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SFH405

SFH405

  • 厂商:

    AMSOSRAM(艾迈斯半导体)

  • 封装:

    DIP

  • 描述:

    EMITTERIR950NM40MARADIAL

  • 数据手册
  • 价格&库存
SFH405 数据手册
GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 405 Wesentliche Merkmale • • • • • GaAs-IR-Lumineszenzdiode Hohe Zuverlässigkeit Gruppiert lieferbar Gehäusegleich mit SFH 305 Miniatur-Gehäuse Features • • • • • GaAs infrared emitting diode High reliability Available in groups Same package as SFH 305 Miniature package Anwendungen • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb • Barcodeleser • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Drehzahlsteuerung Typ Type SFH 405 Bestellnummer Ordering Code Q62702P0835 Applications • • • • • • Miniature photointerrupters Barcode readers Industrial electronics For control and drive ciruits Sensor technology Speed controller Gehäuse Package Miniatur-Leiterbandgehäuse, klares Epoxy-Gießharz, linsenförmig, Anschluß im 2.54-mm-Raster (1/10’’), Kathodenkennzeichnung: abgeschrägte Anschlüsse Miniature lead frame, transparent epoxy resin, solder tabs lead spacing 2.54 mm (1/10’’), cathode marking: bevelled leads 2007-03-30 1 SFH 405 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stoßstrom, τ ≤ 10 μs, D = 0 Surge current Verlustleistung Power dissipation Wärmewiderstand Thermal resistance Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 40 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 50 mA, tp = 20 ms Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimensions of the active chip area Abstand Chipoberfläche bis Linsenscheitel Distance chip surface to lens top Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 40 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to10%, IF = 40 mA, RL = 50 Ω 2007-03-30 Symbol Symbol Wert Value – 40 … + 80 5 40 1.6 65 950 850 Einheit Unit °C V mA A mW K/W K/W Top; Tstg VR IF IFSM Ptot RthJA RthJL Symbol Symbol λpeak Wert Value 950 Einheit Unit nm Δλ 55 nm ϕ ± 16 0.25 0.5 × 0.5 1.3 … 1.9 1 Grad deg. mm2 mm mm μs A L×B L×W H tr , tf 2 SFH 405 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Kapazität, Capacitance VR = 0 V, f = 1 MHz Durchlassspannung Forward voltage IF = 40 mA Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 40 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. Φe, IF = 40 mA Temperature coefficient of Ie or Φe, IF = 40 mA Temperaturkoeffizient von VF, IF = 40 mA Temperature coefficient of VF, IF = 40 mA Temperaturkoeffizient von λpeak, IF = 40 mA Temperature coefficient of λpeak, IF = 40 mA Symbol Symbol Wert Value 40 Einheit Unit pF Co VF 1.25 (≤ 1.4) V IR 0.01 (≤ 1) μA Φe 7 mW TCI – 0.55 %/K TCV TCλ – 1.5 + 0.3 mV/K nm/K Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 40 mA, tp = 20 ms Symbol Werte Values Einheit Unit Ie 2.5 (> 1.6) mW/sr 2007-03-30 3 SFH 405 Relative Spectral Emission Irel = f (λ) 100 % OHRD1938 Radiant Intensity Ιe = f (IF) Ιe 100 mA OHR01039 Single pulse, tp = 20 μs Ιe 10 2 Max. Permissible Forward Current IF = f (TA) 50 OHR00672 Ι e (100 mA) Ι F mA 40 Ι rel 80 10 1 60 30 R thJL = 850 K/W 40 20 10 0 R thJA = 950 K/W 20 10 0 880 920 960 1000 nm 1060 10 -1 10 -2 10 -1 10 0 λ A ΙF 10 1 0 0 20 40 60 80 ˚C 100 TA, TL Forward Current IF = f (VF), Single pulse, tp = 20 μs 10 1 A OHR01042 Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter 10 1 OHR02183 ΙF ΙF A D = 0,005 0,01 0,02 10 0 0,05 0,1 0,2 τ D= τ T T ΙF 10 0 typ. max. 10 -1 10 -1 0,5 DC 10 -2 1 1.5 2 2.5 3 3.5 4 V 4.5 VF 10 -2 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 τ 10 1 Radiation Characteristics Ιrel = f (ϕ) 40 30 20 10 0 1.0 OHR01886 ϕ 50 0.8 60 0.6 70 0.4 80 90 0.2 0 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 2007-03-30 4 SFH 405 Maßzeichnung Package Outlines 1) 2.7 2.5 3.6 3.2 2.1 1.5 Collector (SFH 305) Cathode (SFH 405) 1.15 0.90 2.84 2.24 0.5 0.4 0...5˚ 2.54 spacing 1) Detaching area for tools, flash not true to size. 3.5 3.0 GEO06137 Maße in mm (inch) / Dimensions in mm (inch). 2007-03-30 5 3.0 2.5 SFH 405 Lötbedingungen Soldering Conditions Wellenlöten (TTW) TTW Soldering 300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s 10 s (nach CECC 00802) (acc. to CECC 00802) OHLY0598 Normalkurve standard curve Grenzkurven limit curves 0 0 50 100 150 t 200 s 250 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-03-30 6
SFH405 价格&库存

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