SFH206K

2016-01-04 Silicon PIN Photodiode Version 1.3 SFH 206 K Features: • Especially suitable for applications from 400 nm to 1100 nm • Short switching time (typ. 20 ns) • 5 mm LED plastic package • Also available on tape and reel Applications Photointerrupters • • Industrial electronics • For control and drive circuits • Computer-controlled flashes Ordering Information Type: Ordering Code SFH 206 K Q62702P0129 2016-01-04 1 Version 1.3 SFH 206 K Maximum Ratings (TA = 25 °C) Parameter Symbol Values Unit Operating and storage temperature range Top; Tstg -40 ... 100 °C Reverse voltage VR 32 V Total Power dissipation Ptot 150 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Characteristics (TA = 25 °C) Parameter Symbol Values Unit 80 (≥ 50) nA/Ix Spectral sensitivity (VR = 5 V, standard light A, T = 2856 K) (typ) S Wavelength of max. sensitivity (typ) λS max Spectral range of sensitivity (typ) λ10% Radiant sensitive area (typ) A Dimensions of radiant sensitive area (typ) LxW Half angle (typ) ϕ Dark current (VR = 10 V) (typ (max)) IR Spectral sensitivity of the chip (λ = 850 nm) (typ) Sλ typ 0.62 A/W Quantum yield of the chip (λ = 850 nm) (typ) η 0.90 Electro ns /Photon Open-circuit voltage (Ev = 1000 lx, Std. Light A) (typ (min)) VO 365 (≥ 310) mV Short-circuit current (Ev = 1000 lx, Std. Light A) (typ) ISC 80 µA Rise and fall time (VR = 5 V, RL = 50 Ω, λ = 850 nm, IP = 800 µA) (typ) tr, tf 0.02 µs Forward voltage (IF = 100 mA, E = 0) (typ) VF 1.3 V Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C0 72 pF Temperature coefficient of VO (typ) TCV 2016-01-04 2 850 (typ) 400 ... 1100 nm nm 7.02 mm2 2.65 x 2.65 mm x mm ± 60 2 (≤ 30) -2.6 ° nA mV / K Version 1.3 SFH 206 K Parameter Symbol Values Unit Temperature coefficient of ISC (Std. Light A) (typ) TCI 0.18 %/K Noise equivalent power (VR = 10 V, λ = 850 nm) (typ) NEP 0.041 pW / Hz½ Detection limit (VR = 10 V, λ = 850 nm) (typ) D* 6.5e12 cm x Hz½ / W Relative Spectral Sensitivity 1) page 8 Srel = f(λ) 100 Photocurrent / Open-Circuit Voltage 1) page 8 IP (VR = 5 V) / VO = f(Ev) OHF00078 S rel % 80 60 40 20 0 400 500 600 700 800 900 nm 1100 λ 2016-01-04 3 Version 1.3 SFH 206 K Dark Current 1) page 8 IR = f(VR), E = 0 Power Consumption Ptot = f(TA) OHF00394 160 mW Ptot 140 120 100 80 60 40 20 0 0 20 40 60 80 ˚C 100 TA Capacitance 1) page 8 C = f(VR), f = 1 MHz, E = 0 Dark Current 1) page 8 IR = f(TA), VR = 10 V, E = 0 OHF00082 10 3 Ι R nA 10 2 10 1 10 0 10 -1 2016-01-04 4 0 20 40 60 80 ˚C 100 TA Version 1.3 SFH 206 K Directional Characteristics 1) page 8 Srel = f(ϕ) 40 30 20 10 ϕ 0 OHF01402 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 Package Outline Area not flat 6.9 (0.272) 0.6 (0.024) x 0.5 (0.020) 0.4 (0.016) x 0.3 (0.012) 1.8 (0.071) 1.2 (0.047) 34 (1.339) 32 (1.260) 4.1 (0.161) 3.7 (0.146) GEOY6647 Dimensions in mm (inch). Package 5mm Radial (T 1 ¾), Epoxy 2016-01-04 4.7 (0.185) 4.0 (0.157) Cathode 5.1 (0.201) 2.54 (0.100) spacing 0.8 (0.031) 0.4 (0.016) 6.3 (0.248) 0.8 (0.031) Radiant sensitive area 5 120 Version 1.3 SFH 206 K Approximate Weight: 0.3 g Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm. Note: pad 1: anode 2016-01-04 6 Version 1.3 SFH 206 K TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C First wave Second wave Continuous line: typical process Dotted line: process limits ∆T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C 120 ˚C 100 ˚C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-01-04 7 Version 1.3 SFH 206 K Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-01-04 8 Version 1.3 SFH 206 K Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2016-01-04 9