HSDL-3612
IrDA® Data Compliant 115.2 kb/s 3 V to 5 V Infrared Transceiver
Data Sheet
Description
The HSDL-3612 is a low-profile infrared transceiver
module that provides interface between logic and IR
signals for through-air, serial, half-duplex IR data link.
The module is compliant to IrDA Data Physical Layer
Specifications 1.4 and IEC825-Class 1 Eye Safe.
Applications
• Digital imaging
– Digital still cameras
– Photo-imaging printers
• Data communication
– Notebook computers
– Desktop PCs
– Win CE handheld products
– Personal Digital Assistants (PDAs)
– Printers
– Fax machines, photocopiers
– Screen projectors
– Auto PCs
– Dongles
– Set-Top box
• Telecommunication products
– Cellular phones
– Pagers
• Small industrial & medical instrumentation
– General data collection devices
– Patient & pharmaceutical data collection devices
Features
• Fully compliant to IrDA 1.0 physical layer specifications – 9.6 kb/s to 115.2 kb/s operation
• Typical link distance > 1.5 m
• IEC825-Class 1 eye safe
• Low power operation range – 2.7 V to 5.25 V
• Small module size – 4.0 x 12.2 x 5.1 mm (HxWxD)
• Complete shutdown – TXD, RXD, PIN diode
• Low shutdown current – 10 nA typical
• Adjustable optical power management – Adjustable
LED drive-current to maintain link integrity
• Integrated EMI shield – Excellent noise immunity
• Edge detection input – Prevents the LED from long
turn-on time
• Interface to various super I/O and controller devices
• Designed to accommodate light loss with cosmetic
window
• Only 2 external components are required
• Lead
free
package
Pb-free
and
EU RoHS compliant
Functional Block Diagram
VCC
R1
LEDA (10)
TXD (9)
SP
MD0 (4)
HSDL-3612
MD1 (5)
RXD (8)
CX1
GND (7,3)
CX2
VCC (1)
AGND (2)
The HSDL-3612 contains a high-speed and high-efficiency 870 nm LED, a silicon PIN diode, and an integrated circuit. The IC contains an LED driver and a receiver
providing a single output (RXD) for all data rates supported.
The HSDL-3612 can be completely shut down to achieve
very low power consumption. In the shut down mode,
the PIN diode will be inactive and thus producing very
little photo-current even under very bright ambient
light. The HSDL-3612 also incorporated the capability
for adjustable optical power. With two programming
pins; MODE 0 and MODE 1, the optical power output
can be adjusted lower when the nominal desired link
distance is one-third or two-third of the full IrDA link.
Application Support Information
The Application Engineering group is available to assist
you with the technical understanding associated with
HSDL-3612 infrared transceiver module. You can contact
them through your local sales representatives for additional details.
The HSDL-3612 front view options (HSDL-3612-007/037) and a top view packaging option (HSDL-3612008/-038) come with integrated shield that helps to
ensure low EMI emission and high immunity to EMI
field, thus enhancing reliable performance.
Ordering Information
Package Option
Package
Front View
Part Number
HSDL-3612-007
Standard Package Increment
400
Front View
HSDL-3612-037
1800
Top View
Top View
HSDL-3612-008
HSDL-3612-038
400
1800
I/O Pins Configuration Table
Pin
1
2
3
4
5
6
7
8
9
10
Description
Supply Voltage
Analog Ground
Ground
Mode 0
Mode 1
No Connection
Ground
Receiver Data Output
Transmitter Data Input
LED Anode
Symbol
VCC
AGND
GND
MD0
MD1
NC
GND
RXD
TXD
LEDA
10
9
8
7
6
5
4
3
2
1
BACK VIEW (HSDL-3612-007/-037)
10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW (HSDL-3612-008/-038)
Transceiver Control Truth Table
Mode 0
1
0
0
1
Mode 1
0
0
1
1
RX Function
Shutdown
SIR
SIR
SIR
TX Function
Shutdown
Full Distance Power
2/3 Distance Power
1/3 Distance Power
Transceiver I/O Truth Table
Transceiver
Mode
TXD
Active
1
Active
0
Active
0
Shutdown
X[3]
X = Don’t Care
Inputs
Outputs
EI
LED
RXD
X
On
Not Valid
High[1]
Off
Low[2]
Low
Off
High
Low
Not Valid
Not Valid
EI = In-Band Infrared Intensity at detector
Notes:
1. In-Band El ≤ 115.2 kb/s.
2. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity.
3. To maintain low shutdown current, TXD needs to be driven high or low and not left floating.
Recommended Application Circuit Components
Component
R1
CX1[4]
CX2[5]
Recommended Value
6.2 Ω ± 5%, 0.5 Watt, for 2.7 ≤ VCC ≤ 3.6 V operation
15.0 Ω ± 5%, 0.5 Watt, for 4.75 ≤ VCC ≤ 5.25 V operation
0.47 µF ± 20%, X7R Ceramic
6.8 µF ± 20%, Tantalum
Notes:
4. CX1 must be placed within 0.7 cm of the HSDL-3612 to obtain optimum noise immunity.
5. In “HSDL-3612 Functional Block Diagram” on page 1 it is assumed that Vled and VCC share the same supply voltage and filter capacitors. In case
the 2 pins are powered by different supplies CX2 is applicable for Vled and CX1 for VCC. In environments with noisy power supplies, including
CX2 on the VCC line can enhance supply rejection performance.
0.7
200
180
0.6
160
140
LOP (mW/sr)
ILED (A)
0.5
0.4
0.3
100
80
60
0.2
40
0.1
0
1.3
120
20
1.5
1.7
1.9
2.1
2.3
LEDA VOLTAGE (V)
ILED vs. LEDA.
0
0
30 60 90 120 150 180 210 240 270 300
ILED (mA)
Light Output Power (LOP) vs. ILED.
Marking Information
The HSDL-3612-007/-037 is marked “3612YYWW” on
the shield where “YY” indicates the unit’s manufacturing year, and “WW” refers to the work week in which the
unit is tested.
CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Absolute Maximum Ratings[6]
Parameter
Storage Temperature
Operating Temperature
DC LED Current
Peak LED Current
LED Anode Voltage
Supply Voltage
Transmitter Data
Input Current
Receiver Data
Output Voltage
Symbol
TS
TA
ILED(DC)
ILED(PK)
VLEDA
Vcc
ITXD(DC)
Minimum
–40
–20
–0.5
0
–12
Maximum
+100
+70
165
750
7
7
12
Unit
°C
°C
mA
mA
V
V
mA
VO
–0.5
Vcc+0.5
V
Conditions
≤ 2 µs pulse width,
≤ 10% duty cycle
|IO(RXD)| = 20 µA
Note:
6. For implementations where case to ambient thermal resistance ≤ 50°C/W.
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic High Input Voltage
for TXD, MD0, MD1, and FIR_SEL
Logic Low Transmitter Input Voltage
LED (Logic High) Current Pulse Amplitude
Receiver Signal Rate
Symbol
TA
VCC
VIH
VIL
ILEDA
Minimum
–20
2.7
2 VCC/3
Maximum
+70
5.25
VCC
Unit
°C
V
V
0
180
2.4
VCC/3
300
115.2
V
mA
kb/s
Electrical & Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted.
Parameter
Transceiver
Supply
Shutdown
Current
Idle
Digital Input
Logic
Current
Low/High
Transmitter
Transmitter
Logic High
Radiant
Intensity
Intensity
Peak
Wavelength
Spectral
Line Half
Width
Viewing Angle
Optical Pulse
Width
Rise and Fall
Times
Maximum
Optical Pulse
Width
LED Anode
On State Voltage
LED Anode
Off State Leakage Current
Symbol
Min.
Typ.
Max.
Unit
Conditions
ICC1
ICC2
IL/H
–1
10
2.5
200
5
1
nA
mA
µA
VI(TXD) ≤ VIL or
VI(TXD) ≥ VIH
VI(TXD) ≤ VIL, EI = 0
0 ≤ VI ≤ VCC
EIH
λP
50
120
875
400
mW/sr
nm
VIH = 3.0 V
ILEDA = 200 mA
θ1/2 ≤ 15°
∆λ1/2
35
nm
2θ1/2
tpw (EI)
tr (EI),
tf (EI)
tpw (max)
30
1.5
1.6
20
60
1.8
40
50
°
µs
ns
µs
tpw(TXD) = 1.6 µs at
115.2 kb/s
tpw(TXD) = 1.6 µs at
115.2 kb/s
tr/f (TXD) = 10 ns
TXD pin stuck high
1
2.4
100
V
nA
ILEDA = 200 mA,
VI(TXD) ≥ VIH
VLEDA = VCC = 5.25 V,
VI(TXD) ≤ VIL
VON(LEDA)
ILK(LEDA)
Electrical & Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted.
Parameter
Receiver
Receiver
Logic Low[7]
Data Output
Voltage
Logic High
Viewing Angle
Logic High Receiver Input
Irradiance
Logic Low Receiver Input
Irradiance
Receiver Peak Sensitivity
Wavelength
Receiver SIR Pulse Width
Receiver Latency Time
Receiver Rise/Fall Times
Receiver Wake Up Time
Symbol
Min.
Typ. Max.
Unit Conditions
VOL
VOH
2θ1/2
EIH
EIL
0
VCC – 0.2
30
0.0036
-
-
0.4
VCC
500
0.3
V
V
°
mW/cm2
µW/cm2
λP
880
nm
tpw (SIR)
tL
tr/f (RXD)
tW
1
20
25
4.0
50
100
µs
µs
ns
µs
IOL = 1.0 mA,
EI ≥ 3.6 µW/cm2,
θ1/2 ≤ 15°
IOH = –20 µA,
EI ≤ 0.3 µW/cm2,
θ1/2 ≤ 15°
For in-band signals ≤
115.2 kb/s[8]
For in-band signals[8]
θ1/2 ≤ 15°[9], CL = 10 pF
[10]
Notes:
7. Logic Low is a pulsed response. The condition is maintained for duration dependent on pattern and strength of the incident intensity.
8. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 ≤ lp ≤ 900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
9. For in-band signals ≤ 115.2 kb/s where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2.
10. Wake Up Time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and
ready to receive infrared signals.
TXD “Stuck ON” Protection
TXD
LED
tpw (MAX.)
RXD Output Waveform
tpw
VOH
90%
50%
VOL
10%
tf
tr
LED Optical Waveform
tpw
LED ON
90%
50%
LED OFF
10%
tr
tf
Receiver Wake Up Time Definition
(when MD0 π 1 and MD1 π 0)
RX
LIGHT
RXD
VALID DATA
tw
HSDL-3612-007 and HSDL3612-037 Package Outline with Dimension
and Recommended PC Board Pad Layout
MOUNTING
CENTER
PIN
FUNCTION
PIN
6.10
FUNCTION
1
VCC
6
NC
2
AGND
7
GND
3
GND
8
RXD
4
MD0
9
TXD
5
MD1
10
LEDA
1.17
4.18
4.98
TOP VIEW
2.45
R 2.00
R 1.77
4.00
1.90
1.90
0.80
0.80
1.70
1.20
3.24
4.05
SIDE VIEW
3.84
12.20
FRONT VIEW
ALL DIMENSIONS IN MILLIMETERS (mm).
DIMENSION TOLERANCE IS 0.20 mm
UNLESS OTHERWISE SPECIFIED.
MOUNTING CENTER
PIN 1
PIN 10
0.70
MID OF LAND
0.43
1.05
PIN 10
2.40
PIN 1
2.08
0.70
4.95
10 CASTELLATION:
PITCH 1.1 ± 0.1
CUMULATIVE 9.90 ± 0.1
BACK VIEW
0.45
2.35
2.84
LAND PATTERN
HSDL-3612-008 and HSDL3612-038 Package Outline with Dimension
and Recommended PC Board Pad Layout
11.7
5
0.36
0.53
2.5
0.47
0.85
R2
.3
0.31
0.31
2.08
0.84
3.85
.1
R2
0.83
0.3
+0.05
4.16 -0.00
2.08
1.46
0.42
2.57
0.28
1.77
0.94
3.24
3.84
5
+0.05
2.15 -0.00
5
12.2 +0.10
-0.00
+0.05
11.7 -0.00
0.1
4.65
R2
R1
.77
0.1
0.94
0.8
10
0.73
1.95
Tape and Reel Dimensions (HSDL-3612-007, -037)
QUANTITY = 400 PIECES PER REEL (HSDL-3612-007)
1800 PIECES PER TAPE (HSDL-3612-037)
ALL DIMENSIONS IN MILLIMETERS (mm)
13.00 ± 0.50
R 1.00
(40 mm MIN.)
EMPTY
(400 mm MIN.)
LEADER
PARTS
MOUNTED
21.00 ± 0.80
EMPTY
(40 mm MIN.)
2.00 ± 0.50
DIRECTION OF PULLING
CONFIGURATION OF TAPE
LABEL
SHAPE AND DIMENSIONS OF REELS
A
10
4
Æ1.55 ± 0.05
5
2.00 ± 0.10
6
4.00 ± 0.10
B
3
1.75 ± 0.10
5 (MAX.)
11.50 ± 0.10
2
A 3.8
24.00 ± 0.30
1
Æ1.5 ± 0.1
A
A
8.00 ± 0.10
7
A
8
B
12 12.50 ± 0.10
10
11
0.40 ± 0.10
4.25 ± 0.10
SECTION B-B
5 (MAX.)
4.4 A
5.20 ± 0.10
SECTION A-A
11
9
A
Tape and Reel Dimensions (HSDL-3612-008, -038)
QUANTITY = 400 PIECES PER REEL (HSDL-3612-008)
1800 PIECES PER TAPE (HSDL-3612-038)
ALL DIMENSIONS IN MILLIMETERS (mm)
13.00 ± 0.50
R 1.00
(40 mm MIN.)
EMPTY
(400 mm MIN.)
LEADER
PARTS
MOUNTED
21.00 ± 0.80
EMPTY
(40 mm MIN.)
2.00 ± 0.50
DIRECTION OF PULLING
CONFIGURATION OF TAPE
LABEL
SHAPE AND DIMENSIONS OF REELS
Do
Po
P2
D1
B
E
5 (MAX.)
F
W
Bo
8 ± 0.10
A
A
T
B
P1
5.4 ± 0.15
Ko
5 (MAX.)
SECTION B-B
Ao
SECTION A-A
SYMBOL
Ao
Bo
Ko
Po
P1
P2
T
SPEC
4.4 ± 0.10
12.50 ± 0.10
4.85 ± 0.10
4.0 ±0.10
8.0 ± 0.10
2.0 ± 0.10
0.35 ± 0.10
SYMBOL
E
F
Do
D1
W
10Po
SPEC
1.75 ± 0.10
11.5 ± 0.10
1.55 ± 0.10
1.5 ± 0.10
24.0 ± 0.3
40.0 ± 0.20
NOTES:
1. I.D. sprocket hole pitch cumulative tolerance is ± 0.2 mm.
2. Corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm.
3. Ao and Bo measured on a place 0.3 mm above the bottom of the pocket.
4. Ko measured from a place on the inside bottom of the pocket to top surface of carrier.
5. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
12
Moisture Proof Packaging
Recommended Storage Conditions
All HSDL-3612 options are shipped in moisture proof
package. Once opened, moisture absorption begins.
Baking Conditions
If the parts are not stored in dry conditions, they must
be baked before reflow to prevent damage to the parts.
Package
Temp.
In reels
60°C
In bulk
100°C
125°C
150°C
Baking should be done only once.
Storage
Temperature
Relative
Humidity
After removal from the bag, the parts should be soldered within three days if stored at the recommended
storage conditions. If times longer than 168
72 hours are
needed, the parts must be stored in a dry box.
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 30 C,
AND LESS THAN
60% RH
YES
YES
PACKAGE
PACKAGE
ISIS
OPENED
OPENEDLESS
LESS
THAN168 HOURS
THAN 72 HOURS
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
13
below 60% RH
Time from Unsealing to Soldering
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
NO BAKING
IS NECESSARY
10°C to 30°C
NO
Recommended Reflow Profile
MAX. 245 C
T – TEMPERATURE – ( C)
230
R3
200
183
170
150
R2
90 sec.
MAX.
ABOVE
183 C
125
R1
100
R4
R5
50
25
0
50
P1
HEAT
UP
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
100
150
200
t-TIME (SECONDS)
P2
P3
SOLDER PASTE DRY
SOLDER
REFLOW
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
In process zone P1, the PC board and HSDL-3612 castellation pins are heated to a temperature of 160°C to
activate the flux in the solder paste. The temperature
ramp up rate, R1, is limited to 4°C per second to allow
for even heating of both the PC board and HSDL-3612
castellations.
Process zone P2 should be of sufficient time duration
(60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point
of the solder, usually 200°C (392°F).
Process zone P3 is the solder reflow zone. In zone P3,
the temperature is quickly raised above the liquidus
point of solder to 255°C (491°F) for optimum results. The
dwell time above the liquidus point of solder should
be between 20 and 60 seconds. It usually takes about
300
P4
COOL
DOWN
DT
25°C to 160°C
160°C to 200°C
200°C to 255°C
(260°C at 10 seconds max.)
255°C to 200°C
200°C to 25°C
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four
process zones, each with different ∆T/∆time temperature change rates. The ∆T/∆time rates are detailed in
the above table. The temperatures are measured at the
component to printed circuit board connections.
14
250
Maximum DT/Dtime
4°C/s
0.5°C/s
4°C/s
-6°C/s
-6°C/s
20 seconds to assure proper coalescing of the solder
balls into liquid solder and the formation of good solder
connections. Beyond a dwell time of 60 seconds, the
intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and
unreliable connections. The temperature is then rapidly
reduced to a point below the solidus temperature of the
solder, usually 200°C (392°F), to allow the solder within
the connections to freeze solid.
Process zone P4 is the cool down after solder freeze.
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and HSDL-3612 castellations to change dimensions evenly, putting minimal stresses on the HSDL3612 transceiver.
Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND PATTERN
SOLDER
MASK
PCBA
Figure 1.0. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3612-007/-037
Dim.
a
b
c (pitch)
d
e
f
g
mm
2.40
0.70
1.10
2.35
2.80
3.13
4.31
Inches
0.095
0.028
0.043
0.093
0.110
0.123
0.170
SHIELD SOLDER PAD
Tx LENS
Rx LENS
e
d
b
g
Y
f
a
X
theta
FIDUCIAL
10x PAD
Figure 2.0. Top view of land pattern.
15
c
FIDUCIAL
1.2 Adjacent Land Keep-out and Solder Mask Areas
Dim.
h
j
k
l
mm
min. 0.2
13.4
4.7
3.2
Inches
min. 0.008
0.528
0.185
0.126
• Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There
should be no other SMD components within this
area.
• “h” is the minimum solder resist strip width required
to avoid solder bridging adjacent pads.
• It is recommended that 2 fiducial cross be placed at
mid-length of the pads for unit alignment.
Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended.
j
Tx LENS
LAND
Rx LENS
SOLDER
MASK
h
k
Y
DIM.
mm
INCHES
h
MIN. 0.2
MIN. 0.008
j
13.4
0.528
k
4.7
0.185
l
3.2
0.126
• ADJACENT LAND KEEP-OUT IS THE
MAXIMUM SPACE OCCUPIED BY THE
UNIT RELATIVE TO THE LAND PATTERN.
THERE SHOULD BE NO OTHER SMD
COMPONENTS WITHIN THIS AREA.
• "h" IS THE MINIMUM SOLDER RESIST
STRIP WIDTH REQUIRED TO AVOID
SOLDER BRIDGING ADJACENT PADS.
l
• IT IS RECOMMENDED THAT 2 FIDUCIAL
CROSS BE PLACED AT MID-LENGTH OF
THE PADS FOR UNIT ALIGNMENT.
Figure 3.0. HSDL-3612-007/-037 PCBA – Adjacent land keep-out and solder mask.
2.0 Recommended Solder Paste/Cream Volume for
Castellation Joints
Based on calculation and experiment, the printed solder
paste volume required per castellation pad is 0.30 cubic
mm (based on either no-clean or aqueous solder cream
types with typically 60 to 65% solid content by volume).
16
2.1 Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used:
See Fig 4.0
t, nominal stencil thickness
l, length of aperture
mm
inches
mm
inches
0.152
0.006
2.8 ± 0.05
0.110 ± 0.002
0.127
0.005
3.4 ± 0.05
0.134 ± 0.002
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
APERTURE AS PER
LAND DIMENSIONS
t (STENCIL THICKNESS)
SOLDER
PASTE
w
l
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment Tolerance and
Product Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the unit
will self-align in the X-direction after solder reflow.
Units should be properly reflowed in IR Hot Air convection oven using the recommended reflow profile. The
direction of board travel does not matter.
17
Allowable Misalignment Tolerance
X – direction ≤ 0.2 mm (0.008 inches)
Theta – direction ± 2 degrees
3.1 Tolerance for X-axis Alignment of Castellation
Misalignment of castellation to the land pad should not
exceed 0.2 mm or approximately half the width of the
castellation during placement of the unit. The castellations will completely self-align to the pads during
solder reflow as seen in the pictures below.
Photo 1.0. Castellation misaligned to land pads in x-axis before
reflow.
Photo 2.0. Castellation self-align to land pads after reflow.
3.2 Tolerance for Rotational (Theta) Misalignment
Units when mounted should not be rotated more than
± 2 degrees with reference to center X-Y as specified in
Fig 2.0. Pictures 3.0 and 4.0 show units before and after
reflow. Units with a Theta misalignment of more than 2
degrees do not completely self align after reflow. Units
with ± 2 degree rotational or Theta misalignment selfaligned completely after solder reflow.
Photo 3.0. Unit is rotated before reflow.
18
Photo 4.0. Unit self-aligns after reflow.
3.3 Y-axis Misalignment of Castellation
In the Y-direction, the unit does not self-align after solder reflow. It is recommended that the unit be placed
in line with the fiducial mark (mid-length of land pad.)
This will enable sufficient land length (minimum of 1/2
land length.) to form a good joint. See Fig 5.0.
LENS
EDGE
FIDUCIAL
MINIMUM 1/2 THE LENGTH
OF THE LAND PAD
Y
Figure 5.0. Section of a castellation in Y-axis.
3.4 Example of Good HSDL-3612-007/-037 Castellation Solder Joints
This joint is formed when the printed solder paste
volume is adequate, i.e. 0.30 cubic mm and reflowed
properly. It should be reflowed in IR Hot-air convection
reflow oven. Direction of board travel does not matter.
Photo 5.0. Good solder joint.
4.0 Solder Volume Evaluation and Calculation
Geometry of an HSDL-3612-007/ -037 solder fillet.
0.425
0.20
0.8
0.4
19
1.2
0.70
0.7
Appendix B: HSDL-3612-008/-038 SMT Assembly Application Note
1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND PATTERN
SOLDER
MASK
PCBA
Figure 1. Stencil and PCBA.
1.1. Recommended Land Pattern for HSDL-3612-008/-038
Dim.
a
b
c (pitch)
d
e
f
g
mm
1.95
0.60
1.10
1.60
5.70
3.80
2.40
inches
0.077
0.024
0.043
0.063
0.224
0.123
0.170
SHIELD SOLDER PAD
e
d
g
Y
Rx LENS
b
Tx LENS
theta
f
X
h
a
FIDUCIAL
20
10x PAD
c
FIDUCIAL
2.0 Y-axis Misalignment of Castellation
In the Y-direction, the unit does not self-align after solder reflow. It is recommended that the unit be placed in
line with the fiducial mark (mid-length of land pad). This
will enable sufficient land length (minimum of 1/2 land
length) to form a good joint. See Figure 2.
Y
FIDUCIAL
1/2 THE LENGTH OF THE
CASTELLATION PAD
Figure 2. Section of a castellation in Y-axis.
21
Appendix C: Optical Port Dimensions for HSDL-3612:
To ensure IrDA compliance, some constraints on the
height and width of the window exist. The minimum
dimensions ensure that the IrDA cone angles are met
without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 300 and the maximum size
corresponds to a cone angle of 60º.
In the figure below, X is the width of the window, Y is
the height of the window and Z is the distance from
the HSDL-3612 to the back of the window. The distance
from the center of the LED lens to the center of the
photodiode lens, K, is 7.08mm. The equations for computing the window dimensions are as follows:
X = K + 2*(Z+D)*tanA
Y = 2*(Z+D)*tanA
Section of a castellation in Y-axis.
22
The above equations assume that the thickness of the
window is negligible compared to the distance of the
module from the back of the window (Z). If they are
comparable, Z’ replaces Z in the above equation. Z’ is
defined as
Z’=Z+t/n
where ‘t’ is the thickness of the window and ‘n’ is the refractive index of the window material.
The depth of the LED image inside the HSDL-3612, D, is
8mm. ‘A’ is the required half angle for viewing. For IrDA
compliance, the minimum is 150 and the maximum is
300. Assuming the thickness of the window to be negligible, the equations result in the following tables and
graphs:
Module Depth, (z) mm
0
1
2
3
4
5
6
7
8
9
23
Aperture Width
(x, mm)
max.
min.
16.318
11.367
17.472
11.903
18.627
12.439
19.782
12.975
20.936
13.511
22.091
14.047
23.246
14.583
24.401
15.118
25.555
15.654
26.710
16.190
Aperture height
(y, mm)
max.
min.
9.238
4.287
10.392
4.823
11.547
5.359
12.702
5.895
13.856
6.431
15.011
6.967
16.166
7.503
17.321
8.038
18.475
8.574
19.630
9.110
Window Material
Shape of the Window
Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish
of the plastic should be smooth, without any texture.
An IR filter dye may be used in the window to make it
look black to the eye, but the total optical loss of the
window should be 10 percent or less for best optical
performance. Light loss should be measured at 875 nm.
From an optics standpoint, the window should be flat.
This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the
photodiode.
If the window must be curved for mechanical or industrial design reasons, place the same curve on the back
side of the window that has an identical radius as the
front side. While this will not completely eliminate the
lens effect of the front curved surface, it will significantly
reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for
the window, the radius of the front and back curves, and
the distance from the back surface to the transceiver.
Once these items are known, a lens design can be made
which will eliminate the effect of the front surface curve.
The following drawings show the effects of a curved
window on the radiation pattern. In all cases, the center
thickness of the window is 1.5 mm, the window is made
of polycarbonate plastic, and the distance from the
transceiver to the back surface of the window is 3 mm.
Flat Window
(First choice)
24
Curved Front and Back
(Second choice)
Curved Front, Flat Back
(Do not use)
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Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.
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