US2GF

US2GF

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    -

  • 描述:

  • 数据手册
  • 价格&库存
US2GF 数据手册
US2AF THRU US2MF Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere SURFACE MOUNT ULTRA FAST RECTIFIER Features SMAF  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0     For surface mounted applications 0.106(2.70) 0.094(2.40) 0.063 (1.60) 0.051 (1.30) Ultra fast switching for high efficiency Low reverse leakage 0.146(3.70) 0.130(3.30) Built-in strain relief,ideal for automated placement  High forward surge current capability  High temperature soldering guaranteed 250 °C/10 seconds at terminals 0.047(1.20) 0.035(0.90) 0.008(0.20) 0.005(0.12) 0.047(1.20) 0.031(0.80) Mechanical Data 0.193(4.90) 0.173(4.40) Case : JEDEC SMAF Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.00095 ounce, 0.027 grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS MDD US2AF MDD US2BF VRRM 50 35 50 100 70 100 Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=125℃ Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) Maximum instantaneous forward voltage at 2.0A Maximum DC reverse current at rated DCblocking voltage Maximum reverse recovery time TA=25℃ TA=125℃ (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range VRMS VDC MDD MDD US2DF US2GF 200 140 200 MDD US2JF 400 280 400 600 420 600 MDD MDD US2KF US2MF 800 560 800 1000 700 1000 UNITS V V V I(AV) 2.0 A IFSM 50 A VF 1.30 1.0 5.0 100 IR trr 1.65 50 uA 75 CJ RJA 20.0 RθJC 20.0 TJ,TSTG -55 to +150 65.0 V ns pF ℃/W ℃ Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A 2.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 3.P.C.B. mounted with 2.0”x2.0”(5.0x5.0cm) copper pad areas DN:T21312A1 http://www.microdiode.com Rev:2021A1 Page :1 US2AF THRU US2MF Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere Ratings And Characteristic Curves Fig.2 Typical Reverse Characteristics Fig.1 Forward Current Derating Curve 3.0 Instaneous Reverse Current(μ A) 100 Average Forward Current (A) 2.5 2.0 1.5 1.0 0.5 Single phase half-wave 60 Hz resistive or inductive load 0.0 25 50 75 100 125 150 TJ=125°C 10 1.0 TJ=25°C 0.1 175 00 Case Temperature (°C) Peak Forward Surage Current (A) Instaneous Forward Current (A) 80 100 120 140 60 TJ=25°C US2AF~US2DF US2GF 0.1 US2JF~US2MF 0.01 0 60 Fig.4 Maximum Non-Repetitive Peak Forward Surage Current 1.0 0.001 40 percent of Rated Peak Reverse Voltage (%) Fig.3 Typical Forward Characteristics 10 20 0.5 1.0 1.5 2.0 Instaneous Forward Voltage (V) 2.5 50 40 30 20 10 00 8.3 ms Single Half Sine Wave (JEDEC Method) 1 10 100 Number of Cycles The curve above is for reference only. http://www.microdiode.com Rev:2021A1 Page :2 US2AF THRU US2MF Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere Packing information P0 unit:mm P1 d E Item F B A Symbol Tolerance A B C d D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 SMAF W Carrier width Carrier length Carrier depth Sprocket hole 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width P D2 T D1 C W1 D 2.80 4.75 1.42 1.50 178.00 54.40 13.00 1.75 5.05 4.00 4.00 2.00 0.30 8.00 12.30 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE SMAF REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 3,000 4.0 6,000 210*208*203 178 400*265*400 120,000 10.0 Suggested Pad Layout Symbol Unit (inch) 1.8 0.071 B 1.6 3.8 0.150 D 2.2 0.087 E 5.4 0.213 C http://www.microdiode.com Unit (mm) A 0.063 Rev:2021A1 Page :3
US2GF 价格&库存

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