SFH4860

2015-12-23 GaAlAs Light Emitting Diode (660 nm) Version 1.3 SFH 4860 Features: • Fabricated in a liquid phase epitaxy process • Cathode is electrically connected to the case • High reliability • Spectral match with silicon photodetectors • Hermetically sealed package Applications • Photointerrupters • IR remote control • Sensor technology • Light curtains Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code Ie [mW/sr] IF = 50 mA, tp = 20 ms SFH 4860 Note: 1.3 (≥ 0.63) Q62702P5053 18 A3 DIN 870 (TO-18), flat glass cap, lead spacing 2.54 mm (1/10’’) anode making: projection at package bottom 2015-12-23 1 Version 1.3 SFH 4860 Maximum Ratings (TA = 25 °C) Parameter Symbol Values Unit Operation and storage temperature range Top; Tstg -40 ... 100 °C Junction temperature Tj 125 °C Reverse voltage VR 3 V Forward current IF 50 mA Surge current (tp ≤ 10 µs, D = 0) IFSM 1 A Power consumption Ptot 140 mW Thermal resistance junction - ambient RthJA 450 K/W Thermal resistance junction - case RthJC 160 K/W Characteristics (TA = 25 °C) Parameter Symbol Values Unit Peak wavelength (IF = 50 mA, tP = 20 ms) (typ) λpeak 660 nm Spectral bandwidth at 50% of Imax (IF = 50 mA, tp = 20 ms) (typ) ∆λ 25 nm Half angle (typ) ϕ ± 50 Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 50 mA, RL = 50 Ω) (typ) tr, tf 100 ns Capacitance (VR = 0 V, f = 1 MHz) (typ) C0 25 pF Forward voltage (IF = 50 mA, tP = 20 ms) (typ (max)) VF 2 (≤ 2.8) V Reverse current (VR = 3 V) 0.325 x 0.325 ° mm x mm IR 0.01 (≤ 10) µA Total radiant flux (IF=50 mA, tp=20 ms) (typ) Φe 3 mW Temperature coefficient of Ie or Φe (IF = 50 mA, tp = 20 ms) (typ) TCI -0.4 %/K Temperature coefficient of VF (IF = 50 mA, tp = 20 ms) (typ) TCV -3 mV / K Temperature coefficient of wavelength (IF = 50 mA, tp = 20 ms) (typ) TCλ 0.16 nm / K 2015-12-23 2 Version 1.3 SFH 4860 Grouping (TA = 25 °C) Group SFH 4860 Note: Min Radiant Intensity Typ Radiant Intensity IF = 50 mA, tp = 20 ms IF = 1 A, tp = 100 µs Ie, min [mW / sr] Ie, typ [mW / sr] 0.63 15 measured at a solid angle of Ω = 0.01 sr Relative Spectral Emission 1) page 8 Irel = f(λ), TA = 25°C Radiant Intensity 1) page 8 Ie / Ie(50mA) = f(IF), single pulse, tp = 20 µs, TA = 25°C OHR01869 100 Ι rel % 10 2 OHR01870 Ιe Ι e 50 mA 80 10 1 60 10 0 40 10 -1 20 0 600 2015-12-23 650 700 nm λ 10 -2 750 10 0 3 10 1 10 2 mA ΙF 10 3 Version 1.3 SFH 4860 Max. Permissible Forward Current IF, max = f(TC), RthJC = 160 K / W Max. Permissible Forward Current IF, max = f(TA), RthJA = 450 K / W OHR00390 120 Ι F mA Ι F mA 100 100 80 80 60 60 40 40 20 20 0 0 20 40 60 80 0 100 ˚C 130 TA Forward Current 1) page 8 IF = f(VF), single pulse, tp = 100 µs, TA= 25°C 10 0 20 40 60 80 100 ˚C 130 TA Permissible Pulse Handling Capability IF = f(tp), T A = 25 °C, duty cycle D = parameter OHR01871 10 3 Ι F mA OHR00391 120 ΙF OHR01872 10 4 mA tP D= 10 3 2 0.1 tP T ΙF T D= 0.005 0.01 0.02 0.05 0.2 10 2 0.5 10 1 DC 10 0 2015-12-23 0 1 2 3 4 5 10 1 10 -5 10 -4 10 -3 10 -2 10 -1 6 V 7 VF s tP 4 10 1 Version 1.3 SFH 4860 Radiation Characteristics 1) page 8 Irel = f(ϕ), TA= 25°C 40 30 20 10 0 OHR00389 1.0 ϕ 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 Package Outline Chip position (2.7) 1.1 .9 0 ø4.8 ø4.6 2.54 mm spacing ø0.45 14.5 12.5 Cathode 4.05 3.45 Flat glass cap ø2.54 Dimensions in mm (inch). 2015-12-23 1 0.9 .1 5 5.5 5.2 GMO06983 120 Version 1.3 SFH 4860 Package Metal Can (TO-18), solder tabs lead spacing 2.54 mm (1/10"), anode marking: projection at package bottom Approximate Weight: 25.0 mg Recommended Solder Pad Dimensions in mm. Note: pad 1: anode 2015-12-23 6 Version 1.3 SFH 4860 TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C First wave Second wave Continuous line: typical process Dotted line: process limits ∆T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C 120 ˚C 100 ˚C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2015-12-23 7 Version 1.3 SFH 4860 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2015-12-23 8 Version 1.3 SFH 4860 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2015-12-23 9