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KR EELP41. 22
DATASHEET
KR EELP41.22
Datasheet
Published by ams-OSRAM AG
Tobelbader Strasse 30, 8141 Premstaetten, Austria
Phone +43 3136 500-0
ams-osram.com
© All
reserved
| Version
1.1 | 2024-08-30
1 rights
KR EELP41. 22
DATASHEET
SMARTLED® 0603
KR EELP41.22
The SMARTLED® 0603 is the product of choice for status indication and symbol backlighting in electronics.
The small package size allows compact designs. The improved
corrosion robustness and increased junction temperature range
makes the devices from this series suitable for professional
industrial equipment and applications.
Applications
- Appliances & Tools
- Projection & Display
- Display Backlighting
- Static Signaling
- Factory Automation
- Transportation
- Home & Building Automation
Features
- Package: SMT package 0603, colorless diffused resin
- Chip technology: Volume emitter (InGaAlP )
- Typ. Radiation: 130° (horizontal = 0°), 130° (vertical = 90°)
- Color: λdom = 624 nm (● red)
- Corrosion Robustness Class: 3B
- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
2 | Version 1.1 | 2024-08-30
KR EELP41. 22
DATASHEET
Ordering Information
Type
Luminous Intensity 1)
IF = 20 mA
Iv
KR EELP41.22-Q1S1-36-A8J8
3 | Version 1.1 | 2024-08-30
71 ... 224 mcd
Ordering Code
Q65113A7467
KR EELP41. 22
DATASHEET
Maximum Ratings
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
105 °C
Storage Temperature
Tstg
min.
max.
-40 °C
105 °C
Junction Temperature
Tj
max.
110 °C
Forward current
TS = 25 °C
IF
min.
max.
0.5 mA
30 mA
Forward Current pulsed
D = 0.05 ; TS = 25 °C
IF pulse
max.
100 mA
Surge Current
t ≤ 10 µs; D = 0.05 ; TS = 25 °C
IFS
max.
250 mA
Reverse voltage 2)
TS = 25 °C
VR
max.
10 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD
4 | Version 1.1 | 2024-08-30
Values
2 kV
KR EELP41. 22
DATASHEET
Characteristics
IF = 20 mA; TS = 25 °C
Parameter
Symbol
Peak Wavelength
λpeak
typ.
636 nm
Dominant Wavelength 3)
λdom
min.
typ.
max.
616 nm
624 nm
630 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ.
20 nm
Viewing angle at 50% IV
values for 0°, 90°
2φ
typ.
130 °
130 °
Forward Voltage 4)
IF = 20 mA
VF
min.
typ.
max.
1.60 V
1.95 V
2.40 V
Reverse current 2)
VR = 10 V
IR
typ.
max.
0.01 µA
10 µA
Real thermal resistance junction/solderpoint 5)
RthJS real
typ.
max.
550 K / W
670 K / W
5 | Version 1.1 | 2024-08-30
Values
KR EELP41. 22
DATASHEET
Brightness Groups
Group
Luminous Intensity 1)
IF = 20 mA
min.
Iv
Luminous Intensity. 1)
IF = 20 mA
max.
Iv
Luminous Flux 6)
IF = 20 mA
typ.
ΦV
Q1
71 mcd
90 mcd
290 mlm
Q2
90 mcd
112 mcd
360 mlm
R1
112 mcd
140 mcd
450 mlm
R2
140 mcd
180 mcd
580 mlm
S1
180 mcd
224 mcd
730 mlm
Forward Voltage Groups
Group
Forward Voltage 4)
IF = 20 mA
min.
VF
Forward Voltage 4)
IF = 20 mA
max.
VF
A8
1.60 V
2.00 V
J8
2.00 V
2.40 V
Wavelength Groups
Group
Dominant Wavelength 3)
min.
λdom
Dominant Wavelength 3)
max.
λdom
3
616 nm
620 nm
4
620 nm
624 nm
5
624 nm
627 nm
6
627 nm
630 nm
Group Name on Label
Example: Q1-3-A8
Brightness
Q1
6 | Version 1.1 | 2024-08-30
Wavelength
3
Forward Voltage
A8
KR EELP41. 22
DATASHEET
Relative Spectral Emission
6)
Irel = f (λ); IF = 20 mA; TS = 25 °C
Irel
KR EELP41.22
1,0
: Vλ
: red
0,8
0,6
0,4
0,2
0,0
350
400
Radiation Characteristics
450
500
550
600
650
700
750
800
λ / nm
6)
Irel = f (φ); TS = 25 °C
KR EELP41.22
ϕ/°
-40°
-50°
-20°
-30°
-10°
0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
1,0
: 0°
: 90°
0,8
0,6
-60°
-70°
0,4
-80°
0,2
-90°
0,0
-100°
7 | Version 1.1 | 2024-08-30
Irel
Relative Luminous Intensity
6)
IF = f(VF); TS = 25 °C
IF / mA
6),
7)
30
Forward current
25
KR EELP41. 22
DATASHEET
Iv/Iv(20 mA) = f(IF); TS = 25 °C
KR EELP41.22
30
IV
KR EELP41.22
1,6
IV(20mA)
1,4
25
1,2
20
1,0
0,8
15
0,6
10
0,4
5
8 | Version 1.1 | 2024-08-30
20
2,0
2,1
VF / V
15
1,9
10
1,8
5
0,0
1,7
0,
5
0,5
1,6
0,2
IF / mA
KR EELP41. 22
DATASHEET
Forward Voltage
Relative Luminous Intensity
6)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA
∆VF / V
Iv/Iv(25 °C) = f(Tj); IF = 20 mA
KR EELP41.22
0,3
6)
Iv
KR EELP41.22
1,6
Iv(25°C)
1,4
0,2
1,2
0,1
1,0
0,8
0,0
0,6
-0,1
0,4
-0,2
-0,3
-40 -20
0,2
0
20
Dominant Wavelength
40
60
80 100
Tj / °C
6)
Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 20 mA
KR EELP41.22
dom / nm
8
6
4
2
0
-2
-4
-6
-8
0
20
-10
-40 -20
9 | Version 1.1 | 2024-08-30
40
60
80 100
Tj / °C
0,0
-40 -20
0
20
40
60
80 100
Tj / °C
KR EELP41. 22
DATASHEET
Max. Permissible Forward Current
5)
IF = f(T)
KR EELP41.22
IF / mA
30
25
20
15
10
5
0
0
20
40
60
80
100
Ts / °C
Permissible Pulse Handling Capability
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TS = 25 °C
IF = f(tp); D: Duty cycle; TS = 85 °C
KR EELP41.22
KR EELP41.22
TS = 0°C ... 65°C
IF / A
0,12
0,10
TS = 105°C
IF / A 0,12
0,08
0,06
0,10
: D = 1.0
: D = 0.5
: D = 0.2
: D = 0.1
: D = 0.05
: D = 0.02
: D = 0.01
: D = 0.005
10 | Version 1.1 | 2024-08-30
0,06
0,04
: D = 1.0
: D = 0.5
: D = 0.2
: D = 0.1
: D = 0.05
: D = 0.02
: D = 0.01
: D = 0.005
0,02
0,04
10-6 10-5 10-4 10-3 0,01 0,1
0,08
1 10
Pulse time / s
10-6 10-5 10-4 10-3 0,01 0,1
1 10
Pulse time / s
KR EELP41. 22
DATASHEET
Dimensional Drawing
8)
Further Information:
Approximate Weight:
1.3 mg
Corrosion test:
Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
11 | Version 1.1 | 2024-08-30
KR EELP41. 22
DATASHEET
Electrical Internal Circuit
Recommended Solder Pad
8)
0.7 (0.028)
0.8 (0.031)
0.8 (0.031)
0.8 (0.031)
OHAPY606
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.
12 | Version 1.1 | 2024-08-30
KR EELP41. 22
DATASHEET
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
60
2
3
100
120
2
3
Unit
K/s
s
K/s
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
13 | Version 1.1 | 2024-08-30
°C
480
s
K/s
s
KR EELP41. 22
DATASHEET
Taping
8)
14 | Version 1.1 | 2024-08-30
KR EELP41. 22
DATASHEET
Tape and Reel
9)
Reel Dimensions
A
180 mm
W
Nmin
8 + 0.3 / - 0.1 mm
15 | Version 1.1 | 2024-08-30
W1
58 mm
W2 max
8.4 + 1,5 mm
14.4 mm
Pieces per PU
4000
KR EELP41. 22
DATASHEET
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
8)
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
16 | Version 1.1 | 2024-08-30
KR EELP41. 22
DATASHEET
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