MBRB41H100CTT4G-FS

MBRB41H100CTT4G-FS MBRB41H100CTT4G-FS MBRB41H100CTT4G-FS MBRB41H100CTT4G-FS 2 1 MBRB41H100CTT4G-FS 3 MBRB41H100CTT4G-FS Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o