MDD100N03D
30V N-Channel Enhancement Mode MOSFET
1. Description
This N-Channel MOSFET is produced using MDD's advanced Power Trench technology. This process has been
optimized to minimize on-state resistance and yet maintain superior switching performance with best in class soft
body diode.
2. Features
• Max RDS(on) = 3.6mΩ at VGS = 10 V, ID = 30 A
• Extremely Low Reverse Recovery Charge, Qg
• 100% UIS Tested
• RoHS Compliant
3. Application
• Power Management in Telecom.,Industrial Automation
• Motor Drives and Uninterruptible Power Supplies
• Current Switching in DC/DC&AC/DC(SR) Sub-systems
4. Absolute Maximum Ratings(TA=25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
V
ID
100
A
Single Pulsed Avalanche Energy (Note 3)
EAS
156
mJ
Thermal Resistance, steady-state
RθJA
32
°C/W
PD
W
TJ
3.9
-55~+150
°C
Tstg
-55~+150
°C
Continuous Drain Current (Note 1)
Power Dissipation
Junction Temperature
Storage Temperature
Note:
1)Calculated continuous current based on maximum allowable junction temperature.
2)Repetitive rating, pulse width limited by max. junction temperature.
3)EAS condition:TJ=25°C, VDD=50V, VGS=10V, L= 0.5mH, Rg= 25Ω, IAS=23A.
Rev: 2024A0
MDD100N03D
30V N-Channel Enhancement Mode MOSFET
5. Pinning information
Pin
Symbol
Description
1
G
Gate
2
3
D
S
Simplified outline
Equivalent Circuit
Drain
Source
Parameter
V(BR)DSS
Drain-Source Breakdown Voltage
IGSS
Gate-Source Leakage Current
IDSS
Drain-Source Leakage Current
VGS(TH)
Gate Threshold Voltage
RDS(ON)
Drain-Source On-State Resistance
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
td(on)
tr
td(off)
tf
Typ
Max
Unit
30
—
—
V
—
100
nA
Reverse
VGS=-20V
—
—
-100
nA
VDS =30V, V
—
—
1
μA
VDS=VGS, ID=250μA
1.2
1.5
2.2
V
VGS=10V, ID=30A
—
2.8
3.6
mΩ
VGS=4.5V, ID=20A
—
4.0
6.1
mΩ
Min
Typ
Max
Unit
—
2800
—
pF
GS=0V
Condition
VGS=0V
VDS =15V
f=1MHz
VGS=10V
VDS=15V
ID=30A
Condition
Turn on Delay Time
VGS =10V
VDD =15V
ID=30A
RG=3Ω
Turn on Rise Time
Turn Off Delay Time
Turn Off Fall Time
9. Source Drain Diode Characteristics
VSD
Min
—
Parameter
Symbol
Condition
VGS=20V
8. Switching Characteristics
Symbol
TO-252
Forward
Parameter
Ciss
MDD
100N03D
VGS=0V, ID=250μA
7. Dynamic Electrical Characteristics
Symbol
Package
XXY: Date code
6. TA=25°C unless otherwise specified
Symbol
Marking
Parameter
Condition
—
—
366
310
—
—
pF
pF
—
60
—
nC
—
12
—
nC
—
13
—
nC
Min
Typ
Max
Unit
—
10
—
ns
—
30
—
—
45
ns
—
18
—
—
ns
Min
Typ
Max
Unit
ns
Drain-Source Diode Forward Voltage
IS=30A, VGS=0V
—
0.8
1.2
V
trr
Body Diode Reverse Recovery Time
—
18
—
ns
Qrr
Body Diode Reverse Recovery Charge
IF=30A
di/dt=100A/μs
—
7
—
nC
Craftsman-Made Consciention Chip
Rev: 2024A0
2/5
www.microdiode.com
MDD100N03D
30V N-Channel Enhancement Mode MOSFET
10.Test Circuits And Waveforms
Figure 1. Gate charge testcircuit & waveform
Figure 2.Switching time testcircuit & waveforms
Figure 3.Unclamped inductive switching (UIS)test circuit & waveforms
Figure 4. Diode reverse recoverytest circuit& waveforms
Craftsman-Made Consciention Chip
Rev: 2024A0
3/5
www.microdiode.com
MDD100N03D
30V N-Channel Enhancement Mode MOSFET
11.Electrical Characteristics Diagrams
100
20
VGS = 10V
80
VDS = 5V
VGS = 4.0V
VGS = 4.5V
16
TJ = 125°C
12
ID(A)
ID(A)
60
VGS = 3.5V
TJ = -55°C
40
8
20
4
TJ = 25°C
VGS = 3.0V
0
0
0
1
2
3
4
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
VGS(V)
VDS(V)
Figure 1. Typ. output characteristics
Figure 2. Typ. transfer characteristics
10
8
7
VDD = 15V
ID = 30A
8
6
5
VGS(V)
RDS(ON)(mΩ)
6
VGS = 4.5V
4
3
2
VGS = 10V
2
1
0
0
10
20
4
30
40
0
50
0
10
20
30
ID(A)
40
50
60
Qg(nC)
Figure 3. On-Resistance vs. Drain Current
Figure 4. Gate Charge Characteristics
100
2.2
VGS = 0V
VGS = 10V
ID = 30A
2
10
Normalized RDS(ON)
1.8
TJ = 125°C
1.6
1.4
1
1.2
TJ = -55°C
1
TJ = 25°C
0.1
0.8
0.6
0.4
-80
-40
0
40
80
120
160
0.01
200
TJ(℃) Junction Temperature
0
0.2
0.4
0.6
0.8
1
1.2
VSD(V)
Figure 5. Normalized on Resistance vs.
Junction Temperature
Craftsman-Made Consciention Chip
Rev: 2024A0
Figure 6. Forward characteristic of body diode
4/5
www.microdiode.com
MDD100N03D
30V N-Channel Enhancement Mode MOSFET
12. Outline Drawing
TO-252 Package Outline Dimensions
13. Important Notice and Disclaimer
Microdiode Electronics (Shenzhen) reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the latest product information
and specifications before final design,purchase or use.
Microdiode Electronics (Shenzhen) makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, not does Microdiode Electronics (Shenzhen) assume any liability for
application assistance or customer product design. Microdiode Electronics (Shenzhen) does not warrant or accept
any liability with products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics
(Shenzhen).
Microdiode Electronics (Shenzhen) products are not authorized for use as critical components in life support
devices or systems without express written approval of Microdiode Electronics (Shenzhen).
Craftsman-Made Consciention Chip
Rev: 2024A0
5/5
www.microdiode.com
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