
40
—
mA
—
28
—
mA
1
IOH
IOL
High-level source current (VDD = 3.3 V, VOH
>= 2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1= 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3)
RP U
Internal weak pull-up resistor
—
45
—
kΩ
RP D
Internal weak pull-down resistor
—
45
—
kΩ
—
VDD1+ 0.3
V
—
0.25 × VDD1
V
VIH_nRST
VIL_nRST
Chip reset release voltage CHIP_PU voltage is
within the specified range)
0.75 × VDD1
Chip reset voltage (CHIP_PU voltage is within
the specified range)
1
VDD – voltage from a power pin of a respective power domain.
2
VOH and VOL are measured using high-impedance load.
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ESP32-C6 Series Datasheet v1.0
4 Electrical Characteristics
4.5 ADC Characteristics
The measurements in this section are taken with an external 100 nF capacitor connected to the ADC, using DC
signals as input, and at an ambient temperature of 25 °C with disabled Wi-Fi.
Table 4-5. ADC Characteristics
Symbol
Min
DNL (Differential nonlinearity)
1
INL (Integral nonlinearity)
Sampling rate
1
Max
Unit
–8
12
LSB
–10
10
LSB
—
100
kSPS 2
To get better DNL results, you can sample multiple times and
apply a filter, or calculate the average value.
2
kSPS means kilo samples-per-second.
The calibrated ADC results after hardware calibration and software calibration are shown in Table 4-6. For higher
accuracy, you may implement your own calibration methods.
Table 4-6. ADC Calibration Results
Parameter
Total error
Description
Min
Max
Unit
ATTEN0, effective measurement range of 0 ~ 1000
–12
12
mV
ATTEN1, effective measurement range of 0 ~ 1300
–12
12
mV
ATTEN2, effective measurement range of 0 ~ 1900
–23
23
mV
ATTEN3, effective measurement range of 0 ~ 3300
–40
40
mV
Note:
The above ADC measurement range and accuracy are applicable to chips manufactured on and after the Date Code
212023 on shielding cases, or assembled on and after the D/C 1 and D/C 2 2321 on bar-code labels. For chips manufactured or assembled earlier than these date codes, please ask our sales team to provide the actual range and accuracy
according to batch.
For details of Date Code and D/C, please refer to Espressif Chip Packaging Information.
4.6 Current Consumption
4.6.1 RF Current Consumption in Active Mode
The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature.
TX current consumption is rated at a 100% duty cycle.
RX current consumption is rated when the peripherals are disabled and the CPU idle.
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4 Electrical Characteristics
Table 4-7. Current Consumption for Wi-Fi (2.4 GHz) in Active Mode
Work Mode
RF Condition
TX
Active (RF working)
RX
Description
Peak (mA)
802.11b, 1 Mbps, DSSS @ 21.0 dBm
354
802.11g, 54 Mbps, OFDM @ 19.5 dBm
300
802.11n, HT20, MCS7 @ 18.5 dBm
280
802.11n, HT40, MCS7 @ 18.0 dBm
268
802.11ax, MCS9, @ 16.5 dBm
252
802.11b/g/n, HT20
78
802.11n, HT40
82
802.11ax, HE20
78
Table 4-8. Current Consumption for Bluetooth LE in Active Mode
Work Mode
RF Condition
TX
Active (RF working)
RX
Description
Peak (mA)
Bluetooth LE @ 20.0 dBm
315
Bluetooth LE @ 9.0 dBm
190
Bluetooth LE @ 0 dBm
130
Bluetooth LE @ –15.0 dBm
94
Bluetooth LE
71
Table 4-9. Current Consumption for 802.15.4 in Active Mode
Work Mode
RF Condition
TX
Active (RF working)
RX
Description
Peak (mA)
802.15.4 @ 20.0 dBm
305
802.15.4 @ 12.0 dBm
187
802.15.4 @ 0 dBm
119
802.15.4 @ –15.0 dBm
92
802.15.4
74
4.6.2 Current Consumption in Other Modes
Table 4-10. Current Consumption in Modem-sleep Mode
Typ (mA)
CPU Frequency
Mode
(MHz)
Description
160
Modem-sleep2,3
80
1
All Peripherals
All Peripherals
Clocks Disabled
Clocks Enabled1
CPU is running
27
38
CPU is idle
17
28
CPU is running
19
30
CPU is idle
14
25
In practice, the current consumption might be different depending on which peripherals are
enabled.
2
In Modem-sleep mode, Wi-Fi is clock gated.
3
In Modem-sleep mode, the consumption might be higher when accessing flash.
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4 Electrical Characteristics
Table 4-11. Current Consumption in Low-Power Modes
Mode
Description
Typ (µA)
CPU and wireless communication modules are powered down, peLight-sleep
ripheral clocks are disabled, and all GPIOs are high-impedance
CPU, wireless communication modules and peripherals are powered down, and all GPIOs are high-impedance
180
35
Deep-sleep
RTC timer and LP memory are powered on
7
Power off
CHIP_PU is set to low level, the chip is powered off
1
4.7 Reliability
Table 4-12. Reliability Qualifications
Test Item
HTOL (High Temperature
Operating Life)
ESD (Electro-Static
Discharge Sensitivity)
Latch up
Test Conditions
Test Standard
125 °C, 1000 hours
JESD22-A108
HBM (Human Body Mode)1± 2000 V
JS-001
2
CDM (Charge Device Mode) ± 1000 V
JS-002
Current trigger ± 200 mA
JESD78
Voltage trigger 1.5 × VDDmax
Bake 24 hours @125 °C
Preconditioning
Moisture soak (level 3: 192 hours @30 °C, 60% RH)
IR reflow solder: 260 + 0 °C, 20 seconds, three times
TCT (Temperature Cycling
Test)
J-STD-020, JESD47,
JESD22-A113
–65 °C / 150 °C, 500 cycles
JESD22-A104
130 °C, 85% RH, 96 hours
JESD22-A118
150 °C, 1000 hours
JESD22-A103
–40 °C, 1000 hours
JESD22-A119
uHAST (Highly
Accelerated Stress Test,
unbiased)
HTSL (High Temperature
Storage Life)
LTSL (Low Temperature
Storage Life)
1
JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
2
JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
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5 RF Characteristics
5 RF Characteristics
This section contains tables with RF characteristics of the Espressif product.
The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The
front-end circuit is a 0 Ω resistor.
Devices should operate in the center frequency range allocated by regional regulatory authorities. The target
center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and
Test Guide for instructions.
Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient
temperature.
5.1 Wi-Fi Radio
Table 5-1. Wi-Fi RF Characteristics
Name
Description
Center frequency range of operating channel
2412 ~ 2484 MHz
Wi-Fi wireless standard
IEEE 802.11b/g/n/ax
5.1.1 Wi-Fi RF Transmitter (TX) Characteristics
Table 5-2. TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps, DSSS
—
21.0
—
802.11b, 11 Mbps, CCK
—
21.0
—
802.11g, 6 Mbps, OFDM
—
20.5
—
802.11g, 54 Mbps, OFDM
—
19.5
—
802.11n, HT20, MCS0
—
19.5
—
802.11n, HT20, MCS7
—
18.5
—
802.11n, HT40, MCS0
—
19.0
—
802.11n, HT40, MCS7
—
18.0
—
802.11ax, HE20, MCS0
—
19.5
—
802.11ax, HE20, MCS9
—
16.5
—
Rate
Table 5-3. TX EVM Test1
Rate
802.11b, 1 Mbps, DSSS
Min
Typ
Limit
(dB)
(dB)
(dB)
–25.5
–10.0
—
Cont’d on next page
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5 RF Characteristics
Table 5-3 – cont’d from previous page
Rate
Min
Typ
Limit
(dB)
(dB)
(dB)
802.11b, 11 Mbps, CCK
—
–25.5
–10.0
802.11g, 6 Mbps, OFDM
—
–26.5
–5.0
802.11g, 54 Mbps, OFDM
—
–29.0
–25.0
802.11n, HT20, MCS0
—
–29.0
–5.0
802.11n, HT20, MCS7
—
–30.0
–27.0
802.11n, HT40, MCS0
—
–28.5
–5.0
802.11n, HT40, MCS7
—
–29.5
–27.0
802.11ax, HE20, MCS0
—
–29.0
–5.0
802.11ax, HE20, MCS9
—
–34.0
–32.0
1
EVM is measured at the corresponding typical TX power provided
in Table 5-2 TX Power with Spectral Mask and EVM Meeting 802.11
Standards above.
5.1.2 Wi-Fi RF Receiver (RX) Characteristics
For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n/ax.
Table 5-4. RX Sensitivity
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps, DSSS
—
–99.2
—
802.11b, 2 Mbps, DSSS
—
–96.8
—
802.11b, 5.5 Mbps, CCK
—
–93.8
—
802.11b, 11 Mbps, CCK
—
–90.0
—
802.11g, 6 Mbps, OFDM
—
–94.0
—
802.11g, 9 Mbps, OFDM
—
–93.2
—
802.11g, 12 Mbps, OFDM
—
–92.6
—
802.11g, 18 Mbps, OFDM
—
–90.0
—
802.11g, 24 Mbps, OFDM
—
–86.8
—
802.11g, 36 Mbps, OFDM
—
–83.2
—
802.11g, 48 Mbps, OFDM
—
–79.0
—
802.11g, 54 Mbps, OFDM
—
–77.6
—
802.11n, HT20, MCS0
—
–93.6
—
802.11n, HT20, MCS1
—
–92.4
—
802.11n, HT20, MCS2
—
–89.6
—
802.11n, HT20, MCS3
—
–86.2
—
802.11n, HT20, MCS4
—
–82.8
—
802.11n, HT20, MCS5
—
–78.8
—
802.11n, HT20, MCS6
—
–77.2
—
Rate
Cont’d on next page
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5 RF Characteristics
Table 5-4 – cont’d from previous page
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11n, HT20, MCS7
—
–75.6
—
802.11n, HT40, MCS0
—
–91.0
—
802.11n, HT40, MCS1
—
–90.0
—
802.11n, HT40, MCS2
—
–87.4
—
802.11n, HT40, MCS3
—
–83.8
—
802.11n, HT40, MCS4
—
–80.8
—
802.11n, HT40, MCS5
—
–76.6
—
802.11n, HT40, MCS6
—
–75.0
—
802.11n, HT40, MCS7
—
–73.4
—
802.11ax, HE20, MCS0
—
–93.8
—
802.11ax, HE20, MCS1
—
–91.2
—
802.11ax, HE20, MCS2
—
–88.4
—
802.11ax, HE20, MCS3
—
–85.6
—
802.11ax, HE20, MCS4
—
–82.2
—
802.11ax, HE20, MCS5
—
–78.4
—
802.11ax, HE20, MCS6
—
–76.6
—
802.11ax, HE20, MCS7
—
–74.8
—
802.11ax, HE20, MCS8
—
–71.0
—
802.11ax, HE20, MCS9
—
–69.0
—
Rate
Table 5-5. Maximum RX Level
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps, DSSS
—
5
—
802.11b, 11 Mbps, CCK
—
5
—
802.11g, 6 Mbps, OFDM
—
5
—
802.11g, 54 Mbps, OFDM
—
0
—
802.11n, HT20, MCS0
—
5
—
802.11n, HT20, MCS7
—
0
—
802.11n, HT40, MCS0
—
5
—
802.11n, HT40, MCS7
—
0
—
802.11ax, HE20, MCS0
—
5
—
802.11ax, HE20, MCS9
—
0
—
Rate
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5 RF Characteristics
Table 5-6. RX Adjacent Channel Rejection
Rate
Min
Typ
Max
(dB)
(dB)
(dB)
802.11b, 1 Mbps, DSSS
—
38
—
802.11b, 11 Mbps, CCK
—
38
—
802.11g, 6 Mbps, OFDM
—
31
—
802.11g, 54 Mbps, OFDM
—
20
—
802.11n, HT20, MCS0
—
31
—
802.11n, HT20, MCS7
—
16
—
802.11n, HT40, MCS0
—
28
—
802.11n, HT40, MCS7
—
10
—
802.11ax, HE20, MCS0
—
25
—
802.11ax, HE20, MCS9
—
2
—
5.2 Bluetooth LE Radio
Table 5-7. Bluetooth LE RF Characteristics
Name
Description
Center frequency range of operating channel
2402 ~ 2480 MHz
RF transmit power range
–15.0 ~ 20.0 dBm
5.2.1 Bluetooth LE RF Transmitter (TX) Characteristics
Table 5-8. Bluetooth LE - Transmitter Characteristics - 1 Mbps
Parameter
Carrier frequency offset and drift
Modulation characteristics
Description
Min
Espressif Systems
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
1.3
—
kHz
Max. |f0 − fn |n=2, 3, 4, ...k
—
1.5
—
kHz
Max. |fn − fn−5 |n=6, 7, 8, ...k
—
0.9
—
kHz
|f1 − f0 |
—
0.6
—
kHz
∆ F 1avg
—
249.9
—
kHz
—
212.1
—
kHz
∆ F 2avg /∆ F 1avg
—
0.88
—
—
± 2 MHz offset
—
–29
—
dBm
± 3 MHz offset
—
–36
—
dBm
> ± 3 MHz offset
—
–39
—
dBm
Min. ∆ F 2max (for at least
99.9% of all ∆ F 2max )
In-band emissions
Typ
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Table 5-9. Bluetooth LE - Transmitter Characteristics - 2 Mbps
Parameter
Description
Carrier frequency offset and drift
Modulation characteristics
Min
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
2.2
—
kHz
Max. |f0 − fn |n=2, 3, 4, ...k
—
1.1
—
kHz
Max. |fn − fn−5 |n=6, 7, 8, ...k
—
1.1
—
kHz
|f1 − f0 |
—
0.5
—
kHz
∆ F 1avg
—
499.4
—
kHz
—
443.5
—
kHz
∆ F 2avg /∆ F 1avg
—
0.95
—
—
± 4 MHz offset
—
–40
—
dBm
± 5 MHz offset
—
–41
—
dBm
> ± 5 MHz offset
—
–42
—
dBm
Min. ∆ F 2max (for at least
99.9% of all ∆ F 2max )
In-band emissions
Typ
Table 5-10. Bluetooth LE - Transmitter Characteristics - 125 Kbps
Parameter
Description
Carrier frequency offset and drift
Modulation characteristics
Min
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
0.7
—
kHz
Max. |f0 − fn |n=1, 2, 3, ...k
—
0.3
—
kHz
|f0 − f3 |
—
0.1
—
kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k
—
0.4
—
kHz
∆ F 1avg
—
250.0
—
kHz
—
238.0
—
kHz
± 2 MHz offset
—
–29
—
dBm
± 3 MHz offset
—
–36
—
dBm
> ± 3 MHz offset
—
–39
—
dBm
Min. ∆ F 1max (for at least
99.9% of all ∆ F 1max )
In-band emissions
Typ
Table 5-11. Bluetooth LE - Transmitter Characteristics - 500 Kbps
Parameter
Carrier frequency offset and drift
Modulation characteristics
Description
Min
Espressif Systems
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
0.5
—
kHz
Max. |f0 − fn |n=1, 2, 3, ...k
—
0.3
—
kHz
|f0 − f3 |
—
0.1
—
kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k
—
0.4
—
kHz
∆ F 2avg
—
230.7
—
kHz
—
217.6
—
kHz
± 2 MHz offset
—
–28
—
dBm
± 3 MHz offset
—
–36
—
dBm
> ± 3 MHz offset
—
–39
—
dBm
Min. ∆ F 2max (for at least
99.9% of all ∆ F 2max )
In-band emissions
Typ
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5 RF Characteristics
5.2.2 Bluetooth LE RF Receiver (RX) Characteristics
Table 5-12. Bluetooth LE - Receiver Characteristics - 1 Mbps
Parameter
Description
Max
Unit
Sensitivity @30.8% PER
—
—
–98.5
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
F = F0 MHz
—
7
—
dB
F = F0 + 1 MHz
—
4
—
dB
F = F0 – 1 MHz
—
3
—
dB
F = F0 + 2 MHz
—
–21
—
dB
F = F0 – 2 MHz
—
–22
—
dB
F = F0 + 3 MHz
—
–28
—
dB
F = F0 – 3 MHz
—
–36
—
dB
F ≥ F0 + 4 MHz
—
–27
—
dB
F ≤ F0 – 4 MHz
—
–36
—
dB
Image frequency
—
—
–26
—
dB
Adjacent channel to
F = Fimage + 1 MHz
—
–29
—
dB
image frequency
F = Fimage – 1 MHz
—
–28
—
dB
30 MHz ~ 2000 MHz
—
–16
—
dBm
2003 MHz ~ 2399 MHz
—
–24
—
dBm
2484 MHz ~ 2997 MHz
—
–16
—
dBm
3000 MHz ~ 12.75 GHz
—
–1
—
dBm
—
—
–27
—
dBm
Max
Unit
Co-channel
Adjacent channel
C/I and receiver
selectivity performance
Out-of-band blocking performance
Intermodulation
Min
Typ
Table 5-13. Bluetooth LE - Receiver Characteristics - 2 Mbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–95.5
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
F = F0 MHz
—
8
—
dB
F = F0 + 2 MHz
—
3
—
dB
F = F0 – 2 MHz
—
2
—
dB
F = F0 + 4 MHz
—
–23
—
dB
F = F0 – 4 MHz
—
–25
—
dB
F = F0 + 6 MHz
—
–31
—
dB
F = F0 – 6 MHz
—
–35
—
dB
F ≥ F0 + 8 MHz
—
–36
—
dB
F ≤ F0 – 8 MHz
—
–36
—
dB
Image frequency
—
—
–23
—
dB
Adjacent channel to
F = Fimage + 2 MHz
—
–30
—
dB
image frequency
F = Fimage – 2 MHz
—
3
—
dB
Co-channel
C/I and receiver
Adjacent channel
selectivity performance
Min
Typ
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Table 5-13 – cont’d from previous page
Parameter
Description
Out-of-band blocking performance
Intermodulation
Min
Typ
Max
Unit
30 MHz ~ 2000 MHz
—
–18
—
dBm
2003 MHz ~ 2399 MHz
—
–28
—
dBm
2484 MHz ~ 2997 MHz
—
–16
—
dBm
3000 MHz ~ 12.75 GHz
—
–1
—
dBm
—
—
–29
—
dBm
Max
Unit
Table 5-14. Bluetooth LE - Receiver Characteristics - 125 Kbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–106.0
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
F = F0 MHz
—
2
—
dB
F = F0 + 1 MHz
—
–1
—
dB
F = F0 – 1 MHz
—
–3
—
dB
F = F0 + 2 MHz
—
–31
—
dB
F = F0 – 2 MHz
—
–27
—
dB
F = F0 + 3 MHz
—
–33
—
dB
F = F0 – 3 MHz
—
–42
—
dB
F ≥ F0 + 4 MHz
—
–31
—
dB
F ≤ F0 – 4 MHz
—
–48
—
dB
Image frequency
—
—
–31
—
dB
Adjacent channel to
F = Fimage + 1 MHz
—
–36
—
dB
image frequency
F = Fimage – 1 MHz
—
–33
—
dB
Co-channel
Adjacent channel
C/I and receiver
selectivity performance
Min
Typ
Table 5-15. Bluetooth LE - Receiver Characteristics - 500 Kbps
Parameter
Description
Sensitivity @30.8% PER
—
—
Maximum received signal @30.8% PER
—
Co-channel
C/I and receiver
Adjacent channel
selectivity performance
Image frequency
Min
Typ
Max
Unit
–102.0
—
dBm
—
8
—
dBm
F = F0 MHz
—
4
—
dB
F = F0 + 1 MHz
—
1
—
dB
F = F0 – 1 MHz
—
–1
—
dB
F = F0 + 2 MHz
—
–23
—
dB
F = F0 – 2 MHz
—
–24
—
dB
F = F0 + 3 MHz
—
–33
—
dB
F = F0 – 3 MHz
—
–41
—
dB
F ≥ F0 + 4 MHz
—
–31
—
dB
F ≤ F0 – 4 MHz
—
–41
—
dB
—
—
–30
—
dB
Cont’d on next page
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5 RF Characteristics
Table 5-15 – cont’d from previous page
Parameter
Description
Min
Typ
Max
Unit
Adjacent channel to
F = Fimage + 1 MHz
—
–35
—
dB
image frequency
F = Fimage – 1 MHz
—
–27
—
dB
5.3 802.15.4 Radio
Table 5-16. 802.15.4 RF Characteristics
Name
Description
Center frequency range of operating channel
2405 ~ 2480 MHz
1
Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from
channel 11 to channel 26.
5.3.1 802.15.4 RF Transmitter (TX) Characteristics
Table 5-17. 802.15.4 Transmitter Characteristics - 250 Kbps
Parameter
Min
RF transmit power range
–15.0
—
20.0
dBm
—
13.0%
—
—
EVM
Typ
Max
Unit
5.3.2 802.15.4 RF Receiver (RX) Characteristics
Table 5-18. 802.15.4 Receiver Characteristics - 250 Kbps
Parameter
Description
Sensitivity @1% PER
—
—
Maximum received signal @1% PER
—
Adjacent channel
Relative jamming level
Alternate channel
Espressif Systems
Max
Unit
–104.0
—
dBm
—
8
—
dBm
F = F0 + 5 MHz
—
27
—
dB
F = F0 – 5 MHz
—
32
—
dB
F = F0 + 10 MHz
—
47
—
dB
F = F0 – 10 MHz
—
50
—
dB
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Min
Typ
ESP32-C6 Series Datasheet v1.0
6 Packaging
6 Packaging
• For information about tape, reel, and chip marking, please refer to Espressif Chip Packaging Information.
• The pins of the chip are numbered in anti-clockwise order starting from Pin 1 in the top view. For pin
numbers and pin names, see also Figure 2-1 ESP32-C6 Pin Layout (QFN40, Top View) and Figure 2-2
ESP32-C6 Pin Layout (QFN32, Top View).
Figure 6-1. QFN40 (5×5 mm) Package
Figure 6-2. QFN32 (5×5 mm) Package
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7 Related Documentation and Resources
7 Related Documentation and Resources
Related Documentation
• ESP32-C6 Technical Reference Manual – Detailed information on how to use the ESP32-C6 memory and peripherals.
• ESP32-C6 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C6 into your hardware product.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32-C6 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32-C6 Series SoCs – Browse through all ESP32-C6 SoCs.
https://espressif.com/en/products/socs?id=ESP32-C6
• ESP32-C6 Series Modules – Browse through all ESP32-C6-based modules.
https://espressif.com/en/products/modules?id=ESP32-C6
• ESP32-C6 Series DevKits – Browse through all ESP32-C6-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-C6
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
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ESP32-C6 Series Datasheet v1.0
Table 7-1. QFN40 Pin Overview
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ESP32-C6 Series Datasheet v1.0
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
*
Pin
Name
ANT
VDDA3P3
VDDA3P3
CHIP_PU
VDDPST1
XTAL_32K_P
XTAL_32K_N
GPIO2
GPIO3
MTMS
MTDI
MTCK
MTDO
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
SPIQ
SPIWP
VDD_SPI
SPIHD
SPICLK
SPID
GPIO15
VDDPST2
U0TXD
U0RXD
SDIO_CMD
SDIO_CLK
SDIO_DATA0
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
VDDA1
XTAL_N
XTAL_P
VDDA2
GND
Pin
Type
Analog
Power
Power
Analog
Power
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
Power/IO
IO
IO
IO
IO
Power
IO
IO
IO
IO
IO
IO
IO
IO
Power
Analog
Analog
Power
Power
Pin Providing
Power
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDD_SPI
VDD_SPI
VDD_SPI
—
VDD_SPI
VDD_SPI
VDD_SPI
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
Pin Settings
At Reset
After Reset
0
Analog Function
1
0
LP IO MUX Function
1
Type
I/O/T
I/O/T
I/O/T
I/O/T
I1
I1
I1
O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
O/T
I1/O/T
I1/O/T
I/O/T
I1/O/T
O/T
I1/O/T
I/O/T
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
GPIO24
GPIO25
GPIO26
GPIO27
GPIO28
GPIO29
GPIO30
GPIO15
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
O
I1
I1/O/T
I1
I1/O/T
I1/O/T
I1/O/T
I1/O/T
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO22
GPIO23
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
WPU
WPU
WPU
IE
IE
IE
IE
IE, WPU
IE
IE
IE, WPU
IE
IE
IE
IE, WPU
IE, WPU
IE, WPU
IE, WPU
WPU
WPU
WPU
IE
IE, WPU
IE, WPU
IE, WPU
IE
GPIO0
GPIO1
GPIO2
GPIO3
MTMS
MTDI
MTCK
MTDO
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
SPIQ
SPIWP
GPIO27
SPIHD
SPICLK
SPID
GPIO15
WPU
WPU
WPU
WPU
WPU
WPU
WPU
IE, WPU
IE
IE
IE
IE
IE
IE
U0TXD
U0RXD
SDIO_CMD
SDIO_CLK
SDIO_DATA0
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
XTAL_32K_P
XTAL_32K_N
IE
IE
IE
IE
IE
IE, WPU
ADC1_CH0
ADC1_CH1
ADC1_CH2
ADC1_CH3
ADC1_CH4
ADC1_CH5
ADC1_CH6
USB_DUSB_D+
VDD_SPI
For details, see Section 2 Pins. Regarding highlighted cells, see Section 2.3.4 Restrictions for GPIOs and LP GPIOs.
LP_GPIO0
LP_GPIO1
LP_GPIO2
LP_GPIO3
LP_GPIO4
LP_GPIO5
LP_GPIO6
LP_GPIO7
LP_UART_DTRN
LP_UART_DSRN
LP_UART_RTSN
LP_UART_CTSN
LP_UART_RXD
LP_UART_TXD
LP_I2C_SDA
LP_I2C_SCL
IO MUX Function
1
Type
0
2
Type
FSPIQ
I1/O/T
FSPIHD
FSPIWP
FSPICLK
FSPID
I1/O/T
I1/O/T
I1/O/T
I1/O/T
FSPICS0
FSPICS1
FSPICS2
FSPICS3
FSPICS4
FSPICS5
I1/O/T
O/T
O/T
O/T
O/T
O/T
Appendix A – ESP32-C6 Consolidated Pin Overview
Espressif Systems
Appendix A – ESP32-C6 Consolidated Pin Overview
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ESP32-C6 Series Datasheet v1.0
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
*
Pin
Name
ANT
VDDA3P3
VDDA3P3
CHIP_PU
VDDPST1
XTAL_32K_P
XTAL_32K_N
GPIO2
GPIO3
MTMS
MTDI
MTCK
MTDO
GPIO8
GPIO9
GPIO12
GPIO13
GPIO14
GPIO15
VDDPST2
U0TXD
U0RXD
SDIO_CMD
SDIO_CLK
SDIO_DATA0
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
VDDA1
XTAL_N
XTAL_P
VDDA2
GND
Pin
Type
Analog
Power
Power
Analog
Power
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
Power
IO
IO
IO
IO
IO
IO
IO
IO
Power
Analog
Analog
Power
Power
Pin Providing
Power
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST1
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
VDDPST2
Pin Settings
At Reset
After Reset
0
Analog Function
1
XTAL_32K_P
XTAL_32K_N
IE
IE
IE
IE
IE
IE
IE
IE
IE
IE, WPU
IE
IE
IE, WPU
IE
IE, WPU
IE
IE
WPU
WPU
WPU
WPU
WPU
WPU
WPU
IE, WPU
IE
IE
IE
IE
IE
IE
IE
IE, WPU
ADC1_CH0
ADC1_CH1
ADC1_CH2
ADC1_CH3
ADC1_CH4
ADC1_CH5
ADC1_CH6
USB_DUSB_D+
For details, see Section 2 Pins. Regarding highlighted cells, see Section 2.3.4 Restrictions for GPIOs and LP GPIOs.
0
LP IO MUX Function
1
LP_GPIO0
LP_GPIO1
LP_GPIO2
LP_GPIO3
LP_GPIO4
LP_GPIO5
LP_GPIO6
LP_GPIO7
LP_UART_DTRN
LP_UART_DSRN
LP_UART_RTSN
LP_UART_CTSN
LP_UART_RXD
LP_UART_TXD
LP_I2C_SDA
LP_I2C_SCL
IO MUX Function
1
Type
0
Type
GPIO0
GPIO1
GPIO2
GPIO3
MTMS
MTDI
MTCK
MTDO
GPIO8
GPIO9
GPIO12
GPIO13
GPIO14
GPIO15
I/O/T
I/O/T
I/O/T
I/O/T
I1
I1
I1
O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO12
GPIO13
GPIO14
GPIO15
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
U0TXD
U0RXD
SDIO_CMD
SDIO_CLK
SDIO_DATA0
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
O
I1
I1/O/T
I1
I1/O/T
I1/O/T
I1/O/T
I1/O/T
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO22
GPIO23
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
I/O/T
2
Type
FSPIQ
I1/O/T
FSPIHD
FSPIWP
FSPICLK
FSPID
I1/O/T
I1/O/T
I1/O/T
I1/O/T
FSPICS0
FSPICS1
FSPICS2
FSPICS3
FSPICS4
FSPICS5
I1/O/T
O/T
O/T
O/T
O/T
O/T
Appendix A – ESP32-C6 Consolidated Pin Overview
Espressif Systems
Table 7-2. QFN32 Pin Overview
Revision History
Revision History
Date
Version
Release notes
• Added descriptions of USB_PU in Table 2-3 QFN40 IO MUX Pin Functions
and Table 2-4 QFN32 IO MUX Pin Functions, note 5
• Updated Section 2.6.3 ROM Messages Printing Control
• Added Section 4.5 ADC Characteristics
• Updated the measurement conditions in Table 4-8 Current Consumption for
Bluetooth LE in Active Mode and Table 4-9 Current Consumption for 802.15.4
2023-07-25
v1.0
in Active Mode from –24.0 dBm to –15.0 dBm, and the corresponding peak
values
• Added Section 4.7 Reliability
• Updated the minimum value of RF transmit power range to –15.0 dBm in
Table 5-7 Bluetooth LE RF Characteristics and Table 5-17 802.15.4 Transmitter Characteristics - 250 Kbps
• Updated Section 7 Related Documentation and Resources
• Other minor changes
2023-01-16
v0.5
Espressif Systems
Preliminary release
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ESP32-C6 Series Datasheet v1.0
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