HSDL-3002
IrDA® Data Compliant Low Power 115.2 kbit/s with
Remote Control Transmission Infrared Transceiver
Data Sheet
Description
The HSDL-3002 is a small form factor single enhanced
infrared (IR) transceiver module that provides the
combination of (1) interface between logic and IR
signals for through-air, serial, half-duplex IR data link,
and (2) IR remote control transmission operating at
940 nm for universal remote control applications.
For infrared data communication, the HSDL-3002
provides the flexibility of Low Power SIR applications
and remote control applications depending on the
application circuit designs as outlined in the Application
Circuit section. The transceiver is compliant to IrDA
Physical Layer Specifications version 1.4 from 9.6
kbit/s to 115.2 kbit/s and it is IEC 825-Class 1 Eye Safe.
The HSDL-3002 can be shutdown completely to achieve
very low power consumption. In the shutdown mode,
the PIN diode will be inactive and thus producing very
little photocurrent even under very bright ambient
light. Such features are ideal for battery operated
handheld products.
Features
• Guaranteed temperature performance, –20 to 70°C
– Critical parameters are guaranteed over temperature
and supply voltage
• Low power consumption
• Small module size
– Height: 2.70 mm
– Width: 9.10 mm
– Depth: 3.65 mm
• Withstands >100 mV
p-p power supply ripple typically
• VCC supply 2.7 to 5.5 volts
• Integrated EMI shield
• Designed to accommodate light loss with cosmetic
windows
• IEC 825-class 1 eye safe
IrDA Data Features
• Fully compliant to IrDA physical layer specifications
version 1.4 from 9.6 kbit/s to 115.2 kbit/s
– Excellent nose-to-nose operation
– Link distance up to 50 cm
• Complete shutdown for TXD(IrDA), RXD(IrDA), and
PIN diode
• Low shutdown current (10 nA typical)
• LED stuck-high protection
Remote Control Features
• High radiant intensity
• Spectrally suited to remote control receiver
• Typical link distance at 6 m
Applications
• Mobile data communication and universal remote
control
– PDAs
– Mobile phone
Application Support Information
The Application Engineering Group is available to assist you with the application designs associated with the
HSDL-3002 infrared transceiver module. You can contact them through your local sales representatives for
additional details.
Ordering Information
Part Number
Packaging Type
Package
Quantity
HSDL-3002-007
Tape and Reel
Front View
2500
Marketing Information
The unit is marked with a number
“1” and “YWWLL” on the shield
for front option.
Y = year
WW = work week
LL = lot information
VCC
CX2
CX1
GND (8)
NC (7)
RXD (IrDA) (4)
SD (5)
RECEIVER
VCC (6)
HSDL-3002
SHIELD
V (RC) (2)
IrDA TXD
TXD (IrDA) (3)
REMOTE
CONTROL
INPUT
(RCI)
TRANSMITTER
REAR VIEW
LEDA (1)
R2
R1
8
7
6
5
4
3
2
1
VCC
Figure 1. Functional block diagram of HSDL-3002.
2
Figure 2. Rear view diagram with pin-out.
I/O Pins Configuration Table
Pin
Symbol
I/O Description
Notes
1
LED A
I
IR and Remote Control
LED Anode
Tied through external resistor, R1,
to regulate VCC from 2.7 to 5.5 Volt
2
V(RC)
I
Remote Control LED Cathode
Connected to an external switching transistor. Do not float
the input pin of the swithcing transistor.
3
TXD (IrDA) I
IrDA Transmitter Data Input.
Active High
Logic high turns on the LED. If held high longer than
~50 µs, the LED is turned off. TXD (IrDA) must be driven
either high or low. DO NOT leave the pin floating.
4
RXD (IrDA) O
IrDA Receiver Data Output.
Active Low
Output is at low pulse response when light pulse is seen.
5
SD
I
Shutdown. Active High
Complete shutdown TXD(IrDA), RXD(IrDA), and PIN diode
6
VCC
I
Supply Voltage
Regulated, 2.7 to 5.5 Volt
7
NC
-
No internal connection
8
GND
I
Connect to system ground
Connect to system ground
-
SHIELD
-
EMI Shield
Connect to system ground via a low inductance trace.
For best performance, do not connect to GND
directly at the part.
Recommended Application Circuit Components
Component
Recommended Value
R1[1]
2.2 Ω ± 5%, 0.25 Watt for 2.7 ≤ VCC ≤ 3.3 V
2.7 Ω ± 5%, 0.25 Watt for 3.0 ≤ VCC ≤ 3.6 V
6.8 Ω ± 5%, 0.25 Watt for 4.5 ≤ VCC ≤ 5.5 V
R2
0 Ω, 0.25 Watt for 4.5 ≤ VCC ≤ 5.5 V
CX1[2]
0.47 µF ± 20%, X7R Ceramic
CX2[3]
6.8 µF ± 20%, Tantalum
Q1
N-Channel Logic Level MOSFET (Philip’s BSH103) with less than 1 Ω ‘ON’ resistance
Notes:
1. R1 is used to optimize the performance of the 870 nm LED, while R2 is the current limiting resistor for the 940 nm RC LED.
2. CX1 must be placed within 0.7 cm of HSDL-3002 to obtain optimum noise immunity.
3. In environment with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in Figure 1.
3
Transceiver I/O Truth Table
Inputs
Outputs
Transceiver Mode Shutdown IrDA (TXD) Remote Control Input
EI
IR LED
RC LED
RXD
Active
0
0
0
High[4]
Off
Off
Low[5]
Active
0
0
0
Low
Off
Off
High
Active
0
0
1
X
Off
On
Not Valid
Active
0
1
0
X
On
Off
Not Valid
Active
0
1
1
X
On
On
Not Valid
Shutdown
1
X[6]
X[6]
Low
Not Valid
Not Valid
Not Valid
X = Don’t Care
EI = In-Band Infrared Intensity at detector
Notes:
4. In-Band EI ≤ 115.2 kb/s.
5. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity.
6. To maintain low shutdown current, TXD need to be driven high or low and not left floating. The Remote Control Input should be tied low.
CAUTION: The BiCMOS inherent to this design of this component increases the component’s susceptibility to
damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and
assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50°C/W.
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
–40
100
°C
Operating Temperature
TA
–20
70
°C
LED Supply Voltage
VLED
0
7
V
Supply Voltage
VCC
0
7
V
Output Voltage: RXD
VO
–0.5
7
V
LED Current Pulse Amplitude
ILED
500
mA
Conditions
≤ 90 µs Pulse Width
≤ 20% duty cycle
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Operating Temperature
TA
–20
70
°C
Supply Voltage
VCC
2.7
5.5
V
Logic Input Voltage for TXD Logic High
VIH
2/3 VCC
VCC
V
Logic Low
VIL
0
1/3 VCC V
Logic High
EIH
0.0081
500
mW/cm2 For in-band signals ≤ 115.2 kbps[7]
Logic Low
EIL
0.3
mW/cm2 For in-band signals[7]
tTPW (SIR) 1.5
1.6
µs
115.2
kbps
Receiver Input Irradiance
TXD Pulse Width (SIR)
Receiver Data Rate
4
9.6
Conditions
tPW (TXD) = 1.6 µs at 115.2 kbps
Electrical & Optical Specifications
Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified
test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC set to 3.0 V unless
otherwise noted.
Parameter
Symbol
Min.
Typ.
Max.
Units
Viewing Angle
2θ1/2
30
Peak Sensitivity Wavelength
λp
RXD Output Voltage Logic High
VOH
VCC -0.2
VCC
V
Logic Low
Conditions
Receiver
°
875
nm
IOH=-200 µA, EI ≤ 0.3 µW/cm2
VOL
0
0.4
V
RXD Pulse Width (SIR)[8]
tRPW (SIR)
1
7.5
µs
θ1/2 ≤ 15°, CL = 9 pF
RXD Rise and Fall Times
tr, tf
25
100
ns
CL = 9 pF
Receiver Latency Time[9]
tL
25
50
µs
EI = 4 µW/cm2
Receiver Wake Up Time[10]
tRW
18
100
µs
EI = 10 mW/cm2
IR Transmitter
IR Radiant Intensity
IEH
10
IR Viewing Angle
2θ1/2
30
IR Peak Wavelength
λp
TXD Logic Levels
mW/sr ILEDA = 350 mA, θ1/2 ≤ 15°,
TXD ≥ VIH. TA = 25°C, V(RCI) ≤ VIL
40
60
875
°
nm
High
VIH
2/3 VCC
VCC
V
Low
VIL
0
1/3 VCC
V
High
IH
0.02
1
µA
VI ≥ VIH
Low
IL
-0.02
1
µA
0 ≤ VI ≤ VIL
Shutdown
IVLED
20
1000
nA
VI(SD) ≥ VIH, TA = 25°C
Wakeup Time[11]
tTW
30
100
ns
Maximum Optical PW[12]
tPW(Max)
25
50
µs
TXD Rise and Fall Time (Optical)
tr, tf
600
ns
LED Anode on State Voltage
VON(LEDA)
2.2
V
TXD Input Current
LED Current
–1
ILEDA = 350 mA, VI(TXD) ≥ VIH,
V(RCI) ≤ VIL
RC Transmitter
mW/sr ILEDA = 400 mA, θ1/2 ≤ 15°,
TXD ≤ VIL, TA = 25°C, V(RCI) ≥ VIH
Remote Control (RC)
Radiant Intensity[13]
IEH
5
20
RC Viewing Angle
2θ1/2
30
RC Peak Wavelength
λp
940
High
IH
0.01
1
µA
VI ≥ VIH
Low
IL
–0.02
1
µA
0 ≤ VI ≤ VIL
Shutdown
ICC1
0.01
1
µA
VSD ≥ VCC - 0.5; TA = 25°C
Idle
ICC2
290
450
µA
VI(TXD) ≤ VIL, EI = 0
Active
ICC3
2
8
mA
VI(TXD) ≥ VIL
60
°
nm
Transceiver
Input Current
Supply Current
5
–1
Notes:
7. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are
compliant with the IrDA Serial Infrared Physical Layer Link Specification.
8. For in band signals 2.4 kbps to 115.2 kbps where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2.
9. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity.
10. Receiver Wake up time is measured from VCC power on to valid RXD output.
11. Transmitter wake up time is measured from VCC power on to valid light output in response to a TXD pulse.
12. The optical PW is defined as the maximum time which the LED will turn on, this is to prevent the long turn on time for the LED.
13. The VIH and VIL, when used in reference with RCI, depend on the switching transistor used and should obtain from the transistor datasheet.
ILED vs. RADIANT INTENSITY (mW/Sr)
FOR THE 870 nm LED
TEMPERATURE = 25°C
VLEDA vs. ILED FOR 870 nm LED
TEMPERATURE = 25°C
2.5
70
2.3
50
VLEDA (VOLTS)
RADIANT INTENSITY (mW/sr)
2.4
60
40
30
20
2.2
2.1
2.0
1.9
1.8
1.7
10
1.6
1.5
0
50 100 150 200 250 300 350 400 450 500 550
50 100 150 200 250 300 350 400 450 500 550
ILED (mA)
ILED (mA)
Figure 3. IR LOP vs. ILED.
Figure 4. IR VLED vs. ILED.
ILED vs. RADIANT INTENSITY (mW/Sr)
OF THE 940 nm LED
TEMPERATURE = 25°C
VLEDA vs. ILED FOR THE 940 nm LED
TEMPERATURE = 25°C
2.5
40
2.0
35
VLEDA (VOLTS)
RADIANT INTENSITY (mW/sr)
45
30
25
20
15
5
0
50
150
250
350
450
ILED (mA)
Figure 5. RC LOP vs. ILED.
6
1.0
0.5
10
0
50
1.5
550
650
150
250
350
450
ILED (mA)
Figure 6. RC VLED vs. ILED.
550
650
tpw
VOH
90%
50%
VOL
10%
tf
tr
Figure 7. RXD output waveform.
tpw
LED ON
90%
50%
10%
LED OFF
tr
tf
Figure 8. LED optical waveform.
TXD
LED
tpw (MAX.)
Figure 9. TXD “Stuck ON” protection.
SD
SD
RX
LIGHT
TXD
RXD
TX
LIGHT
tRW
Figure 10. Receiver wakeup time definition.
7
tTW
Figure 11. Transmitter wakeup time definition.
HSDL-3002 Package Outline (with Integrated Shield)
4.55
MOUNTING CENTER
0.885
9.10 ± 0.15
2.70 ± 0.15
1.35
2.65
2.60
;;
;
;;
;
;
;;
;;;;
;;;
;;;
;
1.25
5.80
1.55
R 1.50
R 1.10
3.65
2.95
1
COPLANARITY:
+0.05 TO -0.15
2
3
4
PITCH 1.00
5
6
7
8
0.65
0.80
0.50
ALL DIMENSIONS IN MILLIMETERS (mm).
DIMENSION TOLERANCE IS 0.2 mm
UNLESS OTHERWISE SPECIFIED.
Figure 12. Package outline dimension.
8
HSDL-3002 Tape and Reel Dimensions
4.00 ± 0.10
5.00° (MAX.)
1.75 ± 0.10
1.13 ± 0.10
1.55 ± 0.05
POLARITY
PIN 8: GND
+0.10
3.46 0
7.50 ± 0.10
16.00 ± 0.30
9.50 ± 0.10
+0.10
3.30 0
PIN 1: VLED
8.00
± 0.10
0.40 ± 0.10
3.00 ± 0.10
8.00° (MAX.)
MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE
MATERIAL OF COVER TAPE: PVC
3.40 ± 0.20
METHOD OF COVER: HEAT ACTIVATED ADHESIVE
4.20 ± 0.20
PROGRESSIVE DIRECTION
EMPTY
(40 mm MIN.)
LEADER
PARTS
MOUNTED
(400 mm MIN.)
EMPTY
(40 mm MIN.)
"B" "C"
330
QUANTITY
80
2500
UNIT: mm
DETAIL A
DIA. 13.00 ± 0.50
R 1.00
B
C
2.00 ± 0.50
LABEL
16.40
+ 2.00
0
21.00
± 0.80
DETAIL A
Figure 13. Tape and reel dimensions.
9
2.00 ± 0.50
Moisture Proof Packaging
Baking Conditions
All HSDL-3002 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 4.
Package
Temp.
In reels
60°C
≥ 48 hours
In bulk
100°C
≥ 4 hours
125°C
≥ 2 hours
150°C
≥ 1 hour
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Baking should only be done once.
Recommended Storage
Conditions
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH?
YES
PERFORM RECOMMENDED
BAKING CONDITIONS
Figure 14. Baking conditions chart.
10
Storage
Temperature
10°C to 30°C
Relative
Humidity
below 60% RH
YES
NO BAKING
IS NECESSARY
NO
PACKAGE IS
OPENED MORE
THAN 72 HOURS
Time
NO
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recommended storage conditions.
Reflow Profile
MAX. 245°C
T – TEMPERATURE – (°C)
230
R4
R3
200
183
170
150
R2
90 sec.
MAX.
ABOVE
183°C
125
R1
100
R5
50
25
0
50
100
150
200
250
300
t-TIME (SECONDS)
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
Figure 15. Reflow graph.
Process Zone
Symbol
∆T
Maximum DT/Dtime
Heat Up
P1, R1
25°C to 125°C
4°C/s
Solder Paste Dry
P2, R2
125°C to 170°C
0.5°C/s
Solder Reflow
P3, R3
170°C to 230°C (245°C at 10 seconds max.)
4°C/s
P3, R4
230°C to 170°C
–4°C/s
P4, R5
170°C to 25°C
–3°C/s
Cool Down
The reflow profile is a straightline representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different ∆T/∆time temperature change rates. The ∆T/∆time
rates are detailed in the above
table. The temperatures are
measured at the component to
printed circuit board connections.
In process zone P1, the PC
board and HSDL-3602 castellation I/O pins are heated to a
temperature of 125°C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4°C per second to allow
for even heating of both the PC
board and HSDL-3602
castellation I/O pins.
11
Process zone P2 should be of
sufficient time duration (>60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170°C
(338°F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230°C (446°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170°C (338°F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25°C (77°F) should not exceed
-3°C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3602
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the HSDL3602 transceiver.
Appendix A : SMT Assembly
Application Note
1.0 Solder Pad, Mask and Metal
Stencil
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND
PATTERN
SOLDER
MASK
PCBA
Figure 16. Stencil and PCBA.
1.1 Recommended Land Pattern
2.65
3.05
MOUNTING CENTER
1.175
1.10
0.50
0.715
2.30
1.20
8
7
0.725
Figure 17. Land pattern.
12
6
5
4
1.00
3
2
1
0.65
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 3.05 mm x 1.1 mm as per land
pattern.
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
APERTURES AS PER
LAND DIMENSIONS
t
w
l
Figure 18. Solder stencil aperture.
Aperture size(mm)
Stencil thickness, t (mm)
length, l
width, w
0.152 mm
2.60 ± 0.05
0.55 ± 0.05
0.127 mm
3.00 ± 0.05
0.55 ± 0.05
10.1
0.2
3.85
3.2
SOLDER MASK
UNITS: mm
It is recommended that two
fiducial crosses be placed at midlength of the pads for unit
alignment.
Note: Wet/Liquid PhotoImageable solder resist/mask is
recommended.
13
Figure 19. Adjacent land keepout and solder mask areas.
Appendix B : PCB Layout
Suggestion
The following shows an example
of a PCB layout that would result
in good electrical and EMI performance. Things to note:
1. The ground plane should be
continuous under the part, but
should not extend under the
shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground.
3. The AGND pin should be connected to the ground plane and
not to the shield tab.
4. C1 and C2 are optional supply
filter capacitors; they may be
left out if a clean power supply
is used.
5. VLED can be connected to
either unfiltered or unregulated power supply. If VLED
and VCC share the same power
supply and C1 is used, the
connection should be before
the current limiting resistor
R2. In a noisy environment,
supply rejection can be enhanced by including C2 as
well.
The layout corresponds to the
following application circuit
diagram.
Top View
Bottom View
VCC
CX2
GND
CX1
RECEIVER
NC
RxD
DIP
SWITCH
SD
R1
RC
Q1
TRANSMITTER
TxD
VCC
R2
Figure 20. PCB layout suggestion.
14
R2 is the current limiting resistor,
while R1 is a weak pull down
resistor for the input of the
switching transistor. Do not float
the input of the switching
MOSFET. The DIP switch is used
to select between driving the
875 nm or 940 nm LED.
Appendix C : General
Application Guide for the
HSDL-3002 Infrared IrDA®
Compliant 115.2 Kb/s
Transceiver
computing market such as PDAs,
as well as small embedded mobile
products such as digital cameras
and cellular phones. It also
includes a 940 nm LED to
support universal remote control
applications. It is fully compliant
to IrDA 1.4 low power specification from 9.6 kb/s to 115.2 kb/s,
and supports most remote control
codes. The design of the HSDL-
Description
The HSDL-3002, a wide voltage
operating range infrared
transceiver is a low-cost and
small form factor device that is
designed to address the mobile
3002 also includes the following
unique features:
• An additional spectrally suited
940 nm LED
• Low passive component count.
• Shutdown mode for low power
consumption requirement.
Selection of Resistor R1
Resistor R1 should be selected to
provide the appropriate peak
pulse LED current over different
ranges of VCC as shown in the
table below.
Recommended R1
VCC
Intensity
Minimum Peak
Pulse LED Current
Conditions
2.2 Ω
3.0 V
40 mW/sr
350 mA
Turn on 870 nm LED only TxD ≥ VIH, V(RC) ≤ VIL
20 mW/sr
400 mA
Turn on 940 nm LED only TXD ≤ VIL, V(RC) ≥ VIH
The resistor value chosen above
is for optimal IrDA operation. For
optimized remote control
performance, it is recommended
to turn on both the 870 nm and
940 nm LEDs. Moreover,
separate power control feature
can be incorporated for remote
control operation by implementing device as shown in Figure 3.
Interface to Recommended I/O Chips
The HSDL-3002’s TXD data input
is buffered to allow for CMOS
drive levels. No peaking circuit or
capacitor is required. Data rate
from 9.6 kb/s up to 115.2 kb/s is
available at the RXD pin. The
V(RC), pin 2, in conjunction with
TxD (IrDA), pin 3, can be used to
send remote control codes. Pin 2
is driven through a switching FET
transistor with a very low onresistance capable of driving 400
mA of current for remote control
operation.
The block diagram below shows
how the IrDA port fits into a
mobile phone and PDA platform.
SPEAKER
AUDIO INTERFACE
DSP CORE
MICROPHONE
ASIC
CONTROLLER
RF INTERFACE
TRANSCEIVER
MOD/
DE-MODULATOR
IR
RC
MICROCONTROLLER
USER INTERFACE
HSDL-3002
MOBILE PHONE PLATFORM
Figure 21. IR layout in mobile phone platform.
15
LCD
PANEL
RC
RAM
IR
HSDL-3002
CPU
FOR EMBEDDED
APPLICATION
ROM
PCMCIA
CONTROLLER
TOUCH
PANEL
RS232C
DRIVER
COM
PORT
PDA PLATFORM
Figure 22. IR layout in PDA platform.
The link distance testing was
done using typical HSDL-3002
units with National Semiconductor’s PC87109 3 V Super
I/O controller and SMC’s
FDC37C669 and FDC37N769
Super I/O controllers. An IrDA
link distance of up to 100 cm was
demonstrated.
16
Remote Control Operation
HSDL-3002 comes with an
additional spectrally suited
940 nm LED for remote control
applications. Remote control
applications are not governed by
any standards, owing to which
there are numerous remote
control codes in the market. Each
of these standards results in
receiver modules with different
sensitivities, depending on the
carrier frequencies and
responsivity to the incident light
wavelength.
Based on a survey of some
commonly used remote control
receiver modules, the irradiance
is found to be in the range of
0.05~0.07 µW/cm2. Based on a
typical irradiance of 0.075 µW/
cm2 and turning on both 870 nm
and 940 nm LEDs, a typical link
distance of 6 m is achieved. For a
more exhaustive note on
implementing remote control
using HSDL-3002, please refer to
the application note.
Appendix D : Window Designs
for HSDL-3002
Optical port dimensions for
HSDL-3002
To ensure IrDA compliance, some
constraints on the height and
width of the window exist. The
minimum dimensions ensure that
the IrDA cone angles are met
without vignetting. The maximum
dimensions minimize the effects
of stray light. The minimum size
corresponds to a cone angle of
30° and the maximum size
corresponds to a cone angle
of 60°.
In the figure below, X is the width
of the window, Y is the height of
the window and Z is the distance
from the HSDL-3002 to the back
of the window. The distance from
the center of the LED lens to the
center of the photodiode lens, K,
is 5.8 mm. The equations for
computing the window
dimensions are as follows:
X = K + 2*(Z+D)*tanA
Y = 2*(Z+D)*tanA
The above equations assume that
the thickness of the window is
negligible compared to the
distance of the module from the
back of the window (Z). If they
are comparable, Z' replaces Z in
the above equation. Z' is defined as
Z' = Z+t/n
where ‘t’ is the thickness of the
window and ‘n’ is the refractive
index of the window material.
The depth of the LED image
inside the HSDL-3002, D, is
8.6 mm. ‘A’ is the required half
angle for viewing. For IrDA
compliance, the minimum is 15°
and the maximum is 30°.
Assuming the thickness of the
window to be negligible, the
equations result in the following
tables and graphs:
;;;;;;;;
;;;;;;
;;;;;;;;;
;;;;;;
;;;;;;;;
;;; ;;;;;
;;
OPAQUE
MATERIAL
IR TRANSPARENT WINDOW
Y
X
IR TRANSPARENT
WINDOW
OPAQUE
MATERIAL
K
Z
A
D
Figure 23. Window design diagram.
17
Aperture Height (y, mm)
Module Depth (z) mm
Max.
Min.
Max.
Min.
0
15.73
10.41
9.93
4.61
1
16.89
10.94
11.09
5.14
2
18.04
11.48
12.24
5.68
3
19.19
12.02
13.39
6.22
4
20.35
12.55
14.55
6.75
5
21.5
13.09
15.7
7.29
6
22.66
13.62
16.86
7.82
7
23.81
14.16
18.01
8.36
8
24.97
14.7
19.17
8.90
9
26.12
15.23
20.32
9.43
APERTURE WIDTH (X) vs. MODULE DEPTH
APERTURE HEIGHT (Y) vs. MODULE DEPTH
30
25
APERTURE HEIGHT (Y) – mm
APERTURE WIDTH (X) – mm
Aperture Width (x, mm)
25
20
15
10
X MAX.
X MIN.
5
0
0
1
2
3
4
5
6
7
8
9
20
15
10
5
0
Y MAX.
Y MIN.
0
1
MODULE DEPTH (Z) – mm
2
3
4
5
6
7
8
9
MODULE DEPTH (Z) – mm
Figure 24. Aperture width (X) vs. module depth.
Figure 25. Aperture height (Y) vs. module depth.
Window Material
texture. An IR filter dye may be
used in the window to make it
look black to the eye, but the
total optical loss of the window
should be 10% or less for best
optical performance. Light loss
should be measured at 875 nm.
Almost any plastic material will
work as a window material.
Polycarbonate is recommended.
The surface finish of the plastic
should be smooth, without any
Recommended Plastic Materials
Material #
Light Transmission
Haze
Refractive Index
Lexan 141L
88%
1%
1.586
Lexan 920A
85%
1%
1.586
Lexan 940A
85%
1%
1.586
Note: 920A and 940A are more flame retardant than 141L.
Recommended Dye: Violet #21051 (IR transmissant above 625 nm)
The recommended plastic
materials for use as a cosmetic
window are available from
General Electric Plastics.
Shape of the Window
From an optics standpoint, the
window should be flat. This
ensures that the window will not
alter either the radiation pattern
of the LED, or the receive pattern
of the photodiode.
If the window must be curved for
mechanical or industrial design
reasons, place the same curve on
the back side of the window that
has an identical radius as the
front side. While this will not
completely eliminate the lens
effect of the front curved surface,
it will significantly reduce the
effects. The amount of change in
the radiation pattern is dependent
Flat Window
(First choice)
Figure 26. Shape of windows.
upon the material chosen for the
window, the radius of the front
and back curves, and the distance
from the back surface to the
transceiver. Once these items are
known, a lens design can be
made which will eliminate the
effect of the front surface curve.
The following drawings show the
effects of a curved window on the
radiation pattern. In all cases, the
center thickness of the window is
1.5 mm, the window is made of
polycarbonate plastic, and the
distance from the transceiver to
the back surface of the window is
3 mm.
Curved Front and Back
(Second choice)
Curved Front, Flat Back
(Do not use)
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Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.