2015-12-08
Silicon NPN Phototransistor
Version 1.2 (not for new design in automotive applications)
SFH 3010
Features:
•
Spectral range of sensitivity: (typ) 420 ... 1100 nm
•
Package: SmartLED (SCD 80), Epoxy, colourless, slightly diffused
•
Special: Very small SMT package: (LxBxH) 1.7 mm x 0.8mm x 0.65 mm
•
Large viewing angle ± 80°
•
Available only on tape and reel
Applications
•
Miniature photointerrupters
•
Sensor technology (e.g. mobile phone)
•
For control and drive circuits
Ordering Information
Type:
Photocurrent
Ordering Code
IPCE [µA]
λ = 950 nm, Ee = 0.5 mW/cm2,
VCE = 5 V
SFH 3010
2015-12-08
≥ 25
Q65110A6458
1
Version 1.2 (not for new design in automotive applications)
SFH 3010
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Values
Operating and storage temperature range
Top; Tstg
-40 ... 100
°C
Collector-emitter voltage
VCE
15
V
Collector-emitter voltage
(t < 2 min)
VCE
30
V
Collector current
IC
15
mA
Collector surge current
(τ < 10 µs)
ICS
75
mA
Emitter-collector voltage
VEC
7
V
Total Power dissipation
Ptot
130
mW
Electrostatic discharge
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2000
V
Thermal resistance for mounting on pcb
RthJA
450
K/W
RthJS
250
K/W
Thermal restistance junction
1) page 12
Unit
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
860
nm
Wavelength of max. sensitivity
(typ)
λS max
Spectral range of sensitivity
(typ)
λ10%
Radiant sensitive area
(typ)
A
0.04
mm2
Dimensions of chip area
(typ)
LxW
(typ) 0.38 x
0.38
mm x
mm
Half angle
(typ)
ϕ
± 80
°
Capacitance
(VCE = 0 V, f = 1 MHz, E = 0)
(typ)
CCE
1.3
pF
IPCE
≥ 25
µA
1 (≤ 50)
nA
7
µs
140
mV
Photocurrent
(λ = 950 nm, Ee = 0.5 mW/cm2, VCE = 5 V)
Dark current
(VCE = 20 V, E = 0)
(typ (max)) ICE0
Rise and fall time
(IC = 1 mA, VCC = 5 V, RL = 1 kΩ)
(typ)
tr, tf
Collector-emitter saturation voltage
(IC = 10 μA, Ee = 0.5 mW/cm2, λ = 950 nm, )
(typ)
VCEsat
2015-12-08
2
(typ) 420
... 1100
nm
Version 1.2 (not for new design in automotive applications)
Relative Spectral Sensitivity 2) page 12
Srel = f(λ)
Photocurrent 2) page 12
IPCE = f(VCE), Ee = Parameter
OHF00593
100
%
Srel 90
SFH 3010
IPCE
80
OHF00612
450
µA
350
70
1 mW/cm 2
300
60
250
50
200
0.5 mW/cm 2
40
150
30
100
0.25 mW/cm 2
50
0.1 mW/cm 2
20
10
0
0
400 500 600 700 800 900 nm 1100
0
5
10
15
20
VCE
λ
Photocurrent 2) page 12
IPCE / IPCE(25°C) = f(TA), VCE = 5 V
Ι PCE
Ι PCE 25
Dark Current 2) page 12
ICEO = f(VCE), E = 0
OHF01524
1.6
25 V 30
IR
OHF02420
101
nA
1.4
1.2
100
1.0
0.8
0.6
10-1
0.4
0.2
0
-25
2015-12-08
0
25
50
10-2
75 C 100
TA
0
5
10
15
20
25 V 30
VR
3
Version 1.2 (not for new design in automotive applications)
Dark Current 2) page 12
ICEO = f(TA), E = 0, VCE = 20 V
Collector-Emitter Capacitance 2) page 12
CCE = f(VCE), f = 1 MHz, E = 0
OHF01530
10 3
nA
SFH 3010
Ι CEO
C CE
OHF00592
3.0
pF
2.5
10
2
2.0
10 1
1.5
1.0
10 0
0.5
10 -1
-25
0
25
50
0 -2
10
75 ˚C 100
TA
OHF00613
Ptot
120
100
80
60
40
20
0
2015-12-08
0
20
40
60
10 0
101
V 10 2
VCE
Power Consumption
Ptot = f(TA)
140
mW
10-1
80 C 100
TA
4
Version 1.2 (not for new design in automotive applications)
SFH 3010
Directional Characteristics 2) page 12
Srel = f(ϕ)
40˚
30˚
20˚
10˚
ϕ
0˚
OHF00614
1.0
50˚
0.8
60˚
0.6
70˚
0.4
80˚
0.2
0
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
Package Outline
5˚
7˚ max
Package
marking
1.3 (0.051) ±0.1 (0.004)
Package
marking
(0.002)
0.125 (0.005) +0.05
-0.03 (0.001)
1.7 (0.067) ±0.1 (0.004)
0.8 (0.031) ±0.1 (0.004)
(0.001)
0.65 (0.026) +0.02
-0.05 (0.002)
0.7 (0.028) ±0.05 (0.002)
GPLY7036
Dimensions in mm (inch).
2015-12-08
5
100˚
120˚
Version 1.2 (not for new design in automotive applications)
Additional Information
Information
Package
Epoxy, diffuse
Colour
colourless
Package marking
Collector
Package
SmartLED (SCD 80), Epoxy, colourless, slightly diffused
Approximate Weight:
1.5 mg
Recommended Solder Pad
0.8 (0.031)
0.7 (0.028)
0.8 (0.031)
0.8 (0.031)
OHAPY606
Dimensions in mm (inch).
2015-12-08
6
SFH 3010
Version 1.2 (not for new design in automotive applications)
SFH 3010
0.7 (0.028)
0.8 (0.031)
0.8 (0.031)
0.7 (0.028)
0.05 (0.002)
Alternative Solder Pad
0.6 (0.024)
0.05 (0.002)
Solder stencil aperture
Copper solder pad
OHPY3832
Dimensions in mm (inch).
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
2015-12-08
7
Version 1.2 (not for new design in automotive applications)
SFH 3010
OHA04612
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation
Maximum
2
3
100
120
2
3
)
Ramp-up rate to preheat*
25 °C to 150 °C
Time tS
TSmin to TSmax
tS
60
Ramp-up rate to peak*)
TSmax to TP
Unit
Einheit
K/s
s
K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
s
3
6
K/s
10
Ramp-down rate*
TP to 100 °C
°C
480
Time
25 °C to TP
s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
1.8 (0.071)
8 (0.315)
4 (0.157)
1.75 (0.069)
1.5 (0.059)
3.5 (0.138)
Taping
C
A
2 (0.079)
0.9 (0.035)
0.8 (0.031)
OHAY1491
Dimensions in mm (inch).
2015-12-08
8
Version 1.2 (not for new design in automotive applications)
SFH 3010
Tape and Reel
8 mm tape with 5000 pcs. on ∅ 180 mm reel
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
Tape dimensions [mm]
Tape dim ensions in m m
W
P0
P1
P2
D0
E
F
8 + 0.3 / -0.1
4 ± 0.1
2 ± 0.05
or
4 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
3.5 ± 0.05
Reel dimensions [mm]
Reel dim ensions in m m
A
W
Nmin
W1
W2max
180
8
60
8.4 + 2
14.4
Barcode-Product-Label (BPL)
OSRAM Opto
EX
A
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
MP
ML Temp ST
X XXX °C X
(9D) D/C: 1234
Pack: RXX
LE
DEMY
XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY:
9999
(G) GROUP:
XX-XX-X-X
OHA04563
2015-12-08
9
Version 1.2 (not for new design in automotive applications)
SFH 3010
Dry Packing Process and Materials
Moisture-sensitive label or print
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
AM
OSR
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
Transportation Packing and Materials
Barcode label
Y
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18
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+
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Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
200 ± 5
195 ± 5
30 ± 5
2015-12-08
M
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D
5
14 2
110 0
(Q
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(6
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Barcode label
10
OHA02044
Version 1.2 (not for new design in automotive applications)
SFH 3010
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2015-12-08
11
Version 1.2 (not for new design in automotive applications)
SFH 3010
Glossary
1)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
2)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2015-12-08
12
Version 1.2 (not for new design in automotive applications)
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2015-12-08
13
SFH 3010