⚫
ME2N7002DKW-G
Dual N - Channel 60V (D-S) MOSFET, ESD Protection
Protected
GENERAL DESCRIPTION
FEATURES
The ME2N7002DKW-G is the Dual N-Channel logic enhancement
● RDS(ON)≦3Ω@VGS=10V
mode power field effect transistors are produced using high cell
density, DMOS trench technology. This high density process is
especially tailored to minimize on-state resistance. These devices
are particularly suited for low voltage application such as cellular
phone and notebook computer power management and other battery
powered circuits , and low in-line power loss are needed in a very
small outline surface mount package.
● RDS(ON)≦4Ω@VGS=4.5V
● RDS(ON)≦4.5Ω@VGS=3V
● ESD Protection HBM >2KV
● Super high density cell design for extremely low RDS(ON)
● Exceptional on-resistance and maximum DC current
capability
APPLICATIONS
● Power Management in Note book
● DC/DC Converter
PIN CONFIGURATION
● Load Switch
● LCD Display inverter
(SOT-363)
Top View
Th Ordering Information: ME2N7002DKW-G (Green product-Halogen free)
Absolute Maximum Ratings (TA=25℃ Unless Otherwise Noted)
Symbol
Maximum Ratings
Unit
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
±20
V
TA=25℃
ID
0.3
TA=70℃
ID
0.2
IDM
1.1
TA=25℃
PD
0.3
TA=70℃
PD
0.2
TJ
-55 to 150
℃
Thermal Resistance-Junction to Ambient (Note 1)
RθJA
375
℃/W
Thermal Resistance, Junction to Ambient (Note 2)
RθJA
318
℃/W
Thermal Resistance, Junction to Case (Note 2)
RθJC
135
℃/W
Parameter
Continuous Drain
A
Pulsed Drain Current
Maximum Power Dissipation
A
W
Operating Junction Temperature
2
Note1.The device mounted on 1in FR4 board with 2 oz copper
2
2
Note2. The device mounted on 1in FR4 board with 2 oz copper, with thermal vias to bottom layer 1in copper plate
Apr, 2024-Ver2.0
www.force-mos.com
01
ME2N7002DKW-G
Dual N - Channel 60V (D-S) MOSFET, ESD Protection
Protected
Electrical Characteristics (TA =25℃ Unless Otherwise Specified)
Symbol
Parameter
Limit
Min
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
60
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250μA
1
IGSS
Gate-Body Leakage
IDSS
Zero Gate Voltage Drain Current
Typ
Max
Unit
STATIC
V
2.5
V
VDS=0V, VGS=±20V
±10
μA
VDS=60V, VGS=0V
1
μA
VGS=10V, ID=500mA
2
3
VGS=4.5V, ID=200mA
2.4
4
VGS=3V, ID=10mA
3.9
4.5
Diode Forward Voltage *
IS=200mA, VGS=0V
0.82
1.2
Qg
Total Gate Charge
VDS=30V,VGS=10V,ID=200mA
4.5
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
0.4
Ciss
Input Capacitance
21
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
RDS(ON)
VSD
Drain-Source On-Resistance*
Ω
V
DYNAMIC
1.4
nC
VDS=30V,VGS=4.5V,ID=200mA
VDS=30V, VGS=0V, f=1MHz
2.6
3
pF
1
VDS=30V, RL =150Ω
VGS=10V,RGS=10Ω
ID=200mA
6.8
2.4
ns
15
27.3
Notes: a, pulse test: pulse width≦ 300us, duty cycle≦ 2%, Guaranteed by design, not subject to production testing.
b. Force mos reserves the right to improve product design, functions and reliability without notice.
Apr, 2024-Ver2.0
www.force-mos.com
02
ME2N7002DKW-G
Dual N - Channel 60V (D-S) MOSFET, ESD Protection
Protected
Typical Characteristics (TJ =25℃ Noted)
Apr, 2024-Ver2.0
www.force-mos.com
03
ME2N7002DKW-G
Dual N - Channel 60V (D-S) MOSFET, ESD Protection
Protected
Typical Characteristics (TJ =25℃ Noted)
Apr, 2024-Ver2.0
www.force-mos.com
04
ME2N7002DKW-G
Dual N - Channel 60V (D-S) MOSFET, ESD Protection
Protected
SOT-363 Package Outline
TO-252-3L Package Outline
Apr, 2024-Ver2.0
www.force-mos.com
05
ME2N7002DKW-G
Dual N - Channel 60V (D-S) MOSFET, ESD Protection
Protected
Device name:
ME2N7002DKW-G
Package: SOT-363
Marking Code:
D76:DeviceMarkingCode
M:Date code
Apr, 2024-Ver2.0
www.force-mos.com
06
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