74HCT74D

74HCT74D

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    SOP-14

  • 描述:

    通用逻辑门芯片

  • 数据手册
  • 价格&库存
74HCT74D 数据手册
74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger Product datasheet, Rev. 1.0 Aug 08, 2024 1.General Description The 74HC74 and 74HCT74 are dual positive edge triggered D-type flip-flop. They have individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, is stored in the flip-flop and appears at the nQ output. Schmitt-trigger action in the clock input, makes the circuit highly tolerant to slower clock rise and fall times. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC. 2.Features and Benefits  Wide operating voltage 2.0 V to 6.0 V  High noise immunity  CMOS low power dissipation  Input levels: • For 74HC74: CMOS level • For 74HCT74: TTL level  Symmetrical output impedance  Balanced propagation delays  Latch-up performance exceeds 250 mA  Complies with JEDEC standard: • JESD8C (2.7 V to 3.6 V) • JESD7A (2.0 V to 6.0 V)  ESD protection:  • HBM ANSI/ESDA/JEDEC JS-001 Class 3A exceeds 3500 V • CDM ANSI/ESDA/JEDEC JS-002 Class C3 exceeds 2000 V Multiple package options Rev. 1.0 – Aug 08, 2024 1 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 3.Ordering Information Table 1. Ordering information Type number 74HC74D 74HCT74D 74HC74PW 74HCT74PW Package Name Description Quantity SOP-14L plastic small outline package; 14 leads; body width 3.9 mm 2500 TSSOP14L plastic thin shrink small outline package; 14 leads; body width 4.4 mm 2500 4.Function Diagram Fig. 1. Logic symbol Rev. 1.0 – Aug 08, 2024 Fig. 2. IEC logic symbol Fig. 3. Logic diagram 2 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger Fig. 4. Logic diagram for one flip-flop 5.Pinning Information 5.1. Pinning Fig. 5. Top view pin configuration SOP-14L and TSSOP14L Rev. 1.0 – Aug 08, 2024 3 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 5.2. Pin description Table 2. Pin description Symbol Pin Description 1RD, 2RD 1, 13 asynchronous reset-direct input (active LOW) 1D, 2D 2, 12 data output 1CP, 2CP 3,11 clock input (LOW-to-HIGH, edge-triggered) 1SD, 2SD 4,10 asynchronous set-direct input (active LOW) 1Q, 2Q 5,9 output 1Q, 2Q 6,8 complement output GND 7 ground (0 V) VCC 14 supply voltage 6.Functional Description Table 3. Function table H = HIGH voltage level; L = LOW voltage level; X = don’t care. Input Output nSD nRD nCP nD nQ nQ L H X X H L H L X X L H L L X X H H Table 4. Function table H = HIGH voltage level; L = LOW voltage level; X = don’t care; ↑ = LOW-to-HIGH transition; Qn+1 = state after the next LOW-to-HIGH CP transition. Input Output nSD nRD nCP nD nQn+1 nQn+1 H H ↑ L L H H H ↑ H H L Rev. 1.0 – Aug 08, 2024 4 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 7.Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Table 5. Absolute Maximum Ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND. Symbol Parameter VCC supply voltage IIK input clamping current IOK Conditions Min Max Unit -0.5 7 V VI < -0.5 V or VI > VCC + 0.5 V ±20 mA output clamping current VO < -0.5 V or VO > VCC + 0.5 V ±20 mA IO output current -0.5V < VO < VCC + 0.5 V ±25 mA ICC supply current 100 mA IGND ground current Ptot total power dissipation Tstg storage temperature -100 mA Tamb = -40 °C to + 125 °C -65 500 mW +150 °C 8.Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. MDD does not recommend exceeding them or designing to Absolute Maximum Ratings. Table 6. Recommended Operating Conditions Symbol Parameter VCC VI Conditions 74HC74 74HCT74 Unit Min Typ Max Min Typ Max supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V input voltage 0 VCC 0 VCC V VO output voltage 0 VCC 0 VCC V Tamb ambient temperature +125 -40 +25 +125 °C Δt/ΔV input transition rise and fall rate 1.67 139 Rev. 1.0 – Aug 08, 2024 -40 +25 625 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 1.67 139 83 ns/V ns/V ns/V 5 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 9.Static Characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions -40 °C to +85 °C Max -40 °C to +125 °C Min Max Unit Min Typ[1] VCC = 2.0 V 1.5 1.2 1.5 V VCC = 4.5 V 3.15 2.5 3.15 V VCC = 6.0 V 4.2 3.3 4.2 V 74HC74 VIH VIL VOH VOL II ICC CI HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage Input leakage current supply current input capacitance Rev. 1.0 – Aug 08, 2024 VCC = 2.0 V 0.8 0.5 0.5 V VCC = 4.5 V 2.1 1.35 1.35 V VCC = 6.0 V 2.8 1.8 1.8 V VI = VIH or VIL IO = -4.0 mA; VCC = 4.5 V 3.84 4.4 3.7 V IO = -5.2 mA; VCC = 6.0 V 5.34 5.9 5.2 V VI = VIH or VIL IO = 4.0 mA; VCC = 4.5 V 0.03 0.33 0.4 V IO = 5.2 mA; VCC = 6.0 V 0.04 0.33 0.4 V VI = VCC or GND ; VCC = 6.0 V 0.01 ±1 ±1 μA VI = VCC or GND ; IO = 0A ; VCC = 6.0 V 0.01 20 40 μA 7 pF 6 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger Symbol Parameter Conditions -40 °C to +85 °C Min Typ[1] -40 °C to +125 °C Max Min Max Unit 74HCT74 VIH VIL VOH VOL II ICC ΔICC CI HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage Input leakage current supply current additional supply current input capacitance VCC = 4.5 V to 5.5 V 2.0 VCC = 4.5 V to 5.5 V 1.7 2.0 V 1.3 0.8 0.8 V 4.4 - IO = 4.0 mA 0.03 0.33 0.4 V VI = VCC or GND ; VCC = 5.5 V 0.01 ±1 ±1 μA 0.01 20 40 μA 350 500 550 μA 640 850 950 μA 1130 1550 1650 μA VI = VIH or VIL; VCC = 4.5 V IO = -4.0 mA 3.84 3.7 V VI = VIH or VIL; VCC = 4.5 V VI = VCC or GND ; IO = 0A ; VCC = 5.5 V VI = VCC - 2.1 V; IO = 0 A; other inputs at VCC or GND;VCC = 4.5 V to 5.5 V per input pin; nD,nRD inputs per input pin; nSD inputs per input pin; nCP inputs 7 pF [1]All typical values are measured at Tamb = 25℃. Rev. 1.0 – Aug 08, 2024 7 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 10. Dynamic Characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Fig. 8. Symbol Parameter -40 °C to +85 °C Conditions Min Typ[1] -40 °C to +125 °C Max Min Max Unit 74HC74 nCP to nQ, nQ; see Fig. 6 VCC = 2.0 V 30 33 ns VCC = 4.5 V 16 19 ns VCC = 6.0 V 12 14 ns VCC = 2.0 V 30 33 ns VCC = 4.5 V 16 19 ns VCC = 6.0 V 12 14 ns VCC = 2.0 V 30 33 ns VCC = 4.5 V 16 19 ns VCC = 6.0 V 12 14 ns VCC = 2.0 V 9 11 ns VCC = 4.5 V 6 8 ns VCC = 6.0 V 4 5 ns nSD to nQ, nQ; see Fig. 7 tpd propagation delay nRD to nQ, nQ; see Fig. 7 nQ, nQ;see Fig. 6 tt transition time [2] [2] [2] [3] nCP HIGH or LOW; see Fig. 6 tw pulse width Rev. 1.0 – Aug 08, 2024 VCC = 2.0 V 100 120 ns VCC = 4.5 V 20 24 ns VCC = 6.0 V 17 20 ns VCC = 2.0 V 100 120 ns VCC = 4.5 V 20 24 ns VCC = 6.0 V 17 20 ns nSD, nRD LOW;see Fig. 7 8 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger Symbol Parameter -40 °C to +85 °C Conditions Min Typ[1] -40 °C to +125 °C Max Min Max Unit nSD, nRD;see Fig. 7 trec recovery time VCC = 2.0 V 40 45 ns VCC = 4.5 V 8 9 ns VCC = 6.0 V 7 8 ns VCC = 2.0 V 75 90 ns VCC = 4.5 V 15 18 ns VCC = 6.0 V 13 15 ns VCC = 2.0 V 3 3 ns VCC = 4.5 V 3 3 ns VCC = 6.0 V 3 3 ns VCC = 2.0 V 4.8 4.0 MHz VCC = 4.5 V 24 20 MHz VCC = 6.0 V 28 24 MHz nD to nCP; see Fig. 6 tsu set-up time nD to nCP; see Fig. 6 th hold time nCP; see Fig. 6 fmax CPD maximum frequency power dissipation capacitance VI = GND [4] f = 1MHz to VCC ; 23 pF 74HCT74 nCP to nQ, nQ; see Fig. 6 [2] VCC = 4.5 V tpd propagation delay 16 19 ns 16 19 ns 16 19 ns 6 8 ns nSD to nQ, nQ ; see Fig. 7 [2] VCC = 4.5 V nRD to nQ, nQ ; see Fig. 7 [2] VCC = 4.5 V tt transition time nQ, [3] nQ ;see Fig. 6 VCC = 4.5 V nCP HIGH or LOW; see Fig. 6 tw pulse width VCC = 4.5 V 23 27 ns nSD, nRD LOW;see Fig. 7 Rev. 1.0 – Aug 08, 2024 9 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger VCC = 4.5 V 20 24 -40 °C to +85 °C Symbol Parameter Conditions trec recovery time nSD, nRD;see Fig. 7 tsu set-up time th hold time fmax maximum frequency nCP; see Fig. 6 CPD power dissipation capacitance VI = GND [4] f = 1MHz Min VCC = 4.5 V Typ[1] Max ns -40 °C to +125 °C Min Max Unit 8 9 ns 15 18 ns 3 3 ns 22 18 MHz nD to nCP; see Fig. 6 VCC = 4.5 V nD to nCP; see Fig. 6 VCC = 4.5 V VCC = 4.5 V to VCC ; 24 pF [1] Typical values are measured at Tamb = 25 °C. [2] tpd is the same as tPLH and tPHL. [3] tt is the same as tTHL and tTLH. [4] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. Rev. 1.0 – Aug 08, 2024 10 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 10.1. Waveforms and test circuit Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig. 6. The Propagation delay input (CP) to output (Qn), output transition time, clock input (CP) pulse width and the maximum frequency (CP) Rev. 1.0 – Aug 08, 2024 11 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig. 7. The set (nSD) and reset (nRD) input to output (nQ,nQ) propagation delays, set and reset pulse widths and the nSD, nRD to nCP recovery time Table 9. Measurement points Input Output VM VM 74HC74 0.5VCC 0.5VCC 74HCT74 1.3V 1.3V Type Rev. 1.0 – Aug 08, 2024 12 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.. Fig. 8. Test circuit for measuring switching times Table 10. Test data Type Input Load Test VI tr = tf CL 74HC74 VCC ≤ 2.5 ns 15 pF tPLH, tPHL 74HCT74 3V ≤ 2.5 ns 15 pF tPLH, tPHL Rev. 1.0 – Aug 08, 2024 13 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 11. Package Outline SOP-14L Rev. 1.0 – Aug 08, 2024 14 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger TSSOP-14L Rev. 1.0 – Aug 08, 2024 15 74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive edge-trigger 12. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model CDM Charged Device Model TTL Transistor-Transistor Logic 13. Revision History Table 12. Revision history Document ID Release Date Data sheet status 74HC74_HCT74 Rev. 1.0 Aug 28, 2024 Product datasheet Rev. 1.0 – Aug 08, 2024 Change notice Supersedes 16
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