PLCC LED Series Datasheet
ORH-W45A(IF=15mA)
1. Features:
Chip material: AlInGaN.
Emitted Color : Super Blue.
Lens Appearance: Water Clear.
Mono-color type.
2.0x1.25x0.8mm (0805) standard package.
Suitable for all SMT assembly methods.
Compatible with infrared and vapor phase reflow solder process.
Compatible with automatic placement equipment.
This product doesn’t contain restriction substance, comply ROHS standard.
2.Applications:
Automotive: Dashboards, stop lamps, turn signals.
Backlighting: LCDs, Key pads advertising.
Status indicators: Comsumer & industrial electronics.
General use.
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
3.Package Dimensions:
4.Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Rating
Unit
Operating Temperature
Storage Temperature
Pd
IF
IFP
Topr
Tstg
120
30
100
-25℃~80℃
-30℃~85℃
mW
mA
mA
-
Soldering Temperature
Tsol
260℃
-
Power Dissipation
Forward Current
Peak Forward Current *1
*1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
5.Electrical and optical characteristics(Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Forward Voltage
Vf
IF=15mA
2.8
2.9
3.1
V
Luminous Intensity
Iv
IF=15mA
600
800
900
mcd
Reverse Current
Chromaticity
IR
VR=7V
-
-
1
μA
x
IF=15mA
-
0.33
-
-
Coordinates
Veiwing Angle
y
IF=15mA
-
0.36
-
-
2θ1/2
IF=15mA
-
120
-
deg
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
6.Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
Fig.1 Relative intensity vs. wavelength
vs. ambient temperature
1.0
60
Forward current (mA)
Relative radiant intensity
50
0.5
40
30
20
10
0
120
470
0
520
20
Wavelength (nm)
50
100
2.5
30
20
10
(Normalized @20mA)
Relative Luminous intensity
Forward current (mA)
80
3.0
40
2.0
1.5
1.0
0.5
1
2
3
4
0
-40
5
-20
0
20
40
60
Ambient temperature Ta( C)
Forward voltage(V)
Fig.5 Relative luminous intensity
vs. forward current
Fig.6 Radiation diagram
0
2.0
10
20
30
1.5
Relative radiant intensity
Relative luminous intensity (@20mA)
60
Fig.4 Relative luminous intensity vs.
ambient temperature
Fig.3 Forward current vs. forward voltage
0
40
Ambient temperature Ta( C)
1.0
0.5
1.0
40
0.9
50
0.8
60
70
0.7
80
90
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
7. Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Symbol
VF ( V)
IR(uA)
Iv ( mcd )
Measuring conditions
IF=5mA
VR=5V
IF=5mA
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
Note: 1).U means the upper limit of specified characteristics. S means initial value.
2).Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
8.Bin Limits
In t e n s i t y Bi n Li m i t s (A t 15 mA )
BIN CODE
Min. (mcd)
Max. (mcd)
Q
600
700
W
700
800
E
800
900
To l e r a n c e for ea c h Bi n li m i t is ± 15 % .
Co l o r Bi n Li m i t s (A t
BIN
X1
1
0.291
2
0.2963
3
0.3015
4
0.3067
5
0.3122
6
0.3173
1 5m A )
Y1
X2
Y2
X3
Y3
X4
Y4
0.31
0.2963
0.32
0.3108
0.32
0.3058
0.31
0.32
0.3015
0.33
0.316
0.33
0.3108
0.32
0.33
0.3067
0.34
0.3214
0.34
0.316
0.33
0.34
0.3122
0.35
0.3265
0.35
0.3214
0.34
0.35
0.3173
0.36
0.3315
0.36
0.3265
0.35
0.36
0.3225
0.37
0.337
0.37
0.3315
0.36
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
V F Bi n Li m i t s (A t 15 mA )
BI N CO D E
Mi n . ( v )
Ma x . ( v )
S
2.8
2.9
D
2.9
3
F
3
3.1
To l e r a n c e for ea c h Bi n li m i t is ± 0. 0 5 V.
9. BI N : x
x
x
VF BIN CO DE
Co lor BIN CODE
Intensity BIN CODE
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
10.Tapping and packaging specifications(Units: mm)
13.0± 0.5
1.0± 0.1
1.42 ± 0.1
4.0 ± 0.1
2.0± 0.05
TRAILER
179± 1
71.0± 1
8.0 ± 0.3
3.5 ± 0.05
1.5± 0.1
1.75 ± 0.1
CATHODE
4.0 ± 0.1
13.0± 0.5
END
5.3 ± 0.05
START
2.26± 0.1
ANODE
USER DIRECTION OF FEED
LEADER
0.3
FIXING TAPE
NOTE: 4000 pcs PER REEL
11.Package Method:(unit:mm)
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
12. Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on
each bag.
(2) Label:
ORIENT LOGO
Part No.
Quantity
BIN
Sealing Date
x
xx
xx
xx
Year Month Day
Manufacture Location
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
13.Reliability Test
Classification
Test Item
Reference Standard
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021 :B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS-C-7021 :B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS-C-7021 :B-10
Storage
Low
Temperature JIS-C-7021 :B-12
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021 :A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS-C-7021 :A-1
Test Conditions
Result
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
0/20
0/20
High Ta=+85℃±5℃
Test time=1,000hrs
0/20
Low Ta=-35℃±5℃
Test time=1,000hrs
0/20
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min 60min 20min
Test Time=5cycle
0/20
-35℃±5℃ ~+85℃±5℃
20min
20min
Test Time=10cycle
Preheating:
140℃-160℃,within 2 minutes.
Operation heating:
260℃(Max.), within 10seconds. (Max.)
0/20
0/20
14. Soldering :
1). Manual Of Soldering
The temperature of the iron tip should not be higher than 300 ℃ (572 ℉ ) and Soldering within 3
seconds per solder-land is to be observed.
2). Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
10 SEC. MAX.
Temperature
140~160℃
260℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
Gradual Cooling (Avoid quenching).
3). DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Temperature
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
15.Handling :
Care must be taken not to cause to the epoxy resin portion of ORIENTLEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of ORIENT LEDs with hard or sharp article such
as the sand blast and the metal hook.
16.Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the ORIENT
LEDs within the rated figures. Also, caution should be taken not to overload ORIENT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
ORIENT LEDs.
Copyright© 2018 Orient Tech Corporation.
All rights Reserved
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Ver,
A0
SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-W45A
17. Storage:
In order to avoid the absorption of moisture, it is recommended to solder ORIENT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a....Completed within 24 hours.
b....Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
Copyright© 2018 Orient Tech Corporation.
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