SS2574040M

深圳市盛世台圳科技有限公司 Shenzhen shengshi taizhen Technology CO,LTD. 文件名称： BTB Pitch 0.4mm Series Conn. SPEC 制订单位： 研发单位 文件编号： QRD-B001 制订日期： 2019.03.29 版 本： A 申请单位： 页 数： 16 修 修订日期 申请单号 2019.03.29 ／ 核 准 WX.L 订 记 录 修 订 内 容 摘 要 页次 版本 1~16 新制订 审 查 Wilson 制 订 Hong.C A STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 1.0 Scope: This specification covers the requirements for product performance and test methods of WBXXX’s Board To Board Pitch 0.4mm series Connectors of the part numbers specified as bellow. Product shall be of the design, construction and physical dimensions specified in the applicable product drawing. 本规格书包含了WBXXX板对板 Pitch 0.4mm 系列连接器的性能需求测试方法. 产品的设 计, 结构, 形状和尺寸应该在适当的产品图面中进行描述. 2.0 Ordering information (产品编码)： PART NO.: SS 1 1 2 3 4 5 XXX 2 Series name (系列名称) Product serial number (产品系列) Terminal spacing (端子间距) Pin number (接点数量) Interleaving mode 组合样式 XX XX 3 4 X 5 SS 257 40=0.4 间距 10,12,16,24, 30, 34, 40, 50, 60…. M-公座， F-母座。 3.0Connector Dimensions(外观尺寸): See attached drawings. 参照附件图面. 4.0Material(材质)： 4.1 Housing(塑胶主体)： LCP，UL94 V-0,BLACK; (LCP，防火等级 V-0，黑色) 4.2 Contacts(端子)：Phosphor Bronze (磷青铜) 4.3 Stopper(固定片)：Phosphor Bronze (磷青铜) 4.4 Plating(电镀方式)：Gold plating , Nickel barrier (镀镍底，选镀金) DongGuan shengshi electronic technology Co., Ltd 1 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 5.0 Rating(等级): 5.1 Voltage Rating: 60V AC/DC 额定电压: 60 V AC / DC 5.2 Rated current : 0.3 A/pin（Max.） 额定电流: 0.3 A/pin（Max.） 5.3 Temperature Range: -40℃ to +50℃ storage; -55℃ to +85℃ operating 温度范围：-40℃ to +50℃ storage; -55℃ to +85℃ operating 测试湿度范围：25% to 80% 6.0 Test Condition:(测试条件) All tests shall be performed as bellow conditions unless otherwise specified. 所有测试依据以下规格条件执行，特别说明规格除外。 6.1 Temperature range : +15℃ to +35℃ 测试温度范围：+15℃ to +35℃ 6.2 Humidity range: 25% to 80% 6.3 Atmospheric Pressure: 86kPa to 106 kPa (860 to 1060 m bar) 测试大气压力：86kPa to 106 kPa (860 to 1060 m bar) 7.0 Test Methods and Requirements(测试方法和性能要求): 7.1 Examination of product(产品外观检验): Item 项目 7.1.1 Test Description 测试描述 Examination of Test Methods 测试条件 Requirement 要求 EIA 364-18 1). Shall meet visual requirement, show product (Outward Shall be confirmed with eyes in accordance Appearance with each drawing. no physical damage. 外观没有任何的物理损坏 Structure) Shall be confirmed by using proper 2). Structure shall be meet the design 产品外观结构检验 measuring instruments. and dimensional requirements of 依照图面要求对产品目视检查，再用测量工具 drawing. 按图面要求测量尺寸 外观结构应满足图纸的设计和尺寸要求 DongGuan shengshi electronic technology Co., Ltd 2 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 7.2 Electrical Performance(电器性能): Item 项目 7.2.1 Test Description 测试描述 Test Methods 测试条件 Contact JIS C 5402 Resistance 接触阻抗 Make the BTB plugs and receptacles on Requirement 要求 90 mΩ Maximum. board be fully mated ,then apply 20mV, 100mA current to the mated specimens , 将焊板的 BTB 公母端实配后通电测试，电流 及电压规格：20mV, 100mA。测试公母端实 配后接触阻抗 7.2.2 Insulation EIA 364-21 (or MIL-STD-202F, Method 302, 1).Initial: 1000 MΩ Minimum. Resistance 绝缘阻抗 Test Condition B) 2).After test: 100 MΩ Minimum. Apply a voltage of 250 VDC between 初始值: 1000 MΩ Minimum. adjacent terminals. of the plugs and 测试后: 100 MΩ Minimum. . receptacles. Electrification Time: 1 min 施加 250VDC 到公端&母端相邻两根端子之 间，通电时间：1 分钟 7.2.3 Dielectric EIA 364-20 (or MIL-STD-202F, Method 301, 1). samples no breakdown. Withstanding Test Condition B) 样品无击穿，烧焦等不良. Voltage 耐电压 Apply a voltage of 150V AC between 2). Leakage current: 1mA Maximum adjacent terminals. of the plugs and 表面漏电：1mA Maximum receptacles. Electrification Time: 1 min. 施加 150V AC 到公端&母端相邻两根端子之 间，通电时间：1 分钟 7.2.4 Temperature rise EIA 364-20, Test Method B 温升测试 △T30℃ Maximum.（PER PIN） Connect series, Mate connector and measure the temperature rise at the rated current after 3 hours. 串联, 匹配连接器, 并量测在额定电流下通电 3 小时前后的温度升高的差异. DongGuan shengshi electronic technology Co., Ltd 3 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 7.3 Mechanical Performance（机械性能）: Item 项目 7.3.1 Test Description 测试描述 Test Methods 测试条件 Vibration MIL-STD-202, Method-201 震动测试 half-sine wave, apply 0.1 A DC current。 Requirement 要求 1).Shall meet visual requirement, show no physical damage. frequency:10-55-10 Hz; amplitude: 1.52mm; 外观没有任何的物理损坏 2). Contact Resistance value sweep time:1 minute the connectors condition is PCB mounting After test: 90mΩ Maximum. and the plugs mated with receptacles , they 测试后电阻值：90mΩ Maximum. 3).No discontinuities of 1μsec or longer must be tested 2 hours in each of the 3 duration. axis(X,Y,Z),total 6 hours. 半正弦波，通以 0.1ADC 电流。 导通瞬断不可超过 1.0μ秒 测试频率:10-55-10 Hz; 振幅: 1.52mm 波形完成扫描时间:1 分钟；将公母头配合好之 后在 X,Y,Z 3 个轴向各测试 2 小时，共 6 小时。 7.3.2 Physical Shock EIA 364-27 Test Condition A 1).Shall meet visual requirement, show 机械冲击 Physical Shock EIA 364-27 Test Condition A no physical damage. (orMIL-STD-202F, Method 213) 外观没有任何的物理损坏 half-sine wave, apply 0.1ADC current 2). Contact Resistance value Acceleration:50G(490m/s2);duration：11ms. After test: 90mΩ Maximum. the connectors condition is PCB mounting 测试后电阻值：90mΩ Maximum. and the plugs mated with receptacles , 3).No discontinuities of 1μsec or longer shocking apply to 3 times in each of the 6 duration. direction of 3 axis.18 total shock. 导通瞬断不可超过 1.0μ秒 半正弦波，通以 0.1ADC 电流。 测试的重力加速度:50G(490m/s2) 测试时间：11ms. 将焊接 PCB 公母头配合,在 X,Y,Z 三轴 6 个方向各冲击 3 次，共 18 次 7.3.3 Durability EIA 364-09 1).Shall meet visual requirement, show 寿命测试 Make the specimens that are on board no physical damage. mated, then fix the receptacles to the 外观没有任何的物理损坏 machine on horizontal or perpendicular 2). Contact Resistance value direction. Use the machine catch the plugs After test: 90mΩ Maximum. and separate the specimens, then make the 测试后电阻值：90mΩ Maximum plugs be fully mated with receptacles at a rate of 25.4 mm/min on horizontal or perpendicular direction.duration:30 cycles 将焊板的 BTB 公端与母端组合后，将母端水 平或垂直固定在测试仪器，用仪器夹住公端分 离后再将公端以水平或垂直插入焊板母端到 位，测试速度 25.4 mm/min，循环 30 次 DongGuan shengshi electronic technology Co., Ltd 4 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 7.3.4 Connector EIA 364-13 Mating force(插入力)： Mating & Make the specimens that are on board 100g Max【0.981N】/Pin X N. Unmating Force mated, then fix the receptacles to the ( N means pin numbers) 插入/拔出力 machine on horizontal or perpendicular 100g Max【0.981N】/Pin X N direction. Use the machine catch the plugs (N =产品 pin 数) and separate the specimens, then make the Unmating force： 30g Min【0.29N】/Pin X N. plugs be fully mated with receptacles at a rate of 25.4 millimeters/minute on horizontal ( N means pin numbers) 30g Min【0.29N】/Pin X N. or perpendicular direction. 将焊板的 BTB 公端与母端组合后，将母端水 (N =产品 pin 数) 平或垂直固定在测试仪器，用仪器夹住公端分 离后再将公端以水平或垂直插入焊板母端到 位，测试速度 25.4 mm/min 7.3.5 Contact EIA 364-35 0.20 N/Pin Minimum. Retention Force The pull speed shall 25.4 mm per minute on 端子保持力 the terminal assembled in the housing 以 25.4 mm/min 的速度，将组装在胶芯内的 以垂直方向端子拔出 7.4 Environmental performance（环境性能） Item 项目 7.4.1 Test Description 测试描述 Test Methods 测试条件 Requirement 要求 1). Appearance shall not be distinct Thermal Shock EIA 364-32, Test Condition I 热冲击 (or MIL-202F, Method 107G Condition A.) damage. specimens shall be separated and exposed 不能出现明显的外观损坏 2). Contact Resistance value 5 cycles as the following table conditions. 将测试样本公母端分离暴露条件下，在如下表 After test: 90mΩ Maximum. 中的条件，如此测试循环 5 次 测试后电阻值：90mΩ Maximum Step. 1 2 3 4 Temp. (℃) -55 25 85 25 Exposed time (min) +0 / -3 30 +10 / -5 +3 / -0 5 30 +10 / -5 5 DongGuan shengshi electronic technology Co., Ltd 5 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 7.4.2 Humidity EIA 364-31, Test Condition A Method III, (or 1). Appearance shall not be distinct 耐湿性 MIL-202F, Method 103B Test Condition B.) damage. The specimens shall be separated and left 不能出现明显的外观损坏 in the chamber of 40±2℃ temperature and 2). The Insulation Resistance value 90~95% humidity for 96hrs. After test drying in ambient condition for 1 hours After test：100 MΩ Min 测试后绝缘阻抗值：100 MΩ Min 将测试样本公母端分离放在一个恒温恒湿的 空间内暴露 96 小时，此空间温度：40±2℃， 相对湿度：90~95%。测试完成后将样本擦干 放置在周围环境中 1 小时 7.4.3 Solder ability EIA 364-52 The surface of the portion to be 焊接性 Make the specimens’ tail tested by the last soldered shall at least 95% covered testing step immersion into molten solder at area must show no voids, pin holes 要求焊脚润锡面积达到浸润面积的 95% 260+/-5℃ for 5-10 seconds. 测试样本焊脚浸润在温度为 260+/-5℃的熔融 以上 态锡里面 5-10s。然后将样本拿出。 7.4.4 7.4.5 Resistance to Make the samples be separated and Leave 1). Appearance shall not be distinct high storage them in the chamber of temperature +85℃ temperature 高温存储测试 for 96hr，then it shall be subjected to damage. 不能出现明显的外观损坏 2). Contact Resistance value standard atmospheric condition for 1~2h After test: 90mΩ Maximum. 将测试样本分离放置在一个+85℃的空间里暴 露 96 小时，然后在标准环境下放置 1-2h. 测试后电阻值：90mΩ Maximum resistance to low Make the samples be separated and Leave storage them in the chamber of temperature -40℃ temperature 低温存储测试 for 96hr，then it shall be subjected to 1). Appearance shall not be distinct damage. 不能出现明显的外观损坏 standard atmospheric condition for 1~2h 2). Contact Resistance value 将测试样本分离放置在一个-40℃的空间里暴 After test: 90mΩ Maximum. 露 96 小时，然后在标准环境下放置 1-2h 测试后电阻值：90mΩ Maximum DongGuan shengshi electronic technology Co., Ltd 6 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 7.4.6 Salt water spray EIA 364-16A (MIL-STD-202 METHOD 101) 盐雾测试 Temperature: 35℃±2℃ 1). Appearance shall not be distinct damage. 温度：35℃±2℃ 不能出现明显的外观损坏 Density of salt water : 5±1％ 2). Contact Resistance value After test: 90mΩ Maximum. 盐水浓度：5±1％ Duration: 24±4 hours. 测试后电阻值：90mΩ Maximum 持续时间: 24±4 hours. 7.5 Others(其他测试) 7.5.1 IR .Reflow Soak Zone :150℃~200℃ Time:100~120s 翘曲测试 Reflow Zone > 217℃ Time:100~150s 1). Shall meet visual requirement, show no physical damage. Peak Temperature: 260±5℃ 30s Min 外观没有任何的物理损坏 The test to 2 cycles for each sample 2). samples Without PCB after IR.Relow The IR reflow temp ref. to 5.0。 Coplanarity 0.10 mm Max 均温区：150℃~200℃ 时间：100~120s 样品不含 PCB,IR Relow 后共面度 回流区：大于 217℃ 时间：100~150s 0.10 mm Max 峰值温度：260±5℃ 30s Min 此测试样品需循环 2 次 冷却后测量产品的翘曲度 详细曲线(参考附图 5.0) 7.5.2 Double sided Product soldering in PCB and Thru, IR PCB IR. Reflow Flow after cooling 30 minutes and opposite testing 正反向 PCB make product down side thru。 IR reflow 测试 The IR reflow temp ref. to 5.0。 1). Shall meet visual requirement, show no physical damage. 外观没有任何的物理损坏 Reflow soldering: 2).The product not allow dropping from Soak Zone :150℃~200℃ Time:100~120s PCB board by the second time of IR Reflow Zone > 217℃ Time:100~150s reflow test . Peak Temperature: 260±5℃ 30s Min 两次过炉后，产品不能从 PCB 板掉落 产品焊接 PCB 板，经过 IR Reflow 后， 冷却 30 分钟，再将 PCB 反向，再过一遍 IR Reflow。 均温区：150℃~200℃ 时间：100~120s 回流区：大于 217℃ 时间：100~150s 峰值温度：260±5℃ 30s Min 详细曲线(参考附图 1.0) DongGuan shengshi electronic technology Co., Ltd 7 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN INFRARED REFLOW CONDITION (回流焊曲线条件) Start (Pre-Heat 150°C MAX.) Time(seconds) 温度条件 TEMPERATURE CONDITION GRAPH (基板表面温度) (TEMPERATURE ON BOARD PATTERN SIDE) Fig1.Reflow Temperature profile DongGuan shengshi electronic technology Co., Ltd 8 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 8.0 Group Tests (群组测试): Test Group Test Item 7.1.1 7.2.1 7.2.2 7.2.3 Test Description Examination of product Low Level Contact Resistance Sample Groups A B C D E F G H I J K 1,7 1,10 1,6 1,3 1,4 1,4 1,4 1,3 1,3 1,3 1,3 2,6 2,9 2,5 3 3 3 Insulation Resistance 3,7 Dielectric 4,8 Withstanding Voltage 7.2.4 Temperature rise 7.3.1 Vibration 3 7.3.2 Physical shock 4 7.3.3 Durability 7.3.4 7.3.5 Mating & Unmating force 2 4 3,5 Contact Retention 2 Force 7.4.1 Thermal Shock 5 7.4.2 Humidity 6 7.4.3 Solderability 7.4.4 Heat resistance 7.4.5 Cold resistance 7.4.6 Salt water spray 2 2 2 2 IR.Reflow Housing 7.5.1 7.5.2 2 warp testing Two PCB side IR. 2 Reflow testing Number of Test Samples (Minimum) 5 5 5 5 5 5 5 5 5 5 5 DongGuan shengshi electronic technology Co., Ltd 9 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 9.0 INSTRUCTION OF APPLICATION TO USAGE 产品组装的使用说明 This specification is written based on the supposition that the receptacle is mounted on PCB (Hard PCB) and the plug is mounted on FPC. In the case of the receptacle is mounted on FPC and the plug is mounted on PCB (Hard PCB) is also covered. Receptacle contains formable terminal. Please pay attention to un-mating process of connectors if you mount Receptacle on FPC 本说明书根据母座端往PCB基板（硬板）侧实际安装、公座端往FPC（软板）侧，实际安装的设想 而作成，同时也适用于公座端往FPC（软板） 、公座往PCB基板（硬板）上的实装。母座上的端子容 易变形，实装到FPC（软板）上时，特别要注意拔出时的操作。 9.1 MATING (插入操作相关) 9.1.1 HOW TO MATE(INSERTION) 组合方法（插入方法） After positioning correctly for mating ,then the distance between PCB and FPC is about 1.30mm, insert the Plug to the receptacle in parallel with each other. 组合时（插入时）请对好位置再进行。位置对好时，PCB基板和FPC软板间的尺寸大概位置在1.30mm之后， 请将公座侧与母座侧保持平衡后再插入 Please find correct position at inside wall of receptacle and inside wall of plug 正确的位置调合如右图，请沿母座内壁和公座内壁来进行操作 STEP 1 Positioning the plug correctly in parallel with the receptacle 请在公座侧与母座侧保持平衡的状态下再校对位置 Correct position 调整确切位置 STEP2 Correct position for mating 正确的嵌合调整位置 1.30mm Position the plug correct by adjusting back or forth 轻轻移动公座侧来确认位置调合是否正确 DongGuan shengshi electronic technology Co., Ltd 10 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN STEP3 Insert the plug in parallel wich the receptacle until fully seated 请将公座侧平行压入到母座 STEP4 9.2 MATING POSITIONING WITH SLIGHTLY INCLINED 组合时调合位置的方法（位置平行调整困难时） 9.2.1 When operated in “a” Direction(lengthways) 长方向有自由度时 Please keep it within 0.16mm 请保持在 0.16mm 以内 “ b” Direction 短方向 Please find right Position regarding to procedure below (请按以下流程来调整位置) “ a” Direction（lengthways） 长方向 DongGuan shengshi electronic technology Co., Ltd 11 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN STEP1 100 MAX “b” Direction Position for mating by inclining the plug to the receptacle approximately less than 100 请在公座侧稍微倾斜（10 度以下）的状态下进行组合 位置调整操作 “a” Direction STEP2 Once the plug is positioned over the receptacle Move it to the parallel position 位置调合后，请将公座侧和母座侧保持平行 STEP3 Position the plug correct by adjusting back or forth 轻轻移动公座侧来确认位置调合是否对位 Please go to the STEP3 in 6.1.1 请参照 6.1.1 步骤 3 进行下一步操作 DongGuan shengshi electronic technology Co., Ltd 12 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 9.2.2 When operated in “b” Direction 短方向有自由度时 Please find right Position regarding to procedure below(请按以下流程来调整) 位置) “ b” Direction 短方向 Please keep it within 0.25mm 请保持在 0.25mm 以内 “ a” Direction（lengthways） 长方向 STEP1 100 MAX “a” Direction “b” Direction Position for mating by inclining the plug to the receptacle approximately less than 100 请在公座侧稍微倾斜（10 度以下）的状态下进行组合 位置调整操作 STEP2 Notes)Pay attention NOT to have the wrong position in “b” Direction 注：请注意位置调合偏差不能太大 STEP3 Please go to the STEP3 in 6.1.1 请参照 6.1.1 步骤 3 进行下一步操作 Once the plug is positioned over the receptacle Move it to the parallel position 位置调合后，请将公座侧和母座侧保持平行 Position the plug correct by adjusting back or forth 轻轻移动公座侧来确认位置调合是否对位 DongGuan shengshi electronic technology Co., Ltd 13 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 9.3 CONNECTOR HANDLING WHEN MATING(组合时操作注意事项) Please DO NOT apply force while mating the receptacle or plug at an angle in the “a” direction(lengthways) It may cause damage to the connector 请在连接器之间平行的状态下进行组合操作。如果在连接器之间不平行、处在倾斜的状态下组合时，连接器本 体之间可能会有干涉，就会有损坏连接器的可能。 Broken! 损坏！ Broken! 损坏！ Mating with angle(Wrong Handling) 连接器倾斜组合 Mating with Parallel(Correct Handling) 连接器平行组合 This product is downsized comparing with the current products and needs to be handled more carefully. When mating(inserting), do NOT push the only center of connector but the whole connector in parallel with The receptacle . When pushed only the center of connector , it may cause damage to the connector 本产品比现有产品还要小，连接器的强度较低。组合（插入）时，不能单单只按押连接器中间部，要平行按押 整体。FPC 加强板的强度不充足时，如果只按押连接器中间的话，连接器就会有折断的可能。 Pushing only Center(Wrong Handling) 只按压连接器中间部 Pushing Whole Paralleled(Correct Handling) 平行按压连接器整体 DongGuan shengshi electronic technology Co., Ltd 14 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 9.4 UN-MATING 9.4.1 HOW TO WITHDRAW 拔出方法 The plug shall be released from the receptacle paralleled to the mated axis or by moving the plug slowly 极力沿着组合轴平行拔去，或是向左右一点点边晃动边拔出。 Releasing the plug paralleled to the mated axis 沿着组合轴向平行拔去 Releasing the plug by moving slowly in “a” direction (lengthways) 向左右一点点边晃动边拔去（长方向） Releasing the plug by moving slowly in “b” direction 向左右一点点边晃动边拔去(短方向) DongGuan shengshi electronic technology Co., Ltd 15 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 STANDARD SPECIFICATION REV.A BTB Pitch 0.4mm Series CONN 9.4.2 CONNECTOR HANDLING WHEN WITHDRAWING（拔出时操作注意事项） This product is downsized comparing with the current products and needs to be handled more carefully When un-mating(withdrawing), do NOT twist the plug to release . It may cause damage to connector. 本产品比现有产品还要小，连接器的单体强度较低（单体强度）。如果在过度倾斜状态下拔去的话，连接器就会 有破损的可能 Releasing the plug paralleled to the mated axis 沿着组合轴向平行拔去 Slant releasing in “a” Direction (lengthways) 长方向的倾斜拔出 Slant releasing in “b” Direction 短方向的倾斜拔出 Merit and demerit for slant releasing are below 长方向的倾斜拔去方式与短方向的倾斜拔去方式存在以下优点及缺点 Merit 优点 Demerit 缺点 Slant releasing in “a” Direction (lengthways) Slant releasing in “b” Direction 长方向的倾斜拔出 短方向的倾斜拔出 1.Not easily cause the damage to the terminals None 不容易引起端子变形 2.Hard to be withdrawn 拔出的力度小 Multiple connector can be damaged plug 多个连接器时拔出时可能会损坏公座 无特别优点 The continuity defect can be caused by damage to the terminals 端子变形风险，同时会存在不导通的可能 DongGuan shengshi electronic technology Co., Ltd 16 OF 16 窗体编号 / 版次发行日期保存期限 FM：Q-E-04-01 A 2019/03/29 永久保存 SS SS SS SS SS SS SS SS SS 深圳市盛世台圳科技有限公司 SS257M 本部品不含有環境管理物質規定之有害物質 SS SS SS SS SS SS SS SS SS 深圳市盛世台圳科技有限公司 SS257M 本部品不含有環境管理物質規定之有害物質 紙板(上) 氣泡袋 塑膠袋 三角隔板 紙板(下) 外箱 外箱 紙板 三角隔板 塑膠袋 塑膠圓盤 SS SS SS SS SS SS SS SS SS 深圳市盛世台圳科技有限公司 SS257M 本部品不含有環境管理物質規定之有害物質 氣泡袋 SS SS SS SS SS SS SS SS SS 深圳市盛世台圳科技有限公司 本部品不含有環境管理物質規定之有害物質 SS257F SS SS SS SS SS SS SS SS SS 深圳市盛世台圳科技有限公司 本部品不含有環境管理物質規定之有害物質 SS257F 紙板(上) 氣泡袋 塑膠袋 三角隔板 紙板(下) 外箱 紙板 三角隔板 塑膠袋 塑膠圓盤 SS SS SS 外箱 SS SS SS SS SS SS 深圳市盛世台圳科技有限公司 本部品不含有環境管理物質規定之有害物質 SS257F 氣泡袋