深圳市富满电子集团股份有限公司
SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD.
2302P(文件编号:S&CIC1975)
N-Channel Trench Power MOSFET
Description
General Description
Product Summary
● Trench Power LV MOSFET technology
● High Power and current handing capability
● VDS 20V
● ID 3.2A
● RDS(ON)( at VGS=4.5V) <52mohm
● RDS(ON)( at VGS=2.5V) <68 mohm
Applications
● PWM application
● Load switch
Package
SOT-23
Schematic Diagram
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-source Voltage
VDS
20
V
Gate-source Voltage
VGS
±12
V
Drain Current
TA=25℃ @ Steady State
TA=70℃ @ Steady State
ID
3.2
2.3
A
Pulsed Drain Current A
IDM
12
A
Total Power Dissipation @ TA=25℃
PD
0.84
W
RθJA
167
Thermal Resistance Junction-to-Ambient @ Steady
State B
TJ ,TSTG
Junction and Storage Temperature Range
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第1页共5页
-55~+150
℃/ W
℃
Version 1.0
深圳市富满电子集团股份有限公司
SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD.
2302P(文件编号:S&CIC1975)
N-Channel Trench Power MOSFET
Electrical Characteristics (TJ=25℃ unless otherwise noted)
Parameter
Symbol
Conditions
Min
VGS= 0V, ID=250μA
20
Typ
Max
Units
Static Parameter
Drain-Source Breakdown Voltage BVDSS
V
Zero Gate Voltage Drain Current
IDSS
VDS=20V,VGS=0V
1
μA
Gate-Body Leakage Current
IGSS
VGS= ±12V, VDS=0V
±100
nA
VGS(th)
VDS= VGS, ID=250μA
0.65
1.0
V
VGS= 4.5V, ID=2.5A
39
52
RDS(ON)
VGS= 2.5V, ID=2.0A
46
68
mΩ
VSD
IS=2.5A,VGS=0V
1.2
V
3.2
A
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Diode Forward Voltage
Maximum
Continuous Current
Body-Diode
0.45
IS
Dynamic Parameters
Input Capacitance
Ciss
182
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
29
Total Gate Charge
Qg
3.5
Gate Source Charge
Qgs
Gate Drain Charge
Qgd
Turn-on Delay Time
tD(on)
7.4
Turn-on Rise Time
tr
56
VDS=10V,VGS=0V,f=1MHZ
22
pF
Switching Parameters
Turn-off Delay Time
Turn-off Fall Time
A.
B.
VGS=4.5V,VDS=10V,ID=2.5
A
VGS=4.5V,VDD=10V,
tD(off) RL=1.5Ω, RGEN=3Ω
tf
0.84
nC
0.75
17
ns
55
Pulse Test: Pulse Width≤300us,Duty cycle ≤2%.
Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch.
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第2页共5页
Version 1.0
深圳市富满电子集团股份有限公司
SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD.
2302P(文件编号:S&CIC1975)
N-Channel Trench Power MOSFET
Typical Performance Characteristics
Figure1. Output Characteristics
Figure2. Transfer Characteristics
Figure3. Capacitance Characteristics
Figure4. Gate Charge
Figure5. Drain-Source on Resistance
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第3页共5页
Figure6. Drain-Source on Resistance
Version 1.0
深圳市富满电子集团股份有限公司
SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD.
2302P(文件编号:S&CIC1975)
N-Channel Trench Power MOSFET
Figure7. Safe Operation Area
www.superchip.cn
Figure8. Switching wave
第4页共5页
Version 1.0
深圳市富满电子集团股份有限公司
SHEN ZHEN FINE MADE ELECTRONICS GROUP CO., LTD.
2302P(文件编号:S&CIC1975)
N-Channel Trench Power MOSFET
Package Information.
SOT23-3(小)
符号
毫米
英寸
最小
最大
最小
最大
A
0.900
1.150
0.035
0.045
A1
0.000
0.100
0.000
0.004
A2
0.900
1.050
0.035
0.041
b
0.300
0.500
0.012
0.020
c
0.080
0.150
0.003
0.006
D
2.800
3.000
0.110
0.118
E
1.200
1.400
0.047
0.055
E1
2.250
2.550
0.089
0.100
e
e1
0.950 TYP.
1.800
L
0.037 TYP.
2.000
0.071
0.550 REF.
0.079
0.022 REF.
L1
0.300
0.500
0.012
0.020
θ
0°
8°
0°
8°
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Version 1.0
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