SFH4059S

2016-04-11 High Power Infrared Emitter (850 nm) Version 1.4 SFH 4059S Features: • High optical power • Double Stack emitter • Very small package: (LxWxH) 3.2 mm x 1.6 mm x 1.85 mm Applications Miniature photointerrupters • • Industrial electronics • For control and drive circuits • Mobile devices Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: SFH 4059S Note: Irradiance Radiant intensity Ee [mW/cm2] Ie, typ [mW/sr] IF = 50 mA, tp = 20 ms IF=50 mA, tp= 20 ms 16 (≥ 6.3) 95 Ordering Code Q65111A2990 Ie measured with a detector (11.3 mm diameter) in 100 mm distance (Ω = 0.01 sr) to the device surface Ee measured in the near field with a detector (7.2 mm diameter) in 20 mm distance (Ω = 0.1 sr) to the device surface 2016-04-11 1 Version 1.4 SFH 4059S Maximum Ratings (TA = 25 °C) Parameter Symbol Values Operation and storage temperature range Top; Tstg -40 ... 85 °C Reverse voltage VR 5 V Forward current IF 50 mA Surge current (tp ≤ 300 µs, D = 0) IFSM 0.7 A Power consumption Ptot 175 mW ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 Thermal resistance junction - ambient 1) page 13 RthJA 420 K/W Thermal resistance junction - soldering point RthJS 260 K/W 2) page 13 Unit kV Characteristics (TA = 25 °C) Parameter Symbol Values Unit Peak wavelength (IF = 50 mA, tp = 20 ms) (typ) λpeak 860 nm Centroid wavelength (IF = 50 mA, tp = 20 ms) (typ) λcentroid 850 nm Spectral bandwidth at 50% of Imax (IF = 50 mA, tp = 20 ms) (typ) ∆λ 30 nm Half angle (typ) ϕ ± 15 Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 50 mA, RL = 50 Ω) (typ) tr, tf Forward voltage (IF = 50 mA, tp = 20 ms) Forward voltage ns (typ (max)) VF 2.95 (≤ 3.45) V (typ (max)) VF 4 V (typ) Radiant intensity (IF=50 mA, tp= 20 ms) 2016-04-11 mm x mm 15 Reverse current (VR = 5 V) Total radiant flux (IF=50 mA, tp= 20 ms) 0.3 x 0.3 ° 2 IR not designed for reverse operation µA Φe 50 mW Ie, typ 95 mW/sr Version 1.4 SFH 4059S Parameter Symbol Values Unit Temperature coefficient of Ie or Φe (IF = 50 mA, tp = 20 ms) (typ) TCI -0.5 %/K Temperature coefficient of VF (IF = 50 mA, tp = 20 ms) (typ) TCV -2 mV / K Temperature coefficient of wavelength (IF = 50 mA, tp = 20 ms) (typ) TCλ 0.3 nm / K Grouping (TA = 25 °C) Parameter Min Irradiance Max Irradiance IF = 50 mA, tp = 20 ms IF = 50 mA, tp = 20 ms Ee, min [mW/cm²] Ee, max [mW/cm²] SFH 4059S -Q 6.3 12.5 SFH 4059S -R 10 20 SFH 4059S -S 16 32 Ee measured in the near field with a detector (7.2 mm diameter) in 20 mm distance (Ω = 0.1 sr) to the device surface Note: Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 3) page 13 (typ) Irel = f(λ), TA = 25 °C OHF04132 100 I rel Irradiance 3) page 13 Ee/Ee (50mA) = f (IF), Single pulse, tp = 25 μs, TA= 25°C Εe Ε e (50 mA) 80 60 100 40 10-1 20 0 700 10-2 750 800 850 10-3 0 10 nm 950 λ 2016-04-11 OHF05592 102 % 101 102 mA 103 IF 3 Version 1.4 SFH 4059S Forward Current 3) page 13 IF = f(VF), single pulse, tp = 100 µs, TA= 25°C Max. Permissible Forward Current IF = f (TA), RthJA = 420K/W OHF05588 55 I F mA IF OHF05562 103 mA 45 40 102 35 30 25 20 101 15 10 5 0 0 20 40 60 100 80 ˚C 100 2 3 4 VF Permissible Pulse Handling Capability IF = f(tp), T A = 85 °C, duty cycle D = parameter Permissible Pulse Handling Capability IF = f(tp), TA = 25 °C, duty cycle D = parameter 0.75 A IF OHF05589 t D = TP 0.75 A tP IF IF T 0.60 0.55 0.50 D= 0.45 0.005 0.40 0.01 0.02 0.35 0.05 0.30 0.1 0.2 0.25 0.5 0.20 1 0.15 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 OHF05590 t D = TP tP IF T 0.60 0.55 0.50 0.45 D= 0.40 0.005 0.35 0.01 0.02 0.30 0.05 0.25 0.1 0.2 0.20 0.5 0.15 1 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 2016-04-11 5 V TA tp 4 Version 1.4 SFH 4059S Radiation Characteristics 3) page 13 Irel = f(ϕ), TA= 25°C 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF04536 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 2016-04-11 1.0 0.8 0.6 0.4 0˚ 5 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Version 1.4 SFH 4059S Package Outline Dimensions in mm. 2016-04-11 6 Version 1.4 SFH 4059S Pad Description 1 Cathode 2 Anode Package Chipled Approximate Weight: 8 mg Note: Package: Epoxy Note: Colour: black Recommended Solder Pad Dimensions in mm (inch). 2016-04-11 7 Version 1.4 SFH 4059S Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01 OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 50 0 100 150 200 250 s 300 t OHA04612 Profile Feature Profil-Charakteristik Symbol Symbol Pb-Free (SnAgCu) Assembly Minimum ) Ramp-up rate to preheat* 25 °C to 150 °C Time tS TSmin to TSmax tS 60 Ramp-up rate to peak*) TSmax to TP Recommendation Maximum 2 3 100 120 2 3 Unit Einheit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 s 3 6 K/s 10 Ramp-down rate* TP to 100 °C 480 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2016-04-11 °C 8 s Version 1.4 SFH 4059S Taping Dimensions in mm (inch). Tape and Reel 8 mm tape with 2000 pcs. on ∅ 180 mm reel W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2016-04-11 9 Version 1.4 SFH 4059S Tape dimensions [mm] Tape dim ensions in m m W P0 P1 P2 D0 E F 8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05 or 4 ± 0.1 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05 Reel dimensions [mm] Reel dim ensions in m m A W Nmin W1 W2max 180 8 60 8.4 + 2 14.4 Barcode-Product-Label (BPL) OSRAM Opto EX A RoHS Compliant (6P) BATCH NO: 1234567890 (1T) LOT NO: 1234567890 BIN1: XX-XX-X-XXX-X LX XXXX Semiconductors MP ML Temp ST X XXX °C X (9D) D/C: 1234 Pack: RXX LE DEMY XXX X_X123_1234.1234 X (X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X OHA04563 Dry Packing Process and Materials Moisture-sensitive label or print L VE el LE . see lab e If ve ati nk, bla cod bar y H) (R . dit mi hu e ed ag RH % /60 Barcode label ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe TIO or d , cte itio U g coSEND an bje ing ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < tor ll pro SE _ < urs ). urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ). 23 wi nt tim e or l wi fac ˚C Flo tim at or ca at re. Flo d tha ale el or nth nti Flo uiv du if: rea es l 4 5 Flo lab mo ide ce eq low g, l ve vic is be or de 24 tin en l 5a6 pro ve Le de , e te co , g: ve l un wh Le ke r se da ure ba ed low ba Le ve mo % ba e al d ure Le ist en ref e e 10 tim ure se for ist ale op se for > , Mo se 3 ist ure is or . , is ha se Mo nk be ist nk g rd -03 Mo in n Flo r-p RH g, bla Mo ba TD po If blathi % kin Ca life s (if ar t. wi 10 ba tor J-S thi, va p. elf Ye ar ks _ < e icat me , C 1 Ye ee urs Sh terlow tem ted at ed uir > 1 W no un DE Ho Af Ind 1. d e 4 8 uir ref dy reqy is 2. JE bo e Mo ore tim 16 req : C/ e es dit2b a) St tim or mi IP ed or g is tim e vic b) or e Hu Flo en tim or De 2a kin nc te Flo a) op or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a3 ve Le g an ve l Le Ba te ure Le ve ure Le ist Da ure ist Mo ist ure Mo ist Mo Mo MO TO OP s at t M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 AM OSR Desiccant OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 2016-04-11 10 Version 1.4 SFH 4059S Transportation Packing and Materials Barcode label D/ 8 Y M DE R 18 -1 P -1 + Q C: 99 D/ 21 00 (9 D) 21 : 20 00 : 14 2 5 (Q )Q TY O H 12 34 S S em R ic AM on du O p ct to or H NO s TC 3G BA (6 P) NO : 12 11 00 LO T (1 T) NO : TY : 20 (Q )Q : NO M RA OS (X ) PR O D 5 14 2 110 0 Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 195 ± 5 30 ± 5 2016-04-11 OD PR ) (X (G ) G RO UP : P -1 + Q -1 R 18 DE M Y Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: M u L lt S iT Y O T P 67 L 6 E Bi D Bi n1 00 C: 01 44 Muster O ct pto o rs u M (9 D) d A n o : 34 ic S R NO O BA TC H 3G H (1 T) LO T NO (6 P) S 8 12 2199 : 12 em 2100 01 44 el OU P: L GR E V LE see . lab e H) nk, cod (R bla r If ty ba . idi RH m hu 0% e /6 ive d ˚C re ag lat ra ck re 30 _ < inf pa % k s of to 90 ea ur s d ). < ns (p or ur s d Ho de , cteg itio ur s Ho an bje co ˚C 72 sin nd Ho ur 5 te 48 ˚C su es e Ho co ± 24 6 da e 40 be oc ry tim ˚C e r th < ll pr tim cto ). r OI oo 23 wi nt tim e at l wi fa r M TO Fl oo tim s at at ale ˚C at e. ica Fl th oo r th ur el OP nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low l oc ve vic is en ing be or de 24 l 5a6 pr ve Le de nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo Le ve tu re m % ba e ba al d Le r en re tu re e re 10 ois tim se fo tu re ale op se fo > , M r se ois 3 is , is ha se M ois tu nk be oo . 03 nk rd g M ois in r-p bla in Fl RH g, DM ba po If blath % kin Ca life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e 4 8 ou re ed is re qu ty 2. JE bo e M or tim 16 re C/ : e es idi 2b r a) St tim mor is IP ed r oo tim e vic b) g e r Hu Fl en oo tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 2 Fl If al re tim ve l 4. se d l 2a3 ve Le g an ve l Le re Ba te Le ve tu re Le tu Da ois re tu re M ois M ois tu M ois M Nns IVEORS ai IT ntNS CT TIO DU U g EcoSE ON A ba IC UR M CThisSTSE (G ) M u L lt S iT Y O T67 P L 6 Muster E Bi D Bi n1 Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label 11 OHA02044 Version 1.4 SFH 4059S Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-04-11 12 Version 1.4 SFH 4059S Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each 2) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-04-11 13 Version 1.4 SFH 4059S Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 2016-04-11 14