Data sheet
BMG250
Low noise, low power triaxial gyroscope
Bosch Sensortec
BMG250 – Data sheet
Document revision
1.2
Document release date
July 2016
Document number
BST-BMG250-DS000-02
Technical reference code(s)
0 273 142 064
Notes
Data and descriptions in this document are subject to change without notice.
Product photos and pictures are for illustration purposes only and may differ
from the real product appearance.
BMG250
Data sheet
Page 2
BMG250
Low noise, low power triaxial gyroscope
The BMG250 is a low noise, low power three axial gyroscope that provides a precise angular rate
(gyroscopic) measurement at market leading low power consumption.
The BMG250 is a 16 bit digital, triaxial gyroscope sensor.
Key features
High performance low noise and low offset gyroscope
Very low power consumption: typ. 850 µA (gyroscope in full operation)
Very small 2.5 x 3.0 mm2 footprint, height 0.83 mm
Secondary high speed interface for OIS application
o Optimized for low latency and high Output Data Rate
Parallel use for OIS and standard UI applications
o UI Primary Interface (I²C)
o OIS Secondary Interface (SPI)
Built-in power management unit (PMU) for advanced power management
Power saving with fast start-up mode of gyroscope
Wide power supply range: 1.71V … 3.6V
Allocatable FIFO buffer of 1024 bytes
Hardware sensor time-stamps for accurate sensor data fusion
Flexible digital interface to connect to host over I2C or SPI
Extended I2C mode with clock frequencies up to 1 MHz
Typical applications
Optical Image Stabilization
Electronic Image Stabilization
Optical/Electronic Video Stabilization
Augmented Reality
Indoor navigation
3D scanning / indoor mapping
Advanced gesture recognition
Immersive gaming
3-axis motion detection, e.g. Air mouse applications and pointers
Advanced system power management for mobile applications
warranty logging
Target Devices
Smart phones, tablet and transformer PCs
Camera modules for Smartphones
Digital Still Cameras / Digital Video Cameras
Game controllers, remote controls and pointing devices
Head tracking devices
Wearable devices, e.g. smart watches or augmented reality glasses
Sport and fitness devices
Toys, e.g. toy helicopters
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 3
General Description
The BMG250 is a three axial gyroscope consisting of a state-of-the-art low power 3-axis
gyroscope. It has been designed for low power, high precision multi-axis applications in mobile
phones, tablets, wearable devices, remote controls, game controllers, head-mounted devices and
toys. The BMG250 is available in a compact 2.5 × 3.0 × 0.83 mm3 LGA package. When the
gyroscope is in full operation mode, power consumption is typically 850 µA, enabling always-on
applications in battery driven devices. The BMG250 offers a wide VDD voltage range from 1.71V
to 3.6V and a VDDIO range from 1.2V to 3.6V, allowing the BMG250 to be powered at 1.8V for both
VDD and VDDIO.
The BMG250 provides high precision sensor data together with the accurate timing of the
corresponding data. The timestamps have a resolution of up to 39 µs.
The integrated 1024 byte FIFO buffer supports low power applications and prevents data loss in
non-real-time systems. The intelligent FIFO architecture allows dynamic reallocation of FIFO
space. For typical applications, this is sufficient for approx. 1.4s of data capture at an output data
rate of 100Hz in FIFO mode with data header.
The smart built-in power management unit (PMU) can be configured, for example, to further lower
the power consumption by automatically sending the gyroscope temporarily into fast start-up
mode and waking it up again by externally triggering this function from the host device’s logical
unit.
Besides the flexible primary interface (I2C or SPI) that is used to connect to the host, BMG250
provides an additional secondary interface. This secondary interface can be used in SPI mode
for OIS (optical image stabilization) applications in conjunction with camera modules, or in
advanced gaming use cases.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 4
Index of Contents
1. Contents
2. SPECIFICATION.................................................................................................................... 7
2.1 ELECTRICAL SPECIFICATION ................................................................................................ 7
2.2 ELECTRICAL AND PHYSICAL CHARACTERISTICS, MEASUREMENT PERFORMANCE ...................... 8
2.3 ABSOLUTE MAXIMUM RATINGS ........................................................................................... 10
3. FUNCTIONAL DESCRIPTION ............................................................................................. 11
3.1 BLOCK DIAGRAM ............................................................................................................... 11
3.2 POWER MODES ................................................................................................................. 12
3.2.1 SUSPEND MODE ........................................................................................................................... 12
3.2.2 FAST START-UP MODE .................................................................................................................. 12
3.2.3 TRANSITIONS BETWEEN POWER MODES ......................................................................................... 13
3.2.4 PMU (POWER MANAGEMENT UNIT) .............................................................................................. 13
3.3 SENSOR TIMING AND DATA SYNCHRONIZATION ................................................................... 14
3.3.1 SENSOR TIME .............................................................................................................................. 14
3.4 DATA PROCESSING ........................................................................................................... 15
3.4.1 DATA PROCESSING ...................................................................................................................... 15
3.5 FIFO................................................................................................................................ 16
3.5.1 FIFO FRAMES ............................................................................................................................. 16
3.5.2 FIFO CONDITIONS AND DETAILS .................................................................................................... 19
3.6 INTERRUPT CONTROLLER .................................................................................................. 21
3.6.1 DATA READY DETECTION ............................................................................................................. 21
3.6.2 PMU TRIGGER (GYRO) ................................................................................................................ 21
3.6.3 FIFO INTERRUPTS ....................................................................................................................... 21
3.7 DEVICE SELF TEST ............................................................................................................ 22
3.8 OFFSET COMPENSATION ................................................................................................... 23
3.8.1 FAST OFFSET COMPENSATION....................................................................................................... 23
3.8.2 MANUAL OFFSET COMPENSATION .................................................................................................. 23
3.8.3 INLINE CALIBRATION ..................................................................................................................... 23
3.9 NON-VOLATILE MEMORY ................................................................................................... 24
3.10 REGISTER MAP ............................................................................................................... 25
3.10.1 REGISTER (0X00) CHIPID ......................................................................................................... 26
3.10.2 REGISTER (0X02) ERR_REG .................................................................................................... 27
3.10.3 REGISTER (0X03) PMU_STATUS ............................................................................................. 28
3.10.4 REGISTER (0X12-0X17) DATA ................................................................................................... 29
3.10.5 REGISTER (0X18-0X1A) SENSORTIME .................................................................................... 30
3.10.6 REGISTER (0X1B) STATUS ....................................................................................................... 31
3.10.7 REGISTER (0X1D) INT_STATUS_1 ........................................................................................... 31
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 5
3.10.8 REGISTER (0X20-0X21) TEMPERATURE ................................................................................. 32
3.10.9 REGISTER (0X22-0X23) FIFO_LENGTH ................................................................................... 33
3.10.10 REGISTER (0X24) FIFO_DATA ................................................................................................ 34
3.10.11 REGISTER (0X42) GYR_CONF................................................................................................ 35
3.10.12 REGISTER (0X43) GYR_RANGE ............................................................................................. 36
3.10.13 REGISTER (0X45) FIFO_DOWNS ........................................................................................... 37
3.10.14 REGISTER (0X46-0X47) FIFO_CONFIG .................................................................................. 38
3.10.15 REGISTER (0X51) INT_EN ....................................................................................................... 39
3.10.16 REGISTER (0X53) INT_OUT_CTRL ......................................................................................... 40
3.10.17 REGISTER (0X54) INT_IN_CTRL ............................................................................................. 41
3.10.18 REGISTER (0X56) INT_MAP .................................................................................................... 41
3.10.19 REGISTER (0X6A) CONF ......................................................................................................... 42
3.10.20 REGISTER (0X6B) IF_CONF .................................................................................................... 42
3.10.21 REGISTER (0X6C) PMU_TRIGGER ........................................................................................ 44
3.10.22 REGISTER (0X6D) SELF_TEST ............................................................................................... 45
3.10.23 REGISTER (0X70) NV_CONF .................................................................................................. 46
3.10.24 REGISTER (0X74-0X77) OFFSET ............................................................................................ 47
3.10.25 REGISTER (0X7E) CMD ........................................................................................................... 48
4. DIGITAL INTERFACES ....................................................................................................... 50
4.1 INTERFACE ....................................................................................................................... 50
4.1.1 INTERFACE I²C/SPI PROTOCOL SELECTION................................................................................... 51
4.1.2 SPI INTERFACE ............................................................................................................................ 52
4.1.3 I²C INTERFACE ............................................................................................................................. 55
4.1.4 SPI AND I²C ACCESS RESTRICTIONS ............................................................................................ 59
5. PIN-OUT AND CONNECTION DIAGRAMS ......................................................................... 61
5.1 PIN-OUT BMG250 ............................................................................................................ 61
5.2 CONNECTION DIAGRAMS ................................................................................................... 62
5.2.1 I2C INTERFACE ............................................................................................................................. 62
5.2.2 SPI 3-WIRE INTERFACE ................................................................................................................ 62
5.2.3 SPI 4-WIRE INTERFACE ................................................................................................................ 63
6. PACKAGE ........................................................................................................................... 65
6.1 OUTLINE DIMENSIONS ....................................................................................................... 65
6.2 SENSING AXES ORIENTATION ............................................................................................. 66
6.3 LANDING PATTERN RECOMMENDATION ............................................................................... 67
6.4 MARKING.......................................................................................................................... 68
6.4.1 MASS PRODUCTION MARKING........................................................................................................ 68
6.4.2 ENGINEERING SAMPLES ................................................................................................................ 68
6.5 SOLDERING GUIDELINES .................................................................................................... 69
6.6 HANDLING INSTRUCTIONS .................................................................................................. 70
6.7 TAPE AND REEL SPECIFICATION ......................................................................................... 71
6.7.1 ORIENTATION WITHIN THE REEL..................................................................................................... 71
6.8 ENVIRONMENTAL SAFETY .................................................................................................. 72
6.8.1 HALOGEN CONTENT ..................................................................................................................... 72
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 6
6.8.2 MULTIPLE SOURCING .................................................................................................................... 72
7. LEGAL DISCLAIMER .......................................................................................................... 73
7.1 ENGINEERING SAMPLES .................................................................................................... 73
7.2 PRODUCT USE .................................................................................................................. 73
7.3 APPLICATION EXAMPLES AND HINTS ................................................................................... 73
8. DOCUMENT HISTORY AND MODIFICATIONS .................................................................. 74
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 7
2. Specification
If not stated otherwise, the given values are over lifetime and full performance temperature and
voltage ranges, minimum/maximum values are ±3.
2.1 Electrical specification
VDD and VDDIO can be ramped in arbitrary order without causing the device to consume
significant currents. The values of the voltage at VDD and the VDDIO pins can be chosen
arbitrarily within their respective limits. The device only operates within specifications if the both
voltages at VDD and VDDIO pins are within the specified range. The voltage levels at the digital
input pins must not fall below GNDIO-0.3V or go above VDDIO+0.3V to prevent excessive current
flowing into the respective input pin. BMG250 contains a brownout detector, which ensures
integrity of data in the non-volatile memory under all operating conditions.
Table 1: Electrical parameter specification
Parameter
Supply Voltage
Internal Domains
Supply Voltage
I/O Domain
Voltage Input
Low Level
Voltage Input
High Level
Symbol
Max
Unit
1.71
3.0
3.6
V
VDDIO
1.2
2.4
3.6
V
0.3VDDIO
-
VIL,a
SPI
VIH,a
SPI
VOL,a
Voltage Output
High Level
VOH,a
Current
consumption
Typ
VDD
Voltage Output
Low Level
Operating
Temperature
NVM write-cycles
OPERATING CONDITIONS BMG250
Condition
Min
IDD
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
-
VDDIO=1.62V, IOL=3mA, SPI
0.2VDDIO
-
VDDIO=1.2V, IOL=3mA, SPI
0.23VDDIO
-
VDDIO=1.62V, IOH=3mA, SPI
0.8VDDIO
-
VDDIO=1.2V, IOH=3mA, SPI
0.62VDDIO
-
TA
nNVM
0.7VDDIO
-40
Non-volatile memory
Gyro in fast start-up,
TA=25°C
Gyro full operation mode
TA=25°C
Gyro in suspend mode,
TA=25°C
+85
14
°C
Cycles
500
850
µA
3
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© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 8
2.2 Electrical and physical characteristics, measurement performance
Table 3: Electrical characteristics gyroscope
OPERATING CONDITIONS GYROSCOPE
Parameter
Symbol
Condition
Min
RFS125
Range
(Secondary
interface)
Max
Unit
125
°/s
250
°/s
500
°/s
RFS1000
1,000
°/s
RFS2000
2,000
°/s
°/s
RFS250
Range
Typ
RFS500
Selectable
via serial digital interface
RFSOIS
Fixed range setting
2,000
tG,su
Suspend to normal mode
ODRG=1600Hz
55
80
ms
tG,FS
Fast start-up to normal
mode
10
15
ms
Start-up time
OUTPUT SIGNAL GYROSCOPE
Sensitivity
Sensitivity change
over temperature
Nonlinearity
RFSOIS
Ta=25°C
16.4
LSB/°/s
RFS2000
Ta=25°C
16.4
LSB/°/s
RFS1000
Ta=25°C
32.8
LSB/°/s
RFS500
Ta=25°C
65.6
LSB/°/s
RFS250
Ta=25°C
131.2
LSB/°/s
RFS125
Ta=25°C
262.4
LSB/°/s
TCSG
RFS2000,
Nominal VDD supplies
best fit straight line
±0.02
%/K
NLG
Best fit straight line
RFS1000, RFS2000
0.1
%FS
g- Sensitivity
Zero-rate offset
Off x
y and z
Zero-Rate offset
Over temperature
Off x, oT
y, oT and
z,oT
Zero-rate offset
change over
temperature
TCOG
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Sensitivity to acceleration
stimuli in all three axis
(frequency 2.4V
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 53
The following figure shows the definition of the SPI timings:
tCSB_setup
tCSB_hold
CSB
SCK
tSCKL tSCKH
SDI
SDO
tSDI_setup
tSDI_hold
tSDO_OD
Figure 22: SPI timing diagram
The SPI interface of the BMG250 is compatible with two modes, ´00´ [CPOL = ´0´ and CPHA =
´0´] and ´11´ [CPOL = ´1´ and CPHA = ´1´]. The automatic selection between ´00´ and ´11´ is
controlled based on the value of SCK after a falling edge of CSB.
Two configurations of the SPI interface are supported by the BMG250: 4-wire and 3-wire. The
same protocol is used by both configurations. The device operates in 4-wire configuration by
default. It can be switched to 3-wire configuration by writing ´1´ to Register (0x6B) IF_CONF spi3.
Pin SDI is used as the common data pin in 3-wire configuration.
For single byte read as well as write operations, 16-bit protocols are used. The BMG250 also
supports multiple-byte read and write operations.
In SPI 4-wire configuration CSB (chip select low active), SCK (serial clock), SDI (serial data
input), and SDO (serial data output) pins are used. The communication starts when the CSB is
pulled low by the SPI master and stops when CSB is pulled high. SCK is also controlled by SPI
master. SDI and SDO are driven at the falling edge of SCK and should be captured at the rising
edge of SCK.
The basic write operation waveform for 4-wire configuration is depicted in the following figure.
During the entire write cycle SDO remains in high-impedance state.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
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© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 54
CSB
SCK
SDI
R/W
AD6
AD5
AD4
AD3
AD2
AD1
SDO
AD0
DI7
DI6
DI5
DI4
DI3
DI2
DI1
DI0
Z
tri-state
Figure 23: 4-wire basic SPI write sequence (mode ´11´)
The basic read operation waveform for 4-wire configuration is depicted in the figure below:
CSB
SCK
SDI
R/W
AD6
AD5
AD4
AD3
AD2
AD1
AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 tri-state
Figure 24: 4-wire basic SPI read sequence (mode ´11´)
The data bits are used as follows:
Bit0: Read/Write bit. When 0, the data SDI is written into the chip. When 1, the data SDO from
the chip is read.
Bit1-7: Address AD(6:0).
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
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© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 55
Bit8-15: when in write mode, these are the data SDI, which will be written into the address. When
in read mode, these are the data SDO, which are read from the address.
Multiple read operations are possible by keeping CSB low and continuing the data transfer. Only
the first register address has to be written. Addresses are automatically incremented after each
read access as long as CSB stays active low.
The principle of multiple read is shown in figure below:
Control byte
Start
RW
CSB
=
0
1
Register adress (02h)
0
0
0
0
0
1
0
X
X
Data byte
Data byte
Data byte
Data register - adress 02h
Data register - adress 03h
Data register - adress 04h
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Stop
X
X
CSB
=
1
Figure 25: SPI multiple read
In SPI 3-wire configuration CSB (chip select low active), SCK (serial clock), and SDI (serial data
input and output) pins are used. While SCK is high, the communication starts when the CSB is
pulled low by the SPI master and stops when CSB is pulled high. SCK is also controlled by SPI
master. SDI is driven (when used as input of the device) at the falling edge of SCK and should be
captured (when used as the output of the device) at the rising edge of SCK.
The protocol as such is the same in 3-wire configuration as it is in 4-wire configuration. The basic
operation wave-form (read or write access) for 3-wire configuration is depicted in the figure below:
CSB
SCK
SDI
RW
AD6
AD5
AD4
AD3
AD2
AD1
AD0
DI7
DI6
DI5
DI4
DI3
DI2
DI1
DI0
Figure 26: 3-wire basic SPI read or write sequence (mode ´11´)
4.1.3 I²C Interface
The I²C bus uses SCL (= SCx pin, serial clock) and SDA (= SDx pin, serial data input and output)
signal lines. Both lines are connected to VDDIO externally via pull-up resistors so that they are
pulled high when the bus is free.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 56
The I²C addresses are identical to BMG160. The default I²C address of the device is 0b1101000
(0x68). It is used if the SDO pin is pulled to ´GND´. The alternative address 0b1101001 (0x69) is
selected by pulling the SDO pin to ´VDDIO´.
The I²C interface of the BMG250 is compatible with the I²C Specification UM10204 Rev. 03 (19
June 2007), available at http://www.nxp.com. The BMG250 supports I²C standard mode and
fast mode, only 7-bit address mode is supported. For VDDIO = 1.2V to 1.62 V the guaranteed
voltage output levels are slightly relaxed as described in Table 1 of the electrical specification
section.
BMG250 also supports an extended I²C mode that allows using clock frequencies up to 1 MHz.
In this mode all timings of the fast mode apply and it additionally supports clock frequencies up
to 1MHz.
The timing specification for I²C of the BMG250 is given in the following table:
Table 28: I²C timings
Parameter
Clock Frequency
SCL Low Period
SCL High Period
SDA Setup Time
SDA Hold Time
Setup Time for a
repeated Start
Condition
Hold Time for a Start
Condition
Setup Time for a Stop
Condition
Time before a new
Transmission can
start
Idle time between
write accesses,
normal mode,
suspend mode
Idle time between
write accesses,
suspend mode,
suspend mode
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Symbol
fSCL
tLOW
tHIGH
tSUDAT
tHDDAT
Condition
Min
Units
kHz
1.3
0.6
0.1
0.0
tSUSTA
0.6
tHDSTA
0.6
tSUSTO
0.6
tBUF
Max
1000
suspend mode
400
normal mode
1.3
suspend mode
400
normal mode
1.3
µs
tIDLE_wacc_n
m
tIDLE_wacc_s
um
400
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 57
The figure below shows the definition of the I²C timings given in Table 28:
SDA
tBUF
tf
tLOW
SCL
tHIGH
tr
tHDSTA
tHDDAT
tSUDAT
SDA
tSUSTA
tSUSTO
Figure 27: I²C timing diagram
The I²C protocol works as follows:
START: Data transmission on the bus begins with a high to low transition on the SDA line while
SCL is held high (start condition (S) indicated by I²C bus master). Once the START signal is
transferred by the master, the bus is considered busy.
STOP: Each data transfer should be terminated by a Stop signal (P) generated by master. The
STOP condition is a low to HIGH transition on SDA line while SCL is held high.
ACKS: Each byte of data transferred must be acknowledged. It is indicated by an acknowledge
bit sent by the receiver. The transmitter must release the SDA line (no pull down) during the
acknowledge pulse while the receiver must then pull the SDA line low so that it remains stable
low during the high period of the acknowledge clock cycle.
In the following diagrams these abbreviations are used:
S
P
ACKS
ACKM
NACKM
RW
Start
Stop
Acknowledge by slave
Acknowledge by master
Not acknowledge by master
Read / Write
A START immediately followed by a STOP (without SCL toggling from ´VDDIO´ to ´GND´) is not
supported. If such a combination occurs, the STOP is not recognized by the device.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 58
I²C write access:
I²C write access can be used to write a data byte in one sequence.
The sequence begins with start condition generated by the master, followed by 7 bits slave
address and a write bit (RW = 0). The slave sends an acknowledge bit (ACKS = 0) and releases
the bus. Then the master sends the one byte register address. The slave again acknowledges
the transmission and waits for the 8 bits of data which shall be written to the specified register
address. After the slave acknowledges the data byte, the master generates a stop signal and
terminates the writing protocol.
Example of an I²C write access:
Control byte
Slave Adress
Start
S
1
1
0
1
0
Register adress (0x10)
RW ACKS
0
0
0
Data byte
0
1
1
1
0
0
Data (0x09)
ACKS
0
0
1
1
0
1
0
ACKS Stop
1
0
1
P
Figure 28: I²C write
I²C read access:
I²C read access also can be used to read one or multiple data bytes in one sequence.
A read sequence consists of a one-byte I²C write phase followed by the I²C read phase. The two
parts of the transmission must be separated by a repeated start condition (S). The I²C write phase
addresses the slave and sends the register address to be read. After slave acknowledges the
transmission, the master generates again a start condition and sends the slave address together
with a read bit (RW = 1). Then the master releases the bus and waits for the data bytes to be read
out from slave. After each data byte the master has to generate an acknowledge bit (ACKS = 0)
to enable further data transfer. A NACKM (ACKS = 1) from the master stops the data being
transferred from the slave. The slave releases the bus so that the master can generate a STOP
condition and terminate the transmission.
The register address is automatically incremented and, therefore, more than one byte can be
sequentially read out. Once a new data read transmission starts, the start address will be set to
the register address specified since the latest I²C write command. By default the start address is
set at 0x00. In this way repetitive multi-bytes reads from the same starting address are possible.
In order to prevent the I²C slave of the device to lock-up the I²C bus, a watchdog timer (WDT) is
implemented. The WDT observes internal I²C signals and resets the I²C interface if the bus is
locked-up by the BMG250. The activity and the timer period of the WDT can be configured through
the bits i2c_wdt_en and i2c_wdt_sel at Register (0x70) NV_CONF.
Writing ´1´ (´0´) to Register (0x70) NV_CONF i2c_wdt_en activates (de-activates) the WDT.
Writing ´0´ (´1´) to Register (0x70) NV_CONF i2c_wdt_en selects a timer period of 1 ms (50 ms).
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
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© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 59
Example of an I²C read access (reading gyro data):
Slave Adress
Start
S
1
1
0
1
0
RW ACKS
0
0
0
dummy
Control byte
X
Register adress (0x02)
0
0
0
1
1
0
ACKS
0
Data byte
Slave Adress
Start
Sr
1
1
0
1
0
Read Data (0x02)
RW ACKS
0
0
1
Data byte
X
X
X
X
X
X
Read Data (0x03)
ACKM
X
X
X
X
X
Data byte
X
X
X
X
X
X
X
X
X
X
X
X
X
…
X
X
X
X
X
X
X
ACKM
X
…
X
Data byte
Read Data (0x06)
X
X
Read Data (0x05)
ACKM
Data byte
…
X
Data byte
Read Data (0x04)
…
X
ACKM
X
Read Data (0x07)
ACKM
X
X
X
X
X
X
X
X
NACK
X
X
Stop
P
Figure 29: I²C multiple read
4.1.4 SPI and I²C Access Restrictions
In order to allow for the correct internal synchronization of data written to the BMG250, certain
access restrictions apply for consecutive write accesses or a write/read sequence through the
SPI as well as I2C interface. The required waiting period depends on whether the device is
operating in normal mode or other modes.
As illustrated in the figure below, an interface idle time of at least 2 µs is required following a write
operation when the device operates in normal mode. In suspend mode an interface idle time of
least 450 µs is required1.
X-after-Write
Write-Operation
X-Operation
Register Update Period
(> 2us / 450us)
Figure 30: Post-Write Access Timing Constraints
1
The times are preliminary and need to be verified.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 60
4.2 Secondary Interface
OIS Interface (SPI) for connecting to a OIS control unit:
Secondary interface for OIS application can be enabled by writing ‘01’ to Register (0x6B)
IF_CONF if_mode.
In this case the secondary interface is used as a SPI interface where an external control unit is
connected as a master to BMG250. The external control unit can be e.g. an OIS controller.
If secondary interface is used, primary interface is limited to I²C mode.
The mapping for the secondary interface of the BMG250 is given in the following table:
Table 29: Mapping of the secondary interface pins
Pin#
10
11
Name
OSCB
OSDO
I/O Type
Digital I/O
Digital I/O
Description
Secondary OIS interface
Secondary OIS interface
Connect to (secondary IF)
in SPI4W
CSB
MISO
in SPI3W
CSB
DNC
in I²C
DNC
DNC
4.2.1 Camera module connected to secondary interface for OIS
BMG250 supports specific optical image stabilization (OIS) applications with a dedicated
interface. This interface is used for direct access to pre-filtered gyroscope data with minimum
latency. Pre-filtered gyroscope data is available at output data rate (ODR) of 6.4 kHz and can be
read out via OIS SPI interface at 10MHz maximum speed.
The OIS SPI interface supports 3-wire SPI as well as 4-wire SPI.
The timings of the secondary SPI interface are the same as for the primary SPI interface, see
chapter 4.1.2. The connection diagrams are depicted in chapter.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 61
5. Pin-out and Connection diagrams
5.1 Pin-out BMG250
Pin1
marker
12 (CSB)
13 (SCX)
Top View BMI160
Top
View
(Pads not
visible)
10(DNC)
11 (DNC)
7 (GND)
9 (INT2)
9 (INT2)
8 (VDD)
8 (VDD)
Figure 31: Pin-out top view
5 (VDDIO)
6 (GNDIO)
(Pads visible!)
6 (GNDIO)
5 (VDDIO)
2 (DNC)
Bottom View BMI160
Bottom
View
(Pads visible)
7 (GND)
4 (INT1)
1 (SDO)
10 (DNC)
(Pads not visible!)
3(DNC)
14 (SDX)
11(DNC)
13 (SCX)
1 (SDO)
2(DNC)
12 (CSB)
14 (SDX)
Pin1
3 (DNC)
4 (INT1)
Figure 32: Pin-out bottom view
Table 30: BMG250 Pin-out and pin connections are described in the table below
Pin#
Name
I/O
Type
1
SDO
Digital
I/O
2
ASDx
Digital
I/O
3
ASCx
Digital in
4
INT1
Digital
I/O
5
VDDIO
Supply
6
7
8
GNDIO
GND
VDD
9
INT2
10
OSCB
11
OSCO
12
CSB
Ground
Ground
Supply
Digital
I/O
Digital
I/O
Digital
I/O
Digital in
13
SCx
Digital in
14
SDx
Digital
I/O
Description
Serial data output in SPI
Address select in I²C mode
MOSI serial data input in SPI 4W 2ndary Interface
SISO serial data I/O in SPI 3W 2ndary Interface
Other configuration: Do not connect (or GND)
SPI serial clock for 2ndary Interface
Other configuration: Do not connect (or GND)
Interrupt pin 1 *)
Digital I/O supply voltage
(1.2 … 3.6V)
Ground for I/O
Ground for digital & analog
Power supply analog & digital domain (1.62V – 3.6V)
Interrupt pin 2 *)
CSB in SPI as 2ndary Interface
Other configuration: Do not connect (or GND)
MISO in SPI 4W 2ndary Interface
Other configuration: Do not connect (or GND)
Chip select for SPI mode / Protocol selection pin
SCK for SPI serial clock
SCL for I²C serial clock
SDA serial data I/O in I²C
MOSI serial data input in SPI 4W (without 2ndary Interface)
SISO serial data I/O in SPI 3W (without 2ndary Interface)
*) If INT1 and/or INT2 are not used, please do not connect them (DNC)
NOTE: all pins must be soldered to the PCB even if they are electrically not connected
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 62
5.2 Connection diagrams
5.2.1 I2C interface without using secondary OIS interface
SA0
SDA
CSB
11
R
7
100nF
R
VDDIO
9
8
INT1
INT2
INT2
VDD
100nF
VDDIO
GNDIO
5
4
10
GND
3
6
Top
View
BMI160
(Pads
not
Top View
visible)
(Pads
not visible!)
2
INT1
12
1
13
14
SDO
SCX
SDX
SCL
VDD
Figure 33: I²C as interface
5.2.2 SPI 3-wire interface without using secondary OIS interface
SDA
SCK
CSB
12
7
10
9
8
100nF
VDDIO
100nF
VDDIO
5
4
6
BMI160
Top
View
(Pads
not
Top View
(Pads
not visible!)
visible)
11
INT1
INT2
INT2
VDD
GND
3
13
SDX
2
INT1
14
1
GNDIO
SDO
SCX
CSB
VDD
Figure 34: Only SPI 3-wire as interface
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 63
5.2.3 SPI 4-wire interface without using secondary OIS interface
MISO
MOSI
CSB
SCX
12
9
8
INT1
INT2
INT2
VDD
100nF
100nF
VDDIO
10
7
5
4
VDDIO
INT1
11
Top
View
BMI160
(Pads
not
Top View
visible)
(Pads
not visible!)
6
3
CSB
GND
2
13
1
GNDIO
SDO
14
SDX
SCK
VDD
Figure 35: Only SPI 4-wire as interface
5.2.4 Primary I2C and secondary 4-wire SPI as OIS interface
Figure 36: Using I2C and 4-wire SPI as OIS interface
SA0
SDA
SCX
CSB
12
1
13
SDO
14
SDX
SCL
11
MISO
OSDO
OIS Interface
ASDx
OIS Interface
ASCx
2
3
Top
View
BMI160
(Pads not
Top View
visible)
(Pads
not visible!)
7
OSCB
CSB
INT1
9
8
INT2
INT2
VDD
GND
GNDIO
R
VDDIO
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
5
VDDIO
R
4
100nF
INT1
6
SCK
10
100nF
MOSI
VDD
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 64
5.2.5 Primary I2C and secondary 3-wire SPI as OIS interface
Figure 37: Using I2C and 3-wire SPI as OIS interface
SA0
SDA
SCX
CSB
12
1
13
SDO
14
SDX
SCL
11
OSDO
OIS Interface
ASDx
2
OIS Interface
ASCx
3
Top
View
BMI160
(Pads
not
Top View
visible)
(Pads
not visible!)
7
CSB
OSCB
INT1
9
8
INT2
INT2
VDD
GND
GNDIO
R
VDDIO
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
5
VDDIO
R
4
100nF
INT1
6
SCK
10
100nF
SISO
VDD
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 65
6. Package
6.1 Outline Dimensions
The package dimension is LGA 2.5mm x 3.0mm x 0.83mm.
Unit of the following drawing is mm. Note: Unless otherwise specified tolerance = decimal
±0.05 mm.
Figure 38: Packaging outline dimensions
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 66
Note: Pin1 marker is internally connected to Pin1. It must not be connected to a different signal
than Pin1.
6.2 Sensing axes orientation
If the sensor is rotated in the indicated directions, the corresponding channels of the device will
deliver a positive yaw rate signal. If the sensor is at rest without any rotation the output of the
corresponding gyroscope channel will be “zero” (static acceleration).
Example: If the sensor would be placed on a seconds hand of a watch with the arrows of the
following Fig. pointing towards the watch’s dial, the output signals are:
•
•
•
+ 6°/sec for the ΩX GYR channel
+ 6°/sec for the ΩY GYR channel
+ 6°/sec for the ΩZ GYR channel
ΩZ
ΩX
ΩY
Figure 39: definition of sensing axes orientation
For reference the figure below shows the Android device orientation with an integrated BMG250.
BMG250
Figure 40: Android axis definition with BMG250
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 67
6.3 Landing pattern recommendation
The following landing pad recommendation is given for maximum stability of the solder
connections.
0.675
14
13
12
2
10
3
9
4
8
2.5
0.5
11
0.25
1
6
0.675
5
7
0.925
3.0
Figure 41: Landing pattern recommendation for BMG250
Note: Pin1 marker is internally connected to Pin1. It must not be connected to a different signal
than Pin1.
The size of the landing pads may be further reduced in order to minimize solder-stress induced
effects if sufficient control over the soldering process is given. Please contact your sales
representative for further details.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 68
6.4 Marking
6.4.1 Mass production marking
Table 31: Marking of mass samples
Labeling
CCC
Wx
Name
Symbol
Remark
Counter ID
CCC
3 alphanumeric digits, variable
to generate trace-code
W
Product identifier W, denoting BMG250
First letter
second row
of
Second letter of
x
second row
Pin 1 identifier
•
Internal use – various digits possible
--
6.4.2 Engineering samples
Table 32: Marking of engineering samples
Labeling
VLE
CC
Name
Symbol
Remark
Internal ID
VLE
Various digits – internal
“E” denotes engineering status
Second row
CC
CC - internal revision ID
Pin 1 identifier
•
--
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 69
6.5 Soldering guidelines
The moisture sensitivity level of the BMG250 sensors corresponds to JEDEC Level 1, see also
IPC/JEDEC J-STD-020C “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for
non-hermetic Solid State Surface Mount Devices”
IPC/JEDEC J-STD-033A “Joint Industry Standard: Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices”
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC
standard, i.e. reflow soldering with a peak temperature up to 260°C.
260 °C
Figure 42: Soldering profile
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 70
6.6 Handling instructions
Micromechanical sensors are designed to sense rotations with high accuracy even at low turn
rates and contain highly sensitive structures inside the sensor element. The MEMS sensor can
tolerate mechanical shocks up to several thousand g’s. However, these limits might be exceeded
in conditions with extreme shock loads such as e.g. hammer blow on or next to the sensor,
dropping of the sensor onto hard surfaces etc.
We recommend to avoid g-forces beyond the specified limits during transport, handling and
mounting of the sensors in a defined and qualified installation process.
This device has built-in protections against high electrostatic discharges or electric fields (e.g.
2kV HBM); however, anti-static precautions should be taken as for any other CMOS component.
Unless otherwise specified, proper operation can only occur when all terminal voltages are kept
within the supply voltage range. Unused inputs must always be tied to a defined logic voltage
level.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 71
6.7 Tape and reel specification
The BMG250 is shipped in a standard cardboard box.
The box dimension for 1 reel is: L × W × H = 35 cm × 35 cm × 6 cm.
BMG250 quantity: 5,000pcs per reel, please handle with care.
A0 = 3.30, B0 = 2.80, K0 = 1.10
Note:
Tolerances unless noted: ±0.1
Sprocket hole pitch cumulative tolerance ±0.1
Camber in compliance with EIA481
Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
A0 and B0 are calculated on a plane at a distance “R” above the bottom of the pocket
Figure 43: Tape and reel dimensions in mm
6.7.1 Orientation within the reel
Processing direction
Figure 44: Orientation of the BMG250 devices relative to the tape
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 72
6.8 Environmental safety
The BMG250 sensor meets the requirements of the EC restriction of hazardous substances
(RoHS) directive, see also:
Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003
on the restriction of the use of certain hazardous substances in electrical and electronic
equipment.
6.8.1 Halogen content
The BMG250 is halogen-free. For more details on the analysis results please contact your Bosch
Sensortec representative.
6.8.2 Multiple sourcing
Within the scope of Bosch Sensortec’s ambition to improve its products and secure the mass
product supply, Bosch Sensortec employs multiple sources in the supply chain.
While Bosch Sensortec takes care that all of technical parameters are described above are 100%
identical for all sources, there can be differences in device marking and bar code labeling.
However, as secured by the extensive product qualification process of Bosch Sensortec, this has
no impact to the usage or to the quality of the product.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 73
7. Legal disclaimer
7.1 Engineering samples
Engineering Samples are marked with an asterisk (*) or (e) or (E). Samples may vary from the
valid technical specifications of the product series contained in this data sheet. They are therefore
not intended or fit for resale to third parties or for use in end products. Their sole purpose is
internal client testing. The testing of an engineering sample may in no way replace the testing of
a product series. Bosch Sensortec assumes no liability for the use of engineering samples. The
Purchaser shall indemnify Bosch Sensortec from all claims arising from the use of engineering
samples.
7.2 Product use
Bosch Sensortec products are developed for the consumer goods industry. They may only be
used within the parameters of this product data sheet. They are not fit for use in life-sustaining or
security sensitive systems. Security sensitive systems are those for which a malfunction is
expected to lead to bodily harm or significant property damage. In addition, they are not fit for use
in products which interact with motor vehicle systems.
The resale and/or use of products are at the purchaser’s own risk and his own responsibility. The
examination of fitness for the intended use is the sole responsibility of the Purchaser.
The purchaser shall indemnify Bosch Sensortec from all third party claims arising from any
product use not covered by the parameters of this product data sheet or not approved by Bosch
Sensortec and reimburse Bosch Sensortec for all costs in connection with such claims.
The purchaser must monitor the market for the purchased products, particularly with regard to
product safety, and inform Bosch Sensortec without delay of all security relevant incidents.
7.3 Application examples and hints
With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Bosch Sensortec hereby disclaims any and
all warranties and liabilities of any kind, including without limitation warranties of non-infringement
of intellectual property rights or copyrights of any third party. The information given in this
document shall in no event be regarded as a guarantee of conditions or characteristics. They are
provided for illustrative purposes only and no evaluation regarding infringement of intellectual
property rights or copyrights or regarding functionality, performance or error has been made.
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
BMG250
Data sheet
Page 74
8. Document history and modifications
Rev. No
1.0
1.1
1.2
Chapter
Description of modification/changes
Initial release
Update secondary Interface
Final Release
Date
Sept 2015
May 2016
July 2016
Bosch Sensortec GmbH
Gerhard-Kindler-Straße 9
72770 Reutlingen / Germany
contact@bosch-sensortec.com
www.bosch-sensortec.com
Modifications reserved | Printed in Germany
Preliminary - specifications subject to change without notice
Document number: BST-BMG250-DS000-02
Revision_1.2_072016
BST-BMG250-DS000-02 | Revision 1.2 | July 2016
Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third
parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are preliminary and subject to change without notice.
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