18QHTF32-54.360-OE

QHTF Series MERCURY Crystal Clock Oscillators Since 1973 QHTF is one of the Mercury QuikXO family quick-turn CMOS output clock oscillators. QuikXO™ products, either standard or custom frequencies are buit-to-order and shipped from California USA in 3 to 5 days. QHTF is available in five different hermetically sealed ceramic leadless SMD packages and three supply Voltage, covers frequency range from 1.0 MHz to 200 MHz. Pin 1 can be either Tri-State high enable or power down. General Specifications: at Ta=+25°C Product Series Output Logic Type HTF Series Models Package Dimensions (mm) QHTF21 2.0x1.6x0.8 Supply Voltage (VDD) Frequency Range Current Consumption Rise / Fall Time (Tr; Tf) QHTF22 2.5x2.0x0.8 QHTF Series CMOS (code “T”) QHTF32 QHTF53 3.2x2.5x1.0 5.0x3.2x1.2 QHTF57 7.0x5.0x1.3 +1.8 V ±5% Voltage Code: “18” 1.0 ~ 125.0 MHz 20 mA typical 30 mA max. +2.5 V ±10% Voltage Code: “25” 1.0 ~ 200.0 MHz 28 mA typical 35 mA max. +3.3 V ±10% Voltage Code: “3” 1.0 ~ 200.0 MHz 30 mA typical 40 mA max. 2.0 n. sec. typical 5.0 n. sec. max. 1.4 n. sec. typical 3.0 n. sec. max. 1.1 n. sec. typical 3.0 n. sec. max. 10% ↔ 90% waveform. 15 pF load. Frequency Stability Aging at Ta=+25ºC Output Load Output Drive Strength Output High Voltage; VOH Output Low Voltage; VOL Duty Cycle ±50 ppm over -40 to +85°C. Spec. ±3 ppm (max.) the first year; ±2 ppm (max.) per year thereafter 15 pF typical 8 mA typical VDD – 0.4 V min. 0.4V max. 1.0~150.0 MHz: 50% ±5%. 150.01~200.0 MHz: 50% ±10%. At VDD /2. Start-up Time 4.5 m. sec. typical; 10 m. sec. max. Pin 1 Option: Output Enable (OE) / Disable Output Enable / Disable 70% of VDD (min.) to Enable; 30% of VDD (max.) to Disable Output Enable Time 10 n. sec. max. High Enable. Pin 1 option code: OE Output Disable Current 18 mA typical; 22 mA max. Pin 1 Option: Output Power Down (PD) Output Enable / Disable 70% of VDD (min.) to Enable; 30% of VDD (max.) to Disable Output Enable Time 4.5 m. sec. typical. 10 m. sec. max. Pin 1 option code: PD Output Enable / Disable 300 µA typical; 400 µA max. Offset 10 Hz 100 Hz MERCURY 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz www.mercury-crystal.com Taiwan: TEL (886)-2-2406-2779, e-mail: sales-tw@mercury-crystal.com U.S.A.: TEL (1)-909-466-0427, e-mail: sales-us@MercuryUnited.com MERCURY Page 1 of 4 Jan. 5, 2023 Version: a3 Single Sideband dBc / Phase Noise Hz (dBc / Hz; typical) Integrated Phase Jitter, RMS,12 kHz to 20 MHz -61 -89 -110 -119 -119 -142 -149 3.3 V: 1.0 p. sec. typical; 2.5 V: 1.1 p. sec. typical; 1.8 V: 1.5 p. sec. typical Absolute Maximum Rating: Positive Supply Voltage (VDD) Input Pin Voltage (Vin) Output Pin Voltage (Vout) Electrostatic Discharge (ESD) -0.5 V ~ 7 V w.r.t. ground -0.5 V to VDD+0.5 V -0.5 V to VDD+0.5 V Human Body Model (HBM): Exceeds 2000 V. Class 2 per MIL-STD-1686C Machine Model (MM): Exceeds 120 V. Class M2 per MIL-STD-1686C. Note: Power, ground, and outputs are 200 V. Charged-Device Model (CDM): Exceeds 2000 V. Class C6 per MIL-STD-1686C Environmental Performance Specifications Moisture Sensitivity Level RoHS compliant, Pb (lead) free per EU Directive 2002/95/EC 6/6 (2002/95/EC) and WEEE (2002/96/EC). Free of halide, cadmium, hexavalent chromium, lead, mercury, PBB’s, and PBDE’s. Level 1 per IPC/JEDEC J-STD-020D.1 Storage temperature range -55 to +125°C Humidity 85% RH, 85°C, 48 hours Fine Leak / Gross Leak MIL-Std-883, method 1014, condition A / MIL-Std-883, method 1014, condition C Solderability MIL-STD-202F method 208E Reflow 260°C for 10 sec. 2X. Vibration MIL-STD-202F method 204, 35G, 50 to 2000 Hz Shock MIL-STD-202F method 213B, test condition. E, 1000GG ½ sine wave Resistance to Solvent MIL-STD-202, method 215 Temperature Cycling MIL-STD-883, method 1010 Gold (0.3 um to 1.0 um) over nickel (1.27 um to 8.89 um) Green Requirement Pad Surface Finish Part Number Format and Examples: Example 1: 18QHTF57-25.000-PD 18 25 3 Voltage Code “18” for 1.8V “25” for 2.5V “3” for 3.3V QHTF HTF Series MERCURY Example 2: 25QHTF53-100.000-OE 57 53 32 Package Code “57”: 7.0x5.0x1.3 mm “53”: 5.0x3.2x1.2 mm “32”: 3.2x2.5x1.0 mm “22”: 2.5x2.0x0.8 mm “21”: 2.0x1.6x0.8 mm Page 2 of 4 - a dash Example 3: 3QHTF32-200.000-PD 25.000 100.000 200.000 - The nominal Frequency in a dash MHz. 3 places or more after the decimal point Jan. 5, 2023 PD OE PD Pin 1 option: “PD”: Power Down “OE”: Output Enable Version: a3 Test Circuits and Output Waveforms 𝑇1 Duty cycle=(𝑇2) ∗ 100%. Measured at 50% VDD CMOS T2 CMOS T1 VOH 90%VDD 50%VDD 10%VDD Tri-State or Power Down VOL Tr Package Dimensions and Recommended Solder Pad Layout Tf unit: (mm) QHTF21 QHTF21 QHTF32 QHTF53 QHTF57 ♦ To minimize EMI, a 10 to 100 Ω series resistor is recommended at the output signal. ♦ To improve noise immunity: Do not float pin 1. Connect it to VDD, if Tri-state or power down is not used. MERCURY Page 3 of 4 Jan. 5, 2023 Version: a3 Output OE Function on pad 1 Note: Do not leave this pad floating. If “no-connection” is desired, please contact Mercury. VDD Pad 2 Pad 1 OE Function OE function VIH VIL Enable Time Disable Time High Impedance Related Products: QHTF series is the QuikXO (quick turn) equivalent to the HTF (click to view) series, they are manufactured at different Mercury facilities using the identical designs, raw materials and production processes. Once either one is approved, Mercury recommends to include both the QuikXO and the non-QuikXO part numbers of your referenced part on your BOM to take advantage of the QuikXO short lead- times and the non-QuikXO low-cost high-volume production offerings. E.g. 1, if the QuikXO 18QHTF57-25.000-PD oscillator is qualified, then the non-QuikXO 18HTF57-ET-25.000-PD should also be on the same BOM. E.g. 2, if the QuikXO 25QHTF53-100.000-OE oscillator is qualified, then the non-QuikXO 25HTF53-ET-100.000-OE should also be on the same BOM. E.g. 3, if the QuikXO 3QHTF32-200.000-PD oscillator is qualified, then the non-QuikXO 3HTF57-ET-200.000-PD should also be on the same BOM. Recommended Solder Reflow Profile (per IPC/JEDEC J-STD-020D.1) Tp Tsmax Te m pe rat ur e TL Max. Ramp Up Rate=3°C/s Max. Ramp Down Rate=6°C/s Preheat Area t p tL Tc-5°C User Tp≤Tc Tc Tsmin Tc-5°C User tp t s 25 Time 25°C to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-free Assembly 100⁰C 150⁰C 60 to 120 seconds 3⁰C / sec. max. 150⁰C 200⁰C 60 to 180 seconds 3⁰C / sec. max. Peak package body temperature (Tp) 183⁰C 60 to 150 seconds 235⁰C 217⁰C 60 to 150 seconds 260⁰C Time (Tp) within 5⁰C of the classification temperature Tc 10 to 30 seconds 20 to 40 seconds Ramp-down rate (Tp to TL) 6⁰C / second max. 6⁰C / second max. Time 25⁰C to peak temperature 6 minutes max. 8 minutes max. Preheat/Soak - Temperature min. (Ts min.) - Temperature max. (Ts max.) - Time (ts) (Ts min. to Ts max.) Ramp-up rate (TL to Tp) Liquidous temperature ( TL ) Time (tL) maintained above TL All temperatures refer to the topside of the package, measured on the package body surface. MERCURY Page 4 of 4 Jan. 5, 2023 Version: a3