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MPL1608S4R7MHT

MPL1608S4R7MHT

  • 厂商:

    SUNLORD(顺络)

  • 封装:

    0603

  • 描述:

    功率电感 4.7µH ±20% 0603 0.80mm 1.60 x 0.80mm 450mΩ

  • 数据手册
  • 价格&库存
MPL1608S4R7MHT 数据手册
Sunlord Specifications for Multi-layer Chip Power Inductor Page 1 of 9 S P E C I F I C AT I O N S Customer Product Name Multi-layer Chip Power Inductor Sunlord Part Number MPL1608S4R7MHT Customer Part Number [ New Released, Revised] SPEC No.: MPL081900030 Rev. Effective Date Changed Contents Change Reasons Approved By 01 Jun.11,2019 New release / Hai Guo 【This SPEC is total 9 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafu Industrial Zone, Baoan, Shenzhen, China 518110 Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Date: Restricted Rejected Re-checked By Checked By Sunlord Specifications for Multi-layer Chip Power Inductor Page 2 of 9 Caution All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc. 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord 1. Specifications for Multi-layer Chip Power Inductor Page 3 of 9 Scope This specification applies to MPL1608S4R7MHT of multi-layer chip power inductors 2. Product Description and Identification (Part Number) 1) Description MPL1608S4R7MHT of multi-layer chip power inductors. 2) Product Identification (Part Number) MPL 1608 S 4R7 M H T ② ③ ④ ⑤ ⑥ ⑦ ① ②External Dimensions (L x W) (mm) ①Type MPL Chip Power Inductor 1608 [0603] 1.6 × 0.8 ③Feature Type S Standard ④Nominal Inductance Example Nominal Value 4R7 4.7μH ⑤Inductance Tolerance M ±20% ⑦Packing ⑥Thickness H 3. T 0.9 mm Tape Carrier Package Electrical Characteristics Temperature Part Number MPL1608S4R7MHT 4. L Test Freq. S.R.F DCR Rise Current Current (μH) (MHz) Min. (MHz) (Ω) IDC1(mA.) IDC2 (mA) (max.) (Typ.) 4.7 1 40 0.45±25% 620 100 1) Operating and storage temperature range (individual chip without packing): -40℃ ~ +85℃ 2) Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.) Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table 4-1. 2) Structure: See Fig. 4-3 and Fig. 4-4. Solder-resist Chip inductor C Land pattern B Fig. 4-1 Type L [Table 4-1] W A B Fig. 4-2 T Unit: mm [inch] a 1608 1.60±0.15 0.8±0.15 0.8±0.15 0.3±0.2 [0603] [.063±.006] [.031±.006] [.031±.006] [.012±.008] T Structure of B C 0.6~0.8 0.6~0.8 0.6~0.8 ② Internal electrode (Ag) T a Ferrite Sn ④-2 Outside (Electro-plating Ni-Sn) ④-1 ③ Fig. 4-3 ③ Pull out electrode( Ag) ④-1 Terminal electrode: Inside (Ag) Ni W ④-2 ② A ① Ferrite for MPL Series Electro-plating L a ① Saturation L Ag ④ Fig. 4-4 Sunlord 3) Specifications for Multi-layer Chip Power Inductor Page 4 of 9 Material Information: See Table 4-2. [Table 4-2] 5. Code Part Name Material Name ① Ferrite Body Ferrite Powder ② Inner Coils Silver Paste ③ Pull-out Electrode (Ag) Silver Paste ④-1 Terminal Electrode: Inside Ag Termination Silver Composition ④-2 Electro-Plating: Ni/Sn plating Plating Chemicals Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 kPa to 106 kPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106 kPa 5.2 Visual Examination a. Inspection Equipment: 20× magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Item 3. b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent. 5.3.2 Inductance (L) a. Refer to Item 3. b. Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent. c. Test signal: -20dBm or 50mV. d. Test frequency refers to Item 3. 5.3.3 Temperature Rise Current(IDC1) a. Refer to Item 3. b. Test equipment (see Fig. 5.3.3-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 5.3.3-1): 1. Set test current to be 0 mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. 4. Definition of Temperature Rise Current(IDC1): IDC1 is direct electric current as chip surface temperature rose just 40℃ against chip initial surface temperature (Ta) (see Fig. 5.3.3-2) Thermometer Electric Power Temperature (℃) Electric Current Meter Chip +40 Ta R I (mA) 0 Fig. 5.3.3-1 IDC1 Fig. 5.3.3-2 Sunlord Specifications for Multi-layer Chip Power Inductor Page 5 of 9 5.3.4 Saturation Current(IDC2) a. Refer to Item 3. b. Test equipment: HP6632B system DC power supply, HP4291B+HP16192A+HP16200A or equivalent. c. Measurement method: 1. Measurement conditions of initial inductance L: Measuring Frequency: 1MHz. Test Current: 1mA. 2. Raising the voltage of the DC power supply, measure the inductance at the various current. The rated current is the value of DC current at which the inductance will be 30% down compared with the initial inductance value. Note: In the period of raising voltage, voltage cannot be reduced. 3. Definition of Saturation Current(IDC2): IDC2 is the value of DC current as inductance L (μH) decreased just 30% against initial value (see Fig. 5.3.4-1). +L0 70% L0 0 IDC2 I (mA) Fig. 5.3.4-1 5.3.5Self-Resonant Frequency (SRF) a. Refer to Item 3. b. Test equipment: High Accuracy RF Impedance /Material Analyzer-HP4291B+HP16192A or equivalent. c. Test signal: -20dBm or 50 mV. Sunlord Specifications for Multi-layer Chip Power Inductor Page 6 of 9 5.4 Reliability Test Items Requirements Test Methods and Remarks 5.4.1 No removal or split of the termination or other defects Terminal shall occur. ① Solder the inductor to the testing jig (glass epoxy board shown in Fig.5.4.1-1) using eutectic solder. Then apply a Strength 10N force in the direction of the arrow. Chip F Mounting Pad ② Keep time: 10±1s. ③ Speed: 1.0mm/s. ① Solder the inductor to the test jig (glass epoxy board shown Glass Epoxy Board Fig.5.4.1-1 5.4.2 No visible mechanical damage. Resistance in Fig.5.4.2-1) Using a eutectic solder. Then apply a force in Unit: mm [inch] to Flexure the direction shown Fig. 5.4.2-2. ② Flexure: 2mm. Type a b c ③ Pressurizing Speed: 0.5mm/sec. 1608[0603] 1.0 3.0 1.2 ④ Keep time: 30 sec. 20 10 R230 Φ4.5 b Flexure 40 c a 45[1.772] 45[1.772] 100 Fig. 5.4.2-2 Fig.5.4.2-1 5.4.3 ① No visible mechanical damage. Vibration ② Inductance change: Within ±20%. ① shown in Fig.5.4.3-1) using eutectic solder. ② Cu pad Solder the inductor to the testing jig (glass epoxy board Solder mask The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. ③ The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually Glass Epoxy Board Fig. 5.4.3-1 perpendicular directions (total of 6 hours). 5.4.4 ① No visible mechanical damage. Drop chip inductor 10 times on a concrete floor from a height of Dropping ② Inductance change: Within ±20%. 100 cm. 5.4.5 Inductance change should be within ±20% of initial value Temperature range: -40℃~ +85℃ Temperature measuring at 20℃. Reference temperature: +20℃ 5.4.6 ① No visible mechanical damage. ① Solder temperature: 240±2℃ Solderability ② Wetting shall exceed 95% coverage. ② Duration: 3 sec. ③ Solder: Sn/3.0Ag/0.5Cu. ④ Flux: 25% Resin and 75% ethanol in weight. 5.4.7 ① No visible mechanical damage. ① Solder temperature: 260±3℃. Resistance to ② Wetting shall exceed 95% coverage. ② Duration: 5 sec. Soldering Heat ③ Inductance change: Within ±20%. ③ Solder: Sn/3.0Ag/0.5Cu. ④ Flux: 25% Resin and 75% ethanol in weight. ⑤ The chip shall be stabilized at normal condition for 1~2 hours before measuring. Sunlord Specifications for Multi-layer Chip Power Inductor Items Requirements Test Methods and Remarks 5.4.8 ① No mechanical damage. Thermal Shock ② Inductance change: Within ±20%. 30 min. 85℃ Ambient 8 Temperature 5℃ Page 7 of 9 ① Temperature, Time: (See Fig.5.4.8-1) ② Transforming interval: 20 sec.(max.). ③ Tested cycle: 100 cycles. ④ The chip shall be stabilized at normal condition for 1~2 -40℃ for 30±3 min→ 85℃ for 30±3min. 30 min. hours before measuring. -40℃ 30 min. 20sec. (max.) Fig. 5.4.8-1 5.4.9 Resistance ① No mechanical damage. ① Temperature: -40±2℃ to Low ② Inductance change: Within ±20%. ② Duration: 1000 ③ The chip shall be stabilized at normal condition for 1~2 Temperature +24 hours. hours before measuring. 5.4.10 ① No mechanical damage. ① Temperature: 85±2℃ Resistance to ② Inductance change: Within ±20%. ② Duration: 1000 ③ The chip shall be stabilized at normal condition for 1~2 High Temperature +24 hours. hours before measuring. 5.4.11 ① No visible mechanical damage. ① Temperature: 60±2℃ Damp Heat ② Inductance change: Within ±20%. ② Humidity: 90% to 95% RH. ③ Duration: 1000 ④ The chip shall be stabilized at normal condition for 1~2 (Steady States) +24 hours. hours before measuring. 6. Packaging and Storage 6.1 Packaging Tape Carrier Packaging: Packaging code: T (1) a. Tape carrier packaging are specified in attached figure Fig.6.1-1~3 b. Tape carrier packaging quantity please see the following table: Type 1608[0603] T(mm) 0.8±0.15 Tape PaperTape Quantity 4K c. Reel shall be packaged in vinyl bag. d. Maximum of 5 or 10 reels bags shall be packaged in an inner box. e. Maximum of 6 or 10 inner boxes shall be packaged in an outer case. Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. Sunlord (2) Specifications for Multi-layer Chip Power Inductor Page 8 of 9 Taping Dimensions (Unit: mm) +0.1 Sprocket Hole Φ1.5 -0 Chip Cavity 1.75±0.1 B 8.0±0.3 3.5±0.05 A Type A B P Tmax MPL1608_H 1.0±0.2 1.8±0.2 4.0±0.1 1.1 T P 4.0±0.1 Direction of Feed Fig 6.1-2 (3) Reel Dimensions (Unit: mm) 4.3±0.2mm C 4.0±0.1mm 8.4+1.5/-0.0mm 2.45±0.2mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 3.0±0.1mm max<14.4mm 178±2.0mm Fig. 6.1-3 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored 9 where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. b. 9 The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). ± c. Packaging material may be deformed if package are stored where they are exposed 0 to heat of direct sunlight. d. Solderability specified in Clause 5.4.6 shall be guaranteed for 12 months from the date of delivery on condition that they are stored at . the environment specified in Clause 3 .For those parts, which passed more than 12 months shall be checked solder-ability before use. 3 Sunlord 7. Specifications for Multi-layer Chip Power Inductor Page 9 of 9 Recommended Soldering Technologies 7.1 Reflowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max Peak 260℃ max 260℃ Max Ramp Up Rate=3℃/sec. 217℃ Max Ramp Down Rate=6℃/sec. 60~90sec. 200℃ 150℃ 60~120sec. [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on 25℃ Time 25℃ to Peak =8 min max the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 7.2 Iron Soldering Profile. 3sec. Max. △ Iron soldering power: Max.30W △ Pre-heating: 150 ℃ / 60sec. △ Soldering Tip temperature: 350℃Max. Soldering Iron △ Soldering time: 3sec Max. Power: max. 30W △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering 350℃ Diameter of Soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8. Iron 1.0mm max. Tc ℃ Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer: Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
MPL1608S4R7MHT 价格&库存

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MPL1608S4R7MHT
  •  国内价格
  • 20+0.15960
  • 100+0.14535
  • 500+0.13585
  • 1000+0.12635
  • 5000+0.11495
  • 10000+0.11020

库存:3440

MPL1608S4R7MHT
  •  国内价格
  • 20+0.33880
  • 100+0.25330
  • 1000+0.19650
  • 4000+0.14230
  • 20000+0.12820

库存:919579

MPL1608S4R7MHT
    •  国内价格
    • 10+0.28383
    • 100+0.23458
    • 300+0.20996
    • 1000+0.19149

    库存:2266