BPX61

2015-12-23 Silicon PIN Photodiode Version 1.3 BPX 61 Features: • Suitable up to 125 °C • Especially suitable for applications from 400 nm to 1100 nm • Short switching time (typ. 20 ns) • Hermetically sealed metal package (similar to TO-5) Applications Industrial electronics • • For control and drive circuits • Photointerrupters • IR remote control of hi-fi and TV sets, dimmers, remote controls of various equipment Ordering Information Type: Photocurrent Ordering Code IP [µA] Ev = 1000 lx, Std. Light A, VR =5V BPX 61 2015-12-23 70 (≥ 50) Q62705P0025 1 Version 1.3 BPX 61 Maximum Ratings (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range Top; Tstg -40 ... 125 °C Reverse voltage VR 32 V Total Power dissipation Ptot 250 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Characteristics (TA = 25 °C) Parameter Symbol Values Unit Spectral sensitivity (VR = 5 V) (typ) S 70 (≥ 50) nA/Ix Photocurrent (Ev = 1000 lx, Std. Light A, VR = 5 V) (typ (min)) IP 70 (≥ 50) µA Wavelength of max. sensitivity (typ) λS max 850 nm Spectral range of sensitivity (typ) λ10% Radiant sensitive area (typ) A Dimensions of radiant sensitive area (typ) LxW Half angle (typ) ϕ Dark current (VR = 10 V) (typ (max)) IR Spectral sensitivity of the chip (λ = 850 nm) (typ) Sλ typ 0.62 A/W Quantum yield of the chip (λ = 850 nm) (typ) η 0.90 Electro ns /Photon Open-circuit voltage (Ev = 1000 lx, Std. Light A) (typ (min)) VO 375 (≥ 320) mV Short-circuit current (Ev = 1000 lx, Std. Light A) (typ) ISC 70 µA Rise and fall time (VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA) (typ) tr, tf 0.02 µs Forward voltage (IF = 100 mA, E = 0) (typ) VF 1.3 V Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C0 72 pF Temperature coefficient of VO (typ) TCV 2015-12-23 2 (typ) 400 ... 1100 nm 7.02 mm2 2.65 x 2.65 mm x mm ± 55 2 (≤ 30) -2.6 ° nA mV / K Version 1.3 BPX 61 Parameter Symbol Values Unit Temperature coefficient of ISC (Std. Light A) (typ) TCI 0.18 %/K Noise equivalent power (VR = 10 V, λ = 850 nm) (typ) NEP 0.041 pW / Hz½ Detection limit (typ) D* 6.5e12 cm x Hz½ / W Relative Spectral Sensitivity 1) page 7 Srel = f(λ) 100 Photocurrent / Open-Circuit Voltage 1) page 7 IP (VR = 5 V) / VO = f(EV) OHF00078 S rel % 80 60 40 20 0 400 500 600 700 800 900 nm 1100 λ 2015-12-23 3 Version 1.3 BPX 61 Dark Current 1) page 7 IR = f(VR), E = 0 Power Consumption Ptot = f(TA) OHF00080 4000 ΙR pA 3000 2000 1000 0 Capacitance 1) page 7 C = f(VR), f = 1 MHz, E = 0 5 10 15 V VR 20 Dark Current 1) page 7 IR = f(TA), VR = 10 V, E = 0 OHF00081 100 C 0 OHF00082 10 3 Ι R nA pF 80 10 2 70 60 10 1 50 40 30 10 0 20 10 0 -2 10 10 -1 10 0 10 1 10 -1 V 10 2 VR 2015-12-23 4 0 20 40 60 80 ˚C 100 TA Version 1.3 BPX 61 Directional Characteristics 1) page 7 Srel = f(ϕ) Package Outline Cathode ø0.45 (0.018) 3.4 (0.134) 14.5 (0.571) 3.0 (0.118) 12.5 (0.492) 0.3 (0.012) max Approx. weight 2 g 0.8 0.6 5 (0 5 ( .03 0.0 3) 26 ) 9) .0 03 1) ( 3 1.0 (0.0 0.8 GMOY6011 Dimensions in mm (inch). Package Metal Can (TO-39), hermetically sealed 2015-12-23 Radiant sensitive area ø5.8 (0.228) 1.55 (0.061) ø6.0 (0.236) 1.75 (0.069) 5.08 (0.200) spacing ø9.5 (0.374) ø9.0 (0.354) ø8.3 (0.327) ø8.0 (0.315) Chip position 5 Version 1.3 BPX 61 Approximate Weight: 0.9 g TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C First wave Second wave Continuous line: typical process Dotted line: process limits ∆T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C 120 ˚C 100 ˚C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2015-12-23 6 Version 1.3 BPX 61 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2015-12-23 7 Version 1.3 BPX 61 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2015-12-23 8