Product
Document
Published by
ams OSRAM Group
AS5601
12-Bit Programmable Contactless
Encoder
General Description
The AS5601 is an easy-to-program magnetic rotary position
sensor with incremental quadrature (A/B) and 12-bit digital
outputs. Additionally, the PUSH output indicates fast airgap
changes between the AS5601 and magnet which can be used
to implement a contactless pushbutton function in which the
knob can be pressed to move the magnet toward the AS5601.
This AS5601 is designed for contactless encoder applications,
and its robust design rejects the influence of any homogenous
external stray magnetic fields.
Based on planar Hall sensor technology, this device measures
the orthogonal component of the flux density (Bz) from an
external magnet.
The industry-standard I²C interface supports user
programming of non-volatile parameters in the AS5601 without
requiring a dedicated programmer.
The AS5601 also provides a smart low-power mode which
automatically reduces power consumption
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5601, 12-bit Programmable
Contactless Encoder are listed below:
Figure 1:
Added Value of Using AS5601
Benefits
Features
• Highest reliability and durability
• Contactless angle measurement insensitive to dust and dirt
• Simple programming
• Simple user-programmable zero position and device
configuration
• Flexible choice of the number of A/B
pulses per revolution
• Quadrature output configurable from 8 up to 2048 positions
• Contactless pushbutton functionality
• Pushbutton output by detecting sudden airgap changes
• Low power consumption
• Automatic entry into low-power mode
• Easy setup
• Automatic magnet detection
• Small form factor
• SOIC-8 package
• Robust environmental tolerance
• Wide temperature range: -40°C to 125°C
ams Datasheet
[v1-07] 2016-Sep-09
Page 1
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AS5601 − General Description
Applications
The AS5601 is ideally suited for:
• Encoder replacement
• Contactless rotary knobs with push buttons
• Other angular position measurement solutions
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
AS5601 Block Diagram
VDD3V3
SDA
Register Setting
I²C
Low-Dropout
(LDO) Regulator
(internal load only)
VDD5V
Hall Sensors
One-Time
Programmable
(OTP) Memory
SCL
Analog
Front-End
AFE
12-bit A/D
ATAN
(CORDIC)
Automatic
Gain Control
(AGC)
A
B
A/B Quadrature
Output Encoder
Dynamic
Magnitude
Monitoring
PUSH
Magnetic Core
AS5601
GND
Page 2
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ams Datasheet
[v1-07] 2016-Sep-09
AS5601 − Pin Assignments
Pin Assignments
Figure 3:
SOIC-8 Pin-Out
1
8
A
VDD3V3
2
7
SCL
PUSH
3
6
SDA
GND
4
5
B
AS5601
VDD5V
Pin Description
Figure 4:
Pin Description
Pin Number
Name
1
VDD5V
Supply
Positive voltage supply in 5V mode
2
VDD3V3
Supply
Positive voltage supply in 3.3V mode (requires
an external 1-μF decoupling capacitor in 5V
mode)
3
PUSH
Digital output
Contactless pushbutton function output
4
GND
Supply
Ground
5
B
Digital output
Quadrature incremental signal B
6
SDA
Digital input/output
I²C Data
7
SCL
Digital input
I²C Clock
8
A
Digital output
Quadrature incremental signal A
ams Datasheet
[v1-07] 2016-Sep-09
Type
Description
Page 3
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AS5601 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Operating
Conditions is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD5V
DC supply voltage at
VDD5V pin
-0.3
6.1
V
5.0V operation mode
VDD3V3
DC supply voltage at
VDD3V3 pin
-0.3
4.0
V
3.3V operation mode
VAIO
Voltage at all digital or
analog pins
-0.3
VDD + 0.3
V
ISCR
Input current (latch-up
immunity)
-100
100
mA
JESD78
Continuous Power Dissipation (TA = 70°C)
PT
Continuous power
dissipation
50
mW
Electrostatic Discharge
ESDHBM
Electrostatic discharge
HBM (human body model)
±1
kV
MIL 883 E method 3015.7
Temperature Ranges and Storage Conditions
TSTRG
Storage temperature range
TBODY
Package body temperature
RHNC
Relative humidity
(non-condensing)
MSL
Moisture sensitivity level
Page 4
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-55
125
5
3
°C
260
°C
85
%
ICP/JEDEC J-STD-020
The reflow peak soldering
temperature (body
temperature) is specified
according to IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State
Surface Mount Devices.” The
lead finish for Pb-free leaded
packages is “Matte Tin” (100%
Sn)
ICP/JEDEC J-STD-033
ams Datasheet
[v1-07] 2016-Sep-09
AS5601 − Electrical Characteristics
Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Operating Conditions
Figure 6:
System Electrical Characteristics and Temperature Range
Symbol
Parameter
VDD5V
Positive supply voltage in
5.0V mode
VDD3V3
Positive supply voltage in
3.3V mode
Conditions
Min
Typ
Max
Units
4.5
5.0
5.5
V
3.3V operation mode
3.0
3.3
3.6
V
During OTP burn procedure(2)
3.3
3.4
3.5
V
5.0V operation mode
During OTP burn procedure(2)
IDD
Supply current in NOM (1)
PM = 00 Always on
6.5
mA
lDD_LPM1
Supply current in LPM1 (1)
PM = 01
Polling time = 5 ms
3.4
mA
lDD_ LPM2
Supply current in LPM2 (1)
PM = 10
Polling time = 20 ms
1.8
mA
lDD_ LPM3
Supply current in LPM3 (1)
PM = 11
Polling time = 100 ms
1.5
mA
Supply current per bit for
burn procedure
Initial peak, 1 μs
100
mA
IDD_BURN
Steady burning,
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