74LVC1G58GW

74LVC1G58GW

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    SOT-363

  • 描述:

    一款带施密特触发器输入的可配置多功能门电路。该器件可通过3位输入配置为以下任意逻辑功能:与门、或门、与非门、或非门、异或门、反相器和缓冲器

  • 数据手册
  • 价格&库存
74LVC1G58GW 数据手册
74LVC1G58 Low-power configurable multiple function gate Product datasheet, Rev. 1.0 Aug 08, 2024 1.General Description The 74LVC1G58 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down. 2.Features and Benefits  Wide supply voltage range from 1.65 V to 5.5 V  Overvoltage tolerant inputs to 5.5 V  High noise immunity  ±24 mA output drive (VCC = 3.0 V)  CMOS low power dissipation  Latch-up performance exceeds 200 mA  Direct interface with TTL levels  IOFF circuitry provides partial Power-down mode operation  Complies with JEDEC standard: • JESD8-7 (1.65 V to 1.95 V) • JESD8-5 (2.3 V to 2.7 V) • JESD8C (2.7 V to 3.6 V) • JESD36 (4.5 V to 5.5 V)  ESD protection: • HBM ANSI/ESDA/JEDEC JS-001 Class 3B exceeds 8000 V • CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 2000 V  Multiple package options Rev. 1.0 – Aug 08, 2024 1 74LVC1G58 Low-power configurable multiple function gate Rev. 1.0 – Aug 08, 2024 2 74LVC1G58 Low-power configurable multiple function gate 3.Ordering Information Table 1. Ordering information Type number Package Name Description Quantity 74LVC1G58GV SOT23-6L SOT23 package, 6 pins 2.92 mm × 1.6 mm; 1.25 mm (Max) height 3000 74LVC1G58GW SOT363 SOT363 package, 6 pins 2.1 mm × 1.25 mm; 1.1 mm (Max) height 3000 4.Function Diagram Fig. 1. Logic symbol Rev. 1.0 – Aug 08, 2024 3 74LVC1G58 Low-power configurable multiple function gate 5.Pinning Information 5.1. Pin map Fig. 2. Top view pin configuration SOT23-6 and SOT363 5.2. Pin description Table 2. Pin description Symbol Pin Description B 1 Data input GND 2 Ground (0V) A 3 Data input Y 4 Data output VCC 5 Supply voltage C 6 Data input Rev. 1.0 – Aug 08, 2024 4 74LVC1G58 Low-power configurable multiple function gate 6.Functional Description Table 3. Function table H = HIGH voltage level; L = LOW voltage level. Input Output C B A Y L L L L L L H H L H L L L H H H H L L H H L H H H H L L H H H L 6.1. PIN MAP Table 4. Function selection table Logic function Figure 2-input NAND see Fig. 3 2-input NAND with both inputs inverted see Fig. 6 2-input AND with inverted input see Fig. 4 and Fig.5 2-input NOR with inverted input see Fig. 4 and Fig.5 2-input OR see Fig. 6 2-input OR with both inputs inverted see Fig. 3 2-input XOR see Fig. 7 Buffer see Fig. 8 Inverter see Fig. 9 Rev. 1.0 – Aug 08, 2024 5 74LVC1G58 Low-power configurable multiple function gate Fig. 3. 2-input NAND gate or 2-input OR with both inputs inverted Fig. 4. 2-input AND gate with inverted B input or 2-input NOR gate with inverted C input Fig. 5. 2-input AND gate with inverted C input or 2-input NOR gate with inverted A input Fig. 6. 2-input OR gate or 2-input NAND gate with both inputs inverted Fig. 7. 2-input XOR gate Fig. 8. Buffer Rev. 1.0 – Aug 08, 2024 6 74LVC1G58 Low-power configurable multiple function gate Fig. 9. Inverter 7.Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Table 4. Absolute Maximum Ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND. Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current VO output voltage IO output current ICC supply current IGND ground current Ptot total power dissipation Tstg storage temperature Conditions VI < 0 V Min Max Unit -0.5 6.5 V -50 [1] mA -0.5 6.5 V ±50 mA -0.5 VCC + 0.5 V -0.5 6.5 V ±50 mA 100 mA VO >VCC or VO < 0 V Active [1] Power-down [1] mode mode; VCC = 0 V VO = 0 V to VCC -100 mA Tamb = -40 °C to + 125 °C -65 250 mW 150 °C [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 8.Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. MDD does not recommend exceeding them or designing to Absolute Maximum Ratings. Table 5. Recommended Operating Conditions Symbol Parameter VCC supply voltage VI input voltage Rev. 1.0 – Aug 08, 2024 Conditions Min Typ Max Unit 1.65 5.5 V 0 5.5 V 7 74LVC1G58 Low-power configurable multiple function gate VO output voltage Tamb ambient temperature Rev. 1.0 – Aug 08, 2024 Active mode 0 VCC V Power-down mode; VCC = 0 V 0 5.5 V -40 125 °C 8 74LVC1G58 Low-power configurable multiple function gate 9.Static Characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions -40 °C to +85 °C Min Typ[1] -40 °C to +125 °C Max Min Max Unit VI = VT+ or VTIO = -100μA; VCC = 1.65 V to 5.5 V VOH HIGH-level output voltage VCC - 0.1 VCC - 0.1 V IO = -4 mA; VCC = 1.65 V 1.2 1.6 0.95 V IO = -8 mA; VCC = 2.3 V 1.9 2.2 1.7 V IO = -12 mA; VCC = 2.7 V 2.2 2.5 1.9 V IO = -24 mA; VCC = 3.0 V 2.3 2.7 2.0 V IO = -32 mA; VCC = 4.5 V 3.8 4.2 3.4 V VI = VT+ or VTIO = 100μA; VCC = 1.65 V to 5.5 V VOL LOW-level output voltage 0.10 0.10 V IO = 4 mA; VCC = 1.65 V 0.02 0.45 0.70 V IO = 8 mA; VCC = 2.3 V 0.06 0.30 0.45 V IO = 12 mA; VCC = 2.7 V 0.12 0.40 0.60 V IO = 24 mA; VCC = 3.0 V 0.28 0.55 0.80 V IO = 32 mA; VCC = 4.5 V 0.34 0.55 0.80 V II Input leakage current VI = 5.5 V or GND ; VCC = 5.5 V ±0.1 ±1 ±1 μA IOFF power-off leakage current VCC = 0V ; VI or VO = 5.5 V ±0.1 ±2 ±2 μA ICC supply current VI = 5.5V or GND ; IO = 0A ; VCC = 5.5V 0.1 4 4 μA ΔICC additional supply per pin ; VCC = 2.3V to 5.5V ; current VI = VCC -0.6V ; IO = 0A 5 500 500 μA CI input capacitance 5 VCC = 3.3V ; VI = GND to VCC pF [1]All typical values are measured at VCC = 3.3V and Tamb = 25℃. Rev. 1.0 – Aug 08, 2024 9 74LVC1G58 Low-power configurable multiple function gate 10. Dynamic Characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Fig. 4. Symbol Parameter -40 °C to +85 °C Conditions Typ[1] Max Min Max 4.0 15.7 26 4.0 26.5 ns propagation delay VCC = 2.3 V to 2.7 V 2.5 9.5 14 2.5 14.5 ns VCC = 3.0 V to 3.6 V 2.0 7.1 9 2.0 9.5 ns VCC = 4.5 V to 5.5 V 1.5 2.9 5 1.5 5.5 ns [2] VCC = 1.65 V to 1.95 V CPD Unit Min A, B, C to Y; see Fig. 3 tpd -40 °C to +125 °C power dissipation capacitance VI = GND to VCC ; VCC = 3.3V [3] 25 pF [1] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 3.3 V and 5.0 V respectively. [2] tpd is the same as tPLH and tPHL. [3] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. Rev. 1.0 – Aug 08, 2024 10 74LVC1G58 Low-power configurable multiple function gate 11.1. Waveforms and test circuit Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig. 10. The input A, B, C to output Y propagation delay times Table 8. Measurement points Supply voltage Input Output VCC VM VM 1.65 V to 1.95 V 0.5VCC 0.5VCC 2.3 V to 2.7 V 0.5VCC 0.5VCC 3.0 V to 3.6 V 1.5 V 1.5 V 4.5 V to 5.5 V 0.5VCC 0.5VCC Rev. 1.0 – Aug 08, 2024 11 74LVC1G58 Low-power configurable multiple function gate Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig. 11. Test circuit for measuring switching times Table 9. Test data Supply voltage Input VCC VI tr = tf CL RL tPLH, tPHL 1.65 V to 1.95 V VCC ≤ 2.0 ns 15 pF 500 Ω open 2.3 V to 2.7 V VCC ≤ 2.0 ns 15 pF 500 Ω open 3.0 V to 3.6 V 3V ≤ 2.5 ns 15 pF 500 Ω open 4.5 V to 5.5 V VCC ≤ 2.5 ns 15 pF 500 Ω open Rev. 1.0 – Aug 08, 2024 Load VEXT 12 74LVC1G58 Low-power configurable multiple function gate 11. Transfer Characteristics Table 10. Transfer characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ[1] Max Min Max VCC = 1.8 V 0.70 1.09 1.20 0.67 1.20 V VCC = 2.3 V 1.11 1.36 1.60 1.08 1.60 V VCC = 3.0 V 1.50 1.69 2.00 1.47 2.00 V VCC = 4.5 V 2.16 2.39 2.74 2.13 2.74 V VCC = 5.5 V 2.61 2.86 3.33 2.58 3.33 V VCC = 1.8 V 0.30 0.6 0.72 0.30 0.75 V VCC = 2.3 V 0.58 0.77 1.00 0.58 1.03 V VCC = 3.0 V 0.80 1.09 1.30 0.80 1.33 V VCC = 4.5 V 1.21 1.62 1.90 1.21 1.93 V VCC = 5.5 V 1.45 1.99 2.29 1.45 2.32 V VCC = 1.8 V 0.30 0.49 0.62 0.23 0.62 V VCC = 2.3 V 0.40 0.58 0.80 0.34 0.80 V VCC = 3.0 V 0.50 0.6 1.00 0.44 1.00 V VCC = 4.5 V 0.71 0.76 1.20 0.65 1.20 V VCC = 5.5 V 0.71 0.86 1.40 0.65 1.40 V see Fig. 5, Fig.6, Fig.7, and Fig. 8 VT+ positive-going threshold voltage see Fig. 5, Fig.6, Fig.7, and Fig. 8 VT- negative-going threshold voltage (VT+ - VT-);see Fig. 5, Fig.6, Fig.7, and Fig. 8 VH hysteresis voltage [1] Typical values are measured at Tamb = 25 °C. Rev. 1.0 – Aug 08, 2024 13 74LVC1G58 Low-power configurable multiple function gate 11.1. Waveforms transfer characteristics VT+ and VT- limits at 70% and 20%. Fig. 12. Transfer characteristic Fig. 13. Definition of VT+, VT- and VH VT+ and VT- limits at 70% and 20%. Fig. 14. Transfer characteristic Rev. 1.0 – Aug 08, 2024 Fig. 15. Definition of VT+, VT- and VH 14 74LVC1G58 Low-power configurable multiple function gate 12. Package Outline SOT23-6L Rev. 1.0 – Aug 08, 2024 15 74LVC1G58 Low-power configurable multiple function gate SOT363 Rev. 1.0 – Aug 08, 2024 16 74LVC1G58 Low-power configurable multiple function gate 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model CDM Charged Device Model TTL Transistor-Transistor Logic 14. Revision History Table 11. Revision history Document ID Release Date Data sheet status 74LVC1G58 Rev. 1.0 Dec 20, 2024 Product datasheet Rev. 1.0 – Aug 08, 2024 Change notice Supersedes 17
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