M2 GPP

M1 THRU M7 Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere SURFACE MOUNT GENERAL RECTIFIER Features DO-214AC/SMA  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  Idea for printed circuit board 0.110(2.80) 0.090(2.30) 0.067 (1.70) 0.051 (1.30)  Glass passivated Junction chip  Low reverse leakage  High forward surge current capability 0.177(4.50) 0.150(3.80)  High temperature soldering guaranteed 0.012(0.305) 0.006(0.152) 250 C/10 seconds at terminals 0.097(2.45) 0.073(1.85) Mechanical Data 0.061(1.55) 0.008(0.20) 0.002(0.05) 0.029(0.75) 0.209(5.30) Case : JEDEC DO-214AC/SMA Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.0019ounce, 0.055 grams 0.184(4.70) Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage VRRM VRMS VDC MDD M1 MDD M2 MDD M3 MDD M4 MDD M5 MDD M6 MDD M7 UNITS 50 35 50 100 70 200 140 200 400 280 400 600 420 600 800 560 800 1000 700 1000 V V V 100 Maximum average forward rectified current I(AV) 1 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load IFSM 30 A Maximum instantaneous forward voltage at 1.0A VF 1.1 V Maximum DC reverse current at rated DC blocking voltage TA=25℃ TA=125℃ Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction and storage temperature range IR 5 50 15 CJ RθJA 75 TJ,TSTG -55 to +150 uA pF ℃/W ℃ Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0x2.0”(2.54x2.54cm) copper pad areas http://www.microdiode.com Rev:2025A5 Page :1 M1 THRU M7 Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere Ratings And Characteristic Curves Fig.2 Typical Instaneous Reverse Characteristics Fig.1 Forward Current Derating Curve 1.2 Average Forward Current (A) 1.0 0.8 0.6 0.4 0.2 Single phase half-wave 60 Hz resistive or inductive load 0.0 25 75 50 100 125 150 175 Instaneous Reverse Current (μA) 100 TJ=150°C 10 TJ=125°C TJ=100°C 1.0 TJ=75°C 0.1 TJ=25°C 0.01 0 Junction Capacitance (pF) 25° TJ= 0.8 0.9 J T= 10 C 0°C C 5° 12 TJ= Instaneous Forward Current (A) 0.5 0.2 0.6 0.7 1.0 TJ=25°C 10 1 1.1 0.1 1.0 10 100 Reverse Voltage (V) Instaneous Forward Voltage (V) Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Fig.6- Typical Transient Thermal Impedance 35 100 30 25 20 15 10 05 8.3 ms Single Half Sine Wave (JEDEC Method) 10 1 Number of Cycles 100 Transient Thermal Impedance（°C/W） Peak Forward Surage Current (A) 800 100 1.0 00 600 Fig.4 Typical Junction Capacitance Fig.3 Typical Forward Characteristic 0.1 400 200 Instaneous Reverse Voltage (V) Case Temperature (°C) 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） The curve above is for reference only. http://www.microdiode.com Rev:2025A5 Page :2 M1 THRU M7 Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere Packing information unit:mm P0 P1 d Item Symbol Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.33 2.36 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.28 12.00 18.00 E F W B A P D2 T D1 C W1 D Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE REEL SIZE SMA 13" REEL (pcs) 5,000 COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) 4.0 10,000 340*350*40 330 370*370*370 CARTON (pcs) 80,000 Suggested Pad Layout Symbol Unit (mm) Unit (inch) A 0.066 B 1.68 1.52 C 3.93 0.154 D 2.41 0.095 E 5.45 0.215 0.060 Important Notice and Disclaimer Microdiode Semiconductor(Shenzhen) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design, purchase or use. Microdiode Semiconductor(Shenzhen) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Semiconductor(Shenzhen) assume any liability for application assistance or customer product design. Microdiode Semiconductor(Shenzhen) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Semiconductor(Shenzhen). Microdiode Semiconductor(Shenzhen) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Semiconductor(Shenzhen). http://www.microdiode.com Rev:2025A5 Page :3