4DOLED-602817

4DOLED-602817 Datasheet Revision 1.1 Copyright © 2023 4D Systems Content may change at any time. Please refer to the resource centre for latest documentation. Contents 1. Basic Specifications 4 1.1. Display Specifications 4 1.2. Mechanical Specifications 4 1.3. Active Area / Memory Mapping & Pixel Construction 4 1.4. Mechanical Drawing 5 1.5. Pin Definition 6 1.6. Block Diagram 8 2. Absolute Maximum Ratings 10 3. Optics & Electrical Characteristics 11 3.1. Optics Characteristics 11 3.2. DC Characteristics 12 3.3. AC Characteristics 13 3.3.1. 68XX-Series MPU Parallel Interface 13 3.3.2. 80XX-Series MPU Parallel Interface 15 3.3.3. Serial Interface 17 3.3.4. RGB Interface 18 4. Initialisation Codes 19 4.1. Init Code 20 5. Functional Specification 21 5.1. Commands 21 5.2. Power Down and Power Up Sequence 21 5.2.1. Power up Sequence 21 5.2.2. Power down Sequence 21 5.3. Reset Circuit 22 5.4. Actual Application Example 23 6. Reliability 26 6.1. Contents of Reliability Tests 26 6.2. Failure Check Standard 26 4D Systems DATASHEET Page 2 of 35 7. Outgoing Quality Control Specifications 27 7.1. Cosmetic Check (Display Off) in Non-Active Area 28 7.2. Cosmetic Check (Display Off) in Active Area 29 7.3. Pattern Check (Display On) in Active Area 30 8. Package Specifications 31 9. Precautions When Using These OEL Display Modules 32 9.1. Handling Precautions 32 9.2. Storage Precautions 33 9.3. Designing Precautions 33 9.4. Precautions when disposing of the OEL display modules 34 9.5. Other Precautions 34 10. Revision History 4D Systems 35 DATASHEET Page 3 of 35 4DOLED-602817 Basic Specifications 1. Basic Specifications 1.1. Display Specifications 1. Display Mode: Passive Matrix 2. Display Color: 262,144 Colors (Maximum) 3. Drive Duty: 1/48 Duty 1.2. Mechanical Specifications 1. Outline Drawing: According to the annexed outline drawing 2. Number of Pixels: 160 (RGB) × 128 3. Module size: 39.90 × 48.50 × 1.60 (mm) 4. Panel Size: 39.9 0× 34.00 × 1.60 (mm) including "Glare Polarizer" 5. Active Area: 33.575× 26.864 (mm) 6. Pixel Pitch: 0.07 × 0.21 (mm) 7. Pixel Size: 0.045 × 0.194 (mm) 8. Weight: 4.55 (g) ±10% 1.3. Active Area / Memory Mapping & Pixel Construction 4D Systems DATASHEET Page 4 of 35 4DOLED-602817 Mechanical Drawing 1.4. Mechanical Drawing 4D Systems DATASHEET Page 5 of 35 4DOLED-602817 Pin Definition 1.5. Pin Definition Pin Number Symbol I/O Function VDD P Power Supply for Operation This is a voltage supply pin. It must be connected to external source & always be equal to or higher than VDDIO. Power Supply 31 8 VDDIO P Power Supply for I/O Pin This pin is a power supply pin of I/O buffer. It should be connected to VDD or external source. All I/O signal should have VIH reference to VDDIO. When I/O signal pins (CPU, PS, D17~D9, control signals) pull high, they should be connected to VDDIO. 30 VSS P Ground of Logic Circuit This is a ground pin. It also acts as a reference for the logic pins. It must be connected to external ground. VDDH P Power Supply for OEL Panel These are the most positive voltage supply pins of the chip. They must be connected to external source. P Ground of OEL Panel These are the ground pins for analog circuits. They must be connected to external ground. VSDH: Segment (Data Driver) VSSH: Common (Scan Driver) 3, 33 2, 34 4, 32 VSDH VSSH Driver 5 IREF I/O Current Reference for Brightness Adjustment This is the current reference pin to generate precharge and driving current. 68KΩ resistor should be connected between this pin and VSS. Clock OSCA1 OSCA2 I O Fine Adjustment for Oscillation The frequency is controlled by external 5.1kΩ resistor between OSCA1 and OSCA2. The oscillator signal is used for system clock generation. When the external clock mode is selected, OSCA1 is used external clock input. 9 VSYNCO O Vertical Synchronization Triggering Signal While using MCU interface, it must be floating. 10 VSYNC I Vertical Synchronization Input While using MCU interface, it must be connected to VDD. 11 HSYNC I Horizontal Synchronization Input While using MCU interface, it must be connected to VDD. 12 DOTCLK I Dot Clock Input While using MCU interface, it must be connected to VDD. 7 6 RGB Interface 4D Systems DATASHEET Page 6 of 35 4DOLED-602817 Pin Definition Pin Number Symbol I/O Function 13 ENABLE I Video Enable Input While using MCU interface, it must be connected to VDD. 14 CPU I Select the CPU Type Low: 80XX-Series MCU High: 68XX-Series MCU. 15 PS I Select Parallel/Serial In Low: Serial Interface High: Parallel Interface Interface 29 RESETB I Power Reset for Controller and Driver This pin is reset signal input. When the pin is low, initialization of the chip is executed. Keep this pin pull high during normal operation. 26 CSB I Chip Select Low: SEPS525 is selected and can be accessed. High: SEPS525 is not selected and cannot be accessed. 25 RS I Data/Command Control Low: Command High: Parameter/Data I Read or Read/Write Enable 68XX Parallel Interface: Bus Enabled Strobe(Active High) 80XX Parallel Interface: Read Strobe Signal(Active Low) While using serial interface, it must be connected to VDD or VSS. I Write or Read/Write Select 68XX Parallel Interface: Read (Low)/Write (High) Select 80XX Parallel Interface: Write Strobe Signal(Active Low) While using serial interface, it must be connected to VDD or VSS. 27 28 RDB WRB Host Data Input/Output Bus These pins are 9-bit bi-directional data bus to be connected to the microprocessor’s data bus. 16~24 D17~d9 I/O While using serial interface, the unused pins must be connected to VSS. Reserve 1, 35 4D Systems N.C. (GND) - Reserved Pin (Supporting Pin) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground as the ESD protection circuit. DATASHEET Page 7 of 35 4DOLED-602817 Block Diagram 1.6. Block Diagram MCU Interface Selection: Base on CPU, PS connection and Register setting (14h &16h). Pins connected to MCU interface: D17~D9, RS, CSB, RDB, WRB, and RESETB. Pins connected to RGB interface: D17~D12, VSYNC, HSYNC, DOTCLK, and ENABLE. 4D Systems DATASHEET Page 8 of 35 4DOLED-602817 Block Diagram EIM=1(default) Mode PS CPU DFM1 DFM0 D17 D16 D15 D14 D13 D12 D11 D10 D9 RS CSB RDB WRB RESETB 4-wire SPI 0 X X X SCL SDI NC 0 0 0 0 0 0 RS CSB 0 0 RESETB 80xx parallel 9 bit 1 0 1 0 D8 D7 D6 D5 D4 D3 D2 D1 D0 RS CSB RDB WRB RESETB 80xx parallel 8 bit 1 0 1 1 D7 D6 D5 D4 D3 D2 D1 D0 0 RS CSB RDB WRB RESETB 68xx parallel 9 bit 1 1 1 0 D8 D7 D6 D5 D4 D3 D2 D1 D0 RS CSB E R/W RESETB 68xx parallel 8 bit 1 1 1 1 D7 D6 D5 D4 D3 D2 D1 D0 0 RS CSB E R/W RESETB EIM=0 Mode RIM1 RIM0 D17 D16 D15 D14 D13 D12 D11 D10 D9 VSYNC HSYNC DOTCLK ENABLE 6-bit RGB interface 1 0 D5 D4 D3 D2 D1 D0 0 0 0 VSYNC HSYNC DOTCLK ENABLE Note 1. DFM1, DFM0 setting by Register 16h 2. EIM, RIM1, RIM0 setting by Register 14h 3. X: Don’t care, NC: Non-connection 1: Connect to VDD or set to High level. 0: Connect to GND or set to Low Level. 4D Systems DATASHEET Page 9 of 35 4DOLED-602817 Absolute Maximum Ratings 2. Absolute Maximum Ratings Absolute Maximum Ratings PARAMETER SYMBOL MIN MAX UNIT NOTES VDD -0.3 4 V 1, 2 Supply Voltage for I/O Pins VDDIO -0.3 4 V 1, 2 Supply Voltage for Display VDDH -0.3 16 V 1, 2 Operating Temperature TOP -40 70 °C 3 Storage Temperature TSG -40 85 °C 3 Life Time (75 cd/m2) 10,000 - hour 4 Life Time (60 cd/m2) 15,000 - hour 4 Life Time (45 cd/m2) 20,000 - hour 4 Supply Voltage for Operation Note 1. All the above voltages are based on "VSS = 0V". 2. When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to the Optics & Electrical Characteristics section. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 3. The defined temperature ranges do not include the polarizer. The maximum withstood temperature of the polarizer should be 80°C. 4. VDDH = 14.0V, Ta = 25°C, 50% Checkerboard. Software configuration follows the Actual Application Example section initialization. End of a lifetime is specified as 50% of initial brightness reached. The average operating lifetime at room temperature is estimated by the accelerated operation at high-temperature conditions. 4D Systems DATASHEET Page 10 of 35 4DOLED-602817 Optics & Electrical Characteristics 3. Optics & Electrical Characteristics 3.1. Optics Characteristics The optical measurement was taken at VDD = 2.8V, and VDDH = 14.0V. Software configuration follows the Actual Application Example section initialization. Optical Characteristics Characteristics Symbol Condition Min Typ Max Unit Brightness Lbr Note 5 60 75 - cd/m2 C.I.E. (White) (x) (y) C.I.E. 1931 0.26 0.29 0.30 0.33 0.34 0.37 C.I.E. (Red) (x) (y) C.I.E. 1931 0.60 0.30 0.64 0.34 0.68 0.38 C.I.E. (Green) (x) (y) C.I.E. 1931 0.27 0.58 0.31 0.62 0.35 0.66 C.I.E. (Blue) (x) (y) C.I.E. 1931 0.10 0.12 0.14 0.16 0.18 0.20 Dark Room Contrast CR - > 10,000:1 - - Free - Viewing Angle 4D Systems DATASHEET degree Page 11 of 35 4DOLED-602817 DC Characteristics 3.2. DC Characteristics DC Characteristics Characteristics Symbol Supply Voltage for Operation Min Typ Max Unit VDD 2.6 2.8 3.3 V Supply Voltage for I/O Pins VDDIO 1.6 2.8 VDD V Supply Voltage for Display VDDH 13.5 14.0 14.5 V High Level Input VIH 0.8 x VDDIO - VDDIO V Low Level Input VIL 0 - 0.4 V High Level Output VOH1 IOH = -0.4mA VDDIO-0.4 - VOH2 IOH = -0.4mA VOL1 IOL = -0.1mA VOL2 IOL = -0.1mA Low Level Output Operating Current for VDD IDD Operating Current for VDDH IDDH Condition Note 5 V V - 0.4 V V - 2.5 3.5 mA Note 6 - 10.5 13.2 mA Note 7 - 14.9 18.6 mA Note 8 - 26.2 32.8 mA Sleep Mode Current for VDD IDD, SLEEP - 3 5 uA Sleep Mode Current for VDDH IDDH, SLEEP - 1 5 uA Note 1. Brightness (Lbr) and Supply Voltage for Display (VDDH) are subject to the change of the panel characteristics and the customer’s request. 2. VDD = 2.8V, VDDH = 14.0V, 30% Display Area Turn on. 3. VDD = 2.8V, VDDH = 14.0V, 50% Display Area Turn on. 4. VDD = 2.8V, VDDH = 14.0V, 100% Display Area Turn on. Software configuration follows the Actual Application Example section initialization. 4D Systems DATASHEET Page 12 of 35 4DOLED-602817 AC Characteristics 3.3. AC Characteristics 3.3.1. 68XX-Series MPU Parallel Interface All the timing reference is 10% and 90% of VDDIO. Read Timing Write Timing 4D Systems DATASHEET Page 13 of 35 4DOLED-602817 AC Characteristics Timing Characteristics Symbol Description tAH6 Address Setup Timing tAS6 tCYC6 Address Hold Timing System Cycle Timing Min Max Unit Port (Read) 10 - ns CSB RS (Write) 5 - ns (Read) 10 - ns (Write) 5 - ns (Read) 200 - ns (Write) 100 - ns tELR6 Read "L" Pulse Width 90 - ns tEHR6 Read "H" Pulse Width 90 - ns tELW6 Write "L" Pulse Width 45 - ns tEHW6 Write "H" Pulse Width 45 - ns tRDD6 Read Data Output Delay Time 0 70 ns tRDH6 Data Hold Timing 0 70 ns tDS6 Data Setup Timing 40 - ns tDH6 Data Hold Timing 10 - ns 4D Systems * CL = 15pF DATASHEET E D[17:9] Page 14 of 35 4DOLED-602817 AC Characteristics 3.3.2. 80XX-Series MPU Parallel Interface All the timing reference is 10% and 90% of VDDIO. Read Timing Write Timing 4D Systems DATASHEET Page 15 of 35 4DOLED-602817 AC Characteristics Timing Characteristics Symbol Description Min Max Unit Port tAS8 Address Setup Timing 5 - ns CSB RS tAH8 Address Hold Timing 5 - ns tCYC8 System Cycle Timing 200 - ns tRDLR8 Read "L" Pulse Width 90 - ns tRDHR8 Read "H" Pulse Width 90 - ns tCYC8 System Cycle Timing 100 - ns tWRLW8 Write "L" Pulse Width 45 - ns tWRHW8 Write "H" Pulse Width 45 - ns tRDD8 Read Data Output Delay Time 0 60 ns tRDH8 Data Hold Timing 0 60 ns tDS8 Write Data Setup Timing 30 - ns tDH8 Write Data Hold Timing 10 - ns 4D Systems (Read) (Write) * CL = 15pF DATASHEET RDB D[17:9] Page 16 of 35 4DOLED-602817 AC Characteristics 3.3.3. Serial Interface All the timing reference is 10% and 90% of VDDIO. Timing Characteristics Symbol Description Min Max Unit Port tCYCS Serial Clock Cycle 100 - ns SCL tSLW SCL "L" Pulse Width 45 - ns tSHW SCL "H" Pulse Width 45 - ns tDSS Data Setup Timing 5 - ns tDHS Data Hold Timing 5 - ns tCSS CSB-SCL Timing 5 - ns tCSH CSB-Hold Timing 5 - ns tRSS RS-SCL Timing 5 - ns tRSH RS-Hold Timing 5 - ns 4D Systems DATASHEET SDI CSB RS Page 17 of 35 4DOLED-602817 AC Characteristics 3.3.4. RGB Interface All the timing reference is 10% and 90% of VDDIO. Timing Characteristics Symbol Description Min Max Unit Port tDCYC Dot Clock Cycle 100 - ns DOTCLK tDLW Dot "L" Pulse Width 50 - ns tDHW Dot "H" Pulse Width 50 - ns tDS Data Setup Timing 5 - ns tDH Data Hold Timing 5 - ns tVLW Vsync Pulse Width 1 - DOTCLK VSYNC tCSH CSB-Hold Timing 1 - DOTCLK HSYNC D[17:12] • DTST: Setup Time for Data Transmission • VSYNC, HSYNC, ENABLE, and D[17:12] should be transmitted by 3 clocks for one pixel (RGB). 4D Systems DATASHEET Page 18 of 35 4DOLED-602817 Initialisation Codes 4. Initialisation Codes Command Definitions STATUS_RD 0x01 DUTY 0x28 OSC_CTL 0x02 DSL 0x29 CLOCK_DIV 0x03 D1_DDRAM_FAC 0x2E REDUCE_CURRENT 0x04 D1_DDRAM_FAR 0x2F SOFT_RESET 0x05 D2_DDRAM_SAC 0x31 DISP_ON_OFF 0x06 D2_DDRAM_SAR 0x32 PRECHARGE_TIME_R 0x08 SCR1_FX1 0x33 PRECHARGE_TIME_G 0x09 SCR1_FX2 0x34 PRECHARGE_TIME_B 0x0A SCR1_FY1 0x35 PRECHARGE_CURRENT_R 0x0B SCR1_FY2 0x36 PRECHARGE_CURRENT_G 0x0C SCR2_SX1 0x37 PRECHARGE_CURRENT_B 0x0D SCR2_SX2 0x38 DRIVING_CURRENT_R 0x10 SCR2_SY1 0x39 DRIVING_CURRENT_G 0x11 SCR2_SY2 0x3A DRIVING_CURRENT_B 0x12 SCREEN_SAVER_CONTROL 0x3B DISPLAY_MODE_SET 0x13 SS_SLEEP_TIMER 0x3C RGB_IF 0x14 SCREEN_SAVER_MODE 0x3D RGB_POL 0x15 SS_SCR1_FU 0x3E MEMORY_WRITE_MODE 0x16 SS_SCR1_MXY 0x3F MX1_ADDR 0x17 SS_SCR2_FU 0x40 MX2_ADDR 0x18 SS_SCR2_MXY 0x41 MY1_ADDR 0x19 MOVING_DIRECTION 0x42 MY2_ADDR 0x1A SS_SCR2_SX1 0x47 MEMORY_ACCESS_POINTER_X 0x20 SS_SCR2_SX2 0x48 MEMORY_ACCESS_POINTER_Y 0x21 SS_SCR2_SY1 0x49 DDRAM_DATA 0x22 SS_SCR2_SY2 0x4A GRAY_SCALE_INDEX 0x50 IREF 0x80 GRAY_SCALE_DATA 0x51 4D Systems DATASHEET Page 19 of 35 4DOLED-602817 Init Code 4.1. Init Code Format: (Command, Data1, Data2...DataN) DISP_ON_OFF, 0x00, // display off SOFT_RESET, 0x00, REDUCE_CURRENT, 0x01, REDUCE_CURRENT, 0x00, OSC_CTL, 0x01, CLOCK_DIV, 0x30, PRECHARGE_TIME_R, 0x03, PRECHARGE_TIME_G, 0x03, PRECHARGE_TIME_B, 0x02, PRECHARGE_CURRENT_R, 0x50, PRECHARGE_CURRENT_G, 0x40, PRECHARGE_CURRENT_B, 0x40, DRIVING_CURRENT_R, 0xA0, DRIVING_CURRENT_G, 0xA0, DRIVING_CURRENT_B, 0xA0, DISPLAY_MODE_SET, 0x00, RGB_IF, 0x11, RGB_POL, 0x00, MEMORY_WRITE_MODE, 0x66, DUTY, 0x7F, DSL, 0x00, D1_DDRAM_FAC, 0x00, D1_DDRAM_FAR, 0x00, D2_DDRAM_SAC, 0x00, D2_DDRAM_SAR, 0x00, SCR1_FX1, 0x00, SCR1_FX2, 0x9F, SCR1_FY1, 0x00, SCR1_FY2, 0x7F, IREF, 0x00, DISP_ON_OFF, 0x01, // display on 4D Systems DATASHEET Page 20 of 35 4DOLED-602817 Functional Specification 5. Functional Specification 5.1. Commands Refer to the Technical Manual for the SEPS525 5.2. Power Down and Power Up Sequence To protect the OEL panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 5.2.1. Power up Sequence 1. Power up VDD & VDDIO 2. Send Display off command 3. Initialization 4. Clear Screen 5. Power up VDDH 6. Delay 100ms (When VDDH is stable) 7. Send Display on command 5.2.2. Power down Sequence 1. Send Display off command 2. Power down VDDH 3. Delay 100ms (When VDDH is reach 0 and the panel is completely discharged) 4. Power down VDD & VDDIO Note 1. Since an ESD protection circuit is connected between VDD, VDDIO and VDDH inside the driver IC, VDDH becomes lower than VDD & VDDIO whenever VDD & VDDIO is ON and VDDH is OFF. 2. VDDH should be kept float (disabled) when it is OFF. 3. Power Pins (VDD, VDDIO, VDDH) can never be pulled to the ground under any circumstance. 4. VDD & VDDIO should not be powered down before VDDH is powered down. 4D Systems DATASHEET Page 21 of 35 4DOLED-602817 Reset Circuit 5.3. Reset Circuit When RESETB input is low, the chip is initialized with the following status: 1. Frame Frequency: 90Hz 2. Oscillation: Internal Oscillator On 3. DDRAM Write Horizontal Address: MX1 = 0x00, MX2 = 0x9F 4. DDRAM Write Vertical Address: MY1 = 0x00, MY2 = 0x7F 5. Display Data RAM Write: HC = 1, VC = 1, HV = 0 6. RGB Data Swap: Off 7. Row Scan Shift Direction: G0, G1, ... , G126, G127 8. Column Data Shift Direction: S0, S1, ... , S478, S479 9. Display On/Off: Off 10. Panel Display Size: FX1 = 0x00, FX2 = 0x9F, FY1 = 0x00, FY1 = 0x7F 11. Display Data RAM Read Column/Row Address: FAC = 0x00, FAR = 0x00 12. Precharge Time (R/G/B): 0 Clock 13. Precharge Current (R/G/B): 0µA 14. Driving Current (R/G/B): 0µA 4D Systems DATASHEET Page 22 of 35 4DOLED-602817 Actual Application Example 5.4. Actual Application Example Command usage and explanation of an actual example 4D Systems DATASHEET Page 23 of 35 4DOLED-602817 Actual Application Example Power up Sequence If the noise accidentally occurs at the displaying window during the operation, please reset the display to recover the display function. Power down Sequence 4D Systems DATASHEET Page 24 of 35 4DOLED-602817 Actual Application Example Entering Sleep Mode Exiting Sleep Mode 4D Systems DATASHEET Page 25 of 35 4DOLED-602817 Reliability 6. Reliability 6.1. Contents of Reliability Tests Contents of Reliability Tests Item Conditions Criteria High Temperature Operation 70°C, 240 hrs The operational functions work. Low Temperature Operation -40°C, 240 hrs High Temperature Storage 85°C, 240 hrs Low Temperature Storage -40°C, 240 hrs High Temperature/Humidity Operation 60°C, 90% RH, 120 hrs Thermal Shock -40°C 85°C, 24 cycles 60 mins dwell • The samples used for the above tests do not include polarizers. • No moisture condensation is observed during tests. 6.2. Failure Check Standard After the completion of the described reliability test, the samples were left at room temperature for 2 hrs before conducting the failure test at 23±5°C; 55±15% RH. 4D Systems DATASHEET Page 26 of 35 4DOLED-602817 Outgoing Quality Control Specifications 7. Outgoing Quality Control Specifications Environment Required The customer's test & measurement are required to be conducted under the following conditions: Temperature: 23 ± 5°C Humidity: 55 ± 15% RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: ≥ 50cm Distance between the Panel & Eyes of the Inspector: ≥ 30cm A finger glove (or finger cover) must be worn by the inspector. The inspection table or jig must be anti-electrostatic. Sampling Plan Level II, Normal Inspection, Single Sampling, MIL-STD-105E. Criteria & Acceptable Quality Level 4D Systems Partition AQL Definition Major 0.65 Defects in Pattern Check (Display On) Minor 1.0 Defects in Cosmetic Check (Display Off) DATASHEET Page 27 of 35 4DOLED-602817 Cosmetic Check (Display Off) in Non-Active Area 7.1. Cosmetic Check (Display Off) in Non-Active Area Check Item Classification Criteria X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge) Panel General Chipping Minor Any crack is not allowable. Panel Crack Minor Copper Exposed (Even Pin or Film) Minor Film or Trace Damage Minor Terminal Lead Prober Mark Glue or Contamination on Pin (Couldn't Be Removed by Alcohol) Ink Marking on Back Side of panel (Exclude on Film) 4D Systems Not Allowable by Naked Eye Inspection Acceptable Minor Acceptable DATASHEET Ignore for Any Page 28 of 35 4DOLED-602817 Cosmetic Check (Display Off) in Active Area 7.2. Cosmetic Check (Display Off) in Active Area It is recommended to execute in a clean room environment (class 10k) if necessary. Check Item Classification Any Dirt & Scratch on Polarizer's Protective Film Acceptable Criteria Ignore for not Affect the Polarizer Scratches, Fiber, Line-Shape Defect (On Polarizer) Minor W ≤ 0.1 Ignore W > 0.1 L≤2 n≤1 L>2 n=0 Dirt, Black Spot, Foreign Material, (On Polarizer) Minor Φ ≤ 0.1 Ignore 0.1 < Φ ≤ 0.25 n≤1 0.25 < Φ n=0 Φ ≤ 0.5 -> Ignore if no Influence on Display 0.5 < Φ n=0 Dent, Bubbles, White spot (Any Transparent Spot on Polarizer) Minor Fingerprint, Flow Mark (On Polarizer) Minor Not Allowable • Protective film should not be torn off when cosmetic check. • Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2 4D Systems DATASHEET Page 29 of 35 4DOLED-602817 Pattern Check (Display On) in Active Area 7.3. Pattern Check (Display On) in Active Area Check Item Classification Bright Line Major Missed Line Major Pixel Short Major Darker Pixel Major Wrong Display Major Un-Uniform (Luminance Variation within a Display) Major 4D Systems DATASHEET Criteria Page 30 of 35 4DOLED-602817 Package Specifications 8. Package Specifications Item Quantity Module 420 per Primary Box Holding Trays (A) 15 per Primary Box Total Trays (B) 16 per Primary Box Primary Box (C) 1~4 per Carton (4 as Major / Maximum) 4D Systems DATASHEET Page 31 of 35 4DOLED-602817 Precautions When Using These OEL Display Modules 9. Precautions When Using These OEL Display Modules 9.1. Handling Precautions 1. Since the display panel is made of glass, do not apply mechanical impacts such as dropping from a high position. 2. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale or lick the organic substance. 3. If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 4. The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. 5. When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using the following adhesion tape. 6. Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using a cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: 7. Water 8. Ketone 9. Aromatic Solvents 10. Hold the OEL display module very carefully when placing the OEL display module into the system housing. Do not apply excessive stress or pressure to the OEL display module. And, do not overbend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 11. Do not apply stress to the driver IC and the surrounding molded sections. 12. Do not disassemble nor modify the OEL display module. 13. Do not apply input signals while the logic power is off. 14. Pay sufficient attention to the working environments when handling OEL display modules to prevent the occurrence of element breakage accidents by static electricity. • Be sure to make human body grounding when handling OEL display modules. • Be sure to ground tools to use or assemble such as soldering irons. 4D Systems DATASHEET Page 32 of 35 4DOLED-602817 Storage Precautions • To suppress the generation of static electricity, avoid carrying out assembly work under dry environments. • The protective film is applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 15. The protection film is applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period, the residue adhesive material of the protection film may remain on the surface of the display panel after removing the film. In such cases, remove the residue material by the method introduced in the Reliability section). 16. If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded be careful to avoid the above. 9.2. Storage Precautions 1. When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sunlight nor to lights of fluorescent lamps. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0°C) environments. (We recommend you store these modules in the packaged state when they were shipped from WiseChip Semiconductor Inc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 2. If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 9.3. Designing Precautions 1. The absolute maximum ratings are the ratings that cannot be exceeded for the OEL display module, and if these values are exceeded, panel damage may happen. 2. To prevent the occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, make the signal line cable as short as possible. 3. We recommend you install an excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) 4. Pay sufficient attention to avoid the occurrence of mutual noise interference with the neighboring devices. 5. As for EMI, take necessary measures on the equipment side. 6. When fastening the OEL display module, fasten the external plastic housing section. 7. If the power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. 4D Systems DATASHEET Page 33 of 35 4DOLED-602817 Precautions when disposing of the OEL display modules 8. The electric potential to be connected to the rear face of the IC chip should be as follows: SEPS525 9. Connection (contact) to any other potential than the above may lead to rupture of the IC. 9.4. Precautions when disposing of the OEL display modules 1. Request qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 9.5. Other Precautions 1. When an OEL display module is operated for a length of time a fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, the normal state can be restored. Also, there will be no problem with the reliability of the module. 2. To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. 3. Pins and electrodes 4. Pattern layouts such as the FPC 5. With this OEL display module, the OEL driver is exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. 6. Design the product and installation method so that the OEL driver may be shielded from light in actual usage. 7. Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. 8. Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It, therefore, is necessary to take appropriate measures to suppress noise generation or to protect from the influences of noise on the system design. 9. We recommend you construct its software to make periodical refreshments of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 4D Systems DATASHEET Page 34 of 35 4DOLED-602817 Revision History 10. Revision History Document Revision REVISION DATE COMMENT 1.0 (A) 21/03/2013 New 1.1 20/01/2023 Modified datasheet for web-based documentation 4D Systems DATASHEET Page 35 of 35