SFH4259

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4258 SFH 4259 Wesentliche Merkmale • • • • • Infrarot LED mit hoher Ausgangsleistung Emissionswellenlänge typ. 850 nm Halbwinkel SFH 4258: ± 15° Halbwinkel SFH 4259: ± 25° Hohe Bestromung bei hohen Temperaturen möglich Features • • • • • High Power Infrared LED Peak wavelength typ. 850 nm Half angle SFH 4258: ± 15° Half angle SFH 4259: ± 25° High forward current allowed at high temperature Anwendungen • Infrarotbeleuchtung für CMOS Kameras • IR-Datenübertragung • Sensorik Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Typ Type SFH 4258 SFH 4259 1) Applications • Infrared Illumination for CMOS cameras • IR Data Transmission • Optical sensors Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Bestellnummer Ordering Code Q65110A2975 Q65110A2464 Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) ≥ 40 (typ. 90) ≥ 25 (typ. 55) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device 2007-04-25 1 SFH 4258, SFH 4259 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Vorwärtsgleichstrom Forward current Stoßstrom, tp = 100 µs, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value – 40 … + 100 5 100 1.5 180 300 Einheit Unit °C V mA A mW K/W Top , Tstg VR IF IFSM Ptot Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle SFH 4258 SFH 4259 Aktive Chipfläche Active chip area Symbol Symbol λpeak 140 K/W Wert Value 850 Einheit Unit nm ∆λ 35 nm ϕ ϕ ± 15 ± 25 0.09 Grad deg. mm2 A 2007-04-25 2 SFH 4258, SFH 4259 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Abmessungen der aktiven Chipfläche Dimension of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Symbol Symbol Wert Value 0.3 × 0.3 12 Einheit Unit mm² ns L×B L×W tr , tf VF VF IR 1.5 (< 1.8) 2.4 (< 3.0) V V not designed for µA reverse operation 45 mW Φe typ Temperaturkoeffizient von Ie bzw. Φe, TCI IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA – 0.5 %/K TCV TCλ – 0.7 + 0.2 mV/K nm/K 2007-04-25 3 SFH 4258, SFH 4259 Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol SFH 4258 -U Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1A, tp = 100 µs Ie min Ie max Ie typ. 40 80 400 Werte Values SFH 4258 -V 63 125 600 SFH 4258 -AW 100 200 800 mW/sr mW/sr mW/sr Einheit Unit SFH 4259 -T Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1A, tp = 100 µs 1) SFH 4259 -U 40 80 350 mW/sr mW/sr mW/sr Ie min Ie max Ie typ. 25 50 250 Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1) 2007-04-25 4 SFH 4258, SFH 4259 Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) SFH 4258 40˚ 30˚ 20˚ 10˚ ϕ 0˚ 1.0 OHL00021 50˚ 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 90˚ 100˚ 1.0 0.8 0.6 0.4 0 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 0 Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) SFH 4259 50˚ 0.8 60˚ 40˚ 30˚ 20˚ 10˚ 0˚ 1.0 OHL00999 ϕ 0.6 70˚ 0.4 0.2 0 80˚ 90˚ 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 2007-04-25 5 SFH 4258, SFH 4259 Relative Spectral Emission Irel = f (λ) 100 % OHL01714 Radiant Intensity Ie = f (IF) Ie 100 mA OHL01715 Single pulse, tp = 20 µs 101 Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W 120 mA OHL01716 Ie I e (100 mA) I rel 80 I F 100 80 100 5 60 10-1 40 60 5 40 10 20 -2 5 20 0 700 750 800 850 nm 950 10-3 0 10 5 10 1 5 10 2 mA 10 3 0 0 20 40 60 80 ˚C 120 λ IF TA Forward Current IF = f (VF) Single pulse, tp = 20 µs 10 0 A OHL01713 Permissible Pulse Handling Capability IF = f (τ), TA ≤ 65 °C, duty cycle D = parameter 1.6 IF A 1.4 1.2 1.0 OHF02505 IF D = TP t tP IF T 10 -1 5 D= 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 10 -2 5 0.8 0.6 10 -3 5 0.4 0.2 10 -4 0 0.5 1 1.5 2 2.5 V 3 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 VF tp 2007-04-25 6 SFH 4258, SFH 4259 Maßzeichnung Package Outlines SFH 4258 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 0.8 (0.031) 0.6 (0.024) 3 4 3.8 (0.150) max. 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 4˚±1 ø2.60 (0.102) 0.18 (0.007) 0.13 (0.005) 0.6 (0.024) 0.4 (0.016) 0.1 (0.004) typ 1.1 (0.043) Package marking 0.5 (0.020) 2 1 GPLY6127 SFH 4259 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 3 4 3.5 (0.138) max. 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 4˚±1 ø2.60 (0.102) 0.18 (0.007) 0.13 (0.005) 0.6 (0.024) 0.4 (0.016) 0.1 (0.004) typ 1.1 (0.043) Package marking 0.5 (0.020) 2 1 GPLY6128 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Anschlussbelegung pin configuration Topled mit Linse, klarer Verguss / Topled with lens, clear resin 1 = Kathode / cathode 2/3/4 = Anode / anode 2007-04-25 7 ø2.55 (0.100) (2.4) (0.095) 3.4 (0.134) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) ø2.55 (0.100) (2.4) (0.095) 3.4 (0.134) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) SFH 4258, SFH 4259 Empfohlenes Lötpaddesign Recommended Solder Pad Design Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation 2.3 (0.091) 0.8 (0.031) Reflow Löten Reflow Soldering 3.3 (0.130) 3.3 (0.130) 1.1 (0.043) 0.7 (0.028) _ Cu Fläche / < 16 mm 2 per pad Cu-area Lötstoplack Solder resist 11.1 (0.437) OHFP3021 3.7 (0.146) Empfohlenes Lötpaddesign Recommended Solder Pad Design 6.1 (0.240) 2.8 (0.110) 2 (0.079) 1.5 (0.059) Wellenlöten TTW TTW Soldering 2 (0.079) 3 (0.118) 2 (0.079) 2.8 (0.110) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation 0.5 (0.020) Cu Fläche / > 16 mm 2 per pad Cu-area Lötstoplack Solder resist Bewegungsrichtung der Platine PCB-direction OHPY3040 2007-04-25 6 (0.236) 1 (0.039) 8 SFH 4258, SFH 4259 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering 300 ˚C 255 ˚C 240 ˚C 217 ˚C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 ˚C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 T 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile ˚C 260 ˚C +0˚C -5 245 ˚C ±5 ˚C ˚C 235 ˚C +5˚C -0 50 t Wellenlöten (TTW) TTW Soldering 300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s (nach CECC 00802) (acc. to CECC 00802) OHLY0598 10 s Normalkurve standard curve Grenzkurven limit curves 0 0 50 100 150 t 200 s 250 2007-04-25 9 SFH 4258, SFH 4259 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-25 10