SFH4543-Z

2016-04-14 High Power Infrared Emitter (940nm) in SMR® Package Version 1.2 SFH 4543 Features: • High Power Infrared LED • SMR® (Surface Mount Radial) package • Same package as photodiode SFH 2500 • Short switching times Applications Sensor technology • • Discrete interrupters • Discrete optocouplers Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code Ie [mW/sr] IF= 100 mA, tp= 20 ms SFH 4543 Note: 230 (≥ 100) Q65110A8094 Measured at a solid angle of Ω = 0.01 sr 2016-04-14 1 Version 1.2 SFH 4543 Maximum Ratings (TA = 25 °C) Parameter Symbol Values Unit Operation and storage temperature range Top; Tstg -40 ... 85 °C Reverse voltage VR 5 V Forward current IF 100 Surge current (tp ≤ 100 µs, D = 0) IFSM 1 Power consumption Ptot 180 ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 Thermal resistance junction - ambient 1) page 9 RthJA 300 mA A mW kV K/W Characteristics (TA = 25 °C) Parameter Symbol Values Unit Peak wavelength (IF = 100 mA, tp = 20 ms) (typ) λpeak 950 nm Centroid wavelength (IF = 100 mA, tp = 20 ms) (typ) λcentroid 940 nm Spectral bandwidth at 50% of Imax (IF = 100 mA, tp = 20 ms) (typ) ∆λ 42 nm Half angle (typ) ϕ ± 10 Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 100 mA, RL = 50 Ω) (typ) tr, tf Forward voltage (IF = 100 mA, tp = 20 ms) Forward voltage (IF = 1 A, tp = 100 µs) 0.3 x 0.3 ° mm x mm 12 ns (typ (max)) VF 1.5 (≤ 1.8) V (typ (max)) VF 2.3 (≤ 3) V Reverse current (VR = 5 V) IR not designed for reverse operation µA Total radiant flux (IF=100 mA, tp=20 ms) (typ) Φe 65 mW Temperature coefficient of Ie or Φe (IF = 100 mA, tp = 20 ms) (typ) TCI -0.5 %/K Temperature coefficient of VF (IF = 100 mA, tp = 20 ms) (typ) TCV -1.3 mV / K Temperature coefficient of wavelength (IF = 100 mA, tp = 20 ms) (typ) TCλ 0.3 nm / K 2016-04-14 2 Version 1.2 SFH 4543 Grouping (TA = 25 °C) Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF= 100 mA, tp= 20 ms IF= 100 mA, tp= 20 ms IF = 1 A, tp = 25 µs Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH4543 - AW 100 200 1000 SFH4543 - BW 160 320 1700 SFH4543 - CW 250 500 2600 Note: measured at a solid angle of Ω = 0.01 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 2) page 9 Irel = f(λ), TA = 25°C Radiant Intensity 2) page 9 Ie / Ie(100 mA) = f(IF), single pulse, tp = 25 µs, TA= 25°C OHF04134 100 OHF03821 101 I rel % Ie I e (100 mA) 80 100 5 60 10-1 40 5 10-2 20 5 0 800 850 900 950 nm 1025 10-3 0 10 λ 5 10 1 5 10 2 mA 10 3 IF 2016-04-14 3 Version 1.2 SFH 4543 Forward Current 2) page 9 IF = f(VF), single pulse, tp = 100 µs, TA= 25°C Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W IF OHF03814 0.11 A IF OHF03822 100 A 10-1 0.08 5 0.07 0.06 10-2 0.05 5 0.04 0.03 10-3 0.02 5 0.01 0 10-4 0 10 20 30 40 50 60 70 80 ˚C 100 0 0.5 1 1.5 2 V 2.5 VF T Permissible Pulse Handling Capability IF = f(tp), T A = 85 °C, duty cycle D = parameter Permissible Pulse Handling Capability IF = f(tp), TA = 25 °C, duty cycle D = parameter IF 1.2 A OHF05439 tP D= T 1.0 tP IF IF T D= 0.8 0.6 0.4 1.6 A 1.4 tP tP IF D= T T 1.2 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 1.0 0.8 0.6 0.4 0.2 0.2 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp tp 2016-04-14 OHF03813 4 Version 1.2 SFH 4543 Radiation Characteristics 2) page 9 Irel = f(ϕ), TA= 25°C 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHL03768 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 0.6 0.4 0˚ Chip position 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) 8.0 (0.315) 7.4 (0.291) 2.54 (0.100) spacing 15.5 (0.610) 14.7 (0.579) Cathode 4.5 (0.177) 3.9 (0.154) 7.7 (0.303) 7.1 (0.280) 40˚ 60˚ 80˚ 100˚ ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213) GEOY6961 Dimensions in mm (inch). Approximate Weight: 0.2 g 2016-04-14 20˚ -0.15...0.15 (-0.006...0.006) 0.8 2.7 (0.106) 2.4 (0.094) 1.0 Package Outline 4.8 (0.189) 4.4 (0.173) 100˚ 5 120˚ Version 1.2 SFH 4543 Note Packing information is available on the internet (online product catalog). 5.9 (0.232) 2.54 (0.100) 1.3 (0.051) Recommended Solder Pad Padgeometrie für verbesserte Wärmeableitung Bauteil positioniert Component Location on Pad Lötpad (1 (0.039)) 1.5 (0.059) Paddesign for improved heat dissipation 5.2 (0.205) 3 (0.118) Lötstopplack Solder resist Aussparung 4.85 (0.191) ±0.05 (0.002) 7 (0.276) Dimensions in mm (inch). 2016-04-14 Cu-Fläche > 20 mm 2 Cu-area > 20 mm 2 6 OHF02450 Version 1.2 SFH 4543 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01 OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 50 0 100 150 200 250 s 300 t OHA04612 Profile Feature Profil-Charakteristik Symbol Symbol Pb-Free (SnAgCu) Assembly Minimum ) Ramp-up rate to preheat* 25 °C to 150 °C Time tS TSmin to TSmax tS 60 Ramp-up rate to peak*) TSmax to TP Recommendation Maximum 2 3 100 120 2 3 Unit Einheit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 s 3 6 K/s 10 Ramp-down rate* TP to 100 °C 480 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2016-04-14 °C 7 s Version 1.2 SFH 4543 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-04-14 8 Version 1.2 SFH 4543 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 20 mm2 each 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-04-14 9 Version 1.2 SFH 4543 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2016-04-14 10