4DOLED-282815

4DOLED-282815

  • 厂商:

    4DSYSTEMS

  • 封装:

    -

  • 描述:

    4DOLED-282815

  • 数据手册
  • 价格&库存
4DOLED-282815 数据手册
4DOLED-282815 Datasheet Revision 1.1 Copyright © 2023 4D Systems Content may change at any time. Please refer to the resource centre for latest documentation. Contents 1. General Specification 4 1.1. Mechanical Details 5 1.2. Pin Definition 6 1.3. Block Diagram 9 2. Absolute Maximum Ratings 11 3. Optics & Electrical Characteristics 12 3.1. Optics Characteristics 12 3.2. DC Characteristics 13 3.3. AC Characteristics 14 3.3.1. 68XX-Series MPU Parallel Interface Timing Characteristics 14 3.3.2. 80XX-Series MPU Parallel Interface Timing Characteristics 15 3.3.3. 4-Wire SPI Timing Characteristics 16 3.3.4. 3-Wire SPI Timing Characteristics 17 4. Initialisation Codes 18 5. Functional Specification 20 5.1. Commands 20 5.2. Power down and Power up Sequence 20 5.2.1. Power up Sequence 20 5.2.2. Power down Sequence 20 5.3. Reset Circuit 21 5.4. Actual Application Example 22 6. Reliability 24 6.1. Contents of Reliability Tests 24 6.2. Failure Check Standard 24 7. Outgoing Quality Control Specifications 25 7.1. Cosmetic Check (Display Off) in Non-Active Area 26 7.2. Cosmetic Check (Display Off) in Active Area 27 7.3. Pattern Check (Display On) in Active Area 28 4D Systems DATASHEET Page 2 of 32 8. Precautions When Using These OEL Display Modules 29 8.1. Handling Precautions 29 8.2. Storage Precautions 30 8.3. Designing Precautions 30 8.4. Precautions when disposing of the OEL display modules 31 8.5. Other Precautions 31 9. Revision History 4D Systems 32 DATASHEET Page 3 of 32 4DOLED-282815 General Specification 1. General Specification The 4DOLED-282815 is a 1.5" 128x128 pixel resolution 262K colour Passive Matrix OLED display. This OLED is the same display used in the micro-OLED range of modules. It allows a very cost-effective means of adding a full-colour small display to any product or your next microcontroller project. Specifications ITEM CONTENTS Display Mode Passive Matrix Size 1.5 Color Depth 262K Drive Duty 1/128 Duty Display Size 33.80 x 34.00 x 1.60 mm Active Area (W × H) 26.855 x 26.864 mm Dot Pitch (W × H) 0.07 x 0.21 mm Number of Dots (Pixels) 128 (RGB) × 128 Pixel Size 0.045 x 0.194 mm Weight 3.75 g 4D Systems UNIT Inch DATASHEET Page 4 of 32 4DOLED-282815 Mechanical Details 1.1. Mechanical Details 4D Systems DATASHEET Page 5 of 32 4DOLED-282815 Pin Definition 1.2. Pin Definition Power Supply Pin Number Symbol I/O Function 27 VCI P Power Supply for Operation This is a voltage supply pin. It must be connected to external source & always be equal to or higher than VDDIO. 26 VDD P Power Supply for Core Logic Circuit This is a voltage supply pin which is regulated internally from VCI. A capacitor should be connected between this pin & VSS under all circumstances. 4 VDDIO P Power Supply for I/O Pin This pin is a power supply pin of I/O buffer. It should be connected to VCI or external source. All I/O signal should have VIH reference to VDDIO. When I/O signal pins (BS0~BS1, D0~D7, control signals) pull high, they should be connected to VDDIO. 28 VSS P Ground of Logic Circuit This is a ground pin. It also acts as a reference for the logic pins. It must be connected to external ground. 2 VCC P Power Supply for OEL Panel This is the most positive voltage supply pin of the chip. It must be connected to external source. Driver Pin Number Symbol I/O Function 22 IREF I Current Reference for Brightness Adjustment This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 12.5μA maximum. 3 VCOMH P Voltage Output High Level for COM Signal This pin is the input pin for the voltage output high level for COM signals. A tantalum capacitor should be connected between this pin and VSS. 5 VSL I Voltage Output Low Level for SEG Signal This is segment voltage reference pin. External VSL is set as default. This pin has to connect with resistor and diode to ground. External IC Control Pin Number Symbol 24 23 GPIO0 GPIO1 4D Systems I/O Function I/O General Purpose Input/Output This pin could be left open individually or has signal inputted/outputted. It is able to use as the external DC/DC converter circuit enabled/disabled control or other applications. DATASHEET Page 6 of 32 4DOLED-282815 Pin Definition Interface Pin Number Symbol I/O Function Communicating Protocol Select These pins are MCU interface selection input. See the following table: 17 18 BS0 BS1 O 21 RES# I Power Reset for Controller and Driver Power Reset for Controller and Driver This pin is reset signal input. When the pin is low, initialization of the chip is executed. Keep this pin pull high during normal operation. 19 CS# I Chip Select This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low. I Data/Command Control This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. When the pin is pulled high and serial interface mode is selected, the data at SDIN is treated as data. When it is pulled low, the data at SDIN will be transferred to the command register. When 3-wire serial mode is selected, this pin must be connected to VSS. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams under the AC Characteristics section. I Read/Write Enable or Read This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low. When serial mode is selected, this pin must be connected to VSS. I Read/Write Select or Write This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it to “Low” for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low. When serial mode is selected, this pin must be connected to VSS. 20 15 16 7~14 4D Systems D/C# E/RD# R/W# D7~D0# I/O Host Data Input/Output Bus These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. Unused pins must be connected to VSS except for D2 in serial mode. DATASHEET Page 7 of 32 4DOLED-282815 Pin Definition Reserve Pin Number 1, 35 6, 25, 29 4D Systems Symbol I/O Function N.C. (GND) - Reserved Pin (Supporting Pin) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground as the ESD protection circuit. N.C. - Reserved Pin Reserved Pin The N.C. pins between function pins are reserved for compatible and flexible design. DATASHEET Page 8 of 32 4DOLED-282815 Block Diagram 1.3. Block Diagram MCU Interface Selection: Based on BS0 and BS1 connection, as shown below in the table. Pins connected to MCU interface : D7~D0, E/RD#, R/W#, CS#, D/C#, and RES# 4D Systems DATASHEET Page 9 of 32 4DOLED-282815 Block Diagram EIM=1(default) BS0 BS1 Interface mode Data Bus Control Bus D7 D6 D5 D4 D3 D2 D1 D0 CS# D/C# R/W# E/RD# RES# 0 0 4-wire SPI 0 0 0 0 0 NC SDIN SCLK CS# D/C# 0 0 RES# 0 1 3-wire SPI 0 0 0 0 0 NC SDIN SCLK CS# 0 0 0 RES# 1 0 8bit 8080 D7 D6 D5 D4 D3 D2 D1 D0 CS# D/C# WR# RD# RES# 1 1 8bit 6800 D7 D6 D5 D4 D3 D2 D1 D0 CS# D/C# R/W# R RES# Note • "0" is connected to VSS. • "1" is connected to VDD. • "NC" is not connected. 4D Systems DATASHEET Page 10 of 32 4DOLED-282815 Absolute Maximum Ratings 2. Absolute Maximum Ratings Absolute Maximum Ratings PARAMETER SYMBOL MIN MAX UNIT NOTES VCI -0.3 4 V 1, 2 VDD -0.5 2.75 V 1, 2 VDDIO -0.5 VCI V 1, 2 Supply Voltage for Display VCC -0.5 16 V 1, 2 Operating Temperature TOP -40 70 °C 3 Storage Temperature TSG -40 85 °C 3 Life Time (90 cd/m2) 10,000 - hour 4 Life Time (70 cd/m2) 15,000 - hour 4 Life Time (50 cd/m2) 20,000 - hour 4 Supply Voltage for Operation Supply Voltage for Logic Supply Voltage for I/O Pins Note 1. All the above voltages are based on "VSS = 0V". 2. When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to the Optics & Electrical Characteristics section. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 3. The defined temperature ranges do not include the polarizer. The maximum withstood temperature of the polarizer should be 80°C. 4. VCC = 13.0V, Ta = 25°C, 50% Checkerboard. Software configuration follows the Actual Application Example section initialization. End of a lifetime is specified as 50% of initial brightness reached. The average operating lifetime at room temperature is estimated by the accelerated operation at high-temperature conditions. 4D Systems DATASHEET Page 11 of 32 4DOLED-282815 Optics & Electrical Characteristics 3. Optics & Electrical Characteristics 3.1. Optics Characteristics The optical measurement was taken at VCI = 2.8V, and VCC = 13.0V. Software configuration follows the Actual Application Example section initialization. Optical Characteristics Characteristics Symbol Condition Min Typ Max Unit Brightness Lbr Note 5 70 90 - cd/m2 C.I.E. (White) (x) (y) C.I.E. 1931 0.26 0.29 0.30 0.33 0.34 0.37 C.I.E. (Red) (x) (y) C.I.E. 1931 0.60 0.30 0.64 0.34 0.68 0.38 C.I.E. (Green) (x) (y) C.I.E. 1931 0.27 0.58 0.31 0.62 0.35 0.66 C.I.E. (Blue) (x) (y) C.I.E. 1931 0.10 0.12 0.14 0.16 0.18 0.20 Dark Room Contrast CR - > 10,000:1 - - Free - Viewing Angle 4D Systems DATASHEET degree Page 12 of 32 4DOLED-282815 DC Characteristics 3.2. DC Characteristics DC Characteristics Characteristics Symbol Supply Voltage for Operation Condition Min Typ Max Unit VCI 2.4 2.8 3.5 V Supply Voltage for Operation VDD 2.4 2.5 2.6 V Supply Voltage for I/O Pins VDDIO 1.65 1.8 VCI V Supply Voltage for Display VCC 12.5 13.0 13.5 V High Level Input VIH 0.8 x VDDIO - VDDIO V Low Level Input VIL 0 - 0.2 X VDDIO V High Level Output VOH1 Iout =100µA, 3.3MHz 0.9 x VDDIO - VDDIO V Low Level Output VOL1 Iout =100µA, 3.3MHz 0 - 0.1 x VDDIO V Operating Current for VCC ICI - 240 300 µA Operating Current for VCC ICC Note 6 - 13.3 17.0 mA Note 7 - 23.2 29.0 mA Note 8 - 33.4 42.0 mA Note 5 Sleep Mode Current for VCI ICI, SLEEP - 2 10 µA Sleep Mode Current for VCC ICC, SLEEP - 2 10 µA Note 1. Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to change in the panel characteristics and the customer's request. 2. VCI = 2.8V, VCC = 13.0V, 30% Display Area Turn on. 3. VCI = 2.8V, VCC = 13.0V, 50% Display Area Turn on. 4. VCI = 2.8V, VCC = 13.0V, 100% Display Area Turn on. Software configuration follows the Actual Application Example section initialization. 4D Systems DATASHEET Page 13 of 32 4DOLED-282815 AC Characteristics 3.3. AC Characteristics 3.3.1. 68XX-Series MPU Parallel Interface Timing Characteristics • When 8-bit Used: D[7:0] Instead Symbol tcycle Description Min Max Unit Clock Cycle Time 300 - ns tAS Address Setup Time 10 - ns tAH Address Hold Time 0 - ns - ns tDSW Write Data Setup Time 40 tDHW Write Data Hold Time 7 tDHR Read Data Hold Time 20 - ns tOH Output Disable Time - 70 ns tACC Access Time - 140 ns Chip Select Low Pulse Width (Read) 120 - ns Chip Select Low Pulse Width (Write) 60 Chip Select High Pulse Width (Read) 60 - ns Chip Select High Pulse Width (Write) 60 PWCSL PWCSH tF Rise Time - 15 ns tR Fall Time - 15 ns (VCI - VSS = 2.4V to 3.5V, VDDIO - VSS = 1.65V to VCI, Ta = 25°C) 4D Systems DATASHEET Page 14 of 32 4DOLED-282815 AC Characteristics 3.3.2. 80XX-Series MPU Parallel Interface Timing Characteristics 80XX-Series MPU Parallel Interface Timing Characteristics Symbol Description Min Max Unit Port tAH8 Address Setup Timing 5 - ns CSB RS tAS8 Address Hold Timing 5 - ns tCYC8 System Cycle Timing 200 - ns tRDLR6 Read "L" Pulse Width 90 - ns tRDHR6 Read "H" Pulse Width 90 - ns tCYC8 System Cycle Timing 100 - ns tWRLW8 Write "L" Pulse Width 45 - ns tWRHW8 Write "H" Pulse Width 45 - ns tRDD8 Read Data Output Delay Time - 60 ns tRDH8 Data Hold Timing 0 60 ns tDS8 Write Data Setup Timing 30 - ns tDH8 Write Data Hold Timing 10 - ns (Read) (Write) * CL = 15pF RDB D[17:9] (VCI - VSS = 2.4V to 3.5V, VDDIO - VSS = 1.65V to VCI, Ta = 25°C) 4D Systems DATASHEET Page 15 of 32 4DOLED-282815 AC Characteristics 3.3.3. 4-Wire SPI Timing Characteristics 4-Wire SPI Timing Characteristics Symbol Description Min Max Unit tcycle Clock Cycle Time 50 - ns tAS Address Setup Time 15 - ns tAH Address Hold Time 15 - ns tCSS Chip Select Setup Time 20 - ns tCSH Chip Select Hold Time 10 - ns tDSW Write Data Setup Time 15 - ns tDHW Write Data Hold Time 15 - ns tCLKL Clock Low Time 20 - ns tCLKH Clock High Time 20 - ns tR Rise Time - 15 ns tF Fall Time - 15 ns (VCI - VSS = 2.4V to 3.5V, VDDIO - VSS = 1.65V to VCI, Ta = 25°C) 4D Systems DATASHEET Page 16 of 32 4DOLED-282815 AC Characteristics 3.3.4. 3-Wire SPI Timing Characteristics 3-Wire SPI Timing Characteristics Symbol Description Min Max Unit tcycle Clock Cycle Time 50 - ns tCSS Chip Select Setup Time 20 - ns tCSH Chip Select Hold Time 10 - ns tDSW Write Data Setup Time 15 - ns tDHW Write Data Hold Time 15 - ns tCLKL Clock Low Time 20 - ns tCLKH Clock High Time 20 - ns tR Rise Time - 15 ns tF Fall Time - 15 ns (VCI - VSS = 2.4V to 3.5V, VDDIO - VSS = 1.65V to VCI, Ta = 25°C). 4D Systems DATASHEET Page 17 of 32 4DOLED-282815 Initialisation Codes 4. Initialisation Codes SET_COLUMN_ADDRESS 0x15 SET_ROW_ADDRESS 0x75 WRITE_GRAM 0x5C READ_GRAM 0x5D STOP_MOVING 0x9E START_MOVING 0x9F REMAP_COLOUR_SETTINGS 0xAO DISPLAY_START_LINE 0xA1 DISPLAY_OFFSET 0xA2 DISPLAY_OFF 0xA4 Entire Display Off, All Pixels Turn Off DISPLAY_ALL_ON 0xA5 Entire Display On, All Pixels Turn On at GS Level 63 DISPLAY_NORMAL 0xA6 Normal Display DISPLAY_INVERSE 0xA7 Inverse Display FUNCTION_SELECTION 0xAB DISPLAY_NOP 0xAD DISPLAY_SLEEP_OFF 0xAE DISPLAY_SLEEP_ON 0xAF DISPLAY_NOP2 0xB0 PHASE_PRECHARGE 0xB1 DISPLAY_ENHANCE 0xB2 CLOCK_FREQUENCY 0xB3 SEGMENT_LOW_VOLTAGE 0xB4 SET_GPIO 0xB5 SECOND_PRECHARGE 0xB6 SET_GRAYSCALE_LUT 0xB8 RESET_GRAYSCALE_LUT 0xB9 PRECHARGE_VOLTAGE_RGB 0xBB SET_VCOMH 0xBE CONTRAST_RGB 0xC1 CONTRAST_MASTER 0xC7 DUTY_CYCLE 0xCA OLED_NOP2 0xD1 OLED_NOP3 0xE3 COMMAND_LOCK 0xFD 4D Systems same (set mux ration) DATASHEET Page 18 of 32 4DOLED-282815 Initialisation Codes Init Code Format: (Command, Data1, ... DataN) COMMAND_LOCK, 0x12, // Unlock Driver IC (0x12/0x16/0xB0/0xB1) COMMAND_LOCK, 0xB1, // Unlock All Commands (0x12/0x16/0xB0/0xB1) DISPLAY_OFF, // Display Off (0x00/0x01) CLOCK_FREQUENCY, 0xF1, // Set Clock as 120 Frames/Sec DUTY_CYCLE, 0x7F, // 1/96 Duty (0x0F~0x7F) DISPLAY_OFFSET, 0, // Shift Mapping RAM Counter (0x00~0x7F) DISPLAY_START_LINE, 0x00, // Set Mapping RAM Display Start Line (0x00~0x7F) REMAP_COLOUR_SETTINGS, 0x74, // Set Horizontal Address Increment // Column Address 0 Mapped to SEG0 // Color Sequence D[15:0]=[RRRRR:GGGGGG:BBBBB] // Scan from COM127 to COM0 // Enable COM Split Odd Even // 65536 Colors Mode (0x74) // * 262,144 Colors Mode (0xB4) SET_GPIO, 0x00, // Set Low Voltage Level of SEG Pin FUNCTION_SELECTION, 0x01, // Enable Internal VDD Regulator, Select 8-bit Parallel Interface SEGMENT_LOW_VOLTAGE, 0xA0, 0xB5, 0x55, // Enable External VSL, Set Segment Low Voltage CONTRAST_RGB, 0xC8, 0x80, 0x8A, // Set Contrast of Color A (Red) // Color B (Green) // Color C (Blue) CONTRAST_MASTER, 0x0F, // Set Scale Factor of Segment Output Current Control (0-15) RESET_GRAYSCALE_LUT, // just use internal table for Gray Scale Table PHASE_PRECHARGE, 0x32, // Set Phase 1 as 5 Clocks & Phase 2 as 3 Clocks PRECHARGE_VOLTAGE_RGB, 0x17, // Set Pre-Charge Voltage Level as 0.50*VCC DISPLAY_ENHANCE, 0xA4, 0x00, 0x00, // UNDOCUMENTED COMMAND Enhance Display Performance SECOND_PRECHARGE, 0x01, // Set Second Pre-Charge Period as 1 Clock SET_VCOMH, 0x05, // Set Common Pins Deselect Voltage Level as 0.82*VCC DISPLAY_NORMAL, // Normal Display Mode (0x02) DISPLAY_SLEEP_ON, // not sleeping 4D Systems DATASHEET Page 19 of 32 4DOLED-282815 Functional Specification 5. Functional Specification 5.1. Commands Refer to the Technical Manual for the SSD1351 5.2. Power down and Power up Sequence To protect the OEL panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 5.2.1. Power up Sequence 1. Power up VCI & VDDIO 2. Send Display off command 3. Initialization 4. Clear Screen 5. Power up VCC 6. Delay 200ms (When VCC is stable) 7. Send Display on command 5.2.2. Power down Sequence 1. Send Display off command 2. Power down VCC 3. Delay 100ms (When VDDH is reach 0 and the panel is completely discharged) 4. Power down VCI / VDDIO Note 1. Since an ESD protection circuit is connected between VCI, VDDIO and VCC inside the driver IC, VCC becomes lower than VCI whenever VDD & VDDIO is ON and VCC is OFF. 2. VCC should be kept float (disabled) when it is OFF. 3. Power Pins (VDD, VDDIO, VCC) can never be pulled to the ground under any circumstance. 4D Systems DATASHEET Page 20 of 32 4DOLED-282815 Reset Circuit 5.3. Reset Circuit When RES# input is low, the chip is initialized with the following status: 1. Display is OFF 2. 128(RGB) x 128 Display Mode 3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h) 4. The display start line is set at the display RAM address 0 5. The column address counter is set at 0 6. Normal scan direction of the COM outputs 7. Command A2h, B1h, B3h, BBh, BEh are locked by command FDh 4D Systems DATASHEET Page 21 of 32 4DOLED-282815 Actual Application Example 5.4. Actual Application Example Command usage and explanation of an actual example Power up Sequence Note This command could be programmable to fit various applications. • 0xB4 → 262,144 Colors Mode • 0x74 → 65,536 Colors Mode • Others → Please contact us for further information. If the noise accidentally occurs at the displaying window during the operation, please reset the display to recover the display function. 4D Systems DATASHEET Page 22 of 32 4DOLED-282815 Actual Application Example Power down Sequence Entering Sleep Mode Exiting Sleep Mode 4D Systems DATASHEET Page 23 of 32 4DOLED-282815 Reliability 6. Reliability 6.1. Contents of Reliability Tests Contents of Reliability Tests Item Conditions Criteria High Temperature Operation 70°C, 240 hrs The operational functions work. Low Temperature Operation -40°C, 240 hrs High Temperature Storage 85°C, 240 hrs Low Temperature Storage -40°C, 240 hrs High Temperature/Humidity Operation 60°C, 90% RH, 240 hrs Thermal Shock -40°C 85°C, 24 cycles 60 mins dwell • The samples used for the above tests do not include polarizers • No moisture condensation is observed during tests. 6.2. Failure Check Standard After the completion of the described reliability test, the samples were left at room temperature for 2 hrs before conducting the failure test at 23±5°C; 55±15% RH. 4D Systems DATASHEET Page 24 of 32 4DOLED-282815 Outgoing Quality Control Specifications 7. Outgoing Quality Control Specifications Environment Required The customer's test & measurement are required to be conducted under the following conditions: Temperature: 23 ± 5°C Humidity: 55 ± 15% RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: ≥ 50cm Distance between the Panel & Eyes of the Inspector: ≥ 30cm A finger glove (or finger cover) must be worn by the inspector. The inspection table or jig must be anti-electrostatic. Sampling Plan Level II, Normal Inspection, Single Sampling, MIL-STD-105E. Criteria & Acceptable Quality Level 4D Systems Partition AQL Definition Major 0.65 Defects in Pattern Check (Display On) Minor 1.0 Defects in Cosmetic Check (Display Off) DATASHEET Page 25 of 32 4DOLED-282815 Cosmetic Check (Display Off) in Non-Active Area 7.1. Cosmetic Check (Display Off) in Non-Active Area Cosmetic Check (Display Off) in Non-Active Area Check Item Classification Criteria X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge) Panel General Chipping Minor Any crack is not allowable. Panel Crack Minor Copper Exposed (Even Pin or Film) Minor Film or Trace Damage Minor Terminal Lead Prober Mark Acceptable Glue or Contamination on Pin (Couldn't Be Removed by Alcohol) Ink Marking on Back Side of panel (Exclude on Film) 4D Systems Not Allowable by Naked Eye Inspection Minor Acceptable DATASHEET Ignore for Any Page 26 of 32 4DOLED-282815 Cosmetic Check (Display Off) in Active Area 7.2. Cosmetic Check (Display Off) in Active Area It is recommended to execute in a clean room environment (class 10k) if necessary. Cosmetic Check (Display Off) in Active Area Check Item Classification Any Dirt & Scratch on Polarizer's Protective Film Acceptable Criteria Ignore for not Affect the Polarizer Scratches, Fiber, Line-Shape Defect (On Polarizer) Minor W ≤ 0.1 Ignore W > 0.1 L≤2 n≤1 L>2 n=0 Dirt, Black Spot, Foreign Material, (On Polarizer) Minor Φ ≤ 0.1 Ignore 0.1 < Φ ≤ 0.25 n≤1 0.25 < Φ n=0 Φ ≤ 0.5 -> Ignore if no Influence on Display 0.5 < Φ n=0 Dent, Bubbles, White spot (Any Transparent Spot on Polarizer) Minor Fingerprint, Flow Mark (On Polarizer) Minor Not Allowable • Protective film should not be torn off when cosmetic check. • Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2 4D Systems DATASHEET Page 27 of 32 4DOLED-282815 Pattern Check (Display On) in Active Area 7.3. Pattern Check (Display On) in Active Area Pattern Check (Display On) in Active Area Check Item Classification No Display Major Bright Line Major Missed Line Major Pixel Short Major Darker Pixel Major Wrong Display Major Un-Uniform (Luminance Variation within a Display) Major 4D Systems DATASHEET Criteria Not Allowable Page 28 of 32 4DOLED-282815 Precautions When Using These OEL Display Modules 8. Precautions When Using These OEL Display Modules 8.1. Handling Precautions 1. Since the display panel is made of glass, do not apply mechanical impacts such as dropping from a high position. 2. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale or lick the organic substance. 3. If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 4. The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. 5. When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using the following adhesion tape. 6. Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using a cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: 7. Water 8. Ketone 9. Aromatic Solvents 10. Hold the OEL display module very carefully when placing the OEL display module into the system housing. Do not apply excessive stress or pressure to the OEL display module. And, do not overbend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 11. Do not apply stress to the driver IC and the surrounding molded sections. 12. Do not disassemble nor modify the OEL display module. 13. Do not apply input signals while the logic power is off. 14. Pay sufficient attention to the working environments when handling OEL display modules to prevent the occurrence of element breakage accidents by static electricity. • Be sure to make human body grounding when handling OEL display modules. • Be sure to ground tools to use or assemble such as soldering irons. 4D Systems DATASHEET Page 29 of 32 4DOLED-282815 Storage Precautions • To suppress the generation of static electricity, avoid carrying out assembly work under dry environments. • The protective film is applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 15. The protection film is applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period, the residue adhesive material of the protection film may remain on the surface of the display panel after removing the film. In such cases, remove the residue material by the method introduced in the Reliability section). 16. If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded be careful to avoid the above. 8.2. Storage Precautions 1. When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sunlight nor to lights of fluorescent lamps. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0°C) environments. (We recommend you store these modules in the packaged state when they were shipped from WiseChip Semiconductor Inc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 2. If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 8.3. Designing Precautions 1. The absolute maximum ratings are the ratings that cannot be exceeded for the OEL display module, and if these values are exceeded, panel damage may happen. 2. To prevent the occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, make the signal line cable as short as possible. 3. We recommend you install an excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) 4. Pay sufficient attention to avoid the occurrence of mutual noise interference with the neighboring devices. 5. As for EMI, take necessary measures on the equipment side. 6. When fastening the OEL display module, fasten the external plastic housing section. 7. If the power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. 4D Systems DATASHEET Page 30 of 32 4DOLED-282815 Precautions when disposing of the OEL display modules 8. The electric potential to be connected to the rear face of the IC chip should be as follows: SEPS525 9. Connection (contact) to any other potential than the above may lead to rupture of the IC. 8.4. Precautions when disposing of the OEL display modules 1. Request qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 8.5. Other Precautions 1. When an OEL display module is operated for a length of time a fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, the normal state can be restored. Also, there will be no problem with the reliability of the module. 2. To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. 3. Pins and electrodes 4. Pattern layouts such as the FPC 5. With this OEL display module, the OEL driver is exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. 6. Design the product and installation method so that the OEL driver may be shielded from light in actual usage. 7. Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. 8. Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It, therefore, is necessary to take appropriate measures to suppress noise generation or to protect from the influences of noise on the system design. 9. We recommend you construct its software to make periodical refreshments of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 4D Systems DATASHEET Page 31 of 32 4DOLED-282815 Revision History 9. Revision History Document Revision REVISION DATE COMMENT 1.0 20/09/2018 Initial Version 1.1 20/01/2023 Modified datasheet for web-based documentation 4D Systems DATASHEET Page 32 of 32
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