SFH4511

GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4511 Wesentliche Merkmale • • • • • • GaAs-LED mit sehr hohem Wirkungsgrad 5mm Kunststoffgehäuse Peakwellenlänge 950 nm Sehr enger Abstrahlwinkel (± 4°) Hohe Strahlstärke Hohe Zuverlässigkeit Features • • • • • • Very highly efficient GaAs-LED 5mm plastic package Peak Wavelength 950 nm Very narrow radiation Angle (± 4 Deg.) High radiant intensity High reliability Anwendungen • IR-Fernsteuerung von Fernseh- und Rundfunkgeräten, Videorecordern, Lichtdimmern • Gerätefernsteuerungen für Gleich- und Wechsellichtbetrieb • Sensorik • Diskrete Lichtschranken Typ Type SFH 4511 1) Applications • IR remote control of hi-fi and TV-sets, video tape recorders, dimmers • Remote control for steady and varying intensity • Sensor technology • Discrete interrupters Bestellnummer Ordering Code Q62703Q5557 Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping 1) Ie (mW/sr) > 63 (typ. 150) gemessen bei einem Raumwinkel Ω = 0.001 sr / measured at a solid angle of Ω = 0.001 sr 2005-02-25 1 SFH 4511 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stoßstrom, tp = 10 µs, D = 0 Surge current Verlustleistung Power dissipation Wärmewiderstand Thermal resistance Symbol Symbol Wert Value – 40 … + 100 5 100 3 165 450 Einheit Unit °C V mA A mW K/W Top; Tstg VR IF IFSM Ptot RthJA Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimensions of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω Symbol Symbol λpeak Wert Value 950 Einheit Unit nm ∆λ 55 nm ϕ ±4 0.09 0.3 × 0.3 0.5 Grad deg. mm2 mm µs A L×B L×W tr, tf 2005-02-25 2 SFH 4511 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Kapazität, Capacitance VR = 0 V, f = 1 MHz Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA Symbol Symbol Wert Value 25 Einheit Unit pF Co VF VF IR 1.3 (≤ 1.5) 2.3 (≤ 2.8) 0.01 (≤ 1) V V µA Φe 22 mW Ie typ. 1200 mW/sr TCI – 0.5 %/K TCV TCλ –2 + 0.3 mV/K nm/K 2005-02-25 3 SFH 4511 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.001 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.001 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Symbol Wert Value 63 150 Einheit Unit mW/sr mW/sr Ie min. Ie typ. Ie typ. 1200 mW/sr 2005-02-25 4 SFH 4511 Relative Spectral Emission Irel = f (λ) 100 % OHRD1938 Radiant Intensity Ιe = f (IF ) Ιe 100 mA OHR01551 Single pulse, tp = 20 µs Ιe Ι e 100 mA 10 2 A Max. Permissible Forward Current IF = f (T A ) 120 OHR00883 Ι F mA 100 Ι rel 80 10 1 80 60 R thjA = 450 K/W 10 0 60 40 40 10 -1 20 20 0 880 920 960 1000 nm 1060 λ 10 -2 10 -3 0 10 -2 10 -1 10 0 A ΙF 10 1 0 20 40 60 80 100 ˚C 120 TA Forward Current IF = f (VF), single pulse, tp = 20 µs 10 1 OHR01554 Radiation Characteristics, Ιrel = f (ϕ) 40˚ 30˚ 20˚ ϕ 10˚ 0˚ 1.0 OHF01142 ΙF A 50˚ 10 0 0.8 60˚ 0.6 10 -1 70˚ 0.4 10 -2 80˚ 90˚ 0.2 0 10 -3 0 1 2 3 4 5 6 V VF 8 100˚ 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C duty cycle D = parameter 10 4 OHR00860 Ι F mA 5 D = 0.005 0.01 tp D= tp T T ΙF 0.02 10 3 0.1 0.2 0.05 5 0.5 DC 10 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp 2005-02-25 5 SFH 4511 Maßzeichnung Package Outlines 9.0 (0.354) 8.2 (0.323) Area not flat 7.8 (0.307) 7.5 (0.295) 5.9 (0.232) 5.5 (0.217) ø5.1 (0.201) 1.8 (0.071) 1.2 (0.047) 29 (1.142) 27 (1.063) 2.54 (0.100) spacing 0.8 (0.031) 0.4 (0.016) 0.6 (0.024) 0.4 (0.016) ø4.8 (0.189) 5.7 (0.224) 5.1 (0.201) Chip position 0.6 (0.024) 0.4 (0.016) Cathode GEXY6051 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Package Colour 5 mm radial (T 1 3/4) black 2005-02-25 6 SFH 4511 Empfohlenes Lötpaddesign Recommended Solder Pad Wellenlöten (TTW) TTW Soldering 4 (0.157) OHLPY985 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2005-02-25 4.8 (0.189) 7 SFH 4511 Lötbedingungen Soldering Conditions Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) 300 C T 250 235 C ... 260 C OHLY0598 10 s Normalkurve standard curve 2. Welle 2. wave Grenzkurven limit curves 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s 0 0 50 100 150 t 200 s 250 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2005-02-25 8