74HCT245D

74HCT245D

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    SOP-20

  • 描述:

    缓冲器/驱动器

  • 数据手册
  • 价格&库存
74HCT245D 数据手册
74HC245; 74HCT245 Octal buffer/line driver; 3-state Product datasheet, Rev. 1.0 Aug 08, 2024 1.General Description The 74HC245; 74HCT245 are 8-bit transceivers with 3-state outputs. The device features an output enable ( OE ) and send/receive (DIR) for direction control. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC. 2.Features and Benefits  Wide supply voltage range from 2.0 V to 6.0 V  High noise immunity  CMOS low power dissipation  Latch-up performance exceeds 250 mA  Octal bidirectional bus interface  Non-inverting 3-state outputs  Complies with JEDEC standards: • JESD8C (2.7 V to 3.6 V) • JESD7A (2.0 V to 6.0 V)  Input levels: • For 74HC245: CMOS level • For 74HCT245: TTL level  ESD protection:  • HBM ANSI/ESDA/JEDEC JS-001 Class 3A exceeds 6000 V • CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 2000 V Multiple package options Rev. 1.0 – Aug 08, 2024 1 74HC245; 74HCT245 Octal buffer/line driver; 3-state 3.Ordering Information Table 1. Ordering information Package Type number Name 74HC245D SOP-20L 74HC245PW TSSOP-20L Description Quantity plastic small outline package; 20 leads; body width 7.5 mm plastic thin shrink small outline package; 20 leads; body width 4.4 mm 2000 2000 4.Function Diagram Fig. 1. Logic symbol Rev. 1.0 – Aug 08, 2024 Fig. 2. IEC logic symbol 2 74HC245; 74HCT245 Octal buffer/line driver; 3-state 5.Pinning Information 5.1. Pinning Fig. 3. Top view pin configuration SOP and TSSOP 5.2. Pin description Table 2. Pin description Symbol Pin Description DIR 1 Direction control A0, A1, A2, A3, A4, A5, A6, A7 2, 3, 4, 5, 6, 7, 8, 9 Data input/output GND 10 Ground (0 V) B7, B6, B5, B4, B3, B2, B1, B0 11, 12, 13, 14, 15, 16, 17, 18 Data input/output OE 19 Output enable input (active LOW) VCC 20 Supply voltage Rev. 1.0 – Aug 08, 2024 3 74HC245; 74HCT245 Octal buffer/line driver; 3-state 6.Functional Description Table 3. Function table H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. Input Input/output OE DIR An Bn L L A=B input L H input B=A H X Z Z 7.Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Table 4. Absolute Maximum Ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND. Symbol Parameter Conditions VCC supply voltage IIK input clamping current VI < -0.5 V or VI > VCC + 0.5 V IOK output clamping current VO < -0.5 V or VO > VCC + 0.5 V IO output current VO = -0.5 V to (VCC + 0.5 V) ICC supply current IGND ground current Ptot total power dissipation Tstg storage temperature Min Max Unit -0.5 7.0 V [1] ±20 mA [1] ±20 mA ±25 mA 50 mA -50 -65 mA 500 mW 150 °C [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Rev. 1.0 – Aug 08, 2024 4 74HC245; 74HCT245 Octal buffer/line driver; 3-state 8.Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. MDD does not recommend exceeding them or designing to Absolute Maximum Ratings. Table 5. Recommended Operating Conditions Symbol Parameter VCC Conditions 74HC245 74HCT245 Unit Min Typ Max Min Typ Max supply voltage 2.0 5.0 6.0 2.7 5.0 5.5 V VI input voltage 0 VCC 0 VCC V VO output voltage 0 VCC 0 VCC V Tamb ambient temperature -40 125 -40 125 °C Δt/ΔV input transition rise and fall rate Rev. 1.0 – Aug 08, 2024 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 625 1.67 139 83 ns/V 1.67 139 ns/V ns/V 5 74HC245; 74HCT245 Octal buffer/line driver; 3-state 9.Static Characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Typical values measured at Tamb = 25°C (unless otherwise noted). Symbol Parameter Conditions -40 °C to +85 °C Min Typ Max -40 °C to +125 °C Min Max Unit 74HC245 VIH VIL HIGH-level input voltage LOW-level input voltage VCC = 2.0 V 1.5 1.5 V VCC = 4.5 V 3.15 3.15 V VCC = 6.0 V 4.2 4.2 V VCC = 2.0 V 0.5 0.5 V VCC = 4.5 V 1.35 1.35 V VCC = 6.0 V 1.8 1.8 V VI = VIH or VIL VOH HIGH-level output voltage IO = -20 μA; VCC = 2.0 V 1.9 1.9 V IO = -20 μA; VCC = 4.5 V 4.4 4.4 V IO = -20 μA; VCC = 6.0 V 5.9 5.9 V IO = -6.0 mA; VCC = 4.5 V 3.84 3.7 V IO = -7.8 mA; VCC = 6.0 V 5.34 5.2 V VI = VIH or VIL VOL II IOZ ICC CI CI/O LOW-level output voltage input leakage current OFF-state output current supply current input capacitance Input/output capacitance Rev. 1.0 – Aug 08, 2024 IO = 20 μA; VCC = 2.0 V 0.1 0.1 V IO = 20 μA; VCC = 4.5 V 0.1 0.1 V IO = 20 μA; VCC = 6.0 V 0.1 0.1 V IO = 6.0 mA; VCC = 4.5 V 0.33 0.4 V IO = 7.8 mA; VCC = 6.0 V 0.33 0.4 V ±1 ±1 μA ±5 ±10 μA 20 40 μA VI = VCC or GND ; VCC = 6.0 V VI = VIH or VIL ; VCC = 6.0 V ; VO = VCC or GND VI = VCC or GND ; IO = 0 A ; VCC = 6.0 V 4.0 pF 7.7 pF 6 74HC245; 74HCT245 Octal buffer/line driver; 3-state Symbol Parameter Conditions -40 °C to +85 °C Min Typ Max -40 °C to +125 °C Min Max Unit 74HCT245 VIH VIL HIGH-level input voltage LOW-level input voltage VCC = 3 V 2.0 2.0 V VCC = 4.5 V 2.0 2.0 V VCC = 5.5 V 2.1 2.1 V VCC = 3 V 0.8 0.8 V VCC = 4.5 V 0.8 0.8 V VCC = 5.5 V 0.8 0.8 V VI = VIH or VIL; VOH HIGH-level output voltage IO = -20 μA; VCC = 3 V 2.9 2.9 V IO = -20 μA; VCC = 4.5 V 4.4 4.4 V IO = -6.0 mA; VCC = 4.5 V 3.84 3.7 V VI = VIH or VIL; VOL II IOZ ICC ΔICC CI CI/O LOW-level output voltage input leakage current OFF-state output current supply current additional supply current input capacitance Input/output capacitance Rev. 1.0 – Aug 08, 2024 IO = 20 μA; VCC = 3 V 0.1 0.1 V IO = 20 μA; VCC = 4.5 V 0.1 0.1 V IO = 6.0 mA; VCC = 4.5 V 0.33 0.4 V VI = VCC or GND ; VCC = 5.5 V ±1 ±1 μA VI = VIH or VIL ; VCC = 5.5 V ; VO = VCC or GND ±5 ±10 μA 20 40 μA 400 490 μA VI = VCC or GND; IO = 0 A; VCC = 5.5 V per pin ; VI = VCC - 2.1 V; IO = 0 A; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V 4.0 pF 7.7 pF 7 74HC245; 74HCT245 Octal buffer/line driver; 3-state 10. Dynamic Characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Fig. 6. Typical values measured at Tamb = 25°C (unless otherwise noted). Symbol Parameter -40 °C to +85 °C Conditions Min Typ -40 °C to +125 °C Max Min Max Unit 74HC245 An to Bn or Bn to An; see Fig. 4 tpd propagation delay [1] VCC = 2.0 V 35 40 ns VCC = 4.5 V 20 25 ns VCC = 6.0 V 15 20 ns VCC = 2.0 V 35 40 ns VCC = 4.5 V 20 25 ns VCC = 6.0 V 15 20 ns VCC = 2.0 V 35 40 ns VCC = 4.5 V 20 25 ns VCC = 6.0 V 15 20 ns VCC = 2.0 V 9 11 ns VCC = 4.5 V 6 8 ns VCC = 6.0 V 4 5 ns OE to An or Bn; see Fig. 5 ten enable time [2] OE to An or Bn; see Fig. 5 tdis disable time [3] see Fig. 4 tt transition time CPD power dissipation capacitance Rev. 1.0 – Aug 08, 2024 per buffer; VI = GND [5] [4] to VCC 18 pF 8 74HC245; 74HCT245 Octal buffer/line driver; 3-state Symbol -40 °C to +85 °C Parameter Conditions tpd propagation delay ten enable time tdis disable time An to Bn or Bn to An; VCC = 4.5V; see Fig. 4 [1] OE to An or Bn; VCC = 4.5V; see Fig. 5 [2] OE to An or Bn; VCC = 4.5V see Fig. 5 [3] VCC=4.5V; see Fig. 4; [4] Min Typ -40 °C to +125 °C Max Min Max Unit 74HCT245 tt CPD transition time power dissipation capacitance per buffer; VI = GND to VCC – 1.5 V [5] 18 20 25 ns 20 25 ns 20 25 ns 6 8 ns pF [1] tpd is the same as tPHL and tPLH. [2] ten is the same as tPZH and tPZL. [3] tdis is the same as tPLZ and tPHZ. [4] tt is the same as tTHL and tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. Rev. 1.0 – Aug 08, 2024 9 74HC245; 74HCT245 Octal buffer/line driver; 3-state 10.1. Waveforms and test circuit Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig. 4. Input (An, Bn) to output (Bn, An) propagation delays and output transition times Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig. 5. 3-state enable and disable times Table 8. Measurement points Input Output VM VM VX VY 74HC245 0.5VCC 0.5VCC 0.1VCC 0.9VCC 74HCT245 1.3 V 1.3 V 0.1VCC 0.9VCC Type Rev. 1.0 – Aug 08, 2024 10 74HC245; 74HCT245 Octal buffer/line driver; 3-state Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig. 6. Test circuit for measuring switching times Table 9. Test data Type Input Load VEXT VI tr = tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 74HC245 VCC ≤ 2.5 ns 50 pF 500Ω open GND 2VCC 74HCT245 3V ≤ 2.5 ns 50 pF 500Ω open GND 2VCC Rev. 1.0 – Aug 08, 2024 11 74HC245; 74HCT245 Octal buffer/line driver; 3-state 11. Package Outline SOP-20L Symbol A A1 A2 A3 B B1 C C1 C2 C3 Dimensions In Millimeters Min. Max. 12.600 12.900 0.381 0.431 1.240 1.300 0.450 0.460 7.400 7.600 10.206 10.406 2.150 2.300 0.938 1.038 0.938 1.2038 0.145 0.205 Rev. 1.0 – Aug 08, 2024 Symbol C4 D D1 D2 R1 R2 θ1 θ2 θ3 Dimensions In Millimeters Min. Max. 0.246 0.262 1.353 1.453 0.764 0.964 0.18TYP 0.30TYP 0.20TYP 12° TYP 12° TYP 0° ~ 8° 12 74HC245; 74HCT245 Octal buffer/line driver; 3-state TSSOP-20L Symbol A A1 A2 A3 b b1 c c1 D E1 Dimensions In Millimeters Min. Max. 1.20 0.05 0.15 0.80 1.05 0.39 0.49 0.20 0.28 0.19 0.25 0.13 0.17 0.12 0.14 6.40 6.60 4.30 4.50 Rev. 1.0 – Aug 08, 2024 Symbol E e L L1 θ Dimensions In Millimeters Min. Max. 6.20 6.60 0.65BSC 0.45 0.75 1.00REF 0° 8° 13 74HC245; 74HCT245 Octal buffer/line driver; 3-state 12. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model CDM Charged Device Model 13. Revision History Table 11. Revision history Document ID Release Date Data sheet status 74HC_HCT245 Rev. 1.0 Apr 18, 2025 Product datasheet Rev. 1.0 – Aug 08, 2024 Change notice Supersedes 14
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