74AHCT1G09GW

74AHCT1G09GW

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    SOT-353

  • 描述:

    通用逻辑门芯片

  • 数据手册
  • 价格&库存
74AHCT1G09GW 数据手册
74AHC1G09; 74AHCT1G09 2-inut AND with open-drain output Product datasheet, Rev. 1.0 Aug 08, 2024 1.General Description 74AHC1G09 and 74AHCT1G09 are single 2-input AND gates with open-drain outputs. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments. 2.Features and Benefits  Wide supply voltage range from 2.0 V to 5.5 V  Overvoltage tolerant inputs to 5.5 V  High noise immunity  CMOS low power dissipation  Latch-up performance exceeds 200 mA  Input levels: • For 74AHC1G09: CMOS level • For 74AHCT1G09: TTL level  ESD protection: • HBM ANSI/ESDA/JEDEC JS-001 Class 3A exceeds 7000 V • CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 2000 V  Multiple package options Rev. 1.0 – Aug 08, 2024 1 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 3.Ordering Information Table 1. Ordering information Type number 74AHC1G09GV 74AHCT1G09GV 74AHC1G09GW 74AHCT1G09GW 74AHC1G09DRL 74AHCT1G09DRL Package Name Description Quantity SOT23-5L SOT23 package, 5 pins 2.92 mm × 1.6 mm; 1.25 mm (Max) height 3000 SOT353 SOT353 package, 5 pins 2.1 mm × 1.25 mm; 1.1 mm (Max) height 3000 SOT553 SOT553 package, 5 pins 1.6 mm × 1.2 mm; 0.6 mm (Max) height 3000 4.Function Diagram Fig. 1. Logic symbol Rev. 1.0 – Aug 08, 2024 Fig. 2. IEC logic symbol Fig. 3. Logic diagram 2 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 5.Pinning Information 5.1. Pinning Fig. 4. Top view pin configuration SOT23-5L, SOT353 and SOT553 5.2. Pin description Table 2. Pin description Symbol Pin Description B 1 Data input A 2 Data input GND 3 Ground (0V) Y 4 Data output VCC 5 Supply voltage 6.Functional Description Table 3. Function table H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. Input Output A B Y L L L L H L H L L H H Z Rev. 1.0 – Aug 08, 2024 3 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 7.Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Table 4. Absolute Maximum Ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND. Symbol Parameter VCC Min Max Unit supply voltage -0.5 7.0 V VI input voltage -0.5 7.0 V IIK input clamping current IOK output clamping current IO output current VO output voltage ICC supply current IGND ground current Ptot total power dissipation Tstg storage temperature Conditions VI < -0.5 V VO < [1] VO > - 0.5 V active [1] high-impedance [1] -20 -0.5 mA V mode mode ±20 mA ±25 mA -0.5 7.0 V -0.5 7.0 V 75 mA -75 mA Tamb = -40 °C to + 125 °C -65 250 mW 150 °C [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 8.Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. MDD does not recommend exceeding them or designing to Absolute Maximum Ratings. Table 5. Recommended Operating Conditions Symbol Parameter VCC Conditions 74AHC1G09 74AHCT1G09 Unit Min Typ Max Min Typ Max supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V VI input voltage 0 5.5 0 5.5 V VO output voltage active mode 0 VCC 0 VCC V high-impedance mode 0 6.0 0 6.0 V Tamb ambient temperature 125 -40 125 °C Rev. 1.0 – Aug 08, 2024 -40 25 25 4 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output Δt/ΔV input transition rise and fall rate VCC = 3.3 V ± 0.3 V 100 VCC = 5.0 V ± 0.5 V 20 ns/V 20 ns/V 9.Static Characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions -40 °C to +85 °C Min Typ[1] -40 °C to +125 °C Max Min Max Unit 74AHC1G09 VIH VIL HIGH-level input voltage LOW-level input voltage VCC = 2.0 V 1.5 1.5 V VCC = 3.0 V 2.1 2.1 V VCC = 5.5 V 3.85 3.85 V VCC = 2.0 V 0.5 0.5 V VCC = 3.0 V 0.9 0.9 V VCC = 5.5 V 1.65 1.65 V VI = VIH or VIL VOL II IOZ ICC CI LOW-level output voltage input leakage current OFF-state output current supply current input capacitance Rev. 1.0 – Aug 08, 2024 IO = 50 μA; VCC = 2.0 V 0 0.1 0.1 V IO = 50 μA; VCC = 3.0 V 0 0.1 0.1 V IO = 50 μA; VCC = 4.5 V 0 0.1 0.1 V IO = 4.0 mA; VCC = 3.0 V 0.05 0.44 0.55 V IO = 8.0 mA; VCC = 4.5 V 0.07 0.44 0.55 V VI = 5.5 V or GND ; VCC = 0 V to 5.5 V ±0.01 ±1.0 ±2.0 μA VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V ±0.01 ±2.5 ±10.0 μA VI = VCC or GND ; IO = 0 A ; VCC = 5.5 V 0.01 10 20 μA 3.5 pF 5 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output Symbol Parameter Conditions -40 °C to +85 °C Min Typ[1] -40 °C to +125 °C Max Min Max Unit 74AHCT1G09 VIH VIL VOL II IOZ ICC ΔICC CI HIGH-level input voltage LOW-level input voltage LOW-level output voltage input leakage current OFF-state output current supply current additional supply current input capacitance VCC = 4.5 V to 5.5 V 2.0 2.0 VCC = 4.5 V to 5.5 V V 0.8 0.8 V VI = VIH or VIL; VCC = 4.5 V IO = 50 μA; 0 0.1 0.1 V IO = 8.0 mA; 0.07 0.44 0.55 V VI = 5.5 V or GND ; VCC = 0 V to 5.5 V ±0.01 ±1.0 ±2.0 μA VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V ±0.01 ±2.5 ±10.0 μA 0.01 10 20 μA 0.23 1.35 1.35 mA VI = VCC or GND ; IO = 0 A ; VCC = 5.5 V per input pin ; VI = 3.4 V; other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V 3.5 pF [1]All typical values are measured at Tamb = 25°C. Rev. 1.0 – Aug 08, 2024 6 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 10. Dynamic Characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Fig. 6. Symbol Parameter -40 °C to +85 °C Conditions -40 °C to +125 °C Unit Min Typ[1] Max Min Max VCC = 3.0 V to 3.6 V, CL = 15 pF 2.5 5.3 8.5 2.5 9.5 ns VCC = 4.5 V to 5.5 V, CL = 15 pF 1.5 3.5 5.5 1.5 6.0 ns VCC = 3.0 V to 3.6 V, CL = 15 pF 2.5 5.8 9.0 2.5 10.0 ns VCC = 4.5 V to 5.5 V, CL = 15 pF 1.5 4.1 6.0 1.5 6.5 ns 74AHC1G09 tPZL tPLZ CPD OFF-state to LOW propagation delay A and B to Y; see Fig. 5 LOW to OFFstate propagation delay power dissipation capacitance A and B to Y; see Fig. 5 CL = 15 pF ; f = 1MHz ; VI = GND to VCC ; 4 [2] pF 74AHCT1G09 tPZL tPLZ CPD OFF-state to LOW propagation delay LOW to OFFstate propagation delay power dissipation capacitance A and B to Y; see Fig. 5 VCC = 4.5 V to 5.5 V, CL = 15 pF 1.5 5.0 7.0 1.5 7.5 ns 1.5 5.1 7.0 1.5 7.5 ns A and B to Y; see Fig. 5 VCC = 4.5 V to 5.5 V, CL = 15 pF CL = 15 pF ; f = 1MHz ; VI = GND to [2] VCC ; 4 pF [1] Typical values are measured at Tamb = 25 °C and VCC = 3.3 V and 5.0 V respectively. [2] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. Rev. 1.0 – Aug 08, 2024 7 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 10.1. Waveforms and test circuit Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig. 5. The input A, B to output Y propagation delays Table 8. Measurement points Type Input Output VI VM VM VX 74AHC1G09 GND to VCC 0.5 x VCC 0.5 x VCC VOL + 0.3V 74AHCT1G09 GND to 3.0 V 1.5 V 0.5 x VCC VOL + 0.3V Rev. 1.0 – Aug 08, 2024 8 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output Test data is given in Table 9. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. RL = Load resistance. VEXT = External voltage for measuring switching times. Fig. 6. Test circuit for measuring switching times Table 9. Test data Type Input Load VI tr = tf CL RL tPZL, tPLZ 74AHC1G09 GND to VCC ≤ 2.5 ns 15 pF 500 Ω VCC 74AHCT1G09 GND to 3.0 V ≤ 2.5 ns 15 pF 500 Ω VCC Rev. 1.0 – Aug 08, 2024 9 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 11. Package Outline SOT23-5L Rev. 1.0 – Aug 08, 2024 10 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output SOT353 Rev. 1.0 – Aug 08, 2024 11 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output SOT553 Rev. 1.0 – Aug 08, 2024 12 74AHC1G09; 74AHCT1G09 2-input AND with open-drain output 12. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model CDM Charged Device Model TTL Transistor-Transistor Logic 13. Revision History Table 11. Revision history Document ID Release Date Data sheet status 74AHC_AHCT1G09 Rev. 1.0 Apr 20, 2024 Product datasheet Rev. 1.0 – Aug 08, 2024 Change notice Supersedes 13
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