SFD7N65E
7A, 650V N-CHANNEL MOSFET
GENERAL DESCRIPTION
These N-Channel enhancement mode power field effect
transistors are produced using Hi-semicon’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction, electronic lamp ballasts
based on half bridge topology.
Features
◆VDS(V)=650V, ID=7A
◆RDS(ON)
TYP:1.1Ω@VGS=10V ID=3.5A
MAX:1.4Ω
Applications
◆Power faction correction (PFC)
◆Switched mode power supplies (SMPS)
◆Uninterruptible power supply (UPS)
◆LED lighting power
ORDERING INFORMATION
Part No.
SFD7N65E
Package
Marking
Material
Packing
TO-252-2L
SFD7N65E
Pb Free
Reel
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Rev 1.1
Page 1 of 11
SFD7N65E
ABSOLUTE MAXIMUM RATINGS (TJ=25C unless otherwise noted)
Characteristics
Ratings
Symbol
Unit
SFD7N65E
Drain-Source Voltage
VD S
650
V
Gate-Source Voltage
VGS
±30
V
TC = 25C
Drain Current
TC = 100C
Drain Current Pulsed
7.0
ID
A
5.6
28
A
100
W
0.8
W/C
EAS
537
mJ
Operation Junction Temperature Range
TJ
-55~+150
C
Storage Temperature Range
Tstg
-55~+150
C
TL
300
℃
(Note 1)
Power Dissipation(TC=25C)
-Derate above 25C
Single Pulsed Avalanche Energy
(Note 2)
Maximum lead temperature for soldering
purposes,1/8" from case for 5 seconds
IDM
PD
THERMAL CHARACTERISTICS
Characteristics
MAX
Symbol
Unit
SFD7N65E
Thermal Resistance, Junction-to-Case
RθJC
1.25
C/W
Thermal Resistance, Junction-to-Ambient
RθJA
62.5
C/W
ELECTRICAL CHARACTERISTICS
Characteristics
Symbol
Test conditions
Min.
Typ.
Max.
Unit
BVDSS
VGS=0V, ID=250µA
650
700
--
V
IDSS
VDS=650V, VGS=0V
--
3.3
100
nA
Off Characteristics
Drain -Source Breakdown Voltage
Drain-Source Leakage Current
Gate-Source Leakage Current
IGSS
VGS=30V, VDS=0V
--
3.4
100
nA
Gate-Source Leakage Current
IGSS
VGS=-30V, VDS=0V
--
-2.1
-100
nA
VGS(th)
VGS= VDS, ID=250µA
2
2.9
4.0
V
VGS=10V, ID=1A
--
1.0
1.38
VGS=10V, ID=3.5A
--
1.1
1.4
On Characteristics
Gate Threshold Voltage
Static Drain- Source On State
Resistance
RDS(on)
Dynamic Characteristics
Gate Resistance
Rg
VGS=0V; f=1.0MHZ
1
2.2
10
Input Capacitance
Ciss
VDS=25V
--
1100
--
Output Capacitance
Coss
VGS=0V
--
90.5
--
Reverse Transfer Capacitance
Crss
f=1.0MHZ
--
4.9
--
VDD=325V; VGS=10V
--
11.5
--
RG=10; ID=7A
--
26.3
--
pF
pF
Switching Characteristics
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
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(Note 3.4)
Rev 1.1
ns
Page 2 of 11
SFD7N65E
Turn-off Delay Time
td(off)
VDD=325V; VGS=10V
--
39.2
--
RG=10; ID=7A (Note 3.4)
--
31.5
--
Turn-off Fall Time
tf
Total Gate Charge
Qg
VDS=520V, ID=7A
--
15.5
--
Gate-Source Charge
Qgs
VGS=10V
--
4.3
--
Gate-Drain Charge
Qgd
--
6.6
--
(Note 3.4)
ns
nc
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristics
Symbol
Test conditions
Min.
Typ.
Max.
Continuous Source Current
IS
Integral Reverse P-N
--
--
7
Pulsed Source Current
ISM
--
--
28
Diode Forward Voltage
VSD
IS=7A,VGS=0V
--
0.82
1.2
V
Reverse Recovery Time
Trr
IF=7A,VR=520V,
--
521
--
ns
Reverse Recovery Charge
Qrr
dIF/dt=100A/µS
--
3.6
--
µC
Junction Diode in the
MOSFET
Unit
A
1.Pluse width limited by maximum junction temperature
2.L=10mH, IAS=6A, VDD=100V, VG=10V, RG=25, starting TJ=25C
3.Pulse Test: Pulse width ≤300μs, Duty cycle≤2%
4.Essentially independent of operating temperature
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Rev 1.1
Page 3 of 11
SFD7N65E
Typical Performance Characteristics
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SFD7N65E
Typical Performance Characteristics
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SFD7N65E
Typical Performance Characteristics
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Rev 1.1
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SFD7N65E
Test Circuit
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Rev 1.1
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SFD7N65E
Test Circuit
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Rev 1.1
Page 8 of 11
SFD7N65E
Package Dimensions of TO-252-2L
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Rev 1.1
Page 9 of 11
SFD7N65E
Package Dimensions of TO-252-2L
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Rev 1.1
Page 10 of 11
SFD7N65E
Disclaimer:
► Hi-semicon reserves the right to make changes to the information herein for the improvement of the design
and performance without further notice! Customers should obtain the latest relevant information before placing
orders and should verify that such information is complete and current.
► All semiconductor products malfunction or fail with some probability under special conditions. When using Hisemicon products in system design or complete machine manufacturing, it is the responsibility of the buyer to
comply with the safety standards strictly and take essential measures to avoid situations in which a malfunction
or failure of such Hi-semicon products could cause loss of body injury or damage to property.
► Hi-semicon will supply the best possible product for customers!
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