001
SSM6J08FU-VB
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SSM6J08FU-VB Datasheet
P-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 20
RDS(on) ()
ID (A)a
0.034 at VGS = - 4.5 V
-4
0.045 at VGS = - 2.5 V
-4
0.067 at VGS = - 1.8 V
-4
Qg (Typ.)
12.5 nC
• Halogen-free According to IEC 61249-2-21
Definition
• Trench Power MOSFET
• 100 % Rg Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Load Switch for Portable Devices
SOT-363
SC-70 (6-LEADS)
D
1
6
D
D
2
5
D
G
3
4
S
- Cellular Phone
- DSC
- Portable Game Console
- MP3
- GPS
Top View
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Limit
Symbol
Drain-Source Voltage
VDS
- 20
Gate-Source Voltage
VGS
± 12
TC = 70 °C
TA = 25 °C
-4
ID
- 4a, b, c
- 4a, b, c
TA = 70 °C
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
TA = 25 °C
- 2.3
IS
- 1.3b, c
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
2.8
1.8
PD
W
1.6b, c
1.0b, c
TA = 70 °C
Operating Junction and Storage Temperature Range
A
- 25
IDM
TC = 25 °C
V
- 4a
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
Unit
TJ, Tstg
- 55 to 150
°C
260
Soldering Recommendations (Peak Temperature)
THERMAL RESISTANCE RATINGS
Symbol
Typical
Maximum
Maximum Junction-to-Ambientb, d
t5s
RthJA
60
80
Maximum Junction-to-Foot (Drain)
Steady State
RthJF
34
45
Parameter
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 125 °C/W.
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SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
- 20
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS/TJ
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
VGS(th)/TJ
Gate-Source Threshold Voltage
VGS(th)
Gate-Source Leakage
IGSS
ID = - 250 µA
VDS = VGS, ID = - 250 µA
V
- 11
mV/°C
2.6
- 0.4
-1
VDS = 0 V, VGS = ± 10 V
±8
VDS = 0 V, VGS = ± 4.5 V
±1
VDS = - 20 V, VGS = 0 V
-1
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
VDS - 5 V, VGS = - 10 V
RDS(on)
VGS = - 2.5 V, ID = - 4.4 A
0.045
VGS = - 1.8 V, ID = - 1 A
0.067
VDS = - 10 V, ID = - 5 A
16
VDS = - 20 V, VGS = 0 V, TJ = 55 °C
Forward Transconductancea
gfs
µA
- 10
- 15
VGS = - 4.5 V, ID = - 5 A
Drain-Source On-State Resistancea
V
A
0.034
S
Dynamicb
Total Gate Charge
Gate-Source Charge
Qg
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
VDS = - 10 V, VGS = - 8 V, ID = - 5 A
VDS = - 10 V, VGS = - 4.5 V, ID = - 5 A
22
33
12.5
19
1.8
3.3
f = 1 MHz
0.08
0.43
0.86
150
225
300
450
1620
2430
tf
560
840
td(on)
50
100
td(on)
tr
td(off)
tr
td(off)
nC
VDD = - 10 V, RL = 1.4
ID - 4 A, VGEN = - 4.5 V, Rg = 1
VDD = - 10 V, RL = 1.4
ID - 4 A, VGEN = - 10 V, Rg = 1
tf
90
180
2500
3750
600
900
k
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
TC = 25 °C
- 2.3
- 25
IS = - 4 A, VGS = 0 V
IF = - 4 A, dI/dt = 100 A/µs, TJ = 25 °C
A
- 0.85
- 1.2
V
18
36
ns
8
16
nC
18
10
ns
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.1
10-4
10-5
IGSS - Gate Current (A)
IGSS - Gate Current (mA)
0.08
0.06
0.04
0.02
TJ = 150 °C
10-6
10-7
TJ = 25 °C
10-8
10-9
10-10
0
0
3
6
9
12
15
0
3
VGS - Gate-Source Voltage (V)
6
9
12
15
VGS - Gate-Source Voltage (V)
Gate Current vs. Gate-Source Voltage
Gate Current vs. Gate-Source Voltage
25
5
V GS = 5 V thru 3 V
V GS = 2.5 V
4
ID - Drain Current (A)
ID - Drain Current (A)
20
15
V GS = 2 V
10
T C = 25 °C
2
T C = 125 °C
V GS = 1.5 V
5
3
1
T C = - 55 °C
0
0
0
0.5
1.0
1.5
2.0
2.5
0
0.5
1.0
1.5
2.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
8
0.10
V GS = 1.8 V
VGS - Gate-to-Source Voltage (V)
RDS(on) - On-Resistance (Ω)
ID = 5 A
0.08
V GS = 2.5 V
0.06
V GS = 4.5 V
0.04
0.02
6
V DS = 5 V
V DS = 10 V
4
V DS = 16 V
2
0
0
0
5
10
15
20
ID - Drain Current (A)
On-Resistance vs. Drain Current
25
0
5
10
15
20
25
Qg - Total Gate Charge (nC)
Gate Charge
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.5
100
IS - Source Current (A)
1.3
(Normalized)
RDS(on) - On-Resistance
V GS = - 4.5 V; ID = - 5 A
V GS = - 2.5 V;
ID = - 4.4 A
1.1
T J = 150 °C
10
T J = 25 °C
1
0.9
0.7
- 50
0.1
- 25
0
25
50
75
100
125
150
0
1.0
0.5
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
0.10
0.90
0.08
0.75
ID = - 250 μA
VGS(th) (V)
RDS(on) - On-Resistance (Ω)
ID = - 5 A
0.06
T J = 125 °C
0.04
0.45
T J = 25 °C
0.02
1
2
3
4
0.60
0.30
- 50
5
- 25
0
VGS - Gate-to-Source Voltage (V)
25
50
75
100
125
150
TJ - Temperature (°C)
On-Resistance vs. Gate-to-Source Voltage
Single Pulse Power, Junction-to-Ambient
100
30
Limited by RDS(on) *
24
ID - Drain Current (A)
Power (W)
10
18
12
100 μs
1 ms
1
10 ms
100 ms
1 s, 10 s
DC
0.1
6
0
0.001
TA = 25 °C
Single Pulse
0.01
0.1
Time (s)
Threshold Voltage
1
10
0.01
0.1
BVDSS Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
8
ID - Drain Current (A)
6
Package Limited
4
2
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
4
1.2
3
0.9
Power (W)
Power (W)
Current Derating*
2
1
0.6
0.3
0
0.0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power Derating, Junction-to-Foot
Power Derating, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
0.02
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 125 °C/W
3. TJM - TA = PDMZthJA (t)
Single Pulse
0.01
10-4
10
4. Surface Mounted
-3
10
-2
-1
10
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
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SCĆ70:
6ĆLEADS
MILLIMETERS
6
5
Dim
A
A1
A2
b
c
D
E
E1
e
e1
L
4
E1 E
1
2
3
-B-
e
b
e1
D
-Ac
A2 A
L
A1
INCHES
Min
Nom
Max
Min
Nom
Max
0.90
–
1.10
0.035
–
0.043
–
–
0.10
–
–
0.004
0.80
–
1.00
0.031
–
0.039
0.15
–
0.30
0.006
–
0.012
0.10
–
0.25
0.004
–
0.010
1.80
2.00
2.20
0.071
0.079
0.087
1.80
2.10
2.40
0.071
0.083
0.094
1.15
1.25
1.35
0.045
0.049
0.053
0.65BSC
0.026BSC
1.20
1.30
1.40
0.047
0.051
0.055
0.10
0.20
0.30
0.004
0.008
0.012
7_Nom
7_Nom
ECN: S-03946—Rev. B, 09-Jul-01
DWG: 5550
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RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
0.067
0.026
(0.648)
0.045
(1.143)
0.096
(2.438)
(1.702)
0.016
0.026
0.010
(0.406)
(0.648)
(0.241)
Recommended Minimum Pads
Dimensions in Inches/(mm)
8
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www.VBsemi.com
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