GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant LD 261
Wesentliche Merkmale • • • • • GaAs-IR-Lumineszenzdiode Hohe Zuverlässigkeit Gruppiert lieferbar Gehäusegleich mit BPX 81 Miniatur-Gehäuse
Features • • • • • GaAs infrared emitting diode High reliability Available in bins Same package as BPX 81 Miniature package
Anwendungen • Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb • Barcodeleser • Industrieelektronik • „Messen/Steuern/Regeln“ • Sensorik • Drehzahlsteuerung Typ Type LD 261 LD 261-5/6 Bestellnummer Ordering Code Q62703Q0395 Q65110A3337
Applications • • • • • • Miniature photointerrupters Barcode readers Industrial electronics For control and drive circuits Sensor technology Speed controller
Gehäuse Package Leiterbandgehäuse, klares Epoxy-Gießharz, linsenförmig im 2.54-mm-Raster (1/10’’), Kathodenkennzeichnung: Nase am Lötspieß Lead frame, transparent epoxy resin lens, solder tabs lead spacing 2.54 mm (1/10’’), cathode marking: projection at solder lead
2007-03-30
1
LD 261
Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrschichttemperatur Junction temperature Sperrspannung Reverse voltage Durchlassstrom Forward current Stoßstrom, τ ≤ 10 μs, D = 0 Surge current Verlustleistung Power dissipation Wärmewiderstand Thermal resistance Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission IF = 50 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 50 m A, tp = 20 ms Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimension of the active chip area Abstand Chipoberfläche bis Linsenscheitel Distance chip surface to lens top Symbol Symbol λpeak Wert Value 950 Einheit Unit nm Symbol Symbol Wert Value – 40 … + 80 80 5 50 1.6 70 750 650 Einheit Unit °C °C V mA A mW K/W K/W
Top; Tstg Tj VR IF IFSM Ptot RthJA RthJL
Δλ
55
nm
ϕ
± 15 0.25 0.5 × 0.5 1.3 … 1.9
Grad deg. mm 2 mm² mm
A L×B L×W H
2007-03-30
2
LD 261
Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 50 mA, RL = 50 Ω Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 50 mA, RL = 50 Ω Kapazität, VR = 0 V Capacitance Durchlassspannung Forward voltage IF = 50 mA, tp = 20 μs Sperrstrom, VR = 5 V Reverse current Gesamtstrahlungsfluss Total radiant flux IF = 50 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. Φe, IF = 50 mA Temperature coefficient of Ie or Φe, IF = 50 mA Temperaturkoeffizient von VF, IF = 50 mA Temperature coefficient of VF, IF = 50 mA Temperaturkoeffizient von λpeak, IF = 50 mA Temperature coefficient of λpeak, IF = 50 mA Symbol Symbol Wert Value 1 Einheit Unit μs
tr , tf
Co
40
pF
VF IR
Φe
1.25 (≤ 1.4) 0.01 (≤ 1) 9
V μA mW
TCI
– 0.55
%/K
TCV TCλ
– 1.5 0.3
mV/K nm/K
Gruppierung der Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel Ω = 0.01 sr Grouping of radiant intensity Ie in axial direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Strahlstärke Radiant intensity IF = 50 mA, tp = 20 ms Symbol LD 261 Werte Values LD 261-5 LD 261-6 Einheit Unit
Ie
2 … 10
3.2 … 6.3
5 … 10
mW/sr
2007-03-30
3
LD 261
Relative Spectral Emission Irel = f (λ)
100 %
OHRD1938
Radiant Intensity
Ιe = f (IF) Ιe 100 mA
OHR01039
Single pulse, tp = 20 μs
Ιe
10 2
Max. Permissible Forward Current IF = f (TA)
80 Ι F mA 70 60
OHR01124
Ι e (100 mA)
Ι rel
80
10 1
60
50 40
40
R thJL = 650 K/W
10 0
20
30 R thJA = 750 K/W 20 10
0 880
920
960
1000
nm
1060
λ
10 -1 10 -2
10 -1
10 0
A ΙF
10 1
0
0
20
40
60
80 C 100 TA , TL
Forward Current IF = f (VF), single pulse, t p = 20 μ s
ΙF
10 1 A
OHR01042
Permissible Pulse Handling Capability IF = f (τ), TC = 25 °C, duty cycle D = parameter
10 4
OHR02182
Ι F mA
D=0 0,005 0,01 0,02
τ
D= τ T T
ΙF
10 0
typ.
max.
10 3 0,05 0,1 0,2
10 -1
10 2
0,5 DC
10 -2
1
1.5
2
2.5
3
3.5
4 V 4.5 VF
10 1 -5 10
10 -4
10 -3
10 -2
10 -1 s 10 0 τ
Radiation Characteristics Irel = f (ϕ)
40 30 20 10 0 1.0
OHR01878
ϕ
50
0.8 60
0.6
70
0.4
80 90
0.2 0
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
2007-03-30
4
LD 261
Maßzeichnung Package Outlines
2.7 (0.106) 2.5 (0.098)
2.4 (0.094) 2.1 (0.083)
3.5 (0.138)
0.7 (0.028) 0.6 (0.024)
0.25 (0.010) 0.15 (0.006) 0 ... 5˚
2.1 (0.083)
1.5 (0.059) A 2.54 (0.100) spacing 0.4 A Radiant sensitive area (0.4 x 0.4) 1.4 (0.055) 1.0 (0.039) Collector (BPX 81) Cathode (LD 261) 1) Detaching area for tools, flash not true to size. Approx. weight 0.03 g
GEOY6021
Maße in mm (inch) / Dimensions in mm (inch).
2007-03-30
5
3.0 (0.118)
0.5 (0.020) 0.4 (0.016)
1.9 (0.075) 1.7 (0.067)
3.6 (0.142) 3.2 (0.126)
Chip position
LD 261
Lötbedingungen Soldering Conditions Wellenlöten (TTW) TTW Soldering
(nach CECC 00802) (acc. to CECC 00802)
300 C T 250 235 C ... 260 C
OHLY0598
10 s
Normalkurve standard curve 2. Welle 2. wave Grenzkurven limit curves
200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling ca 200 K/s 5 K/s 2 K/s
0 0 50 100 150 t 200 s 250
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2007-03-30
6
