Reference Only
CUSTOMER:
DATE:
APPROVAL
SPECIFICATION
ROHS
COMPLIANT
PRODUCT NAME:
SMD power inductor
YOUR PART NO.:
OUR PART NO.:
MPIM252010H series
VERSION: V1.0
RECEPTION
THE SPECIFICATION HAS BEEN ACCEPTED.
DATE:
COMPANY:
CFMD
CHKD
RCVD
MANUFACTURING NAME
SHENZHEN MICROGATE TECHNOLOGY CO.,LTD
Address: Yuxing road, Golf Street, Guanlan Town
Longhua District Shenzhen P.R.C
Postcode: 518110
CFMD.
CHKD.
DSGD.
TEL: 86-755-28085000
Charles
Wang
Yusheng
Liu Wei
FAX: 86-755-28085605
Reference Only
CATALOG
Component SPEC Version Record………………………………………………………
3
1
Scope………………………………………………………………………………………
4
2
Product Identification……………………………………………………………………
4
3
Appearance and Dimensions……………………………………………………………
4
4
Testing Conditions………………………………………………………………………… 4
5
Electrical Characteristics And Test Instruments………………………………………
5
6
Condition of work…………………………………………………………………………
5
7
Reliability …………………………………………………………………………………
6-8
8
Recommended Soldering Conditions……………………………………………………
8
9
Package Information……………………………………………………………………… 9
10 Products Storage…………………………………………………………………………
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
2/10
10
Reference Only
Component SPEC Version Record
Rev.
Effective Date
Changed Contents
Change Reasons
Approved By
1.0
May.18.2016
New released
/
Charles
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
3/10
Reference Only
1. Scope
This specification applies to the MPIM252010H series of SMD power inductor.
2. Product Identification
MPIM
①
①
②
③
④
⑤
⑥
252010 H
②
③
1R0
M - LF
④
⑤
⑥
Product Symbol
Product dimensions
Special process code
Inductance Value (R47:0.47 uH; 1R0: 1.0uH )
Induc tance Tolerance (M: ±20% ; N: ±30%)
Lead free product.
3. Appearance and Dimensions
h
f
g
Recommended
A
B
C
Dimensions in mm
D
2.50±0.20
2.00±0.20
1.00Max.
0.60±0.20
Land Pattern
f
g
h
1.20 Typ.
2.80 Typ.
2.00 Typ.
4. Testing Conditions
Unless otherwise specified, the standard conditions for measurement/test as:
Ambient Temperature : 5 to 35℃
Relative Humidity: 25 to 85% RH
Atmospheric Pressure: 86 to 106 kPa
If any doubt on the results, measurements/tests should be made within the following limits:
Ambient Temperature : 25±1℃
Relative Humidity: 60 to 70% RH
Atmospheric Pressure: 86 to 106 kPa
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
4/10
Reference Only
5. Electrical Characteristics And Test Instruments
Inductance
L0 (uH)
1MHz &1V
Max.
Typ.
Max.
Typ.
Max.
Typ.
MPIM252010HR22M-LF
0.22±20%
0.015
0.014
6.50
6.90
5.00
5.40
MPIM252010HR33M-LF
033±20%
0.024
0.020
5.70
6.20
4.20
4.50
MPIM252010HR47M-LF
0.47±20%
0.032
0.028
5.00
5.50
3.60
3.90
MPIM252010HR68M-LF
0.68±20%
0.048
0.044
4.10
4.60
3.00
3.30
MPIM252010H1R0M-LF
1.0±20%
0.054
0.048
3.80
4.20
2.70
3.00
MPIM252010H1R5M-LF
1.5±20%
0.082
0.075
3.00
3.40
2.10
2.40
MPIM252010H2R2M-LF
2.2±20%
0.115
0.107
2.40
2.70
1.70
2.00
Microgate Part No.
DCR(Ω)
Isat (A)
Irms (A)
Test instruments and remarks
* L test by CHROMA 3302 meter or equivalent.
* DCR test by Tonghui TH2516B meter or equivalent.
* CHROMA 3302 and 1320 meter for IDC.
* Rated current: Isat or Irms, whichever is smaller:
Isat: DC current (A) that will cause L0 to drop approximately 30%.
Irms: DC current (A) that will cause an approximate ΔT of 40℃.
* Maximum rated voltage: DC 20 V.
* The part temperature (ambient + temp rise) should not exceed 125℃ under worse case operating
conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other
cooling provision all affect the part temperature. Part temperature should be verified in the end
application.
Isat test schematic diagram
Irms test schematic diagram
6. Condition of work
Operating temperature range: -55℃ ~ +125℃ (Including self-heating) .
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
5/10
Reference Only
7. Reliability
No.
1
Item
Requirements
Solderability
(1) No case deformation
or change in
appearance.
(2) Terminal area must
have 95% min. solder
coverage.
Test Methods and Remarks
Reference
Sample
Size
①Temperature:255± 5℃, flux 5-10 s.
②Sample immersion tin furnace 5 ±0.5s.
③Immersed and in and out of speed: 25
AEC-Q200
(J-STD-002)
15
AEC-Q200
(MIL-STD-20
2
Method 210)
30
AEC-Q200
(MIL-STD
-202 Method
108)
77
±6mm/s.
①The peak temperature: 260+5/-0℃.
②Reflow:3times.
③Temperature curve is as below:
Peak 265℃
max.
265℃
-5℃
Max. Ramp Down
Rate=-6℃/s
30 sec. min.
Max. Ramp Up Rate=3℃/s
217℃
60~150 sec.
Temperature
2
Resistance to
Soldering
Heat
200℃
150℃
60~180
sec.
25℃
.
Time 25 ℃ to Peak =8 min
max.
Time
①Temperature: 125±2℃.
②Time : 1000 hours.
③Measurement at 24±4 hours after test
conclusion.
3
High
Temperature
Storage
Temp.
125℃
High temperature
Room
Temp.
24H
(1) No case deformation
or change in
appearance.
(2)∣ΔL0/L0∣≤10%
0
1000H
Time
①Temperature: -55±2℃.
②Time : 1000 hours.
③Measurement at 24±4 hours after test
conclusion.
4
Low
Temperature
Storage
Room
Temp.
77
JESD22-A119
1000H
0
Time
-55℃ Low temperature
24H
Temp.
①First -40℃ for 15 minutes, last 125℃
5
Thermal
shock
15minutes as 1 cycle. Go through 300
cycles.
②Max transfer time is 20 second.
③Measurement at 24±4 hours after test
conclusion.
125℃
15 min.
15 min.
MIL-STD
-202 Method
107
30
Ambient
Temperature
-40℃
15 min.
20 s (max.)
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
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No.
Item
Requirements
Test Methods and Remarks
Reference
Sample
Size
AEC-Q200
(MIL-STD
-202 Method
103)
77
AEC-Q200
(AEC-Q200-0
06)
30
AEC-Q200
(AEC-Q200-0
05)
30
JESD22-B111
30
AEC-Q200
(MIL-STD-20
2
Method 204)
30
①1000 hours, 85°C/85%RH.
②Unpowered.
③Measurement at 24±4 hours after test
conclusion.
6
Humidity
Resistance
High temperature
High humidity
Temp.
85℃
Room
Temp.
24H
0
1000H
Time
①The test samples shall be soldered to
the board.
②17.64N, 60s,X,Ydirect.
Radius 1.5mm
7
DUT
Terminal
Strength
Substrate
Press tools
Shear force
①Part mounted on a 100mm*40mm FR4
(1) No case deformation
or change in
appearance.
(2)∣ΔL0/L0∣≤10%
8
PCB board, which is 1.6±0.2 mm thick
and as a Layer-thickness 35 µm ±10 µm.
②Bending speed is 1mm/s.
③Keeping the P.C Board 2 mm
minimum for 60 seconds.
Support
Board Flex
Solder
Printed circuit
board before testing
Chip
45±2
45±2
20
Probe to exert bending force
1.6
Radius 340
0
Printed circuit board under test
Displacement
Unit: mm
9
10
Drop
Vibration
①Height: 1 m, Free fall, 10times.
②Direction: 1 Angle, 1side, 2surface.
①Frequency range : 10~2000Hz.
②Amplitude: 1.5mm or 20 G.
③Sweep time and duration:
10~2000~10Hz for 20 minutes.
④Each four hours(12 times) in X,Y,Z
direction, 12 hours in total.
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
7/10
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No.
Item
Requirements
11
Loading
at High
Temperature
(1) No case deformation
or change in
appearance.
(2)∣ΔL0/L0∣≤10%
Test Methods and Remarks
①Temperature: 85±2℃.
②Time : 1000 hours.
③Applied Current : Rated current.
④Measurement at 24±4 hours after test
Reference
Sample
Size
AEC-Q200
(MIL-PRF-27)
77
conclusion.
*All above experiments items need 3 Lot., sample size is as specified in the table above.
*Sample size standard is from AEC-Q200 : qualification sample size requirements.
8. Recommended Soldering Conditions
(1) Reflow soldering conditions
*Above reflow soldering curve is from J-STD-020D.
(2) Iron soldering
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150℃ 1 minute
Tip temperature
350℃ max
Soldering iron output
End of soldering iron
30w max
φ1mm max
Soldering time
3 seconds max
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
8/10
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9. Package Information
(1) Dimension of tape (Unit: mm)
W
A0
B0
K0
E
F
P
P0
D0
T
8.0±0.3
2.40±0.10
2.80±0.10
1.20±0.1
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
1.5+0.1/-0.0
0.18±0.03
(2) Dimension of reel (Unit: mm)
C
B
A
G
Symbol
A
B
C
G
Dimension
178±2
58±2
13.5±0.2
9.0±1.5
(3) Taping figure and drawing direction
(4) Packaging quantities: 2000PCS/Reel.
(5) Peeling strength of cover tape:
The peel force of top cover tape shall be between 0.10N to 1.0N
*the peel force standard is from EIA-481-D
F
165 ° to 180°
Top cover tape
Base tape
Room Temp.
(℃)
5-35
Room Humidity
(%)
45-85
Room aim
(hpa)
860-1060
Peel Speed
mm/min
300
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
9/10
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10. Products Storage
(1) Storage period
Products which inspected in MICROGATE over 12 months ago should be examined and used, which can
be confirmed with inspection No. marked on the container. Solderability should be checked if this period
is exceeded.
(2) Storage conditions
Products should be storage in the warehouse on the following conditions:
Temperature: -10 ~+ 35℃
Humidity : Less than 70% relative and humidity
No rapid change on temperature and humidity.
(3) Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
(4) Products should be storage on the palette for the prevention of the influence from humidity, dust and so
on.
(5) Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
(6) Products should be storage under the airtight packaged condition.
SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Add:Yuxing road, Golf Street, Guanlan Town Longhua District Shenzhen P.R.C
Tel:+86-755-28085000
Fax:+86-755-28085605
Postcode:518110
10/10