SRF1206P005

Circuit Protection SRF1206 Series Surface-Mount Devices | 1206 Size PTC Resettable Fuses Applications Features Resettable over current and over temperature protection Small size of 1206 Fast time-to-trip Small footprint RoHS complaint Low resistance Computer Portable electronics Multimedia Game machines Telephony and broadband Mobile phones Battery Industrial controls RoHS 2015/863/EC Electrical Characteristics IH (A) IT (A) V max (V) I max (A) Time to Trip Part Number (A) SRF1206P005 0.05 0.15 30 40 0.25 IH = Hold current: maximum current at which the device will not trip at 25℃ still air reflow soldering of 260℃ for 20 sec. Trip current: minimum current at which the device will always trip at 25℃ still air reflow soldering of 260℃ for 20 sec. Vmax = Maximum continuous voltage device can withstand without damage at rated current Imax = Maximum fault current device can withstand without damage at rated voltage. Ttrip = Maximum time to trip(s) at assigned current reflow soldering of 260℃ for 20 sec. Pdtyp = Typical power dissipation: typical amount of power dissipated by the device when in state air environment. IT = (Sec.) Pd typ (W) Rmin (Ω) R1max (Ω) 1.50 0.40 3.60 50.0 Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 25℃ measured one hour after reflow soldering of 260℃ for 20 sec. Value specified is determined by using the PWB with 0.030＂*1.5oz copper traces. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Thermal Derating Chart Hold Current (A) Part Number SRF1206P005 Ambient Operating Temperature -40°C 0.074 1 Document Number: P0F0310110307002B -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C 0.066 0.056 0.050 0.046 0.037 0.035 0.030 0.027 Surface-Mount Devices | 1206 Size SRF1206 Series PTC Resettable Fuses Dimensions A Top View BZ B C Recommended Pad Layout (mm) Side View Bottom View 1.80±0.1 1.8±0.1 BZ 1.0±0.1 D Part Number SRF1206P005 A B C D Min Max Min Max Min Max Min 3.00 3.60 1.50 1.90 0.60 1.20 0.15 Solder Reflow Recommendation Recommended reflow methods:IR,hot air oven ,nitrogen oven Devices can be cleaned using standard industry methods and solvents. NOTE: If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame Packaging Options Part Number Quantity SRF1206P005 3,500pcs Reel packaging per EIA -481-1 standard 2 Document Number: P0F0310110307002B © 2021 PROSEMI Inc. All Rights Reserved. Specifications and features are subject to change without notice. www.prosemitech.com The PROSEMI logo, and all other PROSEMI trademarks are the property of PROSEMI Inc. All other trademarks are the property of their respective owners.